Novel circuit board

Abstract

The utility model discloses a novel circuit board, and relates to the technical field of packaging circuit boards. The plate comprises a plate body, the reinforcing assembly is arranged in the middle of one side of the plate body; the reinforcing assembly comprises an electroplated layer, the electroplated layer is of a cross arrangement structure, and the electroplated layer is connected with the plate body. The reinforcing assembly is arranged in the middle of one side of the board body, and particularly, the electroplated layer with the cross arrangement structure is used as the core part of the reinforcing assembly, so that the overall structural strength of the circuit board is effectively enhanced. According to the design, the circuit board can bear larger stress and pressure in the packaging and subsequent using processes, the structural problems such as bending deformation are avoided, and therefore the stability and reliability of the circuit board are guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of packaged circuit boards, and in particular to a new type of circuit board. Background Art

[0002] With the rapid development of modern electronic technology, miniaturization and integration have become mainstream trends in electronic product design. Against this backdrop, electronic devices such as industrial sensors are also generally pursuing compact structures and easy installation, leading to the widespread use of precise and compact surface-mount components. However, the pursuit of miniaturization significantly increases the design difficulty and manufacturing complexity of smaller surface-mount products, particularly those using chip-on-board (COB) (chip-on-board) photosensitive photodiodes (PDs). In the manufacturing process of COB photosensitive PDs, BT (bismaleimide triazine resin) substrates serve as a key substrate material, and their performance and stability significantly impact the overall quality of the product.

[0003] However, existing BT boards present significant challenges in meeting the trend toward miniaturization and thinness. Due to chip length limitations, small-sized COB dual-PD products are necessarily long and thin. This form factor is susceptible to various stresses during manufacturing and assembly, leading to deformation of the BT board. This deformation not only affects the product's appearance and dimensional stability but, more importantly, subjects the gold wires bonding the chip to it to additional stress, increasing the risk of wire breakage. Utility Model Content

[0004] In view of this, the present application provides a new circuit board, the main purpose of which is to solve the technical problem in the prior art that the BT board is easily affected by various stresses, resulting in deformation, thereby increasing the risk of gold wire breakage.

[0005] This application provides a new circuit board, including:

[0006] plate body;

[0007] A reinforcing assembly, the reinforcing assembly being arranged in the middle of one side of the plate body;

[0008] The reinforcing component includes an electroplating layer, the electroplating layer is a cross-arrangement structure, and the electroplating layer is connected to the plate body.

[0009] In a feasible embodiment, the reinforcement component further comprises:

[0010] The insulating layer is a cross-arranged structure, the area of ​​the insulating layer is larger than the area of ​​the electroplating layer, the insulating layer covers the electroplating layer and is connected to the board body.

[0011] In a feasible embodiment, the novel circuit board further includes:

[0012] A welding pad is provided on a side where the plate body is connected to the reinforcing component.

[0013] In a feasible embodiment, the board body is a square board, the number of the pads is multiple, and at least some of the pads are arranged at the four corners of the board body.

[0014] In a feasible embodiment, the novel circuit board further includes:

[0015] The photosensitive component is arranged on a side of the plate body away from the reinforcing component.

[0016] In a feasible embodiment, the novel circuit board further includes:

[0017] A conductive through hole is provided on the pad and the photosensitive component.

[0018] In a feasible embodiment, the conductive through hole is used to conduct electricity between the pad and the photosensitive component, and there are multiple conductive through holes.

[0019] In a feasible embodiment, the novel circuit board further includes:

[0020] A conductive member is provided on a side where the plate is connected to the photosensitive component. There are multiple conductive members, and the conductive members are provided around the photosensitive component.

[0021] In a feasible embodiment, the novel circuit board further includes:

[0022] Solder points, wherein the solder points are arranged at the edge of the photosensitive component, and the number of the solder points is multiple.

[0023] In a feasible embodiment, the novel circuit board further includes:

[0024] A conductive wire, one end of which is connected to the soldering point, and the other end of which is connected to the conductive member, and the number of the conductive wires is the same as the number of the soldering points.

[0025] The present application provides a novel circuit board, comprising a board body; a reinforcement assembly disposed in the middle of one side of the board body; and an electroplating layer having a cross-arranged structure, the electroplating layer being connected to the board body. By disposing the reinforcement assembly in the middle of one side of the board body, and particularly employing the cross-arranged electroplating layer as the core of the reinforcement assembly, the present application effectively enhances the overall structural strength of the circuit board. This design enables the circuit board to withstand greater stress and pressure during packaging and subsequent use, avoiding structural issues such as bending and deformation, thereby ensuring the stability and reliability of the circuit board.

[0026] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. The purposes and other advantages of the present application can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0027] The technical solution of the present application is further described in detail below through the accompanying drawings and examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0029] Figure 1 A schematic diagram of the front structure of a novel circuit board provided in an embodiment of the present application is shown;

[0030] Figure 2 A schematic diagram of the back structure of a new circuit board provided in an embodiment of the present application is shown.

[0031] In the picture:

[0032] 1. Board; 21. Electroplating layer; 22. Insulation layer; 3. Solder pad; 4. Photosensitive component; 5. Conductive part; 6. Solder point; 7. Conductive wire; 8. Conductive through hole. DETAILED DESCRIPTION

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0035] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0036] COB is a packaging technology that directly mounts chips onto substrates, offering advantages such as compact structure and stable performance. Driven by the trend towards miniaturization, COB technology is widely used in various electronic devices to improve product integration and performance. Photodiodes (PDs) are electronic components that convert light signals into electrical signals and are widely used in optical communications, photoelectric detection, and other fields. In COB-type photodiodes, the chip is mounted on a substrate using a specific packaging technology, forming a device with photoelectric conversion capabilities. With the continued development of miniaturization, COB-type photodiodes are also exhibiting smaller sizes and higher integration. This requires product designers and manufacturers to continuously reduce product size and weight while maintaining high performance. BT boards are a high-performance substrate material with excellent electrical, mechanical, and thermal stability. Driven by the trend towards miniaturization, BT boards are widely used as substrates in various high-performance electronic devices to meet the product's demand for high performance, high reliability, and stability.

[0037] See also Figure 1 and Figure 2, shows a schematic structural diagram of a novel circuit board provided in an embodiment of the present application, including:

[0038] Plate 1;

[0039] A reinforcement component is provided in the middle of one side of the plate body 1;

[0040] The reinforcing component includes an electroplating layer 21 . The electroplating layer 21 is a cross-arrangement structure. The electroplating layer 21 is connected to the plate body 1 .

[0041] In the above embodiment, the structural feature of a new type of circuit board provided by the present application lies in the design of its reinforcement component, which is mainly composed of two parts: a board body 1 and a reinforcement component. The reinforcement component is arranged in the middle of one side of the board body 1, that is, the middle part of the back of the circuit board. The core of the reinforcement component is the electroplating layer 21. The electroplating layer 21 adopts a cross-arrangement structure and has a cross-shaped appearance.

[0042] The reinforcement assembly is positioned in the center of the board. This layout evenly distributes stress across the board, reducing the risk of damage caused by stress concentration. Furthermore, the cross-shaped plating structure improves board space utilization, making the board more compact and efficient. The metal plating is durable and resistant to deformation, significantly enhancing the overall strength and stability of the board. This design effectively resists external shock and vibration, extending the board's service life.

[0043] Furthermore, the reinforcement component also includes:

[0044] The insulating layer 22 is a cross-arranged structure. The area of ​​the insulating layer 22 is larger than the area of ​​the electroplating layer 21 . The insulating layer 22 covers the electroplating layer 21 and is connected to the board body 1 .

[0045] In the above embodiment, the insulating layer 22 is also a key component of the reinforcement assembly. Its primary function is to provide electrical insulation, preventing current from flowing where it should not. The shape of the insulating layer 22 is similar to that of the electroplating layer 21, and the area of ​​the insulating layer 22 is larger than that of the electroplating layer 21. This means that the insulating layer 22 directly overlies the electroplating layer 21, covering the entire area of ​​the electroplating layer 21 and extending beyond the electroplating layer 21, thereby forming a close connection with the board body 1.

[0046] Because the insulating layer 22 is larger than the electroplated layer 21, and the electroplated layer 21 is made of metal, which is only required for its high rigidity to provide structural reinforcement, the presence of the insulating layer 22 effectively prevents direct contact between the electroplated layer 21 and other conductive parts, reducing the risk of short circuits. It also provides additional protection for the edges and surrounding areas of the electroplated layer 21, preventing electrical failures caused by edge effects or accidental contact.

[0047] Furthermore, a novel circuit board also includes:

[0048] The welding pad 3 is arranged on the side where the plate body 1 is connected to the reinforcement component.

[0049] In the above embodiment, the present application provides a soldering pad 3 on the side where the board body 1 is connected to the reinforcing component, that is, the back of the circuit board.

[0050] The soldering pad 3 is used to supply power to the photosensitive component 4 arranged on the front side of the circuit board. As a key part of the circuit connection, its good conductive performance can ensure the stable transmission of the circuit signal.

[0051] Furthermore, the board body 1 is a square board, and there are multiple solder pads 3 , and at least some of the solder pads 3 are arranged at the four corners of the board body 1 .

[0052] In the above embodiment, the board body 1 is a square board, which is one of the common shapes of circuit boards and is conducive to standardized production and assembly. The number of pads 3 can be four, that is, four pads 3 are arranged at the four corners of the board body 1.

[0053] Placing solder pads 3 at the four corners of board body 1 strengthens the connection strength at the edges of the circuit board, which is particularly important for circuit boards that must withstand edge stress, such as those mounted on a frame or bracket. If the corner solder pads 3 are connected to a heat-generating component, placing them at the edge facilitates heat dissipation, as the edge typically provides more space for airflow or heat sinks. The corner solder pads 3 also serve as fixing points for securely mounting the circuit board in the device, helping to reduce vibration and movement during use and improve overall structural stability.

[0054] Furthermore, a novel circuit board also includes:

[0055] The photosensitive component 4 is arranged on a side of the plate 1 away from the reinforcing component.

[0056] In the above embodiment, the photosensitive component 4 is arranged on the front side of the circuit board of the present application, that is, the middle part of the side away from the reinforcing component.

[0057] The photosensitive component 4 is the chip functional area of ​​this application. Since this application is a small-size dual-PD product packaged on a COB basis, the addition of the photosensitive component 4 enables the circuit board to sense and respond to changes in light, thereby expanding the application range of the circuit board.

[0058] Furthermore, a novel circuit board also includes:

[0059] The conductive through hole 8 is opened on the pad 3 and the photosensitive component 4.

[0060] In the above embodiment, the conductive through holes 8 are designed and opened on two key component pads 3 and the photosensitive component 4 on the circuit board.

[0061] Conductive vias 8 directly connect pads 3 and photosensitive components 4, significantly improving the electrical connection performance within the circuit board or between components, ensuring the stability and efficiency of signal transmission. By providing conductive vias on pads 3 and photosensitive components 4, the space on the circuit board can be more effectively utilized, allowing more components to be tightly integrated, thereby improving the integration and functional density of the entire circuit board.

[0062] Furthermore, the conductive through hole 8 is used to conduct electricity between the pad 3 and the photosensitive component 4, and there are multiple conductive through holes 8.

[0063] In the above embodiment, the introduction of the conductive through-holes 8 means that an electrical connection channel is established between the two components, and electrical signals can be transmitted between the pads 3 and the photosensitive component 4 through these conductive through-holes 8. In addition, the number of the conductive through-holes 8 can be four, that is, one conductive through-hole 8 corresponds to one pad 3.

[0064] By increasing the number of conductive vias 8, more signal transmission paths can be provided, thereby speeding up signal transmission on the circuit board. This is particularly important for applications requiring high-speed signal transmission. The presence of multiple conductive vias 8 can provide redundant connections. Even if one or more vias fail, the other vias can still maintain electrical connections, thereby improving the overall reliability of the circuit board. In complex circuit designs, multiple electrical connection points may also be required to achieve specific functions. Multiple conductive vias 8 can meet this requirement, allowing the circuit board to support more complex circuit designs.

[0065] Furthermore, a novel circuit board also includes:

[0066] The conductive member 5 is arranged on the side where the plate 1 is connected to the photosensitive component 4 . There are multiple conductive members 5 , and the conductive members 5 are arranged around the photosensitive component 4 .

[0067] In the above embodiment, the conductive member 5 is provided on the side of the circuit board body 1 connected to the photosensitive component 4, that is, the front side of the circuit board, and the number of the conductive members 5 can be two. The two conductive members 5 are arranged around the photosensitive component 4 in terms of layout, which means that they form a conductive frame around the photosensitive component 4.

[0068] The provision of the conductive members 5 can further enhance the electrical connection between the photosensitive component 4 and other parts of the circuit board. They can serve as additional signal transmission paths to improve the reliability and efficiency of signal transmission.

[0069] Furthermore, a novel circuit board also includes:

[0070] Solder point 6, solder point 6 is set at the edge of the photosensitive component 4, and there are multiple solder points 6.

[0071] In the above embodiment, the welding points 6 are arranged at the edge of the photosensitive component 4, and the number of the welding points 6 can be four.

[0072] The provision of multiple solder points 6 allows for greater flexibility in connecting the circuit board to other components, allowing for selection of connection points as needed to optimize circuit layout. Connections made through multiple solder points 6 can reduce the risk of single-point failures and improve the stability and reliability of signal transmission.

[0073] Furthermore, a novel circuit board also includes:

[0074] Conductive wire 7 , one end of the conductive wire 7 is connected to the welding point 6 , and the other end of the conductive wire 7 is connected to the conductive member 5 . The number of the conductive wires 7 is the same as the number of the welding points 6 .

[0075] In the above embodiment, the present application further includes conductive wires 7. One end of these conductive wires 7 is connected to the solder joint 6, and the other end is connected to the conductive member 5, and the number of conductive wires 7 is the same as the number of solder joints 6, which means that each solder joint 6 is connected to the corresponding conductive member 5 through a conductive wire 7, that is, the photosensitive component 4 is connected to the conductive member 5 through the conductive wire 7.

[0076] The conductive wires 7 serve as a medium for current transmission, and their number is the same as the solder joints 6, ensuring that the current can pass through the circuit board evenly and efficiently to power the photosensitive component 4, which helps to reduce current loss, improve the energy efficiency of the circuit board, and enable the photosensitive component 4 to work better.

[0077] The present application provides a schematic structural diagram of a novel circuit board, comprising a board body 1; a reinforcement assembly disposed in the middle of one side of the board body 1; and an electroplating layer 21 arranged in a cross-shaped structure, connected to the board body 1. By disposing the reinforcement assembly in the middle of one side of the board body, and specifically employing the cross-shaped electroplating layer as the core of the reinforcement assembly, the present application effectively enhances the overall structural strength of the circuit board. This design enables the circuit board to withstand greater stress and pressure during packaging and subsequent use, avoiding structural issues such as bending and deformation, thereby ensuring the stability and reliability of the circuit board.

[0078] Those skilled in the art will understand that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, and the modules or processes in the accompanying drawings are not necessarily required to implement the present application. Those skilled in the art will understand that the modules in the devices in the implementation scenario can be distributed in the devices of the implementation scenario according to the implementation scenario description, or can be changed accordingly and located in one or more devices different from the implementation scenario. The modules of the above-mentioned implementation scenario can be combined into one module, or can be further split into multiple sub-modules.

[0079] The serial numbers of the above application are for descriptive purposes only and do not represent the advantages or disadvantages of the implementation scenarios. The above disclosure only discloses several specific implementation scenarios of the present application, but the present application is not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the scope of protection of the present application.

Claims

1. A new type of circuit board, characterized in that: include: plate(1); A reinforcing component, the reinforcing component being arranged in the middle of one side of the plate body (1); The reinforcing component comprises an electroplating layer (21), the electroplating layer (21) is a cross-arrangement structure, and the electroplating layer (21) is connected to the plate body (1).

2. The circuit board according to claim 1, wherein: The reinforcement assembly further comprises: An insulating layer (22), wherein the insulating layer (22) is a cross-arranged structure, the area of ​​the insulating layer (22) is larger than the area of ​​the electroplating layer (21), and the insulating layer (22) covers the electroplating layer (21) and is connected to the plate body (1).

3. The circuit board according to claim 1, wherein: Also includes: A welding pad (3), the welding pad (3) being arranged on a side where the plate body (1) is connected to the reinforcing component.

4. The circuit board according to claim 3, wherein: The plate body (1) is a square plate, the number of the solder pads (3) is multiple, and at least some of the solder pads (3) are arranged at the four corners of the plate body (1).

5. The circuit board according to claim 4, wherein: Also includes: A photosensitive component (4), wherein the photosensitive component (4) is arranged on a side of the plate body (1) away from the reinforcing component.

6. The circuit board according to claim 5, characterized in that Also includes: A conductive through hole (8), wherein the conductive through hole (8) is provided on the solder pad (3) and the photosensitive component (4).

7. The circuit board according to claim 6, wherein: The conductive through hole (8) is used to conduct electricity between the solder pad (3) and the photosensitive component (4), and there are multiple conductive through holes (8).

8. The circuit board according to claim 5, wherein: Also includes: A conductive member (5), the conductive member (5) being arranged on a side where the plate (1) is connected to the photosensitive component (4), the number of the conductive members (5) being multiple, and the conductive members (5) being arranged around the photosensitive component (4).

9. The circuit board according to claim 8, wherein: Also includes: A welding point (6), wherein the welding point (6) is arranged at the edge of the photosensitive component (4), and the number of the welding points (6) is multiple.

10. The circuit board according to claim 9, wherein: Also includes: A conductive wire (7), one end of the conductive wire (7) is connected to the soldering point (6), and the other end of the conductive wire (7) is connected to the conductive member (5), and the number of the conductive wires (7) is the same as the number of the soldering points (6).

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