Liquid cooling device

Abstract

The utility model belongs to the related technical field of cooling devices, and particularly relates to a liquid cooling device. A liquid cooling channel, a water inlet and a water outlet are formed in a shell, the liquid cooling channel is arranged in the shell, the water inlet and the water outlet are formed in the surface of the shell, and the water inlet and the water outlet are connected to the two ends of the liquid cooling channel respectively; a first clamping assembly is further arranged on the outer surface of the shell; and meanwhile, the PCB substrate is clamped and fixed in the first clamping assembly, and heat dissipation is carried out through liquid flowing through the liquid cooling channel. According to the liquid cooling device, the PCB substrate is attached to the outer surface of the liquid cooling channel through the first clamping assembly, the size of the liquid cooling device is reduced, meanwhile, the complexity of the device is reduced, and meanwhile liquid cooling heat dissipation can be conducted on the PCB substrate.

Description

Technical Field

[0001] The present technology belongs to the relevant technical field of cooling devices, and in particular relates to a liquid cooling device. Technical Background

[0002] As the integration of electronic devices continues to increase, the power density of electronic devices increases, which in turn increases the heat generated on the PCB substrate. Therefore, the design of the heat dissipation structure of the PCB substrate is also an issue that must be considered when using the PCB substrate.

[0003] In existing technologies, the heat dissipation structure of electronic devices is usually air cooling, natural heat dissipation, etc., but the heat dissipation level of this method is far from meeting the requirements for current high-performance and high-computing power chips. Some existing technologies also use liquid cooling, but this method may damage electronic devices. Therefore, the liquid cooling structure is usually more complicated to manufacture and has a large volume, which is not conducive to large-scale production and application. Utility Model Content

[0004] Based on the above problems, the present invention proposes a liquid cooling device. By placing the PCB substrate on the surface of the liquid cooling channel, it can reduce the volume of the device while reducing the complexity of the structure. It also enables the PCB substrate to dissipate heat by liquid cooling, thereby meeting the heat dissipation requirements of high-heat-generating chips.

[0005] The purpose of this utility model is achieved through the following technical means:

[0006] In a first aspect, the present invention provides a liquid cooling device, comprising:

[0007] The shell is provided with a liquid cooling channel, a water inlet and a water outlet, the liquid cooling channel is arranged inside the shell, the water inlet and the water outlet are arranged on the surface of the shell, and the water inlet and the water outlet are respectively connected to the two ends of the liquid cooling channel; the outer surface of the shell is also provided with a first clamping assembly; and

[0008] The PCB substrate is clamped and fixed in the first clamping assembly, and dissipates heat through the liquid flowing through the liquid cooling channel.

[0009] The housing is provided with a liquid cooling channel, a water inlet, and a water outlet. The liquid cooling channel is located inside the housing, and the water inlet and outlet are located on the housing surface, with the water inlet and outlet respectively connected to the two ends of the liquid cooling channel. A first clamping assembly is also provided on the outer surface of the housing. Simultaneously, the PCB substrate is clamped and fixed within the first clamping assembly, and heat is dissipated by liquid flowing through the liquid cooling channel. The first clamping assembly allows the PCB substrate to adhere to the outer surface of the liquid cooling channel, reducing the volume and complexity of the liquid cooling device while enabling liquid cooling of the PCB substrate.

[0010] In some embodiments, liquid cooling surfaces are provided on both sides of the liquid cooling channel, the liquid cooling surfaces are provided between the PCB substrate and the liquid cooling channel, and a heat dissipation coating is provided between the liquid cooling surfaces and the PCB substrate.

[0011] A liquid cooling surface is provided between the liquid cooling channel and the PCB substrate to reduce direct contact between the PCB substrate and the liquid cooling channel, which can also further make the heat dissipation more uniform. A heat dissipation coating is provided between the liquid cooling surface and the PCB substrate to improve the heat exchange rate and further improve the heat dissipation efficiency.

[0012] In some embodiments, a second snap-in assembly is further provided, and the second snap-in assembly and the first snap-in assembly are respectively arranged on two side surfaces of the shell, and the PCB substrate is snap-fixed in the first snap-in assembly and / or in the second snap-in assembly; the first snap-in assembly is provided with a first card slot and a second card slot; the second snap-in assembly is provided with a third card slot and a fourth card slot, and the PCB substrate is arranged in the first card slot and the second card slot, and / or the PCB substrate is arranged in the third card slot and the fourth card slot; and the first card slot is arranged below the second card slot, and the third card slot is arranged below the fourth card slot.

[0013] A second clamping assembly is also provided, which is respectively arranged on both sides of the liquid cooling channel, so that the same liquid cooling device can cool two PCB substrates at the same time, further rationally utilizing the liquid cooling space, reducing the volume of the liquid cooling equipment, and increasing the efficiency of liquid cooling. The first clamping assembly and the second clamping assembly are clamped together through a card slot, which simplifies the installation of the PCB substrate, making the structure simpler and more convenient to install.

[0014] In some embodiments, a plurality of limiting holes are provided at the bottom of the first card slot and the third card slot, and a plurality of limiting notches are provided on one side of the PCB substrate that is clamped in the first card slot or in the third card slot. The limiting notches and the limiting holes are aligned, and the limiting member extends from the limiting hole into the first card slot, or the third card slot and into the limiting notch to limit the PCB substrate.

[0015] Limiting holes are provided at the bottom of the first card slot and the second card slot, and the PCB substrate is clamped by the limiting piece to prevent the PCB substrate from moving laterally.

[0016] In some embodiments, the limiting member is provided with a limiting base, a limiting buckle, and a limiting step; limiting buckles are respectively provided on both sides of the limiting base, and the limiting buckles are directed outward; the limiting step is provided in the middle of the limiting base; an elastic member is provided on the limiting step; a buckle step is also provided at the bottom of the first slot and the third slot, and after the limiting member is extended into the buckle step, the limiting buckle is clamped on the buckle step, and the elastic member is extended into the limiting notch and clamped.

[0017] The limit piece is configured by setting limit buckles on both sides of the limit base. When the limit piece is engaged, the limit buckles are engaged on the buckle steps. When disassembled, the limit buckles are detached from the buckle steps, so that the limit piece can be detachably set and can be adjusted according to the size and shape of the actual PCB substrate.

[0018] In some embodiments, the elastic member is a spring.

[0019] The elastic member is a spring, which is used for limiting the position and, at the same time, can also reduce the vibration of the PCB substrate to prevent the electronic components on the PCB substrate from being separated or damaged.

[0020] In some embodiments, mounting walls are provided on both sides of the liquid cooling surface, the liquid cooling surface and the mounting walls form a liquid cooling cavity, the liquid cooling channel is provided inside the liquid cooling cavity, a plurality of mounting grooves are provided in the mounting wall, and a connecting port is provided at the bottom of the mounting groove.

[0021] The liquid cooling cavity formed by the installation wall and the liquid cooling surface can protect the liquid cooling channel. At the same time, the installation groove can also limit the liquid cooling channel and can also help to structurally position the liquid cooling channel when designing the liquid cooling channel.

[0022] In some embodiments, the liquid cooling channel is composed of multiple liquid cooling tubes and connecting pieces, and the connecting pieces are provided with a liquid inlet and a liquid outlet; the liquid cooling tubes are arranged from top to bottom in the liquid cooling cavity, and one end of adjacent liquid cooling tubes is connected through the liquid inlet and liquid outlet of the connecting piece; the connecting piece is arranged in the installation groove, and the liquid inlet and the liquid outlet pass through the connecting port of the installation groove and extend into the interior of the liquid cooling cavity to be connected with the liquid cooling tubes; the water inlet and the water outlet extend out from the connecting port.

[0023] The liquid cooling channel is composed of multiple liquid cooling pipes and connecting pieces. Through the connection of the connecting pieces, the liquid cooling channel is bent and set in the liquid cooling cavity to maximize the use of the liquid cooling cavity structure and reduce the volume occupied by the equipment. At the same time, it can also make the heat dissipation more uniform. By limiting the connecting piece in the installation groove, the entire liquid cooling channel can be prevented from moving in the liquid cooling cavity.

[0024] In some embodiments, waterproof rubber rings are provided at the water inlet, the water outlet, the liquid outlet, and the connection between the liquid inlet and one end of the liquid cooling pipe.

[0025] By installing a waterproof rubber ring, the sealing of the liquid cooling channel is improved and corrosion of the PCB substrate is prevented.

[0026] In some embodiments, a fixing structure is further included, which is arranged on both sides of the liquid cooling channel and outside the mounting wall; the fixing structure is provided with a fixing buckle, and a card interface is provided on both sides of the first card connection component and the second card connection component, and the fixing structure is clamped in the card interface through the fixing buckle, so that the fixing structure is fixed.

[0027] A fixing structure is provided, which is connected to the outside of the first clamping assembly and the second clamping assembly through a fixing buckle, thereby protecting the liquid cooling channel and preventing the liquid cooling channel from shifting laterally.

[0028] The beneficial effects of the liquid cooling device of the utility model are:

[0029] The housing is provided with a liquid cooling channel, a water inlet, and a water outlet. The liquid cooling channel is located inside the housing, and the water inlet and outlet are located on the housing surface, with the water inlet and outlet respectively connected to the two ends of the liquid cooling channel. A first clamping assembly is also provided on the outer surface of the housing. Simultaneously, the PCB substrate is clamped and fixed within the first clamping assembly, and heat is dissipated by liquid flowing through the liquid cooling channel. The first clamping assembly allows the PCB substrate to adhere to the outer surface of the liquid cooling channel, reducing the volume and complexity of the liquid cooling device while enabling liquid cooling of the PCB substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a partial cross-sectional view of a liquid cooling device of the present invention;

[0031] Figure 2 A schematic diagram of a PCB substrate for a new type of liquid cooling device used herein;

[0032] Figure 3 This is a side view of a liquid cooling device of the present invention;

[0033] Figure 4 This is a view of the installation of a limiter for a liquid cooling device of the present invention;

[0034] Figure 5 This is a schematic diagram of a limiter for a liquid cooling device of the present invention;

[0035] Figure 6 This is a schematic diagram of a limiting hole in a bottom view of a liquid cooling device of the present invention;

[0036] Figure 7 This is a cross-sectional view of a liquid cooling channel of a liquid cooling device of the present invention;

[0037] Figure 8 This is a side view of a liquid cooling device of the present invention;

[0038] Figure 9This is an exploded view of a liquid cooling channel of a liquid cooling device of the present invention;

[0039] Figure 10 This is a schematic diagram of the fixed structure of a liquid cooling device of the present utility model.

[0040] Reference numerals:

[0041] 100, housing; 110, liquid-cooling channel; 111, liquid-cooling surface; 112, liquid-cooling pipe; 113, connecting piece; 120, water outlet; 130, water inlet; 140, first clamping assembly; 141, first clamping slot; 142, second clamping slot; 143, limiting hole; 144, clamping interface; 150, second clamping assembly; 151, third clamping slot; 152, fourth clamping slot; 160, limiting piece; 161, limiting base; 162, limiting buckle; 163, limiting step; 164, elastic piece; 170, mounting wall; 171, mounting groove; 172, connecting piece;

[0042] 200, PCB substrate; 210, limiting notch; 220, conductive interface; 230, electronic device;

[0043] 300, waterproof rubber ring;

[0044] 400, fixed structure; 410, fixed buckle. DETAILED DESCRIPTION

[0045] It should be noted that, in the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present invention and should not be regarded as an improper limitation on the present invention.

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the specific technical solutions of the present invention will be further described in detail below with reference to the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0047] In the embodiments of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, unless otherwise specified, "plurality" means two or more.

[0048] In addition, in the embodiments of the present invention, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to changes in the orientation of the components in the drawings.

[0049] In the embodiments of the present invention, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integrated connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0050] In the embodiments of the present invention, the terms "comprise", "include" or any other variations thereof are intended to cover non-exclusive inclusion. In the absence of further restrictions, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0051] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant information in a specific manner.

[0052] Example 1:

[0053] like Figure 1~Figure 2 As shown, this embodiment provides a liquid cooling device, including:

[0054] The housing 100 is provided with a liquid cooling channel 110, a water inlet 130, and a water outlet 120. The liquid cooling channel 110 is provided inside the housing 100, and the water inlet 130 and the water outlet 120 are provided on the surface of the housing 100, and the water inlet 130 and the water outlet 120 are respectively connected to the two ends of the liquid cooling channel 110; the outer surface of the housing 100 is also provided with a first clamping assembly 140; and

[0055] The PCB substrate 200 is fixed in the first clamping assembly 140 and dissipates heat through the liquid flowing through the liquid cooling channel 110 .

[0056] Specifically, housing 100 is made of a highly thermally conductive material, such as an aluminum alloy. Housing 100 is provided with a liquid cooling channel 110, a water inlet 130 for the coolant, and a water outlet 120 for the coolant. Through water inlet 130 and water outlet 120, the coolant carries heat away from housing 100 through liquid cooling channel 110 to the outside. The coolant can be water, oil, or a liquid with high thermal conductivity. A suitable amount of preservative or antifreeze agent may also be added to prevent metal corrosion and liquid freezing. The liquid-cooling channel 110 can be a flexible or rigid channel. The outer surface of the liquid-cooling channel 110 includes at least a conformable, uniformly liquid-cooled heat dissipation surface to dissipate heat from the non-electronic component 230 surface of the PCB substrate 200. A first snap-fit ​​assembly 140 is also provided on the surface. The first snap-fit ​​assembly 140 can be a buckle, a slot, a plug-in slot, a removable fixing structure 400, or other structure that allows the PCB substrate 200 to adhere to the surface of the liquid-cooling channel 110. The PCB substrate 200 can be an aluminum substrate with excellent heat dissipation capabilities. The PCB substrate 200 includes a circuit surface and a cooling surface conforming to the liquid-cooling channel 110. The circuit surface is provided with electronic components 230 and a conductive interface 220 to electrically connect the PCB substrate 200 to the outside world.

[0057] The beneficial effects of this embodiment are as follows: by providing a liquid cooling channel 110, a water inlet 130, and a water outlet 120 on the housing 100, the liquid cooling channel 110 is arranged inside the housing 100, and the water inlet 130 and the water outlet 120 are arranged on the surface of the housing 100, and the water inlet 130 and the water outlet 120 are respectively connected to the two ends of the liquid cooling channel 110; the outer surface of the housing 100 is also provided with a first clamping assembly 140; at the same time, the PCB substrate 200 is clamped and fixed in the first clamping assembly 140, and heat is dissipated by the liquid flowing through the liquid cooling channel 110. The first clamping assembly 140 allows the PCB substrate 200 to be attached to the outer surface of the liquid cooling channel 110, thereby reducing the volume of the liquid cooling device while also reducing the complexity of the device, while enabling the PCB substrate 200 to be liquid-cooled and dissipated.

[0058] Example 2:

[0059] like Figures 3 to 6 As shown, based on Example 1, this embodiment further optimizes and illustrates the connection structure between the PCB substrate 200 and the housing 100 mentioned in Example 1.

[0060] In some embodiments, liquid cooling surfaces 111 are provided on both sides of the liquid cooling channel 110 . The liquid cooling surfaces 111 are provided between the PCB substrate 200 and the liquid cooling channel 110 . A heat dissipation coating is provided between the liquid cooling surfaces 111 and the PCB substrate 200 .

[0061] Specifically, liquid cooling surfaces 111 are provided on both sides of the liquid cooling channel 110. The liquid cooling surfaces 111 are disposed between the PCB substrate 200 and the liquid cooling channel 110 and are in direct contact with the PCB substrate 200. This prevents the PCB substrate 200 from being damaged by the coolant freezing due to direct contact between the PCB substrate 200 and the liquid cooling channel 110, or from damage to the PCB substrate 200 due to coolant leakage. The heat dissipation coating may be thermally conductive silicone grease.

[0062] The beneficial effect of this method is that a liquid cooling surface 111 is provided between the liquid cooling channel 110 and the PCB substrate 200 to reduce direct contact between the PCB substrate 200 and the liquid cooling channel 110, and can further make the heat dissipation more uniform. In addition, a heat dissipation coating is provided between the liquid cooling surface 111 and the PCB substrate 200 to improve the heat exchange rate and further improve the heat dissipation efficiency.

[0063] In some embodiments, a second snap-fit ​​assembly 150 is further provided, and the second snap-fit ​​assembly 150 and the first snap-fit ​​assembly 140 are respectively provided on two side surfaces of the shell 100, and the PCB substrate 200 is snap-fitted and fixed in the first snap-fit ​​assembly 140 and / or in the second snap-fit ​​assembly 150; the first snap-fit ​​assembly 140 is provided with a first snap-fit ​​slot 141 and a second snap-fit ​​slot 142; the second snap-fit ​​assembly 150 is provided with a third snap-fit ​​slot 151 and a fourth snap-fit ​​slot 152, and the PCB substrate 200 is provided in the first snap-fit ​​slot 141 and the second snap-fit ​​slot 142, and / or the PCB substrate 200 is provided in the third snap-fit ​​slot 151 and the fourth snap-fit ​​slot 152; and the first snap-fit ​​slot 141 is provided below the second snap-fit ​​slot 142, and the third snap-fit ​​slot 151 is provided below the fourth snap-fit ​​slot 152.

[0064] Specifically, a second clamping assembly 150 is also provided. The second clamping assembly 150 and the first clamping assembly 140 are respectively arranged on the two side surfaces of the housing 100. The second clamping assembly 150 and the first clamping assembly 140 can be configured to have the same structure, so that the two PCB substrates 200 are arranged on both sides of the liquid cooling channel 110 and are also arranged opposite each other. The first clamping assembly 140 is fixed to the PCB substrates 200 through the first clamping slot 141 and the second clamping slot 142. The first clamping slot 141 and the second clamping slot 142 are arranged vertically to clamp the corresponding two sides of the PCB substrate 200, so that the PCB substrate 200 can be clamped to the outer surface of the liquid cooling device. The second clamping assembly 150 is clamped and fixed to the PCB substrate 200 through the third clamping slot 151 and the fourth clamping slot 152. The third clamping slot 151 and the fourth clamping slot 152 are arranged up and down to clamp the corresponding two sides of the PCB substrate 200, and the first clamping slot 141 and the third clamping slot 151 are arranged at the bottom. At the same time, the PCB substrates 200 installed on the first clamping assembly 140 and the second clamping assembly 150 can also be connected in series through the conductive interface 220 on the PCB substrate 200.

[0065] The beneficial effect of this method is that a second clamping assembly 150 is further provided, which is respectively arranged on both sides of the liquid cooling channel 110, so that the same liquid cooling device can simultaneously cool two PCB substrates 200, further rationally utilize the liquid cooling space, reduce the volume of the liquid cooling equipment, and increase the efficiency of liquid cooling. The first clamping assembly 140 and the second clamping assembly 150 are clamped together through the card slot, which simplifies the installation of the PCB substrate 200, making the structure simpler and more convenient to install.

[0066] In some embodiments, a plurality of limiting holes 143 are provided at the bottom of the first card slot 141 and the third card slot 151. The PCB substrate 200 is snapped into the first card slot 141, or is snapped into the third card slot 151, and a plurality of limiting notches 210 are provided on one side. The limiting notches 210 and the limiting holes 143 are aligned, and the limiting member 160 extends from the limiting hole 143 into the first card slot 141, or the third card slot 151 and into the limiting notches 210 to limit the PCB substrate 200.

[0067] Specifically, the bottoms of the first and third slots 141, 151 are each provided with a plurality of stopper holes 143 arranged at intervals. A corresponding PCB substrate 200 is provided with a plurality of stopper notches 210 on one side thereof, where the stopper holes 143 are engaged with the first or third slot 141, 151. The spacing between the stopper notches 210 is consistent with the spacing between the stopper holes 143. Preferably, the stopper notches 210 are rectangular, and in other embodiments, circular or triangular. The stopper 160 extends into and out of the stopper notches 210 to prevent lateral movement of the PCB substrate 200. This advantageous effect is that the stopper holes 143 are provided at the bottoms of the first and second slots 141, 142, and the stopper 160 engages the PCB substrate 200, preventing lateral movement of the PCB substrate 200.

[0068] In some embodiments, the limiting member 160 is provided with a limiting base 161, a limiting buckle 162, and a limiting step 163; the limiting buckles 162 are respectively provided on both sides of the limiting base 161, and the limiting buckles 162 are directed outward; the limiting step 163 is provided in the middle of the limiting base 161; an elastic member 164 is provided on the limiting step 163; a buckle step is also provided at the bottom of the first slot 141 and the third slot 151, and after the limiting member 160 is extended into the buckle step, the limiting buckle 162 is clamped on the buckle step, and the elastic member 164 extends into the limiting notch 210 and is clamped.

[0069] Specifically, the limiting member 160 is provided with a limiting base 161. The limiting base 161 has the same shape as the limiting notch 210, so that the limiting base 161 can extend into the limiting notch 210. Two limiting clips 162 are provided on both sides of the limiting base 161, with the clips facing outward. The limiting clips 162 are made of elastic material. During installation, the limiting clips 162 bend inward, extending the limiting member 160 into the limiting notch 210. When reaching the clip step, the limiting clip 162 rebounds outward and engages with the clip step. A limiting step 163 is provided in the middle of the limiting step 163, and an elastic member 164 is provided on the limiting step 163. The elastic member 164 can be integrally provided on the limiting step 163, or the elastic member 164 can be removed by disassembly. The elastic member 164 extends into the limiting notch 210 , and when the PCB substrate 200 is installed, the elastic member 164 abuts against the PCB substrate 200 , and the elastic member 164 provides shock absorption.

[0070] The beneficial effect of this method is that the limit member 160 is provided with limit buckles 162 on both sides of the limit base 161. When the limit member 160 is engaged, the limit buckle 162 is engaged on the buckle step. When disassembled, the limit buckle 162 is detached from the buckle step, so that the limit member 160 can be detachably arranged and the limit member 160 can be adjusted according to the size and shape of the actual PCB substrate 200.

[0071] In some embodiments, the elastic member 164 is a spring.

[0072] The elastic member 164 is a spring, which is used for positioning. At the same time, it can also reduce the vibration of the PCB substrate 200 to prevent the electronic components on the PCB substrate 200 from being separated or damaged.

[0073] Example 3:

[0074] like Figures 7 to 10 As shown, based on Example 1 and Example 2, this embodiment further defines the structures of the liquid cooling channel 110 and the housing 100 .

[0075] In some embodiments, mounting walls 170 are provided on both sides of the liquid cooling surface 111. The liquid cooling surface 111 and the mounting walls 170 form a liquid cooling cavity. The liquid cooling channel 110 is provided inside the liquid cooling cavity. A plurality of mounting grooves 171 are provided in the mounting wall 170. A connecting port 172 is provided at the bottom of the mounting groove 171.

[0076] Specifically, mounting walls 170 are provided on both sides of the liquid-cooling surface 111. The liquid-cooling surface 111 and the mounting walls 170 form a rectangular cavity, i.e., a liquid-cooling cavity. The sides of the mounting walls 170 are at the same height as the sides of the liquid-cooling surface 111, but are narrower and wider than the width of the liquid-cooling channel 110. The mounting walls 170 are provided with multiple mounting grooves 171 from top to bottom. The mounting grooves 171 on the two sides of the mounting walls 170 are not arranged at the same height. A connecting port 172 is provided at the bottom of the mounting grooves 171 to allow portions of the liquid-cooling channel 110, the water inlet 130, the water outlet 120, etc. to be disposed outside the liquid-cooling cavity through the connecting port 172. The provision of the mounting grooves 171 and the connecting port 172 facilitates the exchange of external coolant, stabilizes the liquid-cooling channel 110, and facilitates the disassembly of the liquid-cooling channel 110.

[0077] The beneficial effect of the installation of the installation wall 170 is that the liquid cooling cavity formed by the installation wall 170 and the liquid cooling surface 111 can protect the liquid cooling channel 110. At the same time, the installation groove 171 can also limit the liquid cooling channel 110 and can also play a role in structural positioning of the liquid cooling channel 110 when designing the liquid cooling channel 110.

[0078] In some embodiments, the liquid cooling channel 110 is composed of multiple liquid cooling tubes 112 and connecting pieces 113, and the connecting pieces 113 are provided with a liquid inlet and a liquid outlet; the liquid cooling tubes 112 are arranged from top to bottom in the liquid cooling cavity, and one end of adjacent liquid cooling tubes 112 is connected through the liquid inlet and liquid outlet of the connecting piece 113; the connecting piece 113 is set in the installation groove 171, and the liquid inlet and the liquid outlet pass through the connecting port 172 of the installation groove 171, and extend into the interior of the liquid cooling cavity to connect with the liquid cooling tubes 112; the water inlet 130 and the water outlet 120 extend out from the connecting port 172.

[0079] Specifically, the liquid cooling channel 110 is composed of multiple liquid cooling tubes 112 and connecting pieces 113. By staggering the adjacent end-to-end connections, a serpentine liquid cooling channel 110 is formed in the liquid cooling cavity, wherein the multiple liquid cooling tubes 112 are arranged from top to bottom, and the adjacent ends of the liquid cooling tubes 112 are connected through the liquid inlet and liquid outlet of the connecting piece 113, and the same liquid cooling tube 112 is staggered. That is, the liquid cooling tubes 112 are connected end to end to form a complete channel, and one end of the uppermost liquid cooling tube 112 is the water outlet 120, or the water inlet 130; one end of the lowermost liquid cooling tube 112 forms the water outlet 120, or the water inlet 130; so that the coolant flows in from the water inlet 130, passes through the complete liquid cooling channel 110, and flows out from the water outlet 120. The water inlet 130 and the water outlet 120 extend from the same side mounting wall 170 to facilitate the flow of the coolant. At the same time, the connecting piece 113 is set to be U-shaped, and the mounting groove 171 is also set to be consistent with the shape of the connecting piece 113, and two connecting ports 172 are cooperatively provided in the same mounting groove 171, so that the U-shaped connecting piece 113 can be inserted into the mounting groove 171; and the liquid inlet and liquid outlet extend out from the connecting port 172 and extend into the liquid cooling cavity and are connected to the liquid cooling pipe 112, so that the liquid cooling channel 110 is clamped on the mounting wall 170 through the connecting piece 113, so that the liquid cooling channel 110 is fixed inside the liquid cooling cavity to prevent shaking. At the same time, the liquid cooling channel 110 can be disassembled by externally disassembling the connecting piece 113, making disassembly more convenient; wherein, the position of the liquid cooling pipe 112 is also related to the position of the electronic device 230 on the PCB substrate 200. Through the fixation of the mounting groove 171, the liquid cooling pipe 112 can be set at a position to keep the electronic device 230 at the same height, thereby more effectively dissipating heat for the electronic device 230.

[0080] The beneficial effect of this method is that the liquid cooling channel 110 is composed of multiple liquid cooling tubes 112 and connecting pieces 113. Through the connection of the connecting pieces 113, the liquid cooling channel 110 is bent and set in the liquid cooling cavity to maximize the use of the liquid cooling cavity structure and reduce the volume occupied by the equipment. At the same time, it can also make the heat dissipation more uniform during heat dissipation. By limiting the connecting piece 113 in the installation groove 171, the entire liquid cooling channel 110 can be prevented from moving in the liquid cooling cavity.

[0081] In some embodiments, a waterproof rubber ring 300 is provided at the water inlet 130 , the water outlet 120 , the liquid outlet, and the connection between the liquid inlet and one end of the liquid cooling pipe 112 .

[0082] By providing the waterproof rubber ring 300 , the sealing performance of the liquid cooling channel 110 is improved, and corrosion of the PCB substrate 200 is also prevented.

[0083] In some embodiments, a fixing structure 400 is also included, which is arranged on both sides of the liquid cooling channel 110 and outside the mounting groove 171; the fixing structure 400 is provided with a fixing buckle 410, and a card interface 144 is provided on both sides of the first card assembly 140 and the second card assembly 150. The fixing structure 400 is clamped in the card interface 144 through the fixing buckle 410, so that the fixing structure 400 is fixed.

[0084] Specifically, the fixing structure 400 can cover the outside of the mounting wall 170 to protect the mounting groove 171 and prevent the connecting member 113 disposed inside the mounting groove 171 from shifting. A fixing buckle 410 is provided on the fixing structure 400. The fixing buckle 410 is made of an elastic material and has a card interface 144 on both sides of the first and second card components 140, 150. The card interface 144 can be a rectangular notch. The fixing buckle 410 deforms and extends into the first and second card components 140, 150. When the fixing buckle 410 reaches the card interface 144, it deforms and rebounds to be locked into the card interface 144.

[0085] The beneficial effect of this method is that the fixing structure 400 is provided, and is clamped to the outside of the first clamping assembly 140 and the second clamping assembly 150 through the fixing buckle 410, thereby protecting the liquid cooling channel 110 and preventing the liquid cooling channel 110 from shifting laterally.

[0086] The serial numbers of the utility model embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are only preferred embodiments of the utility model and do not limit the scope of the patent of the utility model. Any equivalent device or equivalent process transformation made by using the contents of the utility model specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the scope of patent protection of the utility model.

Claims

1. A liquid cooling device, characterized in that: include: A housing (100) is provided with a liquid cooling channel (110), a water inlet (130) and a water outlet (120); the liquid cooling channel (110) is provided inside the housing (100); the water inlet (130) and the water outlet (120) are provided on the surface of the housing (100); and the water inlet (130) and the water outlet (120) are respectively connected to two ends of the liquid cooling channel (110); and a first clamping assembly (140) is further provided on the outer surface of the housing (100); and The PCB substrate (200) is clamped and fixed in the first clamping assembly (140), and dissipates heat through liquid flowing through the liquid cooling channel (110).

2. The liquid cooling device according to claim 1, characterized in that Liquid cooling surfaces (111) are provided on both sides of the liquid cooling channel (110), the liquid cooling surfaces (111) are provided between the PCB substrate (200) and the liquid cooling channel (110), and a heat dissipation coating is provided between the liquid cooling surfaces (111) and the PCB substrate (200).

3. The liquid cooling device according to claim 2, characterized in that A second snap-fit ​​assembly (150) is also provided. The second snap-fit ​​assembly (150) and the first snap-fit ​​assembly (140) are respectively provided on two side surfaces of the housing (100). The PCB substrate (200) is snap-fitted and fixed in the first snap-fit ​​assembly (140) and / or in the second snap-fit ​​assembly (150). The first snap-fit ​​assembly (140) is provided with a first snap-fit ​​slot (141) and a second snap-fit ​​slot (142). The second snap-fit ​​assembly (150) is provided with a third snap-fit ​​slot (151) and a fourth snap-fit ​​slot (152). The PCB substrate (200) is provided in the first snap-fit ​​slot (141) and the second snap-fit ​​slot (142), and / or the PCB substrate (200) is provided in the third snap-fit ​​slot (151) and the fourth snap-fit ​​slot (152). The first snap-fit ​​slot (141) is provided below the second snap-fit ​​slot (142), and the third snap-fit ​​slot (151) is provided below the fourth snap-fit ​​slot (152).

4. The liquid cooling device according to claim 3, characterized in that The bottom of the first card slot (141) and the bottom of the third card slot (151) are both provided with a plurality of limiting holes (143); the PCB substrate (200) is clamped in the first card slot (141), or is clamped in the third card slot (151) and is provided with a plurality of limiting notches (210) on one side; the limiting notches (210) and the limiting holes (143) are aligned, and a limiting member (160) is extended from the limiting hole (143) into the first card slot (141), or the third card slot (151) and into the limiting notches (210) to limit the PCB substrate (200).

5. The liquid cooling device according to claim 4, characterized in that: The limiting member (160) is provided with a limiting base (161), a limiting buckle (162), and a limiting step (163); the limiting buckles (162) are respectively provided on both sides of the limiting base (161), and the limiting buckles (162) are directed outward; the limiting step (163) is provided in the middle of the limiting base (161); an elastic member (164) is provided on the limiting step (163); a buckle step is further provided at the bottom of the first clamping slot (141) and the third clamping slot (151); after the limiting member (160) is inserted into the buckle step, the limiting buckle (162) is clamped on the buckle step, and the elastic member (164) is inserted into the limiting notch (210) and clamped.

6. The liquid cooling device according to claim 5, characterized in that The elastic member (164) is a spring.

7. The liquid cooling device according to claim 3, characterized in that Mounting walls (170) are provided on both sides of the liquid cooling surface (111), the liquid cooling surface (111) and the mounting walls (170) form a liquid cooling cavity, the liquid cooling channel (110) is provided inside the liquid cooling cavity, a plurality of mounting grooves (171) are provided in the mounting walls (170), and a connecting port (172) is provided at the bottom of the mounting grooves (171).

8. The liquid cooling device according to claim 7, characterized in that: The liquid cooling channel (110) is composed of a plurality of liquid cooling tubes (112) and a connecting piece (113), and the connecting piece (113) is provided with a liquid inlet and a liquid outlet; the liquid cooling tubes (112) are arranged from top to bottom in the liquid cooling cavity, and one end of adjacent liquid cooling tubes (112) is connected through the liquid inlet and the liquid outlet of the connecting piece (113); the connecting piece (113) is arranged in the installation groove (171), and the liquid inlet and the liquid outlet pass through the connecting port (172) of the installation groove (171) and extend into the interior of the liquid cooling cavity to be connected with the liquid cooling tubes (112); the water inlet (130) and the water outlet (120) extend out of the connecting port (172).

9. The liquid cooling device according to claim 8, characterized in that A waterproof rubber ring (300) is provided at the water inlet (130), the water outlet (120), the liquid outlet, and the connection between the liquid inlet and one end of the liquid cooling pipe (112).

10. The liquid cooling device according to claim 9, characterized in that: The invention also includes a fixing structure (400), wherein the fixing structure (400) is arranged on both sides of the installation wall (170) and outside the installation groove (171); the fixing structure (400) is provided with a fixing buckle (410), and a card interface (144) is provided on both sides of the first clamping assembly (140) and the second clamping assembly (150), and the fixing structure (400) is clamped in the card interface (144) through the fixing buckle (410), so that the fixing structure (400) is fixed.

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