Hot pasting head with elastic grabbing function and chip mounter

Abstract

The utility model belongs to the technical field of component assembly part manufacturing equipment, and particularly relates to a hot pasting head with an elastic grabbing function and a chip mounter, and the hot pasting head comprises a rotating assembly, a buffer assembly, and a suction assembly. Wherein the rotating assembly, the buffering assembly and the sucking assembly are connected in sequence; the suction assembly is suitable for sucking an element, so that the rotating assembly drives the buffer assembly and the suction assembly to rotate; the rotating assembly and / or the suction assembly are / is suitable for extruding the buffering assembly so as to adjust the distance between the rotating assembly and the suction assembly. According to the utility model, the buffer assembly is arranged between the rotating assembly and the suction assembly, so that a certain buffer space can be provided, soft contact between the suction assembly and an element is realized, the problem that the element is easily damaged under the conditions that a traditional chip mounting head cannot be accurately positioned and pressure fluctuates is solved, and the safety of sucking the element is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of component installation, and specifically relates to equipment for manufacturing component assemblies, in particular to a thermal mounting head and a mounting machine with an elastic grasping function. Background Art

[0002] The traditional placement head is driven by a robotic arm and is in direct hard contact with the component. On the one hand, the placement head and the component cannot be accurately positioned. On the other hand, the pressure of the placement head on the component fluctuates, which can easily cause damage to the component.

[0003] Therefore, there is an urgent need to develop a new thermal bonding head and placement machine with elastic gripping function to solve the technical problem of how to overcome the damage to components caused by direct hard contact between the bonding head and the components when precise positioning cannot be achieved and pressure fluctuates.

[0004] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Utility Model Content

[0005] The embodiments of the present disclosure at least provide a thermal bonding head and a chip bonding machine with an elastic gripping function.

[0006] In a first aspect, an embodiment of the present disclosure provides a thermal bonding head with an elastic gripping function, which includes: a rotating component, a buffer component and a suction component; wherein the rotating component, the buffer component and the suction component are connected in sequence; the suction component is suitable for sucking elements so that the rotating component drives the buffer component and the suction component to rotate; and the rotating component and / or the suction component are suitable for squeezing the buffer component to adjust the distance between the rotating component and the suction component.

[0007] In an optional embodiment, the rotating component includes: a rotating controller and a motor unit; the motor unit is electrically connected to the rotating controller, and the motor unit is connected to the buffer component; the rotating controller is suitable for driving the motor unit to rotate, thereby driving the buffer component to rotate.

[0008] In an optional embodiment, the motor unit includes: a first fixing seat, a stator and a rotor; the stator is connected to the bottom of the first fixing seat, the rotor is connected to the stator, and the stator is electrically connected to the rotation controller.

[0009] In an optional embodiment, the motor unit further includes: a pressure collector; the pressure collector is sleeved on the top of the first mounting seat, and the pressure collector is electrically connected to the rotation controller.

[0010] In an optional embodiment, the buffer assembly includes: at least two guide rods and at least two buffer springs; at least two longitudinal movement grooves are opened at the bottom of the rotor; the upper part of each guide rod extends into the corresponding longitudinal movement groove, and the bottom of each guide rod is connected to the top of the positioning platform in the suction assembly; each buffer spring is respectively mounted on the corresponding guide rod, and one end of the buffer spring is connected to the rotor, and the other end of the buffer spring is connected to the top of the positioning platform.

[0011] In an optional embodiment, the buffer assembly further includes: at least two distance sensors; each of the distance sensors is respectively distributed at the bottom of the rotor or the top of the positioning platform, and each of the distance sensors is respectively electrically connected to the rotation controller.

[0012] In an optional embodiment, the buffer assembly further includes: a sealing membrane; the sealing membrane is arranged in a ring shape, and the sealing membrane is respectively connected to the bottom outer ring of the rotor and the top outer ring of the positioning platform.

[0013] In an optional embodiment, the suction assembly includes: a positioning platform and a heating module; the top of the positioning platform is connected to each guide rod, the heating module is installed at the bottom of the positioning platform, and the heating module is electrically connected to the rotation controller.

[0014] In an optional embodiment, the suction component further includes: an air pipe; the air pipe passes through the positioning platform and the heating module, and the bottom of the air pipe is flush with the bottom of the heating module to adsorb or release the element at the bottom of the heating module.

[0015] In a second aspect, an embodiment of the present disclosure provides a placement machine, which includes: a robotic arm and a thermal placement head with an elastic gripping function as described above; wherein the thermal placement head with an elastic gripping function is connected to the robotic arm.

[0016] The beneficial effect of the present invention is that, by arranging a buffer component between the rotating component and the suction component, the present invention can provide a certain buffer space, realize soft contact between the suction component and the component, overcome the problem that the traditional patch head is easy to damage the component when it cannot be accurately positioned and the pressure fluctuates, and improve the safety of the suction component.

[0017] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A structural diagram of a thermal bonding head with elastic gripping function provided in an embodiment of the present disclosure;

[0021] Figure 2 A block diagram of the principle of a thermal bonding head with elastic gripping function provided in an embodiment of the present disclosure;

[0022] Figure 3 A schematic diagram of a chip placement machine provided in an embodiment of the present disclosure.

[0023] In the picture:

[0024] 1. Rotating assembly; 11. First fixed seat; 12. Stator; 13. Rotor; 131. Longitudinal moving slot; 14. Pressure collector;

[0025] 2. Buffer assembly; 21. Guide rod; 22. Buffer spring; 23. Distance sensor; 24. Sealing film;

[0026] 3. Suction assembly; 31. Positioning platform; 32. Heating module; 33. Air pipe;

[0027] 4. Components;

[0028] 5. Robotic arm. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0030] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of components may be exaggerated or reduced in order to effectively describe technical content.

[0031] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0033] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0034] like Figures 1 to 2 At least one embodiment provides a thermal bonding head with an elastic gripping function, which includes: a rotating component 1, a buffer component 2 and a suction component 3; wherein the rotating component 1, the buffer component 2 and the suction component 3 are connected in sequence; the suction component 3 is suitable for sucking the element 4, so that the rotating component 1 drives the buffer component 2 and the suction component 3 to rotate; and the rotating component 1 and / or the suction component 3 are suitable for squeezing the buffer component 2 to adjust the distance between the rotating component 1 and the suction component 3.

[0035] In at least one embodiment, by setting a buffer component 2 between the rotating component 1 and the suction component 3, a certain buffer space can be provided to achieve soft contact between the suction component 3 and the component 4, thereby overcoming the problem that the traditional patch head is prone to damaging the component 4 when it cannot be accurately positioned and the pressure fluctuates, and improving the safety of the suction component 4.

[0036] In at least one embodiment, the rotating component 1 includes: a rotating controller and a motor unit; the motor unit is electrically connected to the rotating controller, and the motor unit is connected to the buffer component 2; the rotating controller is suitable for driving the motor unit to rotate, thereby driving the buffer component 2 to rotate.

[0037] Specifically, the rotation controller may adopt an STM32 series single chip microcomputer.

[0038] Specifically, the rotation controller can control the motor unit to rotate, and then when the suction assembly 3 absorbs the component 4, the motor unit drives the buffer unit, the suction unit and the component 4 to rotate.

[0039] In at least one embodiment, the motor unit includes: a first fixing base 11, a stator 12 and a rotor 13; the stator 12 is connected to the bottom of the first fixing base 11, the rotor 13 is connected to the stator 12, and the stator 12 is electrically connected to the rotation controller.

[0040] Specifically, the first fixing seat 11 functions as a transfer, and can be used to install the stator 12 and the rotor 13 . Meanwhile, the first fixing seat 11 can be installed on the robotic arm 5 .

[0041] In at least one embodiment, the motor unit further includes: a pressure collector 14; the pressure collector 14 is sleeved on the top of the first mounting seat, and the pressure collector 14 is electrically connected to the rotation controller.

[0042] Specifically, the pressure collector 14 may adopt an hx711 pressure sensor chip.

[0043] Specifically, the pressure collector 14 can directly collect the pressure value of the thermal head and send the pressure value to the rotation controller, thereby accurately measuring the pressure value of the thermal head.

[0044] Specifically, the pressure collector 14 is connected to the first fixing seat 11 through threads.

[0045] In at least one embodiment, the buffer assembly 2 includes: at least two guide rods 21 and at least two buffer springs 22; at least two longitudinal movement grooves 131 are opened at the bottom of the rotor 13; the upper part of each guide rod 21 extends into the corresponding longitudinal movement groove 131, and the bottom of each guide rod 21 is connected to the top of the positioning platform 31 in the suction assembly 3; each buffer spring 22 is respectively mounted on the corresponding guide rod 21, and one end of the buffer spring 22 is connected to the rotor 13, and the other end of the buffer spring 22 is connected to the top of the positioning platform 31.

[0046] Specifically, the guide rod 21 cooperates with the buffer spring 22 to connect the positioning platform 31 and the rotor 13 together, so that the rotor 13 drives the positioning platform 31 to rotate. At the same time, the positioning platform 31 and / or the rotor 13 can squeeze the buffer spring 22, so that the guide rod 21 extends into the longitudinal moving groove 131, thereby adjusting the distance between the positioning platform 31 and the rotor 13. At the same time, the buffer spring 22 can also push the positioning platform 31 to reset.

[0047] In at least one embodiment, the buffer assembly 2 further includes: at least two distance sensors 23; each of the distance sensors 23 is respectively distributed at the bottom of the rotor 13 or the top of the positioning platform 31, and each of the distance sensors 23 is respectively electrically connected to the rotation controller.

[0048] Specifically, the distance sensor may adopt the HC-SR04 distance measuring sensor chip.

[0049] Specifically, at least two distance sensors 23 are provided to detect whether the positioning platform 31 or the rotor 13 is flat, thereby preventing the positioning platform 31 or the rotor 13 from tilting.

[0050] In at least one embodiment, the buffer assembly 2 further includes: a sealing membrane 24 ; the sealing membrane 24 is arranged in a ring shape, and the sealing membrane 24 is respectively connected to the bottom outer ring of the rotor 13 and the top outer ring of the positioning platform 31 .

[0051] Specifically, the sealing film 24 plays a role in waterproofing and dustproofing, thereby increasing the service life of the device.

[0052] In at least one embodiment, the suction assembly 3 includes: a positioning platform 31 and a heating module 32; the top of the positioning platform 31 is connected to each guide rod 21, the heating module 32 is installed at the bottom of the positioning platform 31, and the heating module 32 is electrically connected to the rotation controller.

[0053] Specifically, the heating module 32 includes a heating block and a heating circuit, that is, the heating module 32 realizes the heating function.

[0054] In at least one embodiment, the suction component 3 further includes: an air pipe 33; the air pipe 33 passes through the positioning platform 31 and the heating module 32, and the bottom of the air pipe 33 is flush with the bottom of the heating module 32 to adsorb or release the element 4 at the bottom of the heating module 32.

[0055] Specifically, the air pipe 33 is connected to an external air pump to realize the negative pressure adsorption element 4 or the positive pressure release element 4 .

[0056] like Figures 1 to 3At least one embodiment provides a placement machine, which includes: a robotic arm 5 and a thermal bonding head with an elastic gripping function as described above; wherein the thermal bonding head with an elastic gripping function is connected to the robotic arm 5.

[0057] To sum up, the present invention can provide a certain buffer space by setting a buffer component between the rotating component and the suction component, so as to achieve soft contact between the suction component and the component, overcome the problem that the traditional patch head is prone to damage to the component when it cannot be accurately positioned and the pressure fluctuates, and improve the safety of the suction component.

[0058] In the description of the embodiments of the present invention, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0059] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used herein unless expressly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0060] Spatially relative terms, such as "inside," "outside," "below," "beneath," "down," "above," "on," etc., may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms may be intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as being "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0061] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A thermal bonding head with elastic gripping function, characterized in that: include: A rotating assembly (1), a buffer assembly (2) and a suction assembly (3); in The rotating component (1), the buffer component (2), and the suction component (3) are connected in sequence; The suction component (3) is suitable for sucking the element (4) so ​​that the rotating component (1) drives the buffer component (2) and the suction component (3) to rotate; and The rotating component (1) and / or the suction component (3) is suitable for squeezing the buffer component (2) to adjust the distance between the rotating component (1) and the suction component (3).

2. The thermal bonding head with elastic gripping function according to claim 1, characterized in that: The rotating assembly (1) comprises: a rotating controller and a motor unit; The motor unit is electrically connected to the rotation controller, and the motor unit is connected to the buffer component (2); The rotation controller is suitable for driving the motor unit to rotate, thereby driving the buffer component (2) to rotate.

3. The thermal bonding head with elastic gripping function as claimed in claim 2, characterized in that: The motor unit comprises: a first fixing seat (11), a stator (12) and a rotor (13); The stator (12) is connected to the bottom of the first fixing seat (11), the rotor (13) is connected to the stator (12), and the stator (12) is electrically connected to the rotation controller.

4. The thermal bonding head with elastic gripping function as claimed in claim 3, characterized in that: The motor unit further includes: a pressure collector (14); The pressure collector (14) is sleeved on the top of the first mounting seat, and the pressure collector (14) is electrically connected to the rotation controller.

5. The thermal bonding head with elastic gripping function as claimed in claim 3, characterized in that: The buffer assembly (2) comprises: at least two guide rods (21) and at least two buffer springs (22); At least two longitudinal movement slots (131) are formed at the bottom of the rotor (13); The upper portion of each guide rod (21) extends into the corresponding longitudinal movement groove (131), and the bottom of each guide rod (21) is connected to the top of the positioning platform (31) in the suction component (3); Each buffer spring (22) is respectively sleeved on a corresponding guide rod (21), and one end of the buffer spring (22) is connected to the rotor (13), and the other end of the buffer spring (22) is connected to the top of the positioning platform (31).

6. The thermal bonding head with elastic gripping function as claimed in claim 5, characterized in that: The buffer assembly (2) further includes: at least two distance sensors (23); Each of the distance sensors (23) is respectively distributed at the bottom of the rotor (13) or the top of the positioning platform (31), and each of the distance sensors (23) is respectively electrically connected to the rotation controller.

7. The thermal bonding head with elastic gripping function as claimed in claim 5, characterized in that: The buffer assembly (2) further includes: a sealing film (24); The sealing film (24) is arranged in a ring shape, and the sealing film (24) is respectively connected to the bottom outer ring of the rotor (13) and the top outer ring of the positioning platform (31).

8. The thermal bonding head with elastic gripping function as claimed in claim 5, characterized in that: The suction component (3) comprises: a positioning platform (31) and a heating module (32); The top of the positioning platform (31) is connected to each guide rod (21), the heating module (32) is installed on the bottom of the positioning platform (31), and the heating module (32) is electrically connected to the rotation controller.

9. The thermal bonding head with elastic gripping function as claimed in claim 8, characterized in that: The suction assembly (3) further includes: an air pipe (33); The air pipe (33) passes through the positioning platform (31) and the heating module (32), and the bottom of the air pipe (33) is flush with the bottom of the heating module (32) to adsorb or release the component (4) at the bottom of the heating module (32).

10. A chip mounter, characterized in that: include: A robotic arm (5) and a thermal bonding head with an elastic gripping function as claimed in any one of claims 1 to 9; in The thermal bonding head with elastic grasping function is connected to the robotic arm (5).

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