LED packaging device

Abstract

The utility model relates to the technical field of semiconductor light emitting, and discloses an LED packaging device, which comprises a support, an LED light emitting chip, a first fluorescent glue layer and a second fluorescent glue layer. The LED light-emitting chips are arranged on the support, and the number of the LED light-emitting chips is at least two. The first fluorescent glue layer is arranged on the support and covers the upper surface and the side face of the LED light-emitting chip. The second fluorescent glue layer is arranged on the support and covers the upper surface and the side face of the first fluorescent glue layer. A reflecting surface is arranged on the side surface of the second fluorescent glue layer and is used for reflecting incident light on the side surface for multiple times and enabling the incident light to be emitted from the upper surface. The high-reflection glue layer is arranged on the support and wraps the reflection surface. According to the utility model, the excitation efficiency of the wavelength conversion particles in unit volume is high due to the double-layer fluorescent glue layer structure, so that the lighting effect is improved. The arrangement of the reflecting surface reduces the light emitting surface of the second fluorescent glue layer, so that the size of the lens is reduced, the product size is greatly reduced, and the system cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting technology, and in particular relates to an LED packaging device. Background Art

[0002] The existing technology of producing white light by LED light emitting chip is to mix the three primary colors of RGB. This method is to combine three light emitting chips of green, red and blue, and then mix the green, red and blue lights in a certain proportion to form white light. The production cost of this method is high. The existing technology is to coat a layer of phosphor glue on the blue light emitting chip. Figure 7-8 An LED light-emitting chip 2 is fixed in the bracket 1, and the front and side surfaces of the LED light-emitting chip 2 are covered with a first fluorescent glue layer 3. The first fluorescent glue layer 3 includes at least two wavelength conversion particles. This method uses the blue light emitted by the LED light-emitting chip 2 to excite the fluorescent powder to produce three primary colors of light, and the three primary colors of light are mixed to form white light. However, the blue light emitted by the LED light-emitting chip 2 to excite the fluorescent powder is currently mixed, with low excitation efficiency and low light efficiency. In addition, because the first fluorescent glue layer 3 fills the entire bracket 1, the light-emitting surface size of the first fluorescent glue layer 3 is large, which in turn makes the volume of the LED package device larger.

[0003] Based on the above, the utility model provides an LED packaging device with high phosphor excitation efficiency, high luminous efficacy, and small system volume. Utility Model Content

[0004] The purpose of the utility model is to provide an LED packaging device, aiming to solve the problems in the prior art of low efficiency in exciting phosphors, low light efficiency, and large system volume.

[0005] The utility model is implemented as follows: an LED packaging device includes:

[0006] Bracket;

[0007] An LED light-emitting chip is provided on the bracket, and the number of the LED light-emitting chips is at least 2;

[0008] A first fluorescent adhesive layer is provided on the bracket and covers the upper surface and side surfaces of the LED light-emitting chip; a first reflective surface is provided on the side surface of the first fluorescent adhesive layer, and the first reflective surface is provided as a concave arc surface;

[0009] a second fluorescent adhesive layer provided on the bracket and covering the upper surface of the first fluorescent adhesive layer or covering the upper surface and side surfaces of the first fluorescent adhesive layer; a second reflective surface is provided on the side surfaces of the second fluorescent adhesive layer;

[0010] A high-reflective adhesive layer is provided on the bracket and covers the second reflective surface or covers the first reflective surface and the second reflective surface.

[0011] Furthermore, the second fluorescent adhesive layer covers the upper surface and side surfaces of the first fluorescent adhesive layer; and the second reflective surface is configured as a concave arc surface.

[0012] Furthermore, the cross section enclosed by the second reflecting surface is configured to be narrow in the middle and wide at both ends, or the cross section enclosed by the second reflecting surface gradually narrows in a direction away from the bracket.

[0013] Furthermore, the second fluorescent adhesive layer only covers the upper surface of the first fluorescent adhesive layer; and the second reflective surface is set to be a positive conical or inverted conical inclined surface.

[0014] Furthermore, the cross section enclosed by the first reflecting surface is configured to be narrow in the middle and wide at both ends, or the cross section enclosed by the first reflecting surface gradually narrows in a direction away from the bracket.

[0015] Furthermore, the thickness of the second fluorescent adhesive layer is less than or equal to the thickness of the first fluorescent adhesive layer.

[0016] Furthermore, the upper surface of the second fluorescent glue layer is a flat surface or a slightly curved surface.

[0017] Furthermore, the first fluorescent glue layer and the second fluorescent glue layer respectively include first wavelength conversion particles and second wavelength conversion particles, the first wavelength conversion particles are used to convert the wavelength of light emitted by the LED light-emitting chip into a wavelength θ, and the second wavelength conversion particles are used to convert the wavelength of light emitted by the LED light-emitting chip into a wavelength γ, satisfying θ<γ.

[0018] Furthermore, it also includes a lens, which includes an optical functional area and a receiving portion connected to the four sides of the optical functional area; the optical functional area is arranged above the second fluorescent glue layer, and the bottom of the receiving portion is connected to the top surface of the four sides of the bracket.

[0019] Furthermore, the lengths between the receiving portion and the two side surfaces of the bracket are L and W respectively, satisfying L≤W.

[0020] Compared with the prior art, the LED packaging device provided by the present invention has the following beneficial effects:

[0021] 1. The "double-layer fluorescent glue layer" structure composed of the first fluorescent glue layer 3 and the second fluorescent glue layer 4 has a higher excitation efficiency of the wavelength conversion particles per unit volume and thus a higher light efficiency than a single fluorescent glue layer composed of a mixture of multiple wavelength conversion particles.

[0022] 2. The present invention sets a second reflective surface 41 and fills the bracket 1 with a high-reflective adhesive layer 5 while covering the second reflective surface 41, thereby reducing the light-emitting surface of the first fluorescent adhesive layer 3 and the second fluorescent adhesive layer 4, thereby reducing the size of the lens, greatly reducing the product size and reducing the system cost.

[0023] 3. Second reflective surface 41 is used to reflect incident light from the side multiple times and direct it out through the top surface. This configuration ensures that light is emitted from the top surface, and is suitable for chips with light emitting from one surface (the top surface or one side surface) as well as chips with light emitting from five surfaces (the top surface and four side surfaces). Furthermore, light of different colors is reflected multiple times between second reflective surfaces 41, increasing the number of times the different colors intersect and achieving more uniform light mixing. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the cross-sectional structure of the LED packaging device provided by the present invention;

[0025] Figure 2 This is a top view of the LED packaging device provided by the present invention;

[0026] Figure 3 This is a schematic cross-sectional view of the LED packaging device according to the first embodiment of the present invention;

[0027] Figure 4 This is a schematic cross-sectional view of the LED packaging device according to the second embodiment of the present invention;

[0028] Figure 5 This is a schematic cross-sectional view of the LED packaging device according to the third embodiment of the present invention;

[0029] Figure 6 yes Figure 5 A partial enlarged view of

[0030] Figure 7 This is a schematic cross-sectional view of an LED packaging device according to the second prior art;

[0031] Figure 8 This is a top view of the LED packaging device provided by the second prior art;

[0032] In the figure: 1- bracket; 2- LED light-emitting chip; 3- first fluorescent adhesive layer; 31- first reflective surface; 4- second fluorescent adhesive layer; 41- second reflective surface; 5- high reflective adhesive layer; 6- lens; 61- optical functional area; 62- receiving part; 7- adhesive glue. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0035] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0036] Reference Figure 1-8 The figure shows a preferred embodiment of the present invention.

[0037] The LED package device of the present invention comprises a bracket 1, an LED light emitting chip 2, a first fluorescent adhesive layer 3 and a second fluorescent adhesive layer 4. Figure 1-2 .

[0038] The LED light-emitting chip 2 is arranged on the bracket 1, and the number of LED light-emitting chips 2 is at least 2. The first fluorescent glue layer 3 is arranged on the bracket 1 and can cover the upper surface and side surfaces of the LED light-emitting chip 2. The first fluorescent glue layer 3 includes first wavelength conversion particles, which can convert the wavelength of a portion of the light emitted by the LED light-emitting chip 2, for example, the blue light wavelength can be converted into the green light wavelength. The upper surface or the upper surface and side surfaces of the first fluorescent glue layer 3 are covered with a second fluorescent glue layer 4, and the bottom of the second fluorescent glue layer 4 is arranged on the bracket 1. The second fluorescent glue layer 4 includes second wavelength conversion particles, which can convert the wavelength of a portion of the light emitted by the LED light-emitting chip 2, for example, the blue light wavelength can be converted into the red light wavelength. Preferably, the first wavelength conversion particles convert the wavelength of the light emitted by the LED light-emitting chip 2 into a wavelength θ, and the second wavelength conversion particles convert the wavelength of the light emitted by the LED light-emitting chip 2 into a wavelength γ, satisfying θ<γ.

[0039] The light emitted by LED chip 2 is excited by the first and second fluorescent adhesive layers 3 and 4 to produce different colors of light. This light is then mixed with the unexcited light from LED chip 2 before being emitted, achieving color conversion. For example, in a blue-to-white light conversion setup, a portion of the blue light emitted by LED chip 2 is converted to green light by the first fluorescent adhesive layer 3 (containing green phosphor), a portion of the blue light is converted to red light by the second fluorescent adhesive layer 4 (containing red phosphor), and a portion of the blue light remains unexcited. The green, red, and blue light then mix to form white light for output.

[0040] Compared to the single-layer fluorescent adhesive layer of the prior art, which mixes first and second wavelength-converting particles, the double-layer fluorescent adhesive layer of this invention significantly improves the excitation efficiency of the wavelength-converting particles per unit volume, thereby enhancing the luminous efficiency. Preferably, the thickness of the second fluorescent adhesive layer 4 is less than or equal to the thickness of the first fluorescent adhesive layer 3.

[0041] A first reflective surface 31 is provided on the side of the first fluorescent adhesive layer 3. The first reflective surface 31 is configured as an inwardly concave arc surface. The first reflective surface 31 can reflect light incident on the side of the first fluorescent adhesive layer 3 multiple times and emit it from the upper surface. Preferably, the cross-section enclosed by the first reflective surface 31 is configured to be narrow in the middle and wide at both ends, or the cross-section enclosed by the first reflective surface 31 is configured to gradually narrow as it moves away from the bracket 1.

[0042] The second fluorescent adhesive layer 4 is provided with a second reflective surface 41 on its side. This second reflective surface 41 is used to multiple-reflect incident light from the side of the second fluorescent adhesive layer 4 and direct it out through the top surface. The arrangement of the first and second reflective surfaces 31 and 41 ensures that light is emitted from the top surface, making it suitable for chips that emit light from one surface (the top surface or one side surface) as well as chips that emit light from five surfaces (the top surface and four side surfaces). Furthermore, the multiple reflections of different colored light between the first and second reflective surfaces 31 and 41 increase the number of interleavings of different colors, resulting in more uniform light mixing.

[0043] Preferably, the second reflective surface 41 can be configured as a concave arc surface. When cut along the bracket 1 toward the second fluorescent adhesive layer 4, the cross-section formed by the second reflective surfaces 41 on both sides can be configured to be narrow in the middle and wide at both ends, or the cross-section formed by the second reflective surfaces 41 on both sides can be configured to gradually narrow as it moves away from the bracket 1. Furthermore, the upper surface of the second fluorescent adhesive layer 4 can be configured as a flat surface or a slightly curved surface to achieve more uniform light output.

[0044] Preferably, the second reflective surface 41 can also be configured as a forward conical or inverted conical inclined surface, and the second fluorescent adhesive layer 4 is configured to cover only the upper surface of the first fluorescent adhesive layer 3. The forward conical shape of the second reflective surface 41 can shorten the distance that high-angle edge light propagates within the second fluorescent adhesive layer 4, thereby reducing the distance that edge light and central light propagate within the second fluorescent adhesive layer 4. This results in consistent and uniform light output color, effectively preventing yellowing at the edges of the light field.

[0045] The high reflective adhesive layer 5 is provided on the bracket 1 and covers the second reflective surface 41 or covers the first reflective surface 31 and the second reflective surface 41, thereby ensuring the reflection effect of the first reflective surface 31 and the second reflective surface 41. Through the combined effect of the high reflective adhesive 5 and the second reflective surface 41 and / or the high reflective adhesive 5 and the first reflective surface 31, the reflective effect of the first reflective surface 31 and the second reflective surface 41 is achieved. Figure 1-2 Compared with the second prior art, the light-emitting surface of the fluorescent glue layer is reduced, thereby reducing the size of the lens, greatly reducing the size of the finished product and the system cost.

[0046] For further optical adjustments of the light, refer to Figure 5 A lens 6 is also positioned above the bracket 1. The lens 6 comprises an optically functional area 61 and a connecting portion 62 surrounding the optically functional area 61. The optically functional area 61 is positioned above the second fluorescent adhesive layer 4. The lens 6 and the second fluorescent adhesive layer 4 can be separated by a cavity, or the lens 6 and the second fluorescent adhesive layer 4 can be tightly bonded. Light emitted from the second fluorescent adhesive layer 4 is incident on the optically functional area 61, where it undergoes optical shaping to achieve a predetermined light output angle and intensity.

[0047] The bottom of the receiving portion 62 is connected to the top surface of the bracket 1. The lengths between the receiving portion 62 and the two side surfaces of the bracket 1 are L and W, respectively, satisfying L≤W. Figure 5 Preferably, the outer side of the receiving portion 62 is arranged on the inner side of the outer side of the bracket 1, that is, the distance L between the outer sides of the receiving portion 62 on both sides is smaller than the distance W between the outer sides of the bracket 1 on both sides. Figure 6 The receiving portion 62 is connected to the bracket 1 by adhesive 7. The adhesive 7 is filled on the bottom surface of the receiving portion 62 and the top surface around the bracket 1, as well as part of the outer side surface of the receiving portion 62. This arrangement makes the connection between the receiving portion 62 and the bracket 1 more stable. Specific embodiments

[0048] Example 1: Reference Figure 3 The LED packaging device of the present invention includes a bracket 1, two LED light-emitting chips 2, a first fluorescent glue layer 3 and a second fluorescent glue layer 4.

[0049] The first fluorescent adhesive layer 3 covers the upper surface and side surfaces of the LED light emitting chip 2. The second fluorescent adhesive layer 4 only covers the upper surface of the first fluorescent adhesive layer 3.

[0050] The first reflecting surface 31 is set as a concave arc surface. When剖切 along the bracket 1 towards the direction of the first fluorescent glue layer 3, the cross-section formed by the two first reflecting surfaces 31 on both sides is set to be narrow in the middle and wide at both ends. The upper surface of the first fluorescent glue layer 3 is set as a plane.

[0051] The second reflecting surface 41 is set as an inverted conical inclined surface, and the upper surface of the second fluorescent glue layer 4 is a plane. The high-reflection glue layer 5 is disposed around the first fluorescent glue layer 3 and the second fluorescent glue layer 4, and covers the first reflecting surface 31 and the second reflecting surface 41. The high-reflection glue layer 5 covers the upper surface and the inner side surface of the bracket 1.

[0052] Example Two: Refer to Figure 4 , the main different technical feature from Example One: The second reflecting surface 41 is set as a positive conical inclined surface. Other settings are the same as those in Example One.

[0053] Example Three: Refer to Figure 5-6 , the main different technical feature from Example One: A lens 6 is further provided above the bracket 1. The lens 6 includes an optical functional area 61 and a承接部62 connected to the periphery of the optical functional area 61. There is a cavity structure between the optical functional area 61 and the second fluorescent glue layer 4.

[0054] The lengths L and W between the承接部62 and the two side surfaces of the bracket 1 satisfy L < W. The承接部62 and the bracket 1 are connected by an adhesive 7. The adhesive 7 fills the bottom surface of the承接部62 and the top surfaces around the bracket 1, as well as part of the outer side surface of the承接部62. Other settings are the same as those in Example One.

[0055] It is not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model. It should be noted that the Chinese term "承接部" in the original text is not clearly defined. Here, it is directly translated as "承接部" in the English translation. If there is a more specific English term for it, it can be replaced accordingly.

Claims

1. An LED packaging device, characterized in that: include: Bracket (1); LED light-emitting chips (2), which are arranged on the bracket (1), and the number of the LED light-emitting chips (2) is at least 2; a first fluorescent adhesive layer (3) provided on the bracket (1) and covering the upper surface and side surfaces of the LED light-emitting chip (2); a first reflective surface (31) is provided on the side surface of the first fluorescent adhesive layer (3), and the first reflective surface (31) is provided as a concave arc surface; a second fluorescent adhesive layer (4) provided on the bracket (1) and covering the upper surface of the first fluorescent adhesive layer (3) or covering the upper surface and side surfaces of the first fluorescent adhesive layer (3); a second reflective surface (41) is provided on the side surface of the second fluorescent adhesive layer (4); A high-reflective adhesive layer (5) is provided on the bracket (1) and covers the second reflective surface (41) or covers the first reflective surface (31) and the second reflective surface (41).

2. The LED package device according to claim 1, characterized in that: The second fluorescent adhesive layer (4) covers the upper surface and side surfaces of the first fluorescent adhesive layer (3); and the second reflective surface (41) is configured as a concave arc surface.

3. The LED package device according to claim 2, characterized in that: The cross section enclosed by the second reflecting surface (41) is configured to be narrow in the middle and wide at both ends, or the cross section enclosed by the second reflecting surface (41) gradually narrows in a direction away from the bracket (1).

4. The LED package device according to claim 1, wherein: The second fluorescent glue layer (4) only covers the upper surface of the first fluorescent glue layer (3); the second reflective surface (41) is configured as a positive conical or inverted conical inclined surface.

5. The LED package device according to claim 1, wherein: The cross section enclosed by the first reflecting surface (31) is configured to be narrow in the middle and wide at both ends, or the cross section enclosed by the first reflecting surface (31) gradually becomes narrower in a direction away from the bracket (1).

6. The LED package device according to claim 1, characterized in that: The thickness of the second fluorescent glue layer (4) is less than or equal to the thickness of the first fluorescent glue layer (3).

7. The LED package device according to claim 1, characterized in that: The upper surface of the second fluorescent glue layer (4) is a flat surface or a slightly curved surface.

8. The LED package device according to claim 1, wherein: The first fluorescent glue layer (3) and the second fluorescent glue layer (4) respectively comprise first wavelength conversion particles and second wavelength conversion particles, wherein the first wavelength conversion particles are used to convert the wavelength of light emitted by the LED light-emitting chip (2) into a wavelength θ, and the second wavelength conversion particles are used to convert the wavelength of light emitted by the LED light-emitting chip (2) into a wavelength γ, satisfying θ<γ.

9. The LED package device according to claim 1, characterized in that: The invention also includes a lens (6), wherein the lens (6) includes an optical functional area (61) and a receiving portion (62) connected to the four sides of the optical functional area (61); the optical functional area (61) is arranged above the second fluorescent adhesive layer (4), and the bottom of the receiving portion (62) is connected to the top surface of the four sides of the bracket (1).

10. The LED package device according to claim 9, characterized in that: The lengths between the receiving portion (62) and the two side surfaces of the bracket (1) are L and W respectively, satisfying L≤W.

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