High-pressure cavity suitable for dispersing and emulsifying

Abstract

The utility model relates to a high-pressure cavity suitable for dispersion and emulsification, which comprises a high-pressure cavity body, a high-pressure channel is arranged in the high-pressure cavity body, a chip mounting groove is arranged at the center of the high-pressure channel, a chip is connected in the chip mounting groove and is of a circular structure, a chip channel communicated with the high-pressure channel is arranged at the center of the chip, and the chip mounting groove is connected with the chip channel. The opening width of the chip channel ranges from 100 micrometers to 150 micrometers, the feeding end and the discharging end of the high-pressure cavity body are connected with a first threaded connecting sleeve and a second threaded connecting sleeve respectively, and the first threaded connecting sleeve and the second threaded connecting sleeve are each of a convex structure and are provided with connecting channels communicated with the high-pressure channel. The convex end of the first threaded connecting sleeve extends into the feeding end of the high-pressure channel, the convex end of the second threaded connecting sleeve extends into the discharging end of the high-pressure channel, and the first threaded connecting sleeve and the second threaded connecting sleeve are connected to the high-pressure cavity body through threaded pressing sleeves. The device disclosed by the utility model can realize stable treatment.

Description

Technical Field

[0001] The utility model relates to a high-pressure cavity suitable for dispersion and emulsification. Background Art

[0002] At present, the mainstream high-pressure dispersion method on the market is mainly based on high-pressure homogenizers. Its core component is the adjustable high-pressure homogenizing valve assembly, which is suitable for some materials that require ultra-high pressure processing or stable channel processing.

[0003] After searching, the patent: A high-pressure homogenizing valve (CN201811634982.4), including a base with a feed port, the discharge end of the base is sequentially provided with a valve seat, a valve core and a push rod, the base is provided with a liquid cooling cavity arranged around the outer wall of the valve seat, the base is provided with a liquid inlet and a liquid outlet connected to the liquid cooling cavity, the outer sleeve of the valve core is provided with a guide sleeve arranged coaxially with the valve core, and the side wall of the guide sleeve is provided with a discharge port connected with the inner cavity thereof.

[0004] The above-mentioned high-pressure homogenizing valve has the following disadvantages:

[0005] For ultra-high pressure use requirements of 200MP and above, the averaging valve group has poor stability and is easily damaged; at the same time, the averaging valve group channel is adjustable, and there are fluctuations that affect the treatment effect.

[0006] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a high-pressure cavity with a new structure suitable for dispersion and emulsification, making it more valuable for industrial use. Utility Model Content

[0007] In order to solve the above technical problems, the purpose of the present invention is to provide a high-pressure cavity suitable for dispersion and emulsification.

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] A high-pressure chamber suitable for dispersion and emulsification, comprising a high-pressure chamber body, a high-pressure channel being provided in the high-pressure chamber body, a chip mounting groove being provided at the center of the high-pressure channel, a chip being connected to the chip mounting groove, the chip being in a circular structure, a chip channel connected to the high-pressure channel being provided at the center of the chip in the circular structure, the opening width of the chip channel being between 100um and 150um, the feed end and the discharge end of the high-pressure chamber body being respectively connected to a first threaded connection sleeve and a second threaded connection sleeve, the first threaded connection sleeve and the second threaded connection sleeve both being in a convex structure and being provided with a connection channel connected to the high-pressure channel, the convex end of the first threaded connection sleeve extending into the feed end of the high-pressure channel, and the convex end of the second threaded connection sleeve extending into the discharge end of the high-pressure channel, the first threaded connection sleeve and the second threaded connection sleeve both being connected to the high-pressure chamber body via a threaded pressing sleeve.

[0010] Preferably, the high-pressure chamber suitable for dispersion and emulsification has a first positioning groove on the upper and lower side walls of the high-pressure chamber body, and a second positioning groove opposite to the first positioning groove is provided on the first threaded connection sleeve and the second threaded connection sleeve, and a positioning pin is connected between the first positioning groove and the second positioning groove.

[0011] Preferably, in the high-pressure chamber suitable for dispersion and emulsification, a leakage hole is provided on the second threaded connection sleeve.

[0012] Preferably, in the high-pressure cavity suitable for dispersion and emulsification, the opening width of the chip channel is 100 μm.

[0013] Preferably, in the high-pressure cavity suitable for dispersion and emulsification, an adjusting gasket is connected between the threaded pressing sleeve and the corresponding threaded connecting sleeve.

[0014] Preferably, the high-pressure cavity suitable for dispersion and emulsification, the high-pressure channel and the corresponding threaded connection sleeve are connected through a guide sleeve

[0015] Preferably, in the high-pressure cavity suitable for dispersion and emulsification, the guide sleeve has a conical structure, and the tip of the guide sleeve with the conical structure is connected to the threaded connection sleeve.

[0016] By means of the above solution, the present invention has at least the following advantages:

[0017] The connection structure of the utility model is stable and can be used at ultra-high pressure of 200MP and above and can achieve a stable treatment effect; at the same time, the sealing performance of the threaded connection sleeve and the high-pressure cavity body can be adjusted by adjusting the gasket to ensure the sealing performance.

[0018] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a structural diagram of the utility model;

[0021] Figure 2 It is a schematic structural diagram of the chip of the utility model. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0024] Example

[0025] like Figure 1 and Figure 2 As shown, a high-pressure chamber suitable for dispersion and emulsification includes a high-pressure chamber body 7, a high-pressure channel 11 is provided in the high-pressure chamber body 7, a chip mounting groove 6 is provided at the center of the high-pressure channel 11, a chip 9 is connected to the chip mounting groove 6, the chip is a circular structure, and a chip channel 10 connected to the high-pressure channel is provided at the center of the chip 9 in the circular structure, and the opening width of the chip channel 10 is 100um to 150um. The feed end and the discharge end of the high-pressure chamber body 7 are respectively connected to the first threaded connection sleeve 1 and the second threaded connection sleeve 12, the first threaded connection sleeve 1 and the second threaded connection sleeve 12 are both convex structures and are provided with a connecting channel 13 connected to the high-pressure channel 11, the convex end of the first threaded connection sleeve 1 extends into the feed end of the high-pressure channel 11, and the convex end of the second threaded connection sleeve 12 extends into the discharge end of the high-pressure channel 11, and the first threaded connection sleeve 1 and the second threaded connection sleeve 12 are both connected to the high-pressure chamber body 7 through a threaded pressing sleeve 4.

[0026] In the present invention, a first positioning groove 14 is provided on the upper and lower side walls of the high-pressure chamber body 7, and a second positioning groove 15 opposite to the first positioning groove 14 is provided on the first threaded connection sleeve 1 and the second threaded connection sleeve 12, and a positioning pin 3 is connected between the first positioning groove 14 and the second positioning groove 15.

[0027] In the present invention, a drain hole 8 is provided on the second threaded connection sleeve 12 .

[0028] The opening width of the chip channel 10 in the present invention is 100 μm.

[0029] In the present invention, an adjusting washer 2 is connected between the threaded pressing sleeve 4 and the corresponding threaded connecting sleeve.

[0030] The high pressure channel 11 in the utility model is connected to the corresponding threaded connection sleeve through the guide sleeve 5.

[0031] The guide sleeve 5 in the present invention has a conical structure, and the tip of the guide sleeve 5 with the conical structure is connected to the threaded connection sleeve.

[0032] In this utility model:

[0033] Threaded connecting sleeve: connected to the high-pressure channel of the high-pressure chamber body;

[0034] Adjusting gasket: adjust the gap between the threaded connection sleeve and the high-pressure chamber body;

[0035] Positioning pin: Positioning threaded connection sleeve and high-pressure chamber body;

[0036] Threaded sleeve: the internal parts are compressed and sealed to form pressure;

[0037] Guide sleeve: internal fluid guide;

[0038] Chip installation slot: used to install the chip;

[0039] Weep hole: releases pressure in case of overpressure or incorrect installation

[0040] Chip: Channel Carrier

[0041] The specific work of dispersion and emulsification in the present invention has been disclosed in the patent in the background technology: a high-pressure homogenizing valve (CN201811634982.4) and will not be repeated here.

[0042] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0043] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0044] In addition, the terms "horizontal" and "vertical" do not mean that the components must be absolutely horizontal or vertical, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0045] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A high-pressure chamber suitable for dispersion and emulsification, comprising a high-pressure chamber body (7), characterized in that: A high-pressure channel (11) is provided in the high-pressure chamber body (7), and a chip mounting groove (6) is provided in the center of the high-pressure channel (11). A chip (9) is connected to the chip mounting groove (6), and the chip is in a circular structure. A chip channel (10) connected to the high-pressure channel is provided in the center of the circular chip (9). The opening width of the chip channel (10) is between 100 μm and 150 μm. The feed end and the discharge end of the high-pressure chamber body (7) are respectively connected to the first threaded connection sleeve (1). and a second threaded connection sleeve (12), the first threaded connection sleeve (1) and the second threaded connection sleeve (12) both have convex structures and are provided with a connection channel (13) connected to the high-pressure channel (11), the convex end of the first threaded connection sleeve (1) extends into the feed end of the high-pressure channel (11), and the convex end of the second threaded connection sleeve (12) extends into the discharge end of the high-pressure channel (11), and the first threaded connection sleeve (1) and the second threaded connection sleeve (12) are both connected to the high-pressure chamber body (7) through a threaded pressing sleeve (4).

2. A high-pressure chamber suitable for dispersion and emulsification according to claim 1, characterized in that: A first positioning groove (14) is provided on the upper and lower side walls of the high-pressure chamber body (7); a second positioning groove (15) opposite to the first positioning groove (14) is provided on the first threaded connection sleeve (1) and the second threaded connection sleeve (12); and a positioning pin (3) is connected between the first positioning groove (14) and the second positioning groove (15).

3. The high-pressure chamber suitable for dispersion and emulsification according to claim 1, characterized in that: The second threaded connection sleeve (12) is provided with a leakage hole (8).

4. The high-pressure chamber suitable for dispersion and emulsification according to claim 1, characterized in that: The opening width of the chip channel (10) is 100 μm.

5. The high-pressure chamber suitable for dispersion and emulsification according to claim 1, characterized in that: An adjusting gasket (2) is connected between the threaded pressing sleeve (4) and the corresponding threaded connecting sleeve.

6. The high-pressure chamber suitable for dispersion and emulsification according to claim 1, characterized in that: The high-pressure channel (11) is communicated with the corresponding threaded connection sleeve via a flow guide sleeve (5).

7. The high-pressure chamber suitable for dispersion and emulsification according to claim 6, characterized in that: The guide sleeve (5) has a conical structure, and the tip of the guide sleeve (5) with the conical structure is connected to the threaded connection sleeve.

Images