Device for improving flatness of mini LED backlight substrate
The miniLED backlight substrate is heated and flattened by a platen heating device, which solves the problem of substrate warping, ensures the accuracy of the marking position, and improves the production yield.
Patent Information
- Application Number
- CN202422479872.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-14
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-14
AI Technical Summary
The miniLED backlight substrate is prone to warping during the packaging process, causing the marking position to shift, affecting the rework effect and reducing the production yield.
The pressing plate heating device is used to drive the pressing plate to press horizontally on the substrate by screwing in the screw rod, and the heating component is used to heat the substrate to make it plastic quickly, ensuring the accuracy of the marking position.
It effectively improves the flatness of the miniLED backlight substrate, ensures the accuracy of the marking position, and improves production yield.
Smart Images
Figure CN223340006U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED backlight sources, and in particular to a device for improving the flatness of a miniLED backlight substrate. Background Art
[0002] MiniLED backlights can be used for VR backlights, mobile phone curved screen backlights or wearable devices such as bracelets and phone watches. Among them, flexible substrates such as FPC substrates may be used. Their materials are relatively soft and prone to warping and deformation. When encapsulating miniLED chips on flexible substrates, the yield of the encapsulation depends on the flatness of the substrate. If the substrate cannot be guaranteed not to warp, the production yield cannot be improved.
[0003] Since the LED chips in miniLED backlight sources are small in size, have narrow chip spacing, and have a large number of chips, it is difficult to manually repair faulty LED chips and they must be done using repair equipment.
[0004] During the miniLED backlight packaging process, the detection equipment will perform multiple inspections and mark the coordinates of the faulty LED chip, which will then be transmitted to the rework equipment. If the substrate is warped, the marked coordinate points will shift, thereby affecting the rework effect. For this reason, this application proposes a device for improving the flatness of the miniLED backlight substrate. Utility Model Content
[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract and title of the utility model to avoid obscuring the purpose of this section, the abstract and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the present invention.
[0006] In view of the above-mentioned problems and / or existing problems in the existing devices for improving the flatness of miniLED backlight substrates, the present utility model is proposed.
[0007] Therefore, the purpose of the present utility model is to provide a device for improving the flatness of the miniLED backlight substrate. The pressing plate is pressed horizontally on the miniLED backlight substrate to flatten the miniLED backlight substrate. At the same time, a heating component is arranged on the pressing plate. The heating component generates heat to heat the miniLED backlight substrate, so that the miniLED backlight substrate is quickly plasticized and the miniLED backlight substrate is quickly flattened to ensure that the marking position on the miniLED backlight substrate is accurate.
[0008] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:
[0009] A device for improving the flatness of a miniLED backlight substrate, comprising:
[0010] The adjustment device includes a base, a bracket, a screw-in screw, a pressure plate, a guide rod and a heating component. The bracket is provided on the top of the base, the screw-in screw is provided on the bracket, the pressure plate is provided at the lower end of the screw-in screw, guide rods connected to the bracket are provided on both sides of the pressure plate, and the heating component is provided on the pressure plate;
[0011] The backlight substrate is arranged on the top of the base.
[0012] As a preferred solution of the device for improving the flatness of the miniLED backlight substrate described in the utility model, wherein: a purge mechanism is provided on the rear side of the base, and the purge mechanism includes a connecting seat, a rotating shaft, an impeller, a gear, a connecting rod and a rack. The connecting seat is rotatably connected to the rotating shaft, an impeller is provided at one end of the rotating shaft, a gear is provided at the other end of the rotating shaft, the connecting rod is provided on the side of the pressure plate, and a rack meshing with the gear is provided at the end of the connecting rod.
[0013] As a preferred solution of the device for improving the flatness of the miniLED backlight substrate described in the utility model, the upper surface of the base is arranged parallel to the lower surface of the pressing plate, and a limiting frame is provided on the base.
[0014] As a preferred solution of the device for improving the flatness of the miniLED backlight substrate described in the utility model, the bottom of the screw-in screw is connected to the pressure plate through a bearing, and a handle wheel is provided on the top of the screw-in screw.
[0015] As a preferred solution of the device for improving the flatness of a miniLED backlight substrate described in the utility model, the heating component adopts a heating wire and the pressing plate adopts a heat conducting plate.
[0016] As a preferred solution of the device for improving the flatness of the miniLED backlight substrate described in the utility model, a guide slope is provided on the inner side of the top of the limit frame, and the inner wall of the limit frame is embedded in the outer wall of the pressure plate.
[0017] As a preferred solution of the device for improving the flatness of a miniLED backlight substrate described in the present invention, the outside of the handle wheel is provided with evenly distributed anti-slip ridges.
[0018] Compared with the existing technology: The utility model places the miniLED backlight substrate on the base, and drives the pressure plate to press down by rotating the screw rod. During the pressing process of the pressure plate, the guide rod is used to keep the pressure plate stable and move downward, so that the pressure plate is pressed horizontally on the miniLED backlight substrate to flatten the miniLED backlight substrate. At the same time, a heating component is provided on the pressure plate, and the heating component generates heat to heat the miniLED backlight substrate, so that the miniLED backlight substrate is quickly plasticized and the miniLED backlight substrate is quickly flattened to ensure the accurate position of the mark on the miniLED backlight substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive labor. Among them:
[0020] Figure 1 This is a schematic diagram of the shaft side structure of the utility model;
[0021] Figure 2 This is a schematic diagram of the structure of the adjustment device of the utility model;
[0022] Figure 3 This is a schematic diagram of the structure of the purge mechanism of the utility model.
[0023] In the figure: 100 adjustment device, 110 base, 120 bracket, 130 screw-in screw, 140 pressure plate, 150 guide rod, 160 heating component, 170 limit frame, 200 backlight substrate, 300 purge mechanism, 310 connecting seat, 320 rotating shaft, 330 impeller, 340 gear, 350 connecting rod, 360 rack. DETAILED DESCRIPTION
[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0026] Next, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, cross-sectional views of device structures may be partially enlarged and not to scale when describing the embodiments of the present invention. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.
[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
[0028] This utility model provides a device for improving the flatness of the miniLED backlight substrate. The pressing plate is pressed horizontally on the miniLED backlight substrate to flatten the miniLED backlight substrate. At the same time, a heating component is set on the pressing plate. The heating component heats the miniLED backlight substrate to quickly plasticize the miniLED backlight substrate and quickly flatten the miniLED backlight substrate to ensure the accurate position of the mark on the miniLED backlight substrate. Figure 1-Figure 3 , including: an adjustment device 100 and a backlight substrate 200.
[0029] The adjustment device 100 includes a base 110, a bracket 120, a screw rod 130, a pressure plate 140, a guide rod 150, and a heating component 160. The bracket 120 is provided on the top of the base 110, the screw rod 130 is provided on the bracket 120, the pressure plate 140 is provided at the lower end of the screw rod 130, and guide rods 150 connected to the bracket 120 are provided on both sides of the pressure plate 140. The heating component 160 is provided on the pressure plate 140.
[0030] Among them, the bottom of the screw-in screw 130 is connected to the pressure plate 140 through a bearing, and a handle wheel is provided on the top of the screw-in screw 130. The outside of the handle wheel is provided with evenly distributed anti-slip ridges. When the screw-in screw 130 is rotated, the screw-in screw 130 rises and falls on the bracket 120 under the feed action of the thread, driving the pressure plate 140 to rise and fall. When the pressure plate 140 rises and falls, the guide rod 150 slides on the bracket 120 to provide vertical guidance, ensuring that the pressure plate 140 rises and falls horizontally.
[0031] The backlight substrate 200 is disposed on the top of the base 110 and is placed under the pressing plate 140 . The pressing plate 140 presses down the backlight substrate 200 to flatten it.
[0032] Because the backlight substrate 200 is very hot after heating and cannot be directly picked up, a purge mechanism 300 is provided on the rear side of the base 110. The purge mechanism 300 includes a connecting base 310, a rotating shaft 320, an impeller 330, a gear 340, a connecting rod 350, and a rack 360. The connecting base 310 is rotatably connected to the rotating shaft 320. The impeller 330 is provided at one end of the rotating shaft 320, and the gear 340 is provided at the other end of the rotating shaft 320. The connecting rod 350 is provided on the side of the pressure plate 140, and the end of the connecting rod 350 is provided with a rack 360 that meshes with the gear 340.
[0033] When the pressing plate 140 is raised or lowered, the rack 360 is raised or lowered by the connecting rod 350 , the rack 360 drives the gear 340 to rotate, the gear 340 drives the impeller 330 to rotate through the rotating shaft 320 , and the impeller 330 drives the air flow to dissipate heat and cool the backlight substrate 200 .
[0034] Since the backlight substrate 200 is placed directly on the base 110, it is difficult to ensure that it is located directly below the pressure plate 140. The upper surface of the base 110 is arranged parallel to the lower surface of the pressure plate 140. A limit frame 170 is provided on the base 110. A guide slope is provided on the inner side of the top of the limit frame 170. The inner wall of the limit frame 170 is embedded with the outer wall of the pressure plate 140, so that after the backlight substrate 200 is placed inside the limit frame 170, it is completely located directly below the pressure plate 140.
[0035] Since heat is transferred to the backlight substrate 200 when needed, the heating component 160 uses a heating wire and the pressing plate 140 uses a heat conducting plate, so that the heat generated by the heating component 160 can be transferred to the backlight substrate 200, making the backlight substrate 200 quickly plastic.
[0036] During specific use, the backlight substrate 200 is placed inside the limit frame 170, and the screw rod 130 is rotated and screwed in. The screw rod 130 descends on the bracket 120 under the feeding action of the thread, driving the pressure plate 140 to descend. When the pressure plate 140 descends, the guide rod 150 slides on the bracket 120 to provide vertical guidance, ensuring that the pressure plate 140 is lifted and lowered horizontally. The pressure plate 140 presses on the backlight substrate 200 to flatten the warped backlight substrate 200. At the same time, the heat generated by the heating component 160 is transferred to the backlight substrate 200, so that the backlight substrate 200 is quickly plastically flattened. After adjustment, the pressure plate 140 rises and drives the rack 360 to rise through the connecting rod 350. The rack 360 drives the gear 340 to rotate. The gear 340 drives the impeller 330 to rotate through the rotating shaft 320. The impeller 330 drives air circulation, so that the backlight substrate 200 is cooled and cooled, making it easy to remove the backlight substrate 200.
[0037] While the present invention has been described above with reference to specific embodiments, various modifications may be made and equivalent components may be substituted without departing from the scope of the present invention. In particular, as long as no structural conflicts exist, the various features of the embodiments disclosed herein may be combined with one another in any manner, and the omission of an exhaustive description of these combinations in this specification is solely for the sake of space and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.
Claims
1. A device for improving the flatness of a miniLED backlight substrate, characterized in that: include: An adjusting device (100) comprises a base (110), a bracket (120), a screw-in screw (130), a pressure plate (140), a guide rod (150) and a heating component (160), wherein the bracket (120) is arranged on the top of the base (110), the screw-in screw (130) is arranged on the bracket (120), the pressure plate (140) is arranged at the lower end of the screw-in screw (130), guide rods (150) connected to the bracket (120) are arranged on both sides of the pressure plate (140), and the heating component (160) is arranged on the pressure plate (140); A backlight substrate (200) is arranged on the top of the base (110).
2. The device for improving the flatness of a miniLED backlight substrate according to claim 1, wherein: A purge mechanism (300) is provided on the rear side of the base (110), and the purge mechanism (300) comprises a connecting seat (310), a rotating shaft (320), an impeller (330), a gear (340), a connecting rod (350) and a rack (360). The connecting seat (310) is rotatably connected to the rotating shaft (320), an impeller (330) is provided at one end of the rotating shaft (320), and a gear (340) is provided at the other end of the rotating shaft (320). The connecting rod (350) is provided on the side of the pressure plate (140), and a rack (360) meshing with the gear (340) is provided at the end of the connecting rod (350).
3. The device for improving the flatness of a miniLED backlight substrate according to claim 1, wherein: The upper surface of the base (110) is arranged parallel to the lower surface of the pressing plate (140), and a limiting frame (170) is arranged on the base (110).
4. The device for improving the flatness of a miniLED backlight substrate according to claim 1, wherein: The bottom of the screw-in screw (130) is connected to the pressure plate (140) via a bearing, and a handle wheel is provided on the top of the screw-in screw (130).
5. The device for improving the flatness of a miniLED backlight substrate according to claim 1, wherein: The heating component (160) is a heating wire, and the pressing plate (140) is a heat conducting plate.
6. The device for improving the flatness of a miniLED backlight substrate according to claim 3, wherein: A guide slope is provided on the inner side of the top of the limit frame (170), and the inner wall of the limit frame (170) is engaged with the outer wall of the pressing plate (140).
7. The device for improving the flatness of a miniLED backlight substrate according to claim 4, wherein: The outside of the handle wheel is provided with evenly distributed anti-skid ridges.