Anode assembly and electroplating equipment

Abstract

The utility model discloses an anode assembly and electroplating equipment, the anode assembly comprises an anode piece and an anode supplement piece, and the anode piece and the anode supplement piece are arranged in a manner that at least partial areas are overlapped along a direction vertical to a to-be-plated surface of a to-be-plated piece. The power lines generated in the overlapping area are more, and the overlapping area of the anode piece and the anode supplement piece is aligned with the plating weak part of the to-be-electroplated piece, so that the electric field intensity of the plating weak part of the to-be-electroplated piece can be enhanced, the power lines on the surface of the anode assembly are uniformly distributed, and the plating uniformity of the to-be-electroplated piece is further improved. The utility model further provides electroplating equipment comprising the anode assembly, the to-be-electroplated part moves in the electroplating bath, so that positive ions can be provided for the to-be-electroplated part through the anode assembly in the moving process of the to-be-electroplated part, and the coating uniformity of the to-be-electroplated part is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to an anode assembly and electroplating equipment. Background Art

[0002] During the electroplating process, the workpiece to be plated is immersed in the plating solution and electrically connected to the negative pole of the power supply to form a cathode; an anode is installed in the plating tank and electrically connected to the positive pole of the power supply. Under the action of the electric field, the cations in the plating solution will be liberated to the vicinity of the workpiece to be plated and form a plating layer on the workpiece to be plated, thereby completing the electroplating of the workpiece to be plated.

[0003] During electroplating, the electric field will generate an electric field gradient on the surface of the anode part. The electric lines of force tend to concentrate on the sharp corners and edges of the anode part, resulting in uneven current density distribution on the surface of the anode part. The cations move along the current direction in the electroplating solution and adhere to the surface of the part to be electroplated. In the case of uneven electric line density, the coating thickness at the edge of the part to be electroplated will be higher than the coating thickness in the center, resulting in poor uniformity of the coating on the surface of the part to be electroplated.

[0004] Therefore, it is urgent to design a new anode component and electroplating equipment to solve the above technical problems. Utility Model Content

[0005] The purpose of the utility model is to provide an anode assembly and electroplating equipment, which forms an anode assembly by combining two or more anode parts so that the electric lines on the surface of the anode assembly are evenly distributed and the cations are evenly attached to the surface of the part to be electroplated, thereby improving the uniformity of the plating layer of the part to be electroplated.

[0006] To achieve the above object, the technical solution adopted by the present invention is: an anode assembly, including an anode piece and an anode supplement piece, wherein the anode piece and the anode supplement piece are at least partially overlapped in a direction perpendicular to the surface to be plated of the workpiece.

[0007] In some embodiments, within a projection plane, the anode assembly is projected to form a projection pattern, and a first pattern formed by the projection of the anode component overlaps with a second pattern formed by the projection of the anode supplemental component to form an overlapping area; wherein, the overlapping area is located in the central area of ​​the projection pattern, and the projection pattern other than the overlapping area is the remaining area, and the remaining area is located in the edge area of ​​the projection pattern, and the projection plane is parallel to the surface to be plated of the component to be electroplated.

[0008] In some embodiments, both the first graphic and the second graphic are regular graphics, wherein:

[0009] The anode supplementary member and the anode member have the same shape, and the overlapping area formed therein has the same shape as the remaining area; or

[0010] The anode supplement and the anode member have the same shape, and the overlapping area is different in shape from the remaining area; or

[0011] The anode supplement and the anode member have different shapes, and the overlapping area formed therein has the same shape as the remaining area; or

[0012] The anode supplement and the anode member have different shapes, and the overlapping area formed therein has a different shape from the remaining area.

[0013] In some embodiments, the second pattern formed by the anode supplement in the projection plane includes a plurality of regular patterns, and the plurality of regular patterns are sequentially overlapped along the circumferential direction.

[0014] In some embodiments, the anode member and the anode supplement member are both hollow structures, and the structure of the anode assembly is any one of the following:

[0015] (1) The hollow density of the anode supplementary member is less than the hollow density of the anode member;

[0016] (2) The hollow density of the anode supplementary member is greater than the hollow density of the anode member;

[0017] (3) The hollow density of the anode supplementary member is equal to the hollow density of the anode member.

[0018] In some embodiments, there are a plurality of anode supplements, and the sizes and hollowing densities of the anode supplements gradually decrease in a direction away from the anode member.

[0019] In some embodiments, the anode member and the anode supplement member are both hollow structures; the second pattern formed by the anode supplement member in the projection plane includes a plurality of regular patterns, and the plurality of regular patterns are stacked in sequence along the circumferential direction; the size and hollow density of the plurality of regular patterns gradually decrease from the inside to the outside.

[0020] In some embodiments, the anode member has a central portion and an edge portion, the central portion is at least partially located in a first plane, and the edge portion is at least partially located in a second plane, and the distance between the first plane and the surface to be plated of the member to be electroplated is smaller than the distance between the second plane and the surface to be plated of the member to be electroplated.

[0021] To achieve the above object, the present application further provides an electroplating device, comprising the anode member as described above, and further comprising:

[0022] A mounting seat, used for mounting the anode assembly;

[0023] Carrier, used to mount the parts to be plated;

[0024] A moving mechanism, used for driving the carrier to move;

[0025] an electroplating tank, wherein the mounting seat is disposed in the electroplating tank;

[0026] power supply;

[0027] In working state, the plating tank is filled with plating liquid, the anode assembly and the area to be plated of the workpiece to be plated are immersed in the plating liquid, the positive pole of the power supply is electrically connected to the anode assembly, and the negative pole of the power supply is electrically connected to the workpiece to be plated.

[0028] In some embodiments, the mounting seat at least includes a seat body, and the seat body is provided with a mounting groove for accommodating the anode assembly, and the mounting groove is at least one.

[0029] In some embodiments, the mounting seat further includes a cover plate, which is detachably connected to the seat body. In a working state, the cover plate covers an edge portion of the anode assembly.

[0030] In some embodiments, a plurality of the mounting seats are provided in the electroplating tank, and the plurality of the mounting seats are distributed at intervals or continuously along a preset direction to form an anode queue;

[0031] A plurality of anode queues are arranged at intervals in the electroplating tank, and an electroplating channel is formed between two adjacent anode queues;

[0032] In a working state, the moving mechanism drives the carrier to move along the electroplating channel.

[0033] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0034] The anode assembly provided in the present application partially overlaps the anode component and the anode supplement component, so that more electric lines are generated in the overlapping area. By aligning the overlapping area of ​​the anode component and the anode supplement component with the weak part of the coating of the part to be electroplated, the electric field strength at the weak part of the coating of the part to be electroplated can be enhanced, thereby making the electric lines on the surface of the anode assembly evenly distributed, thereby improving the uniformity of the coating of the part to be electroplated.

[0035] The present application also provides an electroplating device including an anode assembly, which moves the workpiece to be electroplated in the electroplating tank so that the anode assemblies passed by the workpiece during the movement can provide cations to it, thereby further improving the uniformity of the plating layer of the workpiece to be electroplated.

[0036] The electroplating plant includes the entire technical solution of the anode assembly and therefore also has all the technical advantages of the anode assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] Figure 1 Schematic diagram of the planar structure of an anode member in the prior art, wherein (a) is a front view of the anode member, and (b) is a side view of the anode member and a schematic diagram of the distribution of electric lines;

[0039] Figure 2 1 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the anode member is a thin plate-shaped structure;

[0040] Figure 3 1 is a schematic diagram of a planar structure of another anode member provided in an embodiment of the present application, wherein the anode member is a three-dimensional structure;

[0041] Figure 4 Schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein (a) is a front view of the anode member, and (b) is a side view of the anode member and a schematic diagram of the distribution of electric lines, and the hollowing density of the central portion and the edge portion of the anode member is different;

[0042] Figure 5 1 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the central plane of the central portion of the anode member is a curved surface;

[0043] Figure 6 1 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the central plane of the central portion of the anode member is a plane;

[0044] Figure 7 1 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the center portion and the edge portion of the anode member are connected by a planar surface, and the center surface of the center portion is a curved surface;

[0045] Figure 8 1 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the center portion and the edge portion of the anode member are connected by a planar surface, and the center plane of the center portion is a plane;

[0046] Figure 9 1 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the center portion and the edge portion of the anode member are connected by a curved surface, and the center plane of the center portion is a plane;

[0047] Figure 10is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the connection portion between the edge portion and the center portion of the anode member includes a combination of multiple planes, and includes multiple planes in different layers;

[0048] Figure 11 is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the connection portion between the edge portion and the center portion of the anode member includes a plurality of stacked planar connection portions, and the center area of ​​each planar connection portion is distributed on different planes;

[0049] Figure 12 : is a schematic diagram of a planar structure of an anode member provided in an embodiment of the present application, wherein the connection portion between the edge portion and the center portion of the anode member includes a plurality of stacked planar connection portions, and the center area of ​​each planar connection portion is diamond-shaped;

[0050] Figure 13 1 is a schematic diagram of a planar structure of another anode member provided in an embodiment of the present application, wherein the shape of the first region of the anode member is different from the shape of the second region;

[0051] Figure 14 is a schematic diagram of a planar structure of another anode member provided in an embodiment of the present application, wherein the first region of the anode member includes a plurality of sub-regions stacked one on another from the inside to the outside, and the outer contour of each sub-region is a regular pattern;

[0052] Figure 15 1 is a schematic diagram of a planar structure of another anode member provided in an embodiment of the present application, wherein the shape of the hollow structure in the first region of the anode member is different from the shape of the hollow structure in the second region;

[0053] Figure 16 1 is a schematic plan view of the structure of an anode assembly provided in an embodiment of the present application, wherein the anode supplement is detachably provided on the anode member, and the anode supplement is installed on top of the anode member;

[0054] Figure 17 1 is a schematic diagram of a planar structure of an anode assembly provided in an embodiment of the present application, wherein the anode supplementary member is located on one side of the anode member and has a certain distance between the anode member and the anode member;

[0055] Figure 18 1 is a schematic diagram of a planar structure of an anode assembly provided in an embodiment of the present application, wherein the anode supplementary member is located on one side of the anode member and contacts the anode member;

[0056] Figure 19 : is a schematic diagram of a planar structure of an anode assembly provided in an embodiment of the present application, wherein the anode supplement comprises a plurality of sub-regions stacked one on another from the inside to the outside, and the outer contour of each sub-region is a regular pattern;

[0057] Figure 20 1 is a schematic diagram of a planar structure of an anode assembly provided in an embodiment of the present application, wherein the anode supplementary members have multiple components;

[0058] Figure 21 1 is a schematic diagram of a planar structure of an anode assembly provided in an embodiment of the present application, wherein the shape of the hollow structure of the anode supplementary member is different from the shape of the hollow structure of the anode member;

[0059] Figure 22 Schematic diagram of the planar structure of the connection between the mounting base and the anode assembly provided in an embodiment of the present application, wherein (a) is a front view, and (b) is a side view and a schematic diagram of the distribution of power lines;

[0060] Figure 23 1 is a schematic diagram of the planar structure of the anode member provided in an embodiment of the present application when installed on the mounting base, wherein (a) is a front view, (b) is a side view, and the mounting base also includes a cover plate;

[0061] Figure 24 Schematic diagram of the planar structure of the anode member provided in an embodiment of the present application when installed on the mounting base, wherein (a) is a front view, (b) is a side view and a schematic diagram of the distribution of power lines, and the mounting base also includes a clamping assembly;

[0062] Figure 25 1 is a schematic diagram of the three-dimensional structure of the mounting base provided in an embodiment of the present application, wherein the mounting base is cooperatively connected to the bottom and / or side of the anode member;

[0063] Figure 26 The embodiment of this application provides Figure 25 The cross-sectional view corresponding to the mounting base shown;

[0064] Figure 27 1 is a schematic diagram of the three-dimensional structure of the mounting base provided in an embodiment of the present application, wherein the mounting base is cooperatively connected to the bottom of the anode member;

[0065] Figure 28 The embodiment of this application provides Figure 27 The cross-sectional view corresponding to the mounting base shown;

[0066] Figure 29 Schematic diagram of the planar structure of the mounting base provided in an embodiment of the present application, wherein the mounting base has two mounting slots;

[0067] Figure 30 Schematic diagram of the planar structure of the electroplating tank provided in an embodiment of the present application;

[0068] Figure 31 This embodiment of the present application provides Figure 30A cross-sectional view of the electroplating tank in the EE direction is shown;

[0069] Figure 32 It is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application.

[0070] Wherein: 10 ', the anode member of the prior art; 20 ', the mounting seat of the prior art;

[0071] 10. Anode; 101. Center; 102. Edge; 103. First plane; 104. Second plane; 105. Surface to be plated; 106. Center surface; 110. Ion release surface.

[0072] 20, mounting seat; 201, seat body; 2011, mounting groove; 2012, threaded hole;

[0073] 203, cover plate; 204, clamping assembly; 2041, support frame; 2042, clamping member;

[0074] 30. Parts to be plated; 40. Carrier; 50. Moving mechanism; 60. Plating tank; 601. Plating channel;

[0075] 70. Anode supplement;

[0076] 10A, first region; 10a, sub-region; 10B, second region; 10D, overlapping region. DETAILED DESCRIPTION

[0077] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings. Terms such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end" used in this application to express spatial relative positions are used to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings for the purpose of convenience of explanation. Terms of spatial relative position may be intended to include different orientations of the device in use or work other than the orientation shown in the figures. For example, if the device in the figure is turned over, the unit described as being "below" or "beneath" other units or features will be "above" the other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein are interpreted accordingly.

[0078] Furthermore, the terms "installed," "disposed," "provided with," "connected," "slidingly connected," "fixed," and "socketed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0079] The background technology of this application points out that during the electroplating process, the uneven distribution of electric field lines on the surface of the anode will lead to uneven thickness of the coating formed on the surface of the electroplated part. Figure 1 As shown, during the electroplating process of the anode part, due to the edge effect, the electric line density at the edge of the anode part will be greater than the electric line density at the center. In order to avoid uneven coating of the part to be electroplated, the existing anode unit uses a cover plate to cover the edge of the anode part, and the center part is exposed, thereby limiting the transmission of current to the edge area, weakening the edge effect, and making the electric line density distribution on the entire surface of the anode part more uniform. However, the method of using the cover plate to cover the edge of the anode part may not be able to completely cover all the edge parts, resulting in poor covering effect. The exposed edge part will still cause uneven coating of part of the part to be electroplated. In addition, when the shape and model of the part to be electroplated changes, it is necessary to determine its corresponding edge part. The installation and alignment of the cover plate will consume a lot of production time, resulting in reduced production efficiency.

[0080] Based on this, the present application provides an anode assembly and electroplating equipment including the anode assembly. The anode assembly includes an anode member 10 and an anode supplement 70. Both the anode member 10 and the anode supplement 70 have a hollow structure. The anode supplement 70 is disposed around the anode member 10. By partially overlapping the anode member 10 and the anode supplement 70, with the overlapping portion located in the center, the hollow density in the center of the anode assembly is greater than the hollow density in the edge areas. This improves the uniformity of the electric field lines on the surface of the anode assembly due to the edge effect.

[0081] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of this application.

[0082] See also Figures 16-21As shown, the anode assembly provided by the present application includes an anode element 10 and an anode supplement 70. In a direction perpendicular to the surface to be plated of the workpiece 30 to be plated, the anode element 10 and the anode supplement 70 are arranged so that at least a portion of the area overlaps. This allows for more lines of force to be generated in the overlapping area. Aligning the overlapping area of ​​the anode element 10 and the anode supplement 70 with a weak point in the plating of the workpiece 30 to be plated can enhance the electric field strength at the weak point in the plating of the workpiece 30 to be plated, thereby evenly distributing the lines of force on the surface of the anode assembly and improving the uniformity of the plating of the workpiece 30 to be plated. The weak point in the plating of the workpiece 30 to be plated refers to a location on the workpiece 30 to be plated where the plating thickness is relatively thin when a single anode element is used.

[0083] Specifically, the anode assembly is projected onto a virtual projection plane along a direction perpendicular to the surface to be plated of the workpiece 30 to be electroplated to form a projection pattern, and the projection plane is parallel to the surface to be plated.

[0084] Anode member 10 forms a first pattern within the aforementioned projection plane, while supplemental anode member 70 forms a second pattern within the same projection plane. The first pattern partially overlaps with the second pattern. Within the projection pattern formed by the anode assembly, the overlapping portion of the first and second patterns is referred to as an overlapping region 10D. The portion of the projection pattern excluding the overlapping region is referred to as the remaining region. Overlapping region 10D is located in the center of the projection pattern, while the remaining regions are located at the edges of the projection pattern.

[0085] In this way, by superimposing the anode member 10 and the anode supplement member 70, the hollow density of the overlapping area 10D of the anode assembly is greater than the hollow density of the remaining areas. Since the greater the hollow density, the greater the electric line density of the area, and the more electric lines are generated, therefore, under this structure, by increasing the electric line density of the overlapping area 10D, the electric line density gathered in the overlapping area 10D can be close to the electric line density gathered in the remaining areas under the edge effect, and the amount of cations moved to the surface of the workpiece 30 to be electroplated is similar, thereby improving the uniformity of the coating on the surface of the workpiece 30 to be electroplated.

[0086] In this embodiment, the structure of the anode assembly can be any of the following:

[0087] (1) The anode supplement 70 is detachably mounted on the anode member 10. When the anode supplement 70 is connected to the anode member 10, the anode supplement 70 and the anode member 10 at least partially overlap and form an overlapping region 10D, so that the electric line density of the overlapping region 10D is equal to the electric line density of the remaining region under the edge effect. The anode supplement 70 and the anode member 10 can be detachably connected by means of threaded connection, snap connection, and pin connection, and the installation position of the anode supplement 70 can be adjusted as needed so that different regions of the anode member 10 overlap with the anode supplement 70, see Figure 16 As shown, the anode complement 70 is mounted on top of the anode member 10 .

[0088] (2) The anode supplementary member 70 is located on one side of the anode member 10 and has a certain distance from the anode member 10. Figure 17 As shown, the anode supplement 70 and the anode member 10 are parallel to each other, and partially overlap to form an overlapping region 10D, so that the electric line density of the overlapping region 10D is enhanced.

[0089] (3) The anode supplementary member 70 is located on one side of the anode member 10 and is in contact with the anode member 10. Figure 18 As shown, the anode supplement 70 and the anode member 10 are parallel to each other, and partially overlap and contact each other, forming an overlap region 10D. This enhances the density of electric lines in the overlap region 10D. Compared to an arrangement where there is a certain distance between the anode supplement 70 and the anode member 10, in this arrangement, the plating solution passing through the anode supplement 70 inevitably passes through the anode member 10. In other words, in this arrangement, the enhanced electric lines have a certain degree of stability.

[0090] In some embodiments, both the anode member 10 and the anode supplement 70 are hollow structures, wherein the hollow density of the anode assembly in the overlapping region 10D is greater than the hollow density in the remaining regions. Further, in this embodiment, the structure of the anode member 10 can be any of the following:

[0091] (1) The hollow density of the anode supplementary member 70 is less than the hollow density of the anode member 10;

[0092] (2) The hollow density of the anode supplementary member 70 is greater than the hollow density of the anode member 10;

[0093] (3) The hollow density of the anode supplementary member 70 is equal to the hollow density of the anode member 10 .

[0094] In the above three structures, since the overlapping area 10D is the superposition of the anode supplement 70 and the anode 10 structure, the density of the electric lines in the overlapping area 10D must be greater than the density of the electric lines in the remaining areas. Therefore, under the edge effect, the density of the electric lines converged in the overlapping area 10D is similar to the density of the electric lines converged in the remaining areas, and the amount of cations moving to the surface of the workpiece 30 to be electroplated is similar, thereby improving the uniformity of the coating on the surface of the workpiece 30 to be electroplated.

[0095] In some achievable embodiments, the structure of the anode assembly may be any of the following:

[0096] (1) The second pattern formed by the anode supplement 70 on the projection plane and the first pattern formed by the anode member 10 on the projection plane are both regular patterns. The anode supplement 70 and the anode member 10 have the same shape, and the overlapping area 10D formed therein has the same shape as the remaining areas.

[0097] (2) The second pattern formed by the anode supplement 70 on the projection plane and the first pattern formed by the anode member 10 on the projection plane are both regular patterns. The anode supplement 70 and the anode member 10 have the same shape, and the overlapping region 10D formed therein is different in shape from the remaining regions.

[0098] (3) The second pattern formed by the anode supplement 70 on the projection plane and the first pattern formed by the anode member 10 on the projection plane are both regular patterns. The anode supplement 70 and the anode member 10 have different shapes, and the overlapping area 10D formed therein has the same shape as the remaining areas.

[0099] (4) The second pattern formed by the anode supplement 70 on the projection plane and the first pattern formed by the anode member 10 in the projection plane are both regular patterns. The anode supplement 70 and the anode member 10 have different shapes, and the overlapping area 10D formed therein has a different shape from the remaining areas.

[0100] It should be noted that the present application does not limit the specific shapes of the regular patterns of the second pattern formed by the anode supplementary member 70 on the projection plane and the first pattern formed by the anode member 10 in the projection plane, and they can be selected according to the actual application effect.

[0101] In some feasible embodiments, the second pattern formed by the anode supplement 70 in the above-mentioned projection plane includes a plurality of regular patterns, the plurality of regular patterns are sequentially overlapped along the circumferential direction, and the size and hollow density of the plurality of regular patterns gradually decrease from the inside to the outside. Figure 19 As shown, by gradually decreasing the hollowing density, the electric lines of force of the anode supplement 70 can gradually increase from the edge area to the central area, thereby improving the electric line density in the central area.

[0102] In one possible implementation, see Figure 20 As shown, the anode supplement 70 includes a plurality of anode supplements 70 , and an overlapping region 10D is formed by overlapping the plurality of anode supplements 70 , thereby increasing the electric line density in the overlapping region 10D.

[0103] In one practicable embodiment, the hollow structure of the anode supplement 70 and the hollow structure of the anode member 10 are both regular patterns, and the shape of the hollow structure of the anode supplement 70 is the same as or different from the shape of the hollow structure of the anode member 10. In practical applications, the electric line density can be changed by changing the shape of the hollow. For example, see Figure 21 As shown in the figure, the shape of the hollow structure of the anode supplement 70 is different from the shape of the hollow structure of the anode member 10. Specifically, the hollow structure of the anode supplement 70 is hexagonal, while the hollow structure of the anode member 10 is rhombus-shaped. It should be noted that the specific shape of the regular pattern used in the hollow structure of the anode supplement 70 and the hollow structure of the anode member 10 is not limited in this application and can be selected based on actual application effects.

[0104] The anode element 10 and anode supplement 70 provided herein may have the same or different structures. In some feasible embodiments, the distribution of the lines of force on the surface of the anode element 10 and / or the anode supplement 70 can be modified by changing the structure of the anode element 10 and / or the anode supplement 70, thereby making the lines of force across the entire anode assembly more uniform and improving the uniformity of the coating on the plated article. The following describes this in detail using the anode element 10 as an example.

[0105] In some feasible embodiments, for the anode 10, by making the hollow density of the central part greater than the hollow density of the edge part, more electric lines are generated in the central part, thereby improving the uniformity of the plating layer of the electroplated part under the edge effect.

[0106] Specifically, see Figures 13 to 15 The anode element 10 shown is a hollow structure. The anode element 10 has a central portion 101 and an edge portion 102 , wherein the hollow density of the central portion 101 is greater than that of the edge portion 102 .

[0107] The hollow density of the anode member 10 is positively correlated with the density of electric lines generated on the surface of the anode member 10. Specifically, when the area of ​​the region remains unchanged, the greater the hollow density, the greater the density of electric lines in the region, and the more electric lines are generated. Therefore, under this structure, by increasing the density of electric lines in the central part 101, the density of electric lines converged in the central part 101 can be close to the density of electric lines converged in the edge part 102 under the edge effect, thereby improving the uniformity of the surface coating of the component 30 to be electroplated.

[0108] In some feasible embodiments, the hollow structure of the central portion 101 and the hollow structure of the edge portion 102 are both regular patterns, and the shape of the hollow structure of the central portion 101 is the same as or different from the shape of the hollow structure of the edge portion 102, that is, the patterns constituting the hollow are different. In practical applications, the electric line density can be changed by changing the shape of the hollow. For example, see Figure 15 As shown in the figure, the shape of the hollow structure of the central portion 101 is different from the shape of the hollow structure of the edge portion 102. Specifically, the shape of the hollow structure of the central portion 101 is hexagonal, and the shape of the hollow structure of the edge portion 102 is rhombus. It should be noted that the specific shape of the regular pattern used by the hollow structure of the central portion 101 and the hollow structure of the edge portion 102 is not limited in this application and can be selected according to the actual application effect.

[0109] The anode member 10 is projected onto a virtual projection plane in a direction perpendicular to the surface to be plated 105 of the member to be electroplated 30, and the projection plane is parallel to the surface to be plated 105, wherein the central portion 101 forms a first region 10A in the projection plane, and the edge portion 102 forms a second region 10B in the projection plane, and the second region 10B is arranged circumferentially outside the first region 10A.

[0110] In some feasible embodiments, the outer contour of the first region 10A and the outer contour of the second region 10B are both regular shapes, and the outer contour shape of the first region 10A is the same as or different from the outer contour shape of the second region 10B. Figure 13 As shown in the figure, the shape of the first region 10A of the anode element 10 is different from the shape of the second region 10B, wherein the shape of the first region 10A is a diamond and the shape of the second region 10B is a square; see Figure 4 As shown in (a), the shape of the first region 10A of the anode element 10 is the same as the shape of the second region 10B, and the shapes of the first region 10A and the second region 10B are both square. It should be noted that the specific shapes of the regular patterns used in the first region 10A and the second region 10B are not limited in this application and can be selected according to the actual application effect. Figure 4 In (a), the hollow density of the central portion 101 is greater than the hollow density of the edge portion 102, see Figure 4 As shown in (b), after the hollowing density of the central part 101 is changed, the electric line density of the central part 101 is close to the electric line density of the edge part 102, wherein D in the figure refers to the height range of the central part 101.

[0111] Furthermore, the first region 10A includes a plurality of sub-regions 10a, which are stacked one on top of the other from the inside to the outside, and the size and / or hollow density of the sub-regions 10a gradually decrease from the inside to the outside, and the outer contours of the sub-regions 10a are all regular patterns. Figure 14 As shown, by gradually decreasing the hollowing density, the electric lines of force of the anode member 10 can gradually increase from the edge portion 102 to the central portion 101 , thereby improving the electric line density of the central portion 101 .

[0112] In one feasible embodiment, the central portion 101 and the edge portion 102 are integrally formed, or a detachable connection structure is provided between the central portion 101 and the edge portion 102. In practical applications, the integrally formed structure facilitates processing and production, improving production efficiency, while the detachable connection structure facilitates replacement of parts of the anode member 10, and the choice can be made based on actual needs.

[0113] On the basis of the structure of the above-mentioned anode part 10, the adhesion rate of the cations released from the central part 101 can be increased by making the distances between the central part 101 and the edge part 102 and the surface to be plated 105 of the part to be plated 30 different, thereby improving the uniformity of the surface coating of the part to be plated 30 under the edge effect.

[0114] For ease of description, the surface of the anode element 10 that faces the surface 105 of the workpiece 30 to be plated during operation is defined as the ion-releasing surface 110. When energized, the anode element 10 converges electric lines from the ion-releasing surface 110 and releases cations. As the electric lines of the anode element 10 extend toward the surface 105 to be plated, the cations released from the ion-releasing surface 110 migrate toward the surface 105 to be plated, where they adhere to the surface 105 to form a plated layer. The ion-releasing surface 110 is the starting point for the movement of cations from the anode element 10 toward the surface to be plated. If the anode element 10 is a soluble anode, the released cations are metal cations; if the anode element 10 is an insoluble anode, the released cations are non-metal cations, such as hydrogen ions.

[0115] The anode element 10 of the present application can be in the form of a flat plate, with the ion-releasing surface 110 located in the center portion 101 and the edge portion 102 within the same plane. During electroplating, the center portion 101 and the edge portion 102 are located at the same distance from the surface to be plated 105. Due to the difference in the hollowing density between the center portion 101 and the edge portion 102, the electric lines of force of the anode element 10 gradually increase from the edge portion 102 toward the center portion 101, thereby improving the uniformity of the coating on the surface of the object to be plated 30.

[0116] In some feasible embodiments, the distances between the central portion 101 and the edge portion 102 and the surface 105 of the workpiece 30 to be plated can be different to increase the density of the electric lines of force from the central portion 101, thereby making the thickness of the plating layer formed on the surface of the workpiece 30 to be plated more uniform. Specifically, the anode element 10 is configured such that the distance between the central portion 101 and the surface 105 to be plated of the ion-releasing surface 110 is smaller than the distance between the edge portion 102 and the surface 105 to be plated.

[0117] See also Figures 5 to 11 As shown, at least a portion of the central portion 101 is located on the first plane 103, and at least a portion of the edge portion 102 is located on the second plane 104. The distance L1 between the first plane 103 and the surface to be plated 105 is smaller than the distance L2 between the second plane 104 and the surface to be plated 105. In other words, when the anode element 10 is energized, the distance that the positive ions released from the first plane 103 move toward the surface to be plated 105 is smaller than the distance that the positive ions released from the second plane 104 move toward the surface to be plated 105.

[0118] The cations released from the first plane 103 are more likely to adhere to the surface to be plated 105 than the cations released from the second plane 104, thereby ensuring that the number of cations that can move to the surface to be plated 105 from the first plane 103 and the second plane 104 is similar. That is, the number of free cations in the second plane 104 is large, but due to the greater distance, only some of them can adhere to the surface to be plated 105. The number of free cations in the first plane 103 is less than that in the second plane 104, but due to the closer distance, most of the cations can adhere to the surface to be plated 105, thereby improving the uniformity of the coating on the object to be plated 30. The first plane 103 and the second plane 104 are both virtual planes, which are parallel to the surface to be plated 105, and the second plane 104, the first plane 103 and the surface to be plated 105 are distributed in sequence.

[0119] Since the distance between the first plane 103 and the surface to be plated 105 is smaller than the distance between the second plane 104 and the surface to be plated 105, when the electric line density of the first plane 103 increases but is still smaller than the electric line density of the second plane 104, the movement distance of the cations released from the first plane 103 is reduced, so that the movement distance of the cations is shorter, and the attachment rate of the cations released from the first plane 103 is higher than that of the cations released from the second plane 104, so that the cations attached to the surface of the part to be plated 30 are evenly distributed, thereby improving the uniformity of the plating layer.

[0120] In some possible implementations, see Figure 2 As shown, the anode member 10 is in the shape of a thin plate, and its overall structure is a thin plate; see the attached Figure 3As shown, the anode member 10 is a three-dimensional structure. The ion release surface 110 of the anode member 10 is gradually arched from the edge portion 102 to the center portion 101 toward the surface to be plated 105. When the anode member 10 is a thin plate structure, the surface of the anode member 10 facing the surface to be plated 105 constitutes the ion release surface 110; when the anode member 10 is a three-dimensional structure, the surface of the anode member 10 facing the surface to be plated 105 constitutes the ion release surface 110. In some embodiments, as shown in FIG. Figure 3 In the modes (b) and (c), the ion release surface 110 also includes the end surface of the anode member 10 facing the surface to be plated 105 .

[0121] In some achievable embodiments, the ion release surface 110 has a central surface located in the central portion 101, and the central surface is a curved surface or a flat surface. Figure 5 As shown, when the center plane is a curved surface, the center point of the curved surface is located on the first plane 103. When the surface 105 of the workpiece 30 to be plated is electroplated with the anode 10, the distance L1 that the cations released from the first plane 103 move toward the surface 105 to be plated is less than the distance L2 that the cations released from the second plane 104 move toward the surface to be plated. The cations released from the first plane 103 are more likely to adhere to the surface 105 to be plated than the cations released from the second plane 104. This ensures that the adhesion rates of the cations released from the first plane 103 and the second plane 104 are similar, thereby improving the uniformity of the coating on the workpiece 30 to be plated. Figure 6 As shown, when the center plane is a plane, the center plane coincides with the first plane 103. When the surface to be plated 105 of the part to be plated 30 is electroplated with the anode part 10, the distance L1 that the cations released from the first plane 103 move toward the surface to be plated 105 is less than the distance L2 that the cations released from the second plane 104 move toward the surface to be plated 105. The cations released from the first plane 103 are easier to adhere to the surface to be plated 105 than the cations released from the second plane 104, thereby ensuring that the adhesion rates of the cations released from the first plane 103 and the second plane 104 are similar, thereby improving the uniformity of the plating of the part to be plated 30.

[0122] In one feasible embodiment, a connecting portion is provided between the central portion 101 and the edge portion 102, and the connecting portion has a connecting surface located on the ion release surface 110. The connecting surface can be a plane or a curved surface, or a combination of a plane and a curved surface, or a combination of a plane and a plane, or a combination of a curved surface and a curved surface.

[0123] See also Figure 5 As shown in the figure, the central portion 101 and the edge portion 102 of the anode member 10 are connected by a curved surface, and the central surface of the central portion 101 is a curved surface; see Figure 6As shown in the figure, the center portion 101 and the edge portion 102 of the anode member 10 are connected by a plane, and the center plane of the center portion 101 is a plane; see Figure 7 As shown in the figure, the center portion 101 and the edge portion 102 of the anode member 10 are connected by a plane, and the center surface of the center portion 101 is a curved surface; see Figure 8 As shown in the figure, the center portion 101 and the edge portion 102 of the anode member 10 are connected by a combination of a plane and a curved surface, and the center surface of the center portion 101 is a plane, wherein the curved surface portion of the connecting portion is connected to the center portion 101; see Figure 9 As shown in the figure, the central portion 101 and the edge portion 102 of the anode member 10 are connected by a curved surface, and the central surface of the central portion 101 is a plane. Figure 10 As shown in the figure, the central portion 101 and the edge portion 102 of the anode member 10 are connected through multiple planes, and parts of the multiple planes are parallel to the first plane 103 and the second plane 104 and are distributed in multiple layers.

[0124] In one feasible embodiment, the connection portion between the central portion 101 and the edge portion 102 includes a plurality of planar connection portions, each planar connection portion having a central region, the central region having a central region surface 106 located on the ion release surface 110, the plurality of central region surfaces 106 being arranged on different planes and located between the first plane 103 and the second plane 104, and the areas of the plurality of central region surfaces 106 decrease successively from the second plane 104 to the first plane 103.

[0125] like Figure 11 As shown, a plurality of planar connecting portions are provided between the central portion 101 and the edge portion 102 of the anode member 10, and these plurality of planar connecting portions are stacked between the central portion 101 and the edge portion 102, wherein the central region surface 106 of the central region of these plurality of planar connecting portions is located between the first plane 103 and the second plane 104, forming a stack of multiple planes. In this way, by superimposing multiple planes, the electric lines of the anode member 10 can gradually increase from the edge portion 102 to the central portion 101, so as to improve the electric line density of the central portion 101. It should be noted that the shape of the plane is not limited here, and can be any regular shape, such as a square, a diamond, a circle, etc., see Figure 12 As shown, the plane in the figure is a rhombus.

[0126] One embodiment disclosed herein further provides an electroplating apparatus, comprising the anode member 10 of the aforementioned embodiment. The electroplating apparatus is configured to electroplate an object 30 to be electroplated, thereby depositing a metal film over the entire or partial surface of the object 30. The electroplating apparatus may be a vertical electroplating apparatus.

[0127] The electroplating equipment further includes a mounting base 20, a carrier 40, a moving mechanism 50, an electroplating tank 60 and a power supply. Figures 22 to 32 As shown, the mounting seat 20 is used to mount the anode member 10; the carrier 40 is used to mount the member to be plated 30. In vertical electroplating, the member to be plated 30 is immersed in the plating solution in a vertical state through the carrier 40, and the cations in the plating solution will be released to form a plating layer on both sides of the member to be plated 30; the moving mechanism 50 is used to drive the carrier 40 to move. Since the cations in the plating tank 60 are unevenly distributed, the member to be plated 30 is moved along the length direction of the plating tank 60 by moving the carrier 40, thereby improving the uniformity of the plating layer; the anode member 10 is set in the plating tank 60 through the mounting seat 20, and the cations in the plating solution are replenished by the anode member 10 to avoid insufficient cations in the plating tank 60 after long-term use; the positive pole of the power supply is electrically connected to the anode member 10, and the negative pole of the power supply is electrically connected to the member to be plated 30 to form a current loop. In the working state, the electroplating tank 60 is filled with electroplating liquid, and the anode component 10 and the area to be plated of the component to be plated 30 are immersed in the electroplating liquid. Under the action of the electric field, the cations in the electroplating liquid will be liberated to the vicinity of the component to be plated 30 and form a plating layer on the area to be plated of the component to be plated 30.

[0128] In one possible implementation, see Figures 22 to 24 As shown, the mounting base 20 at least includes a base body 201, and the base body 201 is provided with a mounting groove 2011 for accommodating the anode member 10. There is at least one mounting groove 2011. Figure 25-28 As shown, the base 201 includes at least a mounting groove 2011 for accommodating the anode member 10. The base 201 is provided with a threaded hole 2012 that communicates with the mounting groove 2011. In the operating state, the anode member 10 is located in the mounting groove 2011 and is threadedly connected to the base 201. The mounting groove 2011 can be set at a predetermined position on the base 201. For example, when the base 201 is a rectangular parallelepiped, the mounting groove 2011 is provided along its length, and the bottom of the edge portion 102 is placed in the mounting groove 2011. The threaded hole 2012 communicates with the mounting groove 2011 and the bottom of the base 201, thereby achieving a threaded connection between the anode member 10 and the base 201.

[0129] Further, see Figure 29 As shown, the base 201 includes at least two mounting slots 2011, each of which houses an anode element 10. One anode element 10 is positioned on either side of the other anode element 10 as an anode supplement. The two anode elements 10 can be spaced apart or placed in contact with each other. When there is a certain distance between the two anode elements 10, the two mounting slots 2011 should be spaced apart accordingly. When the two anode elements 10 are in contact, the two mounting slots 2011 should be connected.

[0130] In one possible implementation, see Figure 23 As shown, the mounting base 20 further includes a cover plate 203, which is detachably connected to the base body 201. In operation, the cover plate 203 covers the edge portion of the anode member 10. If the electric line density in the center portion of the anode member 10 is too low due to the edge effect, the cover plate 203 can be added to cover the edge portion of the anode member 10, thereby limiting the current transmission to the edge region.

[0131] In one possible implementation, see Figure 24 As shown, the mounting base 20 also includes a clamping assembly 204, which includes at least a support frame 2041 and a clamping member 2042. One end of the support frame 2041 is mounted on the base 201, and the other end is a telescopic structure. The clamping member 2042 is connected to the telescopic structure. The clamping member 2042 has a clamping groove. In the operating state, the two ends of the anode member 10 are respectively located in the mounting groove 2011 and the clamping groove. The height of the support frame 2041 is adjusted according to the degree of deformation of the anode member 10. Specifically, the clamping groove is provided with a threaded hole 2012, which allows the clamping member 2042 to be threadedly connected to the anode member 10, thereby maintaining a stable deformation state of the anode member 10. The support frame 2041 can be a telescopic rod.

[0132] In practical applications, reference Figure 30-Figure 32 As shown, a plurality of mounting seats 20 are provided within the electroplating tank 60. The plurality of mounting seats 20 are spaced or continuously arranged along a predetermined direction to form anode arrays. The plurality of anode arrays are spaced apart within the electroplating tank 60, and a plating channel 601 is formed between adjacent anode arrays. The width of the plating channel 601 is greater than the thickness of the workpiece 30 to be plated. During operation, the moving mechanism 50 drives the carrier 40 along the plating channel 601. In this way, the cations released by the anode elements 10 located on either side of the plating channel 601 are attached to both sides of the workpiece 30 to be plated, thereby achieving double-sided electroplating of the workpiece 30. Preferably, each mounting seat 20 is provided with two mounting slots 2011, in which the two anode elements 10 are mounted, respectively. The two mounting slots 2011 are spaced apart and arranged parallel to each other. The moving mechanism 50 can employ an existing mechanical transmission structure capable of moving the carrier 40, such as a drive source driving a transmission member to move the carrier 40.

[0133] Furthermore, a plurality of electroplating channels 601 are arranged in parallel in the electroplating tank 60 , so that a plurality of parts 30 to be electroplated can be electroplated in the electroplating tank 60 at the same time, thereby achieving continuous and efficient production. If only one electroplating channel 601 is set, a continuous electroplating method can be adopted, and the distance between the two mounting grooves 2011 in a mounting seat 20 can be adjusted to be greater than the thickness of the workpiece 30 to be electroplated, that is, a plating channel 601 is formed between the two mounting grooves 2011. When the workpiece 30 to be electroplated moves into the electroplating channel 601, the two anode parts 10 will electroplate the two sides of the workpiece 30 to be electroplated respectively. That is to say, even if the distance between the two anode parts 10 is large enough, when the workpiece 30 to be electroplated is double-sided electroplated, the electroplating channel 601 can only allow one workpiece 30 to be electroplated to pass through at a time. Therefore, multiple workpieces 30 to be electroplated need to enter the electroplating channel 601 in sequence. While ensuring that the workpieces 30 to be electroplated do not affect each other, the smaller the interval time between two adjacent workpieces 30 to be electroplated entering the anode channel, the higher the electroplating efficiency. If multiple electroplating channels 601 are provided simultaneously, the two anode members 10 installed on one mounting seat 20 serve as the side walls of the two electroplating channels 601, i.e., one anode member 10 serves as the left side wall of the first electroplating channel 601, and the other anode member 10 serves as the right side wall of the second electroplating channel 601. Under this structure, the distance between the two mounting grooves 2011 on one mounting seat 20 can be less than the thickness of the workpiece 30 to be electroplated, thereby enabling parallel and continuous electroplating of the multiple workpieces 30 to be electroplated. Specifically, multiple workpieces 30 to be electroplated can be simultaneously mounted on the carrier 40, with the multiple workpieces 30 to be electroplated being parallel to each other and the number of the mounted workpieces 30 being equal to or less than the number of the electroplating channels 601. This allows the multiple workpieces 30 to be electroplated to enter the electroplating channels 601 simultaneously for electroplating. Since the multiple electroplating channels 601 are independent of each other, the manner in which the workpieces 30 to be electroplated enter the electroplating channels 601 is the same as when only one electroplating channel 601 is provided. Compared to individual installation, the parallel installation of multiple parts 30 to be plated can reduce the space occupied by the installation components. In addition, the parallel movement of multiple parts 30 to be plated facilitates management and adjustment of the interval time. Therefore, it can be seen that the provision of multiple plating channels 601 in the plating tank 60 can effectively improve the plating efficiency of the vertical plating equipment.

[0134] In summary, the anode assembly provided in the present application is formed by combining two or more anode parts 10. By making the anode part 10 partially overlap with the anode supplement part 70, and the overlapping part is located in the central area, the electric line density in the central area of ​​the anode assembly is greater than the electric line density in the edge area. Under the edge effect, the uniformity of the electric line on the surface of the anode assembly is improved.

[0135] The present application further makes the hollow density of the central part 101 greater than the hollow density of the edge part 102, so that the central part 101 generates more electric lines, so that under the edge effect, the density of the electric lines gathered in the central part 101 is similar to the density of the electric lines gathered in the edge part 102, and the amount of cations moving to the surface of the workpiece 30 to be electroplated is similar, thereby improving the uniformity of the surface coating of the workpiece 30 to be electroplated.

[0136] The present application further increases the electric line density of the central portion 101 by making the distances between the central portion 101 and the edge portion 102 and the surface 105 of the workpiece 30 to be electroplated different, thereby improving the uniformity of the surface coating of the workpiece 30 to be electroplated under the edge effect.

[0137] The present application also provides an electroplating device including an anode assembly, which moves the workpiece 30 to be electroplated in the electroplating tank 60 so that the anode parts 10 passing by the workpiece 30 during the movement can provide cations to it, thereby further improving the uniformity of the plating layer of the workpiece 30 to be electroplated.

[0138] The electroplating plant includes the entire technical solution of the anode assembly and therefore also has all the technical advantages of the anode assembly.

[0139] It needs to be defined that the "vertical" or "parallel" mentioned in this application is not strictly vertical or parallel. For example, an angle of 92 degrees or 88 degrees between two components can be considered vertical, and an angle of 2 degrees between two components can be considered parallel. That is, within the scope of manufacturing tolerance or on the premise of meeting functional requirements, the two components remain "vertical" or "parallel".

[0140] It should be noted that the projection referred to in this application is an orthographic projection. For example, the projection of component A on plane B refers to the orthographic projection of component A on plane B.

[0141] It should be noted that the technical principles are introduced only to better understand the technical solution and technical effects, and are not essential to a complete technical solution. Due to the applicant's knowledge and current technological constraints, the technical principles involved in this application may contain deviations or errors, but this does not affect the correctness and completeness of the technical solution and the technical effects it produces.

[0142] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An anode assembly, characterized in that: The anode component and the anode supplement component are provided so that at least a portion of the anode component and the anode supplement component overlap in a direction perpendicular to the surface of the workpiece to be plated.

2. The anode assembly according to claim 1, characterized in that: In a projection plane, the anode assembly is projected to form a projection pattern, and the first pattern formed by the projection of the anode component overlaps with the second pattern formed by the projection of the anode supplement component to form an overlapping area; wherein, the overlapping area is located in the central area of ​​the projection pattern, and the projection pattern other than the overlapping area is the remaining area, and the remaining area is located in the edge area of ​​the projection pattern, and the projection plane is parallel to the surface to be plated of the component to be electroplated.

3. The anode assembly according to claim 2, wherein: The first graphic and the second graphic are both regular graphics, wherein: The anode supplement and the anode member have the same shape, and the overlapping area formed therein has the same shape as the remaining area; or The anode supplement and the anode member have the same shape, and the overlapping area is different in shape from the remaining area; or The anode supplement and the anode member have different shapes, and the overlapping area formed therein has the same shape as the remaining area; or The anode supplement and the anode member have different shapes, and the overlapping area formed therein has a different shape from the remaining area.

4. The anode assembly according to claim 2, wherein: The second pattern formed by the anode supplement in the projection plane includes a plurality of regular patterns, and the plurality of regular patterns are sequentially overlapped along the circumferential direction.

5. The anode assembly according to claim 1, wherein The anode member and the anode supplement member are both hollow structures, and the structure of the anode assembly is any one of the following: (1) The hollow density of the anode supplementary member is less than the hollow density of the anode member; (2) The hollow density of the anode supplementary member is greater than the hollow density of the anode member; (3) The hollow density of the anode supplementary member is equal to the hollow density of the anode member.

6. The anode assembly according to claim 5, characterized in that There are a plurality of anode supplementary parts, and the sizes and hollow density of the anode supplementary parts gradually decrease in a direction away from the anode part.

7. The anode assembly according to claim 2, wherein: The anode member and the anode supplement member are both hollow structures; the second pattern formed by the anode supplement member in the projection plane includes a plurality of regular patterns, and the plurality of regular patterns are stacked in sequence along the circumferential direction; the size and hollow density of the plurality of regular patterns gradually decrease from the inside to the outside.

8. The anode assembly according to any one of claims 1 to 7, characterized in that: The anode part has a central part and an edge part, the central part is at least partially located in a first plane, and the edge part is at least partially located in a second plane, and the distance between the first plane and the surface to be plated of the part to be electroplated is smaller than the distance between the second plane and the surface to be plated of the part to be electroplated.

9. An electroplating device, characterized in that: The anode assembly according to any one of claims 1 to 8, further comprising: A mounting seat, used for mounting the anode assembly; Carrier, used to mount the parts to be plated; A moving mechanism, used for driving the carrier to move; an electroplating tank, wherein the mounting seat is disposed in the electroplating tank; power supply; In working state, the plating tank is filled with plating liquid, the anode assembly and the area to be plated of the workpiece to be plated are immersed in the plating liquid, the positive pole of the power supply is electrically connected to the anode assembly, and the negative pole of the power supply is electrically connected to the workpiece to be plated.

10. The electroplating equipment according to claim 9, characterized in that: The mounting base at least includes a base body, the base body is provided with a mounting groove for accommodating the anode assembly, and the mounting groove is at least one; the mounting base also includes a cover plate, the cover plate is detachably connected to the base body, and in a working state, the cover plate covers the edge portion of the anode assembly; A plurality of mounting seats are provided in the electroplating tank, and the plurality of mounting seats are distributed at intervals or continuously along a preset direction to form an anode queue; A plurality of anode queues are arranged at intervals in the electroplating tank, and an electroplating channel is formed between two adjacent anode queues; In a working state, the moving mechanism drives the carrier to move along the electroplating channel.

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