Chip induction lamp

Abstract

The utility model relates to the technical field of lamp structures, and provides a chip induction lamp, which comprises a heat conduction substrate, the light-emitting plate is used for emitting light and is mounted on the heat-conducting substrate; the sensing chip is used for sensing environment change to control the light emitting of the light emitting plate; the sealing seat is used for loading the sensing chip, the sealing seat is installed on the heat conduction substrate and is sealed through the heat conduction substrate, and the sensing chip is attached to the side, directly making contact with the heat conduction substrate, of the sealing seat so that heat generated by the sensing chip can be conducted out. According to the utility model, the sealing seat used for loading the induction chip is installed on the heat conduction substrate, so that the installation space of the induction chip is reduced, the induction chip is designed to be attached to one side, directly contacted with the heat conduction substrate, of the sealing seat on the basis, and the heat of the induction chip is rapidly transmitted to the heat conduction substrate through the sealing seat; the temperature of the chip is maintained in a certain interval, the performance stability of the chip is improved, and normal use of the lamp is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp structures, in particular to a chip induction lamp. Background Art

[0002] With technological advancements and growing awareness of energy conservation and environmental protection, sensor lights—intelligent lighting devices that automatically detect environmental changes and control lighting accordingly—have become widely used in homes, businesses, and public spaces. These sensor lights typically use infrared, pyroelectric, or microwave technologies to sense human activity or other triggering conditions, and their built-in control circuitry enables intelligent light source management.

[0003] However, the sensor chips in most induction lamps currently on the market usually need to be installed in a special chip box. Although this design can protect the chip from the influence of the external environment to a certain extent, it also takes up a large space, making it difficult to adapt to the requirements of the installation position, making it difficult for heat to be transferred out quickly, resulting in slow heat dissipation. As a result, the chip temperature may continue to rise in the state of continuous operation, which in turn affects the performance stability of the chip and even causes the overheating protection mechanism to be activated, affecting the normal use of the lamp. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide an induction lamp that reduces the installation space of the induction chip and improves the heat dissipation effect of the induction chip.

[0005] In order to solve the above problems, the present invention provides the following technical solutions:

[0006] A chip induction lamp, comprising:

[0007] Thermally conductive substrate;

[0008] A light-emitting plate, used for emitting light, wherein the light-emitting plate is mounted on the heat-conducting substrate;

[0009] A sensing chip, used for sensing environmental changes to control the light emission of the light emitting panel;

[0010] The sealing seat is used to load the sensing chip. The sealing seat is installed on the thermally conductive substrate and sealed by the thermally conductive substrate. The sensing chip is attached to the side of the sealing seat that directly contacts the thermally conductive substrate to conduct the heat generated by the sensing chip.

[0011] In one embodiment, a sealing chamber is provided on the thermally conductive substrate, the sealing chamber and the thermally conductive substrate are integrally formed, and the sealing seat is assembled in the sealing chamber.

[0012] In one embodiment, an assembly plate is further included, which is installed on the cavity of the sealing chamber. The sealing seat is detachably installed on the assembly plate, and the sealing seat is communicated with the sealing chamber when installed on the assembly plate.

[0013] In one embodiment, the sealing chamber is disposed in the center of the thermally conductive substrate.

[0014] In one embodiment, a threaded plug is provided on the sealing seat, and a connecting port is provided on the assembly plate. The threaded plug is installed into the connecting port by rotating the sealing seat.

[0015] In one embodiment, a heat dissipation fin is provided on a side of the heat conductive substrate facing away from the light emitting board, and an extension direction of the heat dissipation fin is perpendicular to the light emitting board.

[0016] In one embodiment, the height of the sealed chamber is less than or equal to the height of the thermally conductive substrate.

[0017] In one embodiment, a heat conducting sheet is further included, and the heat conducting sheet is installed between the sensing chip and the sealing seat, and / or the heat conducting sheet is installed between the heat conducting substrate and the sealing seat.

[0018] In one embodiment, a plurality of heat dissipation holes are provided on a side of the heat conductive substrate close to the sealed chamber, and any adjacent heat dissipation holes are arranged with each other and surround the sealed chamber.

[0019] In one embodiment, the heat dissipation hole passes through the thermally conductive substrate.

[0020] The beneficial effect of the utility model is that the sealing seat for loading the sensing chip is installed on the thermally conductive substrate, and the sealing seat is sealed by the thermally conductive substrate, so that the sensing chip can be installed without using a chip box, reducing the installation space of the sensing chip. On this basis, the sensing chip is designed to be attached to the side of the sealing seat that directly contacts the thermally conductive substrate, so that the heat of the sensing chip can be quickly transferred to the thermally conductive substrate through the sealing seat, and the heat is quickly dissipated through the thermally conductive substrate, so that the temperature of the chip is maintained within a certain range under continuous working conditions, thereby improving the performance stability of the chip and ensuring the normal use of the lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional diagram of one embodiment of a chip sensor lamp of the present invention;

[0022] Figure 2 This is a cross-sectional view of one embodiment of a chip sensor lamp of the present invention;

[0023] Figure 3 This is a schematic diagram of the assembly of a sealing seat and a sealing chamber in one embodiment;

[0024] Figure 4 This is a schematic diagram of the assembly of another embodiment of a sealing seat and a sealing chamber;

[0025] Figure 5 This is a schematic diagram of the assembly of one of the embodiments of Example 1;

[0026] Figure 6 This is an exploded schematic diagram of one embodiment of a chip sensor lamp of the present invention;

[0027] Figure 7 This is a schematic diagram of the decomposition of one of the embodiments 1 and 2 of the present invention.

[0028] Reference numerals:

[0029] 100, chip sensor lamp; 110, thermally conductive substrate; 111, light-emitting board; 112, sensor chip; 113, sealing seat; 114, sealing chamber; 115, assembly plate; 121, threaded plug; 12a, connection port; 122, heat sink fin; L1, height of sealing chamber; L2, height of thermally conductive substrate; 116, thermal pad; 12b, heat dissipation hole;

[0030] 200, sealing structure; 211, sealing cover; 212, sealing ring; 21a, sealing groove; 221, sealing protrusion; 31a, sealing groove; 311, supporting frame; 411, sealing gasket; 412, waterproof ring; 41a, embedding groove; 511, fixing nut; 512, gasket; 51a, limiting groove. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0033] Example 1: Please refer to Figure 1-2 and Figure 5-7As shown, this embodiment provides a chip sensor lamp 100, which includes: a thermally conductive substrate 110, a light-emitting board 111, a sensor chip 112 and a sealing seat 113; wherein the light-emitting board 111 is used to irradiate light and is installed on the thermally conductive substrate 110. The thermally conductive substrate 110 dissipates heat by loading the light-emitting board 111. The sensor chip 112 is used to sense environmental changes to control the light emission of the light-emitting board 111; further, the sealing seat 113 is used to load the sensor chip 112. The sealing seat 113 is installed on the thermally conductive substrate 110 and sealed by the thermally conductive substrate 110. The sensor chip 112 is attached to the side of the sealing seat 113 that directly contacts the thermally conductive substrate 110 to conduct away the heat generated by the sensor chip 112.

[0034] According to the above scheme, it can be understood that this embodiment installs the sealing seat 113 for loading the sensing chip 112 on the thermally conductive substrate 110, and seals the sealing seat 113 through the thermally conductive substrate 110, thereby realizing the installation of the sensing chip 112 without the need for a chip box structure, and realizes sealing by using the sealing seat 113 to load the sensing chip 112 and install it into the thermally conductive substrate 110, and designs the sensing chip 112 to be attached to the side of the sealing seat 113 that directly contacts the thermally conductive substrate 110, thereby realizing the rapid transfer of the heat of the sensing chip 112 through the sealing seat 113 to the thermally conductive substrate 110, and the rapid heat dissipation through the thermally conductive substrate 110, so that the temperature of the chip is maintained within a certain range under continuous working conditions, thereby improving the performance stability of the chip and ensuring the normal use of the lamp.

[0035] According to the above scheme, preferably, a sealing chamber 114 is provided on the thermal conductive substrate 110. In this embodiment, a recess is designed on one side of the thermal conductive substrate 110 facing the irradiation direction of the light-emitting plate 111, so that the recess forms a sealing chamber 114 integrally formed with the thermal conductive substrate 110. The sealing seat 113 on which the sensing chip 112 is installed is installed into the sealing chamber 114, thereby achieving the installation and sealing of the sensing chip 112. Furthermore, in this embodiment, the chip sensor lamp 100 also includes an assembly plate 115, which is installed at the cavity of the sealing chamber 114. By designing the sealing seat 113, the sealing seat 113 is installed on the assembly plate 115, so that the sealing seat 113 is A threaded plug 121 is provided on one side, and the threaded plug 121 is used to connect to the assembly plate 115. Furthermore, a connection port 12a is provided on the assembly plate 115. The threaded plug 121 is driven to be installed into the connection port 12a by rotating the sealing seat 113, so that the sealing seat 113 can be detachably installed on the assembly plate 115. In this embodiment, the sealing seat 113 is connected to the sealing chamber 114 when installed on the assembly plate 115 through the threaded plug 121. It can be understood that the light-emitting board 111 is connected with the sealing chamber 114 through the sealing chamber 114, so that the wires of the light-emitting board 111 can be electrically connected to the sensing chip 112 through the sealing chamber 114 and the threaded plug 121.

[0036] Preferably, the sealing chamber 114 is arranged in the center of the heat-conducting substrate 110. The advantage of designing this structure is that the sealing chamber 114 and the sealing seat 113 installed in the sealing chamber 114 can be located in the center of the overall chip sensing lamp 100, which is more conducive to the sensing chip 112 sensing the surrounding environment and the control of the light-emitting board 111, and the sensing chip 112 is not easily affected by the heat generated by the light-emitting board 111 during operation.

[0037] Preferably, heat dissipation fins 122 are provided on the side of the thermally conductive substrate 110 facing away from the light-emitting board 111. The heat dissipation fins 122 are used to increase the heat dissipation area, thereby improving the heat dissipation speed, and realize the circulation of airflow through the heat dissipation channel formed by the heat dissipation fins 122 arranged at intervals from each other, thereby quickly dissipating the heat. In addition, the extension direction of the heat dissipation fins 122 is perpendicular to the light-emitting board 111. The purpose of designing this structure is to not affect the illumination of the light-emitting board 111; further, in this embodiment, the height L1 of the sealed chamber 114 ≤ the height L2 of the thermally conductive substrate 110. Optionally, in this embodiment, the height L1 of the sealed chamber 114 is less than the height L2 of the thermally conductive substrate 110. The purpose of this is to limit the space of the sealed chamber 114 to avoid the height L1 of the sealed chamber 114 being too high and occupying a larger space, so that the overall structure of the chip sensor lamp 100 is more reasonable and the heat dissipation effect is better.

[0038] Preferably, a heat conducting sheet 116 is further included, and the heat conducting sheet 116 is installed between the sensing chip 112 and the sealing seat 113, and / or the heat conducting sheet 116 is installed between the heat conducting substrate 110 and the sealing seat 113. Optionally, in this embodiment, the heat conducting sheet 116 is installed between the sensing chip 112 and the sealing seat 113, and the heat conducting sheet 116 enables the sensing chip 112 to quickly transfer heat to the sealing seat 113, so that the sealing seat 113 can further dissipate heat. It is understandable that in other embodiments, the heat conducting sheet 116 can also be provided at the connection between the sealing seat 113 and the sealing chamber 114 to increase the speed at which the sealing seat 113 transfers heat to the side wall of the sealing chamber 114, and the sealing chamber 114 is integrally formed with the heat conducting substrate 110 to achieve rapid dispersion and transfer of heat. It is understandable that the heat conducting sheet 116 in this embodiment is a heat conducting silicone sheet.

[0039] Preferably, a plurality of heat dissipation holes 12b are provided on one side of the thermally conductive substrate 110 close to the sealed chamber 114, and any adjacent heat dissipation holes 12b are arranged with each other and surround the sealed chamber 114. Furthermore, in this embodiment, the heat dissipation holes 12b pass through the thermally conductive substrate 110, and the air flow in the vertical direction is realized through the heat dissipation holes 12b. Moreover, by designing the heat dissipation holes 12b on the peripheral side of the sealed chamber 114, the air flow accelerates the heat dissipation of the sealed chamber 114 during the circulation process.

[0040] Example 2: Please refer to Figure 1-4 and Figure 6-7 As shown, this embodiment provides a sealing structure 200, which includes: a sealing seat 113, a sealing cover 211 and an elastic sealing ring 212, wherein the sealing seat 113 is used to install the sensing chip 112, the sealing cover 211 covers the sensing chip 112 and is engaged with the sealing seat 113, the sensing chip 112 is used to sense environmental changes and / or control the light emission of the light-emitting board 111. In this embodiment, the sensing chip 112 is used to sense environmental changes and control the light emission of the light-emitting board 111; further, the elastic sealing ring 212 is provided with at least one circle, and the elastic sealing ring 212 is provided on the contact surface between the sealing cover 211 and the sealing seat 113. When the sealing cover 211 and the sealing seat 113 are closed, the elastic sealing ring 212 provides a sealing effect.

[0041] According to the above scheme, it can be understood that in this embodiment, when the sealing cover 211 and the sealing seat 113 are closed, the elastic sealing ring 212 will abut against the sealing cover 211 and the sealing seat 113 respectively, and the sealing cover 211 and the sealing seat 113 will squeeze the elastic sealing ring 212 so that the elastic sealing ring 212 will be deformed after being subjected to force, thereby improving its sealing effect between the sealing cover 211 and the sealing seat 113.

[0042] According to the above scheme, it can be understood that in this embodiment, the sensing chip 112 is installed on the sealing seat 113, and the sealing seat 113 is engaged with the sealing cover 211 to achieve the sealing of the sensing chip 112, and at least one circle of elastic sealing ring 212 is designed on the contact surface between the sealing cover 211 and the sealing seat 113 to achieve a double waterproof effect for the sensing chip 112, and the elastic sealing ring 212 seals the sensing chip 112 when the sealing cover 211 and the sealing seat 113 are closed, so that the thickness of the seal between the sealing cover 211 and the sealing seat 113 is more controllable, thereby improving its sealing effect on the sensing chip 112, and the elasticity of the elastic sealing ring 212 increases its wear resistance between the sealing cover 211 and the sealing seat 113, thereby avoiding its aging failure and ensuring the stability of the sealing effect on the sensing chip 112.

[0043] Preferably, optionally, the present embodiment is designed to have one elastic sealing ring 212 on the contact surface between the sealing cover 211 and the sealing seat 113, and the elastic sealing ring 212 is provided on the contact surface between the sealing cover 211 and the sealing seat 113. It is understandable that in other embodiments, the number of elastic sealing rings 212 on the contact surface between the sealing cover 211 and the sealing seat 113 can be multiple circles according to the structure of the sealing seat 113 or the structure of the sealing cover 211, so as to maintain its sealing effect on the sensing chip 112, which will not be elaborated here.

[0044] According to the above scheme, if Figure 3 As shown, preferably, in some embodiments, one of the sealing cover 211 and the sealing seat 113 is provided with a sealing groove 21a facing the other, and the other of the sealing cover 211 and the sealing seat 113 is provided with a sealing protrusion 2221, and the elastic sealing ring 212 is installed in the sealing groove 21a, and the sealing protrusion 2221 abuts against the elastic sealing ring 212 when the sealing cover 211 and the sealing seat 113 are engaged; it can be understood that the purpose of designing the sealing groove 21a is to limit the elastic sealing ring 212 to facilitate the installation of the sealing ring 212, and through the cooperation of the sealing groove 21a and the sealing protrusion 2221, the sealing effect of the elastic sealing ring 212 can be maximized while reducing the volume of the elastic sealing ring 212.

[0045] Preferably, Figure 4As shown, in some embodiments, a threaded plug 121 is provided on the sealing cover 211 for connecting the sensing chip 112 to the light-emitting board 111. It can be understood that in this embodiment, the threaded plug 121 is used to realize that the overall sealing structure 200 can be installed into the lamp, and after being installed into the lamp through the threaded plug 121, the sensing chip 112 is electrically connected to the light-emitting board 111 of the lamp through the threaded plug 121. The outer wall of the threaded plug 121 is provided with a sealing groove 31a, and the elastic sealing ring 212 is installed in the sealing groove 31a.

[0046] Preferably, in the above two different embodiments, the elastic sealing ring 212 can be removably installed in the sealing groove. This embodiment can include either one of them or all of them. The advantage of designing this structure is that the elastic sealing ring 212 can be replaced, thereby improving the service life of the sealing structure 200 through maintenance.

[0047] Preferably, a support frame 311 is provided in the sealing seat 113, and the sensing chip 112 is installed on the support frame 311 and spaced apart from the bottom wall of the sealing seat 113, and / or the sensing chip 112 is installed on the support frame 311 and spaced apart from the sealing cover 211. Optionally, in this embodiment, the sensing chip 112 is installed on the support frame 311 and spaced apart from the bottom wall of the sealing seat 113, and spaced apart from the sealing cover 211; it can be understood that the purpose of designing the support frame 311 is to be able to engage the sensing chip 112, so as to maintain the installation position of the sensing chip 112, avoid displacement of the sensing chip 112 when it is shaken in the sealing seat 113, and further enhance its waterproof effect by designing the sensing chip 112 to be spaced apart from the bottom wall of the sealing seat 113 and the sealing cover 211.

[0048] Example 3: Please refer to Figure 1-2 and Figure 6-7 As shown, this embodiment provides a chip sensor lamp 100, including the sealing structure 200 as in Example 2, which also includes: a thermally conductive substrate 110 and a light-emitting board 111; wherein the light-emitting board 111 is used to irradiate light, the light-emitting board 111 is installed on the thermally conductive substrate 110, the sealing structure 200 is installed in the center of the thermally conductive substrate 110, and the sensor chip 112 is electrically connected to the light-emitting board 111.

[0049] According to the above scheme, it can be understood that the sensing chip 112 in this embodiment is electrically connected to the light-emitting board 111, so that the sensing chip 112 can sense and monitor the surrounding environment and control and adjust the operation of the light-emitting board 111 in real time; in addition, the sealing structure 200 of this embodiment is installed in the center of the thermal conductive substrate 110. The advantage of designing this structure is that the sealing chamber 114 and the sealing seat 113 installed in the sealing chamber 114 can be located in the center of the overall chip sensing lamp 100, which is more conducive to the sensing chip 112 sensing the surrounding environment and controlling the light-emitting board 111, and the sensing chip 112 is not easily affected by the heat generated by the light-emitting board 111 during operation.

[0050] Preferably, the chip sensor lamp 100 also includes a sealing gasket 411. A sealing chamber 114 is provided on the thermal conductive substrate 110. The sealing gasket 411 is installed between the sealing chamber 114 and the sealing seat 113. The sealing seat 113 is assembled in the sealing chamber 114 and seals the sensing chip 112 through the sealing gasket 411. This structure is to achieve multiple waterproofing of the sensing chip 112 through the sealing effect, and at the same time also improve the sealing effect of the electrical connection structure of the light-emitting board 111.

[0051] Preferably, a waterproof ring 412 is also included. An embedding groove 41a is provided on the peripheral side of the thermal conductive substrate 110 close to the sealing chamber 114, and the waterproof ring 412 is installed in the embedding groove 41a. It can be understood that this structure further seals the sealing seat 113 after it is assembled into the sealing chamber 114, thereby preventing some liquids or other substances from deviating from the light-emitting board 111 from the thermal conductive substrate 110 from affecting the sealing seat 113 and the interior of the sealing chamber 114.

[0052] Preferably, in some embodiments, the chip sensor lamp 100 further includes a fixing nut 511 and a gasket 512. The fixing nut 511 is installed on the side of the thermal conductive substrate 110 away from the sealing seat 113. The sealing cover 211 is provided with a threaded plug 121. The gasket 512 is sleeved on the threaded plug 121. When the threaded plug 121 is inserted into the fixing nut 511, the gasket 512 is located between the thermal conductive substrate 110 and the sealing seat 113, thereby realizing a detachable connection between the threaded plug 121 and the fixing nut 511. This structure is to fix the corresponding assembled threaded plug 121 by the fixing nut 511, thereby improving the installation stability of the threaded plug 121. The design of the gasket 512 improves the connection effect between the threaded plug 121 and the fixing nut 511 and improves its firmness. In addition, a limiting groove 51a is provided on the outer wall of the threaded plug 121, and the gasket 512 is installed in the limiting groove 51a. This structure is to prevent the gasket 512 from moving during the assembly process and causing a negative impact on the assembly effect.

[0053] In summary, this embodiment installs a sealing seat for loading the sensing chip on the thermally conductive substrate, and seals the sealing seat through the thermally conductive substrate, thereby realizing the installation of the sensing chip without the need for a chip box. The sealing seat is used to load the sensing chip and install it into the thermally conductive substrate to achieve sealing. The sensing chip is designed to be attached to the side of the sealing seat that directly contacts the thermally conductive substrate, thereby realizing the rapid transfer of heat from the sensing chip to the thermally conductive substrate through the sealing seat, and the rapid heat dissipation through the thermally conductive substrate, thereby maintaining the temperature of the chip within a certain range under continuous working conditions, improving the performance stability of the chip, and ensuring Normal use of the lamp; and by installing the sensing chip on the sealing seat, and clamping the sealing seat with the sealing cover to achieve the sealing of the sensing chip, and designing at least one circle of elastic sealing ring on the contact surface between the sealing cover and the sealing seat to achieve a double waterproof effect on the sensing chip, and the elastic sealing ring seals the sensing chip when the sealing cover and the sealing seat are closed, so that the thickness of the seal between the sealing cover and the sealing seat is more controllable, thereby improving its sealing effect on the sensing chip, and the elasticity of the elastic sealing ring increases its wear resistance between the sealing cover and the sealing seat, avoiding its aging failure, and ensuring the stability of the sealing effect on the sensing chip.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip induction lamp, characterized in that: include: Thermally conductive substrate; A light-emitting plate, used for emitting light, wherein the light-emitting plate is mounted on the heat-conducting substrate; A sensing chip, used for sensing environmental changes to control the light emission of the light emitting panel; The sealing seat is used to load the sensing chip. The sealing seat is installed on the thermally conductive substrate and sealed by the thermally conductive substrate. The sensing chip is attached to the side of the sealing seat that directly contacts the thermally conductive substrate to conduct the heat generated by the sensing chip.

2. The chip induction lamp according to claim 1, characterized in that: A sealing chamber is provided on the heat-conducting substrate. The sealing chamber and the heat-conducting substrate are integrally formed, and the sealing seat is assembled in the sealing chamber.

3. The chip sensor lamp according to claim 2, characterized in that: It also includes an assembly plate, which is installed on the cavity of the sealing chamber. The sealing seat is detachably installed on the assembly plate, and the sealing seat is communicated with the sealing chamber when installed on the assembly plate.

4. The chip induction lamp according to claim 2, characterized in that: The sealing chamber is arranged at the center of the heat-conducting substrate.

5. The chip induction lamp according to claim 3, characterized in that: The sealing seat is provided with a threaded plug, and the assembly plate is provided with a connecting port. The threaded plug is driven to be installed into the connecting port by rotating the sealing seat.

6. The chip induction lamp according to claim 1, characterized in that: A heat dissipation fin is provided on a side of the heat-conducting substrate away from the light-emitting board, and an extension direction of the heat dissipation fin is perpendicular to the light-emitting board.

7. The chip sensor lamp according to claim 2, characterized in that: The height of the sealing chamber is less than or equal to the height of the heat-conducting substrate.

8. The chip sensor lamp according to claim 1, characterized in that: It also includes a heat conducting sheet, which is installed between the sensing chip and the sealing seat, and / or the heat conducting sheet is installed between the heat conducting substrate and the sealing seat.

9. The chip induction lamp according to claim 2, characterized in that: A plurality of heat dissipation holes are provided on a side of the heat-conducting substrate close to the sealing chamber, and any adjacent heat dissipation holes are arranged with each other and surround the sealing chamber.

10. The chip induction lamp according to claim 9, characterized in that: The heat dissipation hole passes through the heat conductive substrate.

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