Chip rotary heating device

Abstract

The utility model discloses a chip rotary heating device. The chip rotary heating device comprises a base; the bearing piece is rotationally arranged on the base, and the bearing piece is provided with a plurality of assembling parts used for assembling chips; the heating assembly comprises a first heating piece, the first heating piece is located above the bearing piece and covers the multiple assembling parts, the first heating piece is provided with a testing notch, and the testing notch is used for exposing part of the assembling parts; and the rotation driving mechanism is in transmission connection with the bearing piece, and the rotation driving mechanism can drive the bearing piece to rotate, so that each assembly part can pass through the test notch in the rotation stroke, the chip is uniformly heated in the heating process, and the chip is not damaged. All the assembling parts can pass through the test notches in the rotating process, continuous operation is achieved, the production efficiency is greatly improved, diversified production requirements are met, and the temperature, performance and the like of the chip are monitored in time.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a chip rotating heating device. Background Art

[0002] Chips may encounter various temperature environments during actual use. Therefore, reliability testing of chips by heating them can identify potential issues such as thermal stability and thermal fatigue in advance, verify whether they meet product quality requirements, and ensure that the chips can function properly under different temperature conditions. Existing technology generally uses a metal plate with good thermal conductivity to heat the metal plate, then places the chip on the metal plate, and heat is transferred to the chip through contact. This method is simple and direct, but chip testing requires the testing equipment to be moved to each chip position for separate testing. This places high demands on the movement and positioning of the testing equipment, and the operation is complex and inefficient. Utility Model Content

[0003] The present application discloses a chip rotating heating device, which allows the chips to be heated evenly during the heating process. At the same time, each chip can pass through the test gap during the rotation process, realizing continuous operation, greatly improving production efficiency, adapting to diverse production needs, and at the same time being able to timely monitor the temperature, performance and other parameters of the chip, thereby improving the stability and consistency of product quality.

[0004] In order to achieve the above objectives, the present application discloses a chip rotating heating device, comprising:

[0005] base;

[0006] A supporting member, the supporting member is rotatably mounted on the base, and the supporting member has a plurality of mounting portions for mounting chips;

[0007] a heating assembly, the heating assembly comprising a first heating element, the first heating element being located above the supporting element and covering the plurality of the assembly portions, the first heating element being provided with a test notch, the test notch being used to expose a portion of the assembly portion;

[0008] A rotary drive mechanism is in transmission connection with the supporting member, and the rotary drive mechanism can drive the supporting member to rotate so that each of the assembling parts can pass through the test notch during its rotation stroke.

[0009] In a possible implementation, the plurality of assembly portions are distributed around the rotation center of the supporting member, and the distance between each assembly portion and the rotation center of the supporting member is the same.

[0010] In one possible implementation, the heating assembly further includes a second heating element, which is located below the supporting element and corresponds to the plurality of assembly portions.

[0011] In one possible implementation, the heating assembly further includes a third heating element, which is arranged around a circumference of the supporting member.

[0012] In one possible implementation, the heating assembly includes a heat source, which is connected to the first heating element, the second heating element or the third heating element, the upper end of the third heating element is connected to the first heating element, and the lower end of the third heating element is connected to the second heating element, and the first heating element, the second heating element and the third heating element are heat conductive elements.

[0013] In one possible implementation, the second heating element is provided with a plurality of mounting grooves on the side facing the supporting element, the heat source includes a plurality of groups of heating plates, each group of heating plates is stacked in the mounting grooves along the vertical direction, and the chip rotating heating device also includes a fixed pressure plate, which is provided above the second heating element and is pressed onto the heating plates.

[0014] In one possible implementation, the chip rotating heating device also includes a cover plate, which is located above the first heating element and covers the first heating element. A temperature sensor is provided on the cover plate. A temperature measuring through hole is provided at a position of the cover plate and the first heating element corresponding to one of the assembly parts, and a test end of the temperature sensor corresponds to the temperature measuring through hole.

[0015] In one possible implementation, the chip rotation heating device further includes a vacuum source, an adsorption hole is provided on the assembly portion, the vacuum source is connected to the adsorption hole, and the vacuum source is used to evacuate so that the adsorption hole forms a negative pressure to adsorb the chip.

[0016] In one possible implementation, the chip rotating heating device further includes a vacuum breaking solenoid valve, a vacuum breaking through hole is provided on the first heating element, the vacuum breaking solenoid valve is connected to the vacuum breaking through hole, and the vacuum breaking solenoid valve allows external gas to blow toward the chip through the vacuum breaking through hole.

[0017] In a possible implementation, the chip rotation heating device further includes a temperature-lowering solenoid valve, which is connected to the rotation drive mechanism and is used to cool the rotation drive mechanism.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] In the chip rotation heating device provided in the present application, a supporting member is rotatably assembled on the base, and the supporting member has multiple assembly parts for assembling chips. The first heating member is arranged above the supporting member and covers the multiple assembly parts. A test notch is provided on the first heating member. The test notch is used to expose part of the assembly part. The existence of the test notch facilitates real-time detection or operation of the chip that has exposed the assembly part during the heating process. The supporting member is driven to rotate by a rotating drive mechanism. On the one hand, the chip is heated evenly during the heating process, and at the same time, each assembly part can pass through the test notch during the rotation process, thereby realizing continuous operation of chip detection and greatly improving production efficiency. The chip to be detected is rotated to the corresponding position for detection, which reduces the positioning requirements of the detection equipment and adapts to diversified production needs. At the same time, it can timely monitor the temperature, performance and other parameters of the chip, thereby improving the stability and consistency of product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic structural diagram of a chip rotary heating device showing a first heating element provided by an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the overall structure of a chip rotary heating device provided by an embodiment of the present utility model;

[0023] Figure 3 A schematic structural diagram of a chip rotary heating device showing a supporting member provided by an embodiment of the present invention;

[0024] Figure 4 A schematic structural diagram of a chip rotating heating device showing a heating component provided by an embodiment of the present invention;

[0025] Figure 5 A schematic structural diagram of a chip rotary heating device showing a fixed pressure plate provided by an embodiment of the present utility model;

[0026] Figure 6 A schematic structural diagram of adsorption holes on a chip rotary heating device shown in an embodiment of the present invention.

[0027] Description of reference numerals:

[0028] 10-base; 20-supporting member; 21-assembly part; 211-adsorption hole; 30-heating component; 31-first heating element; 311-test notch; 312-vacuum breaking hole; 32-second heating element; 321-mounting slot; 33-third heating element; 34-heat source; 40-rotational drive mechanism; 50-fixed pressure plate; 60-cover plate; 61-temperature sensor; 62-temperature measuring hole; 63-vacuum breaking hole; 70-vacuum source; 80-vacuum breaking solenoid valve; 90-cooling solenoid valve. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0030] In this application, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0032] Chips may encounter various temperature environments during actual use. Therefore, reliability testing of chips by heating them can identify potential issues such as thermal stability and thermal fatigue in advance, verify whether they meet product quality requirements, and ensure that the chips can function properly under different temperature conditions. Existing technology generally uses a metal plate with good thermal conductivity to heat the metal plate, then places the chip on the metal plate, and heat is transferred to the chip through contact. This method is simple and direct, but chip testing requires the testing equipment to be moved to each chip position for separate testing. This places high demands on the movement and positioning of the testing equipment, and the operation is complex and inefficient.

[0033] In view of this, some embodiments of the present application provide a chip rotating heating device, so that the chip is heated evenly during the heating process. At the same time, each chip can pass through the test gap during the rotation process to achieve continuous operation, greatly improving production efficiency and adapting to diverse production needs. At the same time, it can timely monitor the temperature, performance and other parameters of the chip, thereby improving the stability and consistency of product quality.

[0034] The present application is described in detail below through specific embodiments:

[0035] The chip rotating heating device of the embodiment of the present application is as follows Figure 1-6 As shown, the chip rotation heating device includes a base 10, a supporting member 20, a heating component 30 and a rotation drive mechanism 40. The supporting member 20 is rotatably arranged on the base 10. The supporting member 20 has a plurality of assembly parts 21 for assembling chips. The heating component 30 includes a first heating member 31. The first heating member 31 is located above the supporting member 20 and covers the plurality of assembly parts 21. The first heating member 31 is provided with a test notch 311. The test notch 311 is used to leak out part of the assembly part 21. The rotation drive mechanism 40 is transmission-connected to the supporting member 20. The rotation drive mechanism 40 can drive the supporting member 20 to rotate so that each assembly part 21 can pass through the test notch 311 during its rotation stroke.

[0036] The chip rotating heating device provided in the embodiment of the present application has a supporting member 20 rotatably assembled on the base 10, and the supporting member 20 has multiple assembly parts 21 for assembling chips. The first heating member 31 is arranged above the supporting member 20 and covers the multiple assembly parts 21. The first heating member 31 is used to heat the chip. A test gap 311 is provided on the first heating member 31. The test gap 311 is used to leak out part of the assembly part 21. The existence of the test gap 311 facilitates real-time detection or operation of the chip that leaks out of the assembly part 21 during the heating process. The supporting member 20 is driven to rotate by the rotating drive mechanism 40. On the one hand, the chip is evenly heated during the heating process, and at the same time, each assembly part 21 can pass through the test gap 311 during the rotation process, thereby realizing continuous operation of chip detection and greatly improving production efficiency. The chip to be detected is rotated to the corresponding position for detection, which reduces the positioning requirements of the detection equipment and adapts to diversified production needs. At the same time, it can timely monitor the temperature, performance and other parameters of the chip, thereby improving the stability and consistency of product quality.

[0037] It should be explained that the first heating element 31 may have its own heating function to heat the chip, or the first heating element 31 may be heated by conducting heat to the first heating element 31 through a heating element, thereby heating the chip.

[0038] Specifically, if Figure 3As shown, multiple assembly parts 21 are distributed around the rotation center of the support member 20, and the distance between each assembly part 21 and the rotation center of the support member 20 is the same. Since the distance between each assembly part 21 and the rotation center is the same, when the support member 20 rotates, the heating environment of the chip on each assembly part 21 is similar, and the heating conditions are more consistent. The same distance ensures that the centrifugal force exerted on each assembly part 21 is equal during the rotation process, which can reduce the risk of chip position offset or uneven force on the assembly part 21 due to centrifugal force differences, and ensure the stability of the chip during the heating process. At the same time, this uniformly distributed structure facilitates the control and design of the rotation drive mechanism 40. The control program can use relatively uniform parameters to drive the support member 20 to rotate, and there is no need to make complex adjustments to the assembly parts 21 in different positions. The uniform force distribution can reduce local wear and deformation of the support member 20, extend the service life of the equipment, and improve the reliability of the equipment operation.

[0039] In this embodiment, Figure 6 As shown, the supporting member 20 is an annular turntable, and multiple assembly parts 21 are evenly distributed around the center of the turntable, and the distance between each assembly part 21 and the center of the turntable is the same. In this way, the space of the supporting member 20 can be fully utilized, and more assembly parts 21 can be arranged within a limited area. While improving production efficiency, the structure of the entire device can also be made more compact. Because the conditions of each assembly part 21 are the same, the same standards and methods can be used during quality monitoring and testing, which simplifies the quality control process.

[0040] Furthermore, in order to improve the heating effect, as Figure 3 As shown, the heating component 30 also includes a second heating element 32, which is located below the support member 20 and corresponds to multiple assembly parts 21. In this way, simultaneous heating from the top and bottom can transfer heat to the chip more quickly, shorten the heating time, and thus improve production efficiency. Moreover, heating from the top and bottom directions makes the chip heated more evenly, which helps to ensure the consistency and stability of its performance. The top and bottom heating method can better meet the different heating requirements of various chips. Through the coordinated action of the upper and lower heating elements, the temperature reached by the chip can be more accurately controlled, and the heat can be more fully absorbed by the chip, reducing heat loss, thereby improving energy utilization efficiency and reducing energy consumption costs. Even if one of the heating elements fails, the other heating element can still maintain the heating effect to a certain extent, reducing the risk of production interruption.

[0041] Going further, Figure 3As shown, the heating assembly 30 also includes a third heating element 33, which is arranged around the circumference of the support member 20 to heat the chip from the circumference, and then combined with the heating elements above and below, to achieve multi-directional heating of the chip, ensuring that the chip is heated more evenly, avoiding the situation of insufficient local heating, and improving the heating efficiency. The circumferential heating helps to conduct heat to the edge of the chip more quickly and evenly, reducing the chip performance difference caused by uneven heat conduction. At the same time, when other heating elements have temperature fluctuations or uneven heating, the third heating element 33 on the circumferential side can play a certain compensation and stabilizing role to maintain the stability of the overall heating environment. The heating elements arranged on the circumferential side can also prevent heat loss, further improving the heating rate.

[0042] In this embodiment, the heating component 30 includes a heat source 34, which is connected to the first heating element 31, the second heating element 32 or the third heating element 33. The upper end of the third heating element 33 is connected to the first heating element 31, and the lower end of the third heating element 33 is connected to the second heating element 32. The first heating element 31, the second heating element 32 and the third heating element 33 are heat conductors. Therefore, the first heating element 31, the second heating element 32 and the third heating element 33 realize the heating function through the same heat source 34, and the heat can be more evenly distributed in the entire heating area to ensure the uniformity of the heating temperature. When heating the chip, local overheating or overcooling can be avoided, ensuring that all parts of the chip are heated uniformly, improving product quality, and heat can be quickly transferred from the heat source 34 to each heating element, reducing the loss during heat transfer, thereby improving heating efficiency, saving energy and time, and the synergistic effect of multiple heating elements makes the heating process more stable. Moreover, by using the same heat source 34, the number of heat sources 34 can be reduced, thereby reducing the cost of equipment procurement and installation. There is no need to equip each heating element with an independent complex heat source 34 system, saving a lot of capital investment, making the structure of the entire heating system simpler, reducing the complexity and maintenance difficulty of the system, and saving the space occupied by the equipment. When controlling and monitoring the heating process, the operator only needs to deal with the parameters and operating status of one heat source 34, which simplifies the operating process and reduces the risk of operational errors.

[0043] Specifically, if Figure 4 As shown, the second heating element 32 is provided with a plurality of mounting grooves 321 on the side facing the supporting member 20, and the heat source 34 includes a plurality of groups of heating sheets. The heating sheets can emit heat relatively evenly. Each group of heating sheets is stacked in the mounting groove 321 along the vertical direction. The heating sheets are generally thin and occupy little space. Figure 5As shown, the chip rotation heating device also includes a fixed pressure plate 50, which is arranged above the second heating element 32 to fix the heating plate, ensure the stability of the position of the heating plate during operation, prevent it from displacement or loosening, thereby ensuring the stability and reliability of heating. The arrangement of multiple mounting grooves 321 and the distribution of the heating plates in the mounting grooves 321 enable heat to be transferred to the second heating element 32, and then to the third heating element 33 and the first heating element 31. In order to heat the chip, the heating plate is located in the mounting groove 321, and the fixed pressure plate 50 is pressed onto the heating plate. The number of heating plates in the mounting groove 321 can be flexibly adjusted according to actual heating requirements, thereby achieving different heating effects. The stable structure and good contact help to improve the heat exchange efficiency between the heating plate and the second heating element 32 and reduce heat loss.

[0044] Exemplarily, the number of heating sheets in each group can be 20, and the 20 heating sheets are stacked. The heat source 34 also includes a power cord. Each group of heating sheets is connected to a power cord. When the power cord is powered on, the heating sheets generate heat. When the heating sheets fail or are damaged, the fixed pressure plate 50 can be easily removed to replace or repair the heating sheets without affecting the structure of the entire heating device. The pressing effect of the fixed pressure plate 50 can evenly distribute the pressure to each group of heating sheets, avoiding damage to the heating sheets due to excessive local pressure.

[0045] In this embodiment, Figure 2 As shown, the chip rotation heating device also includes a cover plate 60, which is located above the first heating element 31 and covers the first heating element 31. A temperature sensor 61 is provided on the cover plate 60. A temperature measuring through hole 62 is provided at a position corresponding to one of the assembly parts 21 of the cover plate 60 and the first heating element 31. The test end of the temperature sensor 61 corresponds to the temperature measuring through hole 62. The temperature sensor 61 can directly measure the temperature near the chip passing through the assembly part 21 by corresponding to the temperature measuring through hole 62, thereby obtaining more accurate temperature data, and can monitor the temperature change during the heating process in real time. When the temperature reaches the detection requirement, the chip is The chip can be tested and abnormal temperature can be discovered in time so that adjustment measures can be taken quickly. At the same time, since the supporting member 20 is rotating, when each chip is rotated to the position corresponding to the temperature measuring through hole 62, the chip can be tested. The temperature sensor 61 is arranged on the cover plate 60. The cover plate 60 is located above the first heating member 31 and can protect the temperature sensor 61. At the same time, the calibration and maintenance of the temperature sensor 61 are more convenient without the need to disassemble complex components. The setting of the temperature measuring through hole 62 provides a fixed and stable measurement position for the temperature sensor 61, ensuring the stability and repeatability of the measurement results.

[0046] Specifically, if Figure 2 and Figure 6As shown, in order to ensure that the chip is properly assembled on the assembly portion 21, the chip rotation heating device also includes a vacuum source 70. The assembly portion 21 is provided with an adsorption hole 211. The vacuum source 70 is connected to the adsorption hole 211. The vacuum source 70 is used to evacuate the chip so that the adsorption hole 211 forms a negative pressure to adsorb the chip. The negative pressure formed by the adsorption hole 211 can firmly adsorb the chip, ensuring that the chip does not shift or fall off during the rotation and heating process, maintaining the stability of the position. Under high-speed rotation or large temperature changes, the chip can still be reliably fixed. Because it uses negative pressure adsorption, it can provide effective fixation for chips of different sizes, increasing the versatility of the device. Compared with mechanical clamping and other methods, negative pressure adsorption does not cause physical damage or indentation to the chip surface, ensuring that the appearance and performance of the chip are not affected. After the chip is stably adsorbed, it can better contact with the support member 20, which is conducive to uniform heat transfer and further improves the uniformity of heating. Moreover, the control of adsorption by the vacuum source 70 can effectively reduce the interference of external factors such as vibration or airflow on the chip, providing a relatively stable working environment for the chip. The operation is simple and convenient, and the chip can be quickly replaced, thereby improving production efficiency.

[0047] At the same time, if Figure 2 As shown, the chip rotating heating device also includes a vacuum breaking solenoid valve 80. A vacuum breaking through hole 312 is provided on the first heating element 31. The vacuum breaking solenoid valve 80 is connected to the vacuum breaking through hole 312. The vacuum breaking solenoid valve 80 allows external gas to blow toward the chip through the vacuum breaking through hole 312. During the heating process, since the first heating element 31, the second heating element 32 and the third heating element 33 form a relatively closed space, a vacuum is formed inside when the vacuum source 70 is evacuated. When the vacuum source 70 is closed, the vacuum state cannot be released in time. Therefore, the vacuum breaking solenoid valve 80 is used to introduce external gas to balance the pressure, which can effectively release the adsorption and fixed state of the chip and break the vacuum in time, thereby ensuring that the performance of the chip is stable and reliable. The operator can better control the pressure environment during the heating process, making the entire process more stable and controllable, and can adapt to the heating requirements of chips of different types and specifications, thereby expanding the scope of application of the equipment, quickly reaching a balanced pressure environment, reducing additional stress on equipment components, reducing equipment wear and fatigue, thereby extending the overall service life of the equipment, and reducing the cost of equipment updates and maintenance.

[0048] In this embodiment, Figure 2As shown, the chip rotation heating device also includes a cooling solenoid valve 90, which is connected to the rotation drive mechanism 40. The cooling solenoid valve 90 is used to cool the rotation drive mechanism 40. The rotation drive mechanism 40 is a direct drive motor. Since the rotation drive mechanism 40 generates heat when it continues to work, if the temperature is too high, it may cause unstable operation, jamming, speed fluctuations and other problems. The cooling solenoid valve 90 can effectively reduce its temperature to ensure stable operation. A stable drive mechanism can ensure the uniformity and accuracy of chip rotation. High temperature will accelerate the aging and wear of components and reduce their service life. Timely cooling can slow down this loss, extend the service life of the rotation drive mechanism 40, and reduce the cost of equipment replacement and maintenance. The stable and long-life rotation drive mechanism 40 reduces downtime caused by failures and improves the overall operating efficiency of the production equipment. Excessive temperature may cause the accuracy of the driving mechanism to decrease, affecting the angle and position accuracy of the chip rotation, reducing the risk of failure caused by overheating, improving the reliability of the entire chip rotation heating device, and making the production process more stable and reliable. In a high temperature and high load working environment, the cooling solenoid valve 90 can enable the rotation drive mechanism 40 to work normally, expanding the scope of application of the equipment.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip rotating heating device, characterized in that: include: base; A supporting member, the supporting member is rotatably mounted on the base, and the supporting member has a plurality of mounting portions for mounting chips; a heating assembly, the heating assembly comprising a first heating element, the first heating element being located above the supporting element and covering the plurality of the assembly portions, the first heating element being provided with a test notch, the test notch being used to expose a portion of the assembly portion; A rotary drive mechanism is in transmission connection with the supporting member, and the rotary drive mechanism can drive the supporting member to rotate so that each of the assembling parts can pass through the test notch during its rotation stroke.

2. The chip rotating heating device according to claim 1, characterized in that: The plurality of assembly portions are distributed around the rotation center of the supporting member, and the distance between each assembly portion and the rotation center of the supporting member is the same.

3. The chip rotating heating device according to claim 2, characterized in that: The heating assembly further includes a second heating element, which is located below the supporting element and corresponds to the plurality of assembly portions.

4. The chip rotating heating device according to claim 3, characterized in that: The heating assembly further includes a third heating element, which is arranged around the circumference of the supporting element.

5. The chip rotating heating device according to claim 4, characterized in that: The heating assembly includes a heat source, which is connected to the first heating element, the second heating element or the third heating element. The upper end of the third heating element is connected to the first heating element, and the lower end of the third heating element is connected to the second heating element. The first heating element, the second heating element and the third heating element are heat conducting elements.

6. The chip rotating heating device according to claim 5, characterized in that: The second heating element is provided with a plurality of mounting grooves on the side facing the supporting element. The heat source includes a plurality of groups of heating plates, and each group of heating plates is stacked in the mounting grooves along the vertical direction. The chip rotating heating device also includes a fixed pressure plate, which is provided above the second heating element and is pressed onto the heating plates.

7. The chip rotating heating device according to claim 1, characterized in that: The chip rotating heating device also includes a cover plate, which is located above the first heating element and covers the first heating element. A temperature sensor is provided on the cover plate. A temperature measuring through hole is provided at a position of the cover plate and the first heating element corresponding to one of the assembly parts, and a test end of the temperature sensor corresponds to the temperature measuring through hole.

8. The chip rotating heating device according to claim 1, characterized in that: The chip rotation heating device further comprises a vacuum source. The assembly portion is provided with an adsorption hole. The vacuum source is connected to the adsorption hole. The vacuum source is used for vacuuming so that the adsorption hole forms a negative pressure to adsorb the chip.

9. The chip rotating heating device according to claim 8, characterized in that: The chip rotating heating device also includes a vacuum breaking solenoid valve. A vacuum breaking through hole is provided on the first heating element. The vacuum breaking solenoid valve is connected to the vacuum breaking through hole. The vacuum breaking solenoid valve allows external gas to blow toward the chip through the vacuum breaking through hole.

10. The chip rotating heating device according to claim 1, characterized in that: The chip rotation heating device further includes a temperature-lowering solenoid valve, which is connected to the rotation drive mechanism and is used to cool the rotation drive mechanism.

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