Wafer exposure device

Abstract

The utility model relates to the technical field of wafer exposure, and discloses a wafer exposure device which comprises a base, a support frame is fixedly arranged on the base, an exposure tube used for wafer P I exposure is fixedly arranged at the bottom of one end of the support frame, a wafer disc assembly used for fixing a wafer is arranged on the base, and the wafer disc assembly is fixedly arranged on the base. The exposure tube is sleeved with an exposure assembly used for performing secondary exposure on an invalid area at the edge of the wafer P I, and the exposure assembly is provided with a fixing assembly capable of fixing the exposure assembly at any position; by arranging the exposure assembly and the fixing assembly, after the wafer P I is subjected to overall exposure by using the exposure tube for the first time, the exposure assembly is slid and fixed by using the fixing assembly, and then the exposure assembly is started to perform secondary exposure on the invalid region of the edge of the wafer, so that the P I in the invalid region cannot be displayed by a developing solution, and the edge is kept flat; therefore, when the thick glue PR is coated, the thick glue can not enter a gap of the P I.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer exposure, in particular to a wafer exposure device. Background Art

[0002] Currently, wafer-level chip scale packaging, also known as wafer-level chip packaging, is a low-cost mass production chip packaging technology. Unlike traditional chip packaging methods (cutting first and then packaging and testing, and the volume of the original chip increases by at least 20% after packaging), it is directly exposed, packaged and tested on the entire wafer after the IC circuit is completed, and then cut into individual IC particles, which can be directly assembled and produced in subsequent processes. Therefore, the volume after packaging is equivalent to the original size of the IC bare chip, which is the smallest micro surface mount device.

[0003] A Chinese utility model patent with the announcement number CN210721014U discloses a wafer exposure machine. Although the above-mentioned prior art achieves focus changes by replacing a detachable exposure tube, thereby realizing exposure of wafers of different thicknesses, wafer-level chip-scale packaging products have a multi-layer structure. The simpler one currently is a bottom wafer plus a first layer of PI plus a second layer of Meta l (formed by thick resist photolithography and then electroplating); when photolithography is performed on the first layer of PI, the traditional practice is to expose the entire surface. At this time, there will be many PI openings in the invalid edge area, and there is air in the openings. Due to the high viscosity of the PR thick resist, the bottom PI openings cannot be filled during the coating process, resulting in the air being trapped at the bottom of the PR. During the soft baking after coating, the air expands and bursts on the PR surface, forming bubbles, turning good products into defective ones and causing waste of resources. Therefore, it is necessary to design a wafer exposure device that can reduce the formation of bubbles. Utility Model Content

[0004] In order to solve the technical problem that bubbles may be generated during wafer exposure and packaging, the utility model provides a wafer exposure device.

[0005] The utility model is implemented by the following technical solutions: a wafer exposure device, including a base, a support frame fixedly mounted on the base, an exposure tube for wafer PI exposure fixedly mounted on the bottom of one end of the support frame, a wafer disk assembly for fixing the wafer is provided on the base, an exposure assembly for secondary exposure of the invalid area of ​​the wafer PI edge is sleeved on the exposure tube, a fixing assembly capable of fixing the exposure assembly at any position is provided on the exposure assembly, the exposure assembly includes a sliding ring slidably sleeved on the circumferential surface of the exposure tube and an exposure ring fixedly mounted on one side of the sliding ring and slidingly matched with the exposure tube.

[0006] Through the above technical solution, after the wafer PI is exposed as a whole for the first time using the exposure tube, the sliding exposure component is fixed using the fixing component, and then the exposure component is turned on to perform a second exposure on the invalid area at the edge of the wafer, so that the PI in the invalid area cannot be developed by the developer, and the edge is kept flat. In this way, when thick glue PR is coated, it will not enter the gap of the PI, reducing the generation of bubbles in the thick glue coating. This setting can avoid the generation of bubbles during wafer-level chip scale packaging, affecting the quality of the product.

[0007] As a further improvement of the above solution, the outer surface of the exposure tube is fixedly covered with a protective cover for protecting the exposure tube.

[0008] Through the above technical solution, the protective cover can protect the exposure tube and prevent the exterior of the exposure tube from being scratched or damaged.

[0009] As a further improvement of the above solution, the inner ring surfaces of the sliding ring and the exposure ring are both in sliding contact with the outer surface of the protective sleeve.

[0010] Through the above technical solution, the exposure ring and the sliding ring both slide on the protective cover, and will not cause scratches to the exposure tube.

[0011] As a further improvement of the above solution, a plurality of sliding grooves are provided on the circumferential surface of the protective sleeve, a sliding block is slidably fitted inside each sliding groove, and one side of each sliding block is fixedly mounted to one side of the sliding ring.

[0012] Through the above technical solution, the sliding block can prevent the sliding ring from rotating with the exposure ring, causing the exposure ring to shift in range.

[0013] As a further improvement of the above scheme, a push rod is provided on one side of each sliding groove, a push plate is fixedly installed at one end of each push rod, a fixed plate is slidably sleeved on the other end of each push rod, each push plate is fixedly installed on one side of an adjacent sliding block, each fixed plate is fixedly installed on a protective cover, a return spring is sleeved on each push rod, one end of each return spring is fixedly installed on the adjacent push plate, and the other end of each return spring is fixedly installed on the adjacent fixed plate.

[0014] Through the above technical solution, the fixing effect of the threaded column on the exposure ring is released, and the exposure ring will be automatically pulled back to its original position, avoiding the exposure ring affecting the subsequent use of the exposure tube.

[0015] As a further improvement of the above solution, the fixing assembly includes a threaded column arranged on one side of the sliding ring and a tightening block fixedly installed at one end of the threaded column. The thread at one end of the threaded column passes through the sliding ring and abuts against the outer surface of the protective sleeve.

[0016] Through the above technical solution, after the position of the exposure ring is adjusted, the sliding ring can be fixed using a threaded column, which can prevent the exposure ring from moving and being unable to expose the wafer.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model sets an exposure component and a fixing component. After the wafer PI is exposed as a whole for the first time using the exposure tube, the sliding exposure component is fixed using the fixing component. Then the exposure component is opened to perform a second exposure on the invalid area at the edge of the wafer, so that the PI in the invalid area cannot be developed by the developer, and the edge is kept smooth. In this way, the gap of the PI will not be entered when thick glue PR is coated, and the generation of bubbles in the thick glue coating is reduced. This setting can avoid the generation of bubbles during wafer-level chip-scale packaging, which affects the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the exposure component of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the utility model with a sliding block.

[0022] Description of main symbols:

[0023] 1. Base; 2. Support frame; 3. Exposure tube; 4. Wafer assembly; 501. Sliding ring; 502. Exposure ring; 601. Threaded column; 602. Tightening block; 7. Protective cover; 8. Sliding block; 9. Push rod; 10. Push plate; 11. Fixed plate; 12. Return spring. DETAILED DESCRIPTION

[0024] Below, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0025] Please combine Figure 1-Figure 3, a wafer exposure device of the present embodiment includes a base 1, a support frame 2 is fixedly mounted on the base 1, an exposure tube 3 for wafer PI exposure is fixedly mounted on the bottom of one end of the support frame 2, a wafer disc assembly 4 for fixing the wafer is provided on the base 1, an exposure assembly for secondary exposure of the invalid area of ​​the wafer PI edge is sleeved on the exposure tube 3, and a fixing assembly capable of fixing the exposure assembly at any position is provided on the exposure assembly. After the wafer PI is exposed as a whole for the first time using the exposure tube 3, the sliding exposure assembly is fixed using the fixing assembly, and then the exposure assembly is opened to perform secondary exposure on the invalid area of ​​the wafer edge, so that the PI in the invalid area cannot be developed by the developer, and the edge is kept smooth. In this way, when the thick glue PR is coated, the gap of the PI will not be entered, thereby reducing the generation of bubbles in the thick glue coating;

[0026] Combine Figure 1 and Figure 2 The exposure assembly includes a sliding ring 501 that is slidably mounted on the circumferential surface of the exposure tube 3 and an exposure ring 502 that is fixedly mounted on one side of the sliding ring 501 and slides with the exposure tube 3. A protective cover 7 for protecting the exposure tube 3 is fixedly mounted on the outer surface of the exposure tube 3. The inner ring surfaces of the sliding ring 501 and the exposure ring 502 are both slidably fitted with the outer surface of the protective cover 7. The protective cover 7 will protect the exposure tube 3 and prevent the exterior of the exposure tube 3 from being scratched or damaged.

[0027] Combine Figure 1-Figure 3 , a plurality of sliding grooves are provided on the circumferential surface of the protective cover 7, and a sliding block 8 is slidably fitted inside each sliding groove, and one side of each sliding block 8 is fixedly installed with one side of the sliding ring 501, and a pushing rod 9 is provided on one side of each sliding groove, and one end of each pushing rod 9 is fixedly installed with a pushing plate 10, and the other end of each pushing rod 9 is slidably sleeved with a fixing plate 11, each pushing plate 10 is fixedly installed with one side of an adjacent sliding block 8, and each fixing plate 11 is fixedly installed with the protective cover 7, and a return spring 12 is sleeved on each pushing rod 9, and one end of each return spring 12 is fixedly installed with the adjacent pushing plate 10, and the other end of each return spring 12 is fixedly installed with the adjacent fixing plate 11. When the fixing effect of the threaded column 601 on the exposure ring 502 is released, the exposure ring 502 will be automatically pulled back to its original position, so as to prevent the exposure ring 502 from affecting the subsequent use of the exposure tube 3.

[0028] Combine Figure 1 and Figure 2The fixing component includes a threaded column 601 arranged on one side of the sliding ring 501 and a tightening block 602 fixedly installed at one end of the threaded column 601. One end of the threaded column 601 is threaded through the sliding ring 501 and abuts against the outer surface of the protective cover 7. After adjusting the position of the exposure ring 502, the threaded column 601 can be used to fix the sliding ring 501, so as to prevent the exposure ring 502 from moving and being unable to expose the wafer PI.

[0029] The implementation principle of a wafer exposure device in an embodiment of the present application is as follows: after the first PI layer on the wafer is exposed using the exposure tube 3, the sliding ring 501 is slid up and down to move the exposure ring 502 above the PI. Then, the threaded column 601 is rotated to fix the position of the exposure ring 502, and the exposure ring 502 is activated to perform a secondary exposure on the edge invalid area of ​​the wafer PI.

[0030] Add one more exposure to the invalid edge area so that the opening of the invalid edge area will not be revealed by the developer, and the invalid edge area becomes flat. When the second layer of thick PR is coated, there will be no PI opening in the edge area, and the thick PR can be smoothly covered on the surface. No air will be trapped at the bottom of the thick PR, effectively reducing the generation of bubbles when coating the thick edge PR and preventing leakage and plating during the second layer of Metal plating.

[0031] After the second exposure is completed, the fixing effect of the threaded column 601 is loosened, and the reset spring 12 can pull the exposure ring 502 back to its original position to prevent the use of the exposure tube 3 from being affected. This arrangement can avoid the generation of bubbles during wafer-level chip scale packaging, which affects the quality of the product.

[0032] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A wafer exposure device, comprising a base (1), a support frame (2) fixedly mounted on the base (1), an exposure tube (3) for wafer PI exposure fixedly mounted at the bottom of one end of the support frame (2), a wafer disc assembly (4) for fixing the wafer on the base (1), characterized in that: The exposure tube (3) is provided with an exposure assembly for secondary exposure of an invalid area at the edge of a wafer PI; the exposure assembly is provided with a fixing assembly capable of fixing the exposure assembly at any position; the exposure assembly comprises a sliding ring (501) slidably sleeved on the circumferential surface of the exposure tube (3) and an exposure ring (502) fixedly mounted on one side of the sliding ring (501) and slidingly engaged with the exposure tube (3).

2. The wafer exposure device according to claim 1, wherein: The outer surface of the exposure tube (3) is fixedly covered with a protective sleeve (7) for protecting the exposure tube (3).

3. The wafer exposure device according to claim 2, wherein: The inner ring surfaces of the sliding ring (501) and the exposure ring (502) are both in sliding contact with the outer surface of the protective sleeve (7).

4. The wafer exposure device according to claim 2, wherein: A plurality of sliding grooves are provided on the circumferential surface of the protective sleeve (7), and a sliding block (8) is slidably fitted inside each sliding groove, and one side of each sliding block (8) is fixedly mounted on one side of the sliding ring (501).

5. The wafer exposure device according to claim 4, wherein: A push rod (9) is provided on one side of each sliding groove, a push plate (10) is fixedly installed on one end of each push rod (9), a fixed plate (11) is slidably sleeved on the other end of each push rod (9), each push plate (10) is fixedly installed on one side of an adjacent sliding block (8), each fixed plate (11) is fixedly installed on the protective cover (7), a reset spring (12) is sleeved on each push rod (9), one end of each reset spring (12) is fixedly installed on the adjacent push plate (10), and the other end of each reset spring (12) is fixedly installed on the adjacent fixed plate (11).

6. The wafer exposure device according to claim 2, wherein: The fixing assembly comprises a threaded column (601) arranged on one side of the sliding ring (501) and a tightening block (602) fixedly mounted on one end of the threaded column (601); one end of the threaded column (601) is threadedly passed through the sliding ring (501) and abuts against the outer surface of the protective sleeve (7).

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