Wafer bonding equipment

Abstract

The utility model discloses wafer bonding equipment which comprises a machine table, a bonding platform is arranged on the machine table, a plurality of discharging bosses used for bonding wafers and lenses are arranged on the bonding platform, a material combining table used for placing the wafers and the lenses is arranged above the discharging bosses in a lifting mode, the material combining table descends, and the wafers and the lenses are arranged on the bonding platform. The wafer and the lens are stacked on the discharging boss in sequence; a mounting bracket is arranged on the machine table, a driving platform is arranged on the mounting bracket in a sliding manner, a vacuum cover is connected to the bottom of the driving platform, the vacuum cover abuts against the bonding platform to form a vacuum area, the discharging boss is arranged in the vacuum area, and a pressing structure is arranged on the driving platform. The pressing structure comprises a driving unit arranged on the driving platform and a lower pressing rod inserted in the vacuum cover, the driving unit drives the lower pressing rod to descend, and the lower pressing rod extrudes the lens to enable the lens to be bonded with the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer bonding device. Background Art

[0002] Wafer bonding involves directly bonding two clean, atomically flat semiconductor materials of the same or different types under certain conditions. After cleaning and activation, the materials are directly bonded together under certain conditions, forming a single piece through van der Waals, molecular, and even atomic forces. Wafer bonding technology is widely used in packaging, MEMS, 3D interconnects, LED manufacturing, and specialty substrate fabrication, and is becoming an essential R&D and production tool in the semiconductor and MEMS fields. Two flat substrates are brought face-to-face and subjected to specific external conditions, such as pressure, temperature, and voltage. This creates atomic or molecular bonds between the two substrates, such as covalent, metallic, or molecular bonds. Once these bonds reach a certain level, the two substrates become a single piece. The equipment used for wafer bonding is called a wafer bonder. Depending on the bonding technology used, wafer bonders can be categorized as direct, anodic, thermal compression, chemical reaction, and polymer bonders.

[0003] Traditional wafer bonding methods generally involve manually placing the lens on the wafer for vacuum pressing. Since the wafer and lens carrier are not absolutely flat, manually placing the lens may cause tiny bubbles that are difficult to remove. Bubbles that are not removed will cause a certain defect rate in subsequent processes. Utility Model Content

[0004] In order to solve the technical problems existing in the background technology, the utility model proposes a wafer bonding device.

[0005] The technical solutions adopted by the present invention to solve the technical problems are as follows:

[0006] A wafer bonding device includes a machine platform, a bonding platform provided on the machine platform, a plurality of material discharge bosses for bonding wafers and lenses provided on the bonding platform, a material combining platform for placing wafers and lenses arranged above the material discharge bosses, and the material combining platform is lowered so that the wafers and lenses are stacked in sequence on the material discharge bosses;

[0007] The machine is provided with a mounting bracket, a driving platform is slidably provided on the mounting bracket, a vacuum cover is connected to the bottom of the driving platform, the vacuum cover abuts the bonding platform and forms a vacuum area, the discharge boss is placed in the vacuum area, and a pressing structure is provided on the driving platform, the pressing structure includes a driving unit arranged on the driving platform, and a pressing rod inserted in the vacuum cover, the driving unit drives the pressing rod to descend, and the pressing rod squeezes the lens to bond the lens to the wafer.

[0008] Preferably, a connecting rod is provided at the bottom of the driving platform, the connecting rod is connected to the vacuum cover, and a sliding seat is slidably provided on the connecting rod, the sliding seat includes a first sliding plate and a second sliding plate, the first sliding plate is connected to the output end of the driving unit, the second sliding plate is connected to the down-pressing rod, and a pressure sensor is provided between the first sliding plate and the second sliding plate. Through the above improvements, during the entire bonding process, the driving platform will first descend under the action of the cylinder, so that the sliding seat is attached to the bonding platform and a vacuum area is formed, and then the driving unit will drive the first sliding plate to descend, and the second sliding plate will descend under the action of the first sliding plate, so that the down-pressing rod squeezes the lens and the wafer for bonding. During the bonding process, the pressure sensor can detect the force of the downward pressure, thereby ensuring the downward pressure strength to improve the bonding quality.

[0009] Preferably, an elastic element is sleeved on the connecting rod, with one end of the elastic element abutting the second sliding plate and the other end abutting the vacuum cover. With the above improvement, since one end of the elastic element abuts the second sliding plate and the other end abuts the vacuum cover, as the second sliding plate descends, the elastic element applies pressure to the second sliding plate, allowing the pressure sensor to accurately detect the pressure applied by the first sliding plate and thus accurately measure the downward force.

[0010] Preferably, a sealing tube is sleeved on the lower pressure rod, one end of which is connected to the second sliding plate and the other end is connected to the vacuum cover. Through the above improvement, the sealing tube is a bellows, one end of which abuts the second sliding plate and the other end abuts the vacuum cover. As the second sliding plate moves up and down, the sealing ring contracts accordingly, thereby ensuring the sealing of the connection between the second sliding plate and the vacuum cover, thereby ensuring the vacuum effect in the vacuum area.

[0011] Preferably, a vacuum tube and a vacuum detector are inserted into the vacuum cover. Through the above improvements, the vacuum tube can be used to evacuate the inside of the vacuum cover, and the vacuum level in the vacuum cover can be detected by the vacuum detector.

[0012] Preferably, the machine is provided with a lifting unit that drives the material combining platform to move up and down, and the material combining platform is provided with a plurality of positioning columns, and a limiting column is formed on the top of the positioning column and inserted, and the top of the positioning column constitutes a placement plane for placing the wafer, and the limiting column abuts against the outer contour of the wafer, and a placement groove for placing the lens is formed on the limiting column, and the limiting column abuts against the outer contour of the lens. Through the above improvements, when loading, the wafer can be placed on the placement platform, the limiting column will abut against the outer contour of the wafer, and the lens is placed on the placement groove, the limiting column abuts against the outer contour of the lens, and when the lifting unit is lowered, the wafer on the material combining platform will first be placed on the material discharge boss, and then the lens will be placed above the wafer, thereby realizing automatic material combining and ensuring the accuracy of the lens and wafer combining.

[0013] Preferably, a sliding groove is formed on the material discharging boss for the positioning column to be placed in. Through the above improvements, the sliding groove cooperates with the positioning column to ensure the stability and accuracy of the lens and wafer combination.

[0014] Preferably, a sealing groove is formed on the bonding platform, a sealing ring is provided in the sealing groove, and the vacuum cover abuts against the sealing ring. Through the above improvements, the sealing performance of the vacuum cover and the bonding platform is improved to ensure the vacuum effect.

[0015] Preferably, the machine platform is provided with a heating structure comprising a lifting plate, heating posts mounted on the lifting plate, and a lifting unit for driving the lifting plate upward, and the discharge boss is formed with heating holes for inserting the heating posts. With the above improvements, when bonding is performed, the lifting unit can be used to drive the lifting plate upward, allowing the heating posts on the heating plate to be inserted into the heating holes, thereby heating the discharge boss.

[0016] Preferably, a cooling water pipe is provided on the machine, and a water passage connected to the cooling water pipe is formed on the discharge boss. Through the above improvement, after hot pressing is completed, the cooling water pipe can be used to input cooling liquid into the water passage, thereby removing heat from the discharge boss for cooling.

[0017] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0018] The lower portion of the driving unit drives the lower pressure rod to descend, and the lens and the wafer are squeezed to achieve bonding. Compared with manual covering of the glass and the wafer, the accuracy of the position is improved, the residual bubbles in the wafer are effectively avoided, and the yield rate of the wafer bonding process and the production efficiency are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a cross-sectional view of the overall structure of the utility model;

[0021] Figure 3 This is a schematic structural diagram of an embodiment of a bonding platform of the present utility model;

[0022] Figure 4 This is a schematic structural diagram of the bottom of the bonding platform of the present invention;

[0023] Figure 5 This is a structural diagram of an embodiment of the mounting bracket of the present utility model;

[0024] Figure 6 This is a structural diagram of the discharge boss of the utility model;

[0025] In the figure: 1. Machine; 2. Bonding platform; 3. Unloading boss; 4. Lens; 5. Wafer; 6. Mounting bracket; 7. Driving platform; 8. Vacuum cover; 9. Vacuum area; 10. Pressing structure; 11. Driving unit; 12. Pressing rod; 13. Material combining platform; 1.1. Connecting rod; 1.2. Sliding seat; 1.3. First sliding plate; 1.4. Second sliding plate; 1.5. Pressure sensor; 1.6. Elastic element; 1.7. Sealing tube; 2.1. Lifting unit; 2.2. Positioning column; 2.3. Limiting column; 2.4. Placement plane; 2.5. Sliding groove; 2.6. Sealing groove; 2.7. Sealing ring; 2.8. Placement groove; 3.1. Heating structure; 3.2. Lifting plate; 3.3. Heating column; 3.4. Lifting unit; 3.5. Heating hole; 3.6. Cooling water pipe; 3.7. Water passage; 4.1. Vacuum tube; 4.2. Vacuum detector; DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] It should be understood that although terms such as upper, middle, lower, top, end, etc. appear in this document to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish elements from each other for ease of understanding, and are not used to define any direction or order limitation.

[0028] like Figure 1-6 As shown, a wafer 5 bonding device is provided, a bonding platform 2 is provided on the machine 1, and a plurality of discharge bosses 3 for bonding the wafer 5 and the lens 4 are provided on the bonding platform 2. A lifting and lowering platform 13 for placing the wafer 5 and the lens 4 is provided above the discharge boss 3. The combination platform 13 descends so that the wafer 5 and the lens 4 are stacked on the discharge boss 3 in sequence. After the stacking is completed, the lens 4 is located above the wafer 5.

[0029] Specifically, the machine 1 is provided with a mounting bracket 6, a driving platform 7 is slidingly provided on the mounting bracket 6, a cylinder for driving the driving platform 7 to move is provided on the mounting bracket 6, a vacuum cover 8 is connected to the bottom of the driving platform 7, the vacuum cover 8 abuts the bonding platform 2 and forms a vacuum area 9, the discharge boss 3 is placed in the vacuum area 9, and a pressing structure 10 is provided on the driving platform 7, the pressing structure 10 includes a driving unit 11 provided on the driving platform 7, and a lower pressure rod 12 inserted in the vacuum cover 8, the driving unit 11 drives the lower pressure rod 12 to descend, and the lower pressure rod 12 squeezes the lens 4 so that the lens 4 is bonded to the wafer 5.

[0030] By arranging a plurality of discharge bosses 3 on the bonding platform 2, and a material combining platform 13 for placing the wafer 5 and the lens 4 is lifted and lowered above the discharge bosses 3, and a mounting bracket 6 is provided on the machine 1, and a driving platform 7 is slidably provided on the mounting bracket 6, and a vacuum cover 8 is connected to the bottom of the driving platform 7, and the vacuum cover 8 abuts the bonding platform 2 and forms a vacuum area 9, the discharge boss 3 is placed in the vacuum area 9, and a pressing structure 10 is provided on the driving platform 7, and the pressing structure 10 includes a driving unit 11 provided on the driving platform 7, and a lower pressing rod 12 inserted in the vacuum cover 8. During the entire bonding process, the lens 4 and the wafer 5 can be placed on the combining platform 13. As the combining platform 13 descends, the wafer 5 and the lens 4 will be stacked in sequence on the discharge boss 3. Then the driving platform 7 will descend to make the vacuum cover 8 fit with the bonding platform 2, so that the wafer 5 and the lens 4 are in a vacuum environment. The driving unit 11 drives the lower pressure rod 12 to descend to squeeze the lens 4 and the wafer 5, thereby achieving bonding. Compared with manually placing the glass and the wafer to cover, the positioning accuracy is improved, the residual bubbles in the wafer are effectively avoided, and the yield rate of the wafer bonding process and the production efficiency are improved.

[0031] like Figure 1 、 Figure 2 、 Figure 5 As shown, as a further explanation of the pressing structure 10, a connecting rod 1.1 is provided at the bottom of the driving platform 7, and the connecting rod 1.1 is connected to the vacuum cover 8, so that the vacuum cover 8 will move with the driving platform 7, and a sliding seat 1.2 is slidingly provided on the connecting rod 1.1, and the sliding seat 1.2 includes a first sliding plate 1.3 and a second sliding plate 1.4. The first sliding plate 1.3 is connected to the output end of the driving unit 11, and the second sliding plate 1.4 is connected to the lower pressure rod 12, and a pressure sensor 1.5 is provided between the first sliding plate 1.3 and the second sliding plate 1.4.

[0032] During the entire bonding process, the driving platform 7 will first descend under the action of the cylinder, so that the sliding seat 1.2 will fit the bonding platform 2 and form a vacuum area 9. Then the driving unit 11 will drive the first sliding plate 1.3 to descend, and the second sliding plate 1.4 will descend under the action of the first sliding plate 1.3, so that the downward pressure rod 12 will squeeze the lens 4 and the wafer 5 for bonding. During the bonding process, the pressure sensor 1.5 can detect the downward pressure force, thereby ensuring the downward pressure strength and improving the bonding quality.

[0033] Furthermore, an elastic element 1.6 is sleeved on the connecting rod 1.1, and one end of the elastic element 1.6 abuts the second sliding plate 1.4, and the other end abuts the vacuum cover 8. Since one end of the elastic element 1.6 abuts the second sliding plate 1.4, and the other end abuts the vacuum cover 8, and as the second sliding plate 1.4 descends, the pressure sensor 1.5 is fixed to the bottom of the first sliding plate 1.3, and the elastic element 1.6 applies pressure to the second sliding plate 1.4, so that the pressure sensor 1.5 can accurately detect the pressure applied by the first sliding plate 1.3 to the second sliding plate 1.4, thereby accurately measuring the downward pressure.

[0034] In addition, after the bonding is completed, the driving unit 11 will drive the first sliding plate 1.3 to rise, and the elastic element 1.6 will drive the second sliding plate 1.4 to rise and reset, thereby realizing automatic reset of the second sliding plate 1.4.

[0035] Preferably, the driving unit 11 is an electric cylinder, and the driving unit 11 is connected to the first sliding plate 1.3 via a floating joint.

[0036] like Figure 1 、 Figure 2 、 Figure 5 As shown, in some other embodiments, a sealing tube 1.7 is sleeved on the lower pressure rod 12, one end of the sealing tube 1.7 is connected to the second sliding plate 1.4, and the other end is connected to the vacuum cover 8. The sealing tube 1.7 is a bellows or an elastic hose, one end of the sealing tube 1.7 abuts the second sliding plate 1.4, and the other end abuts the vacuum cover 8. As the second sliding plate 1.4 moves up and down, the sealing ring 2.7 will shrink, thereby ensuring the sealing of the connection position between the second sliding plate 1.4 and the vacuum cover 8, so as to ensure the vacuum effect in the vacuum area 9.

[0037] like Figure 5 As shown, as a further explanation of the implementation method of the vacuum cover 8, a vacuum tube 4.1 and a vacuum detector 4.2 are inserted into the vacuum cover 8. The vacuum tube 4.1 can be used to evacuate the inside of the vacuum cover 8, and the vacuum level in the vacuum cover 8 can be detected by the vacuum detector 4.2.

[0038] Preferably, a sealing groove 2.6 is formed on the bonding platform 2, a sealing ring 2.7 is provided in the sealing groove 2.6, and the vacuum cover 8 abuts against the sealing ring 2.7, thereby improving the sealing performance of the vacuum cover 8 and the bonding platform 2 to ensure the vacuum effect.

[0039] like Figures 1 to 4As shown, a further explanation of the implementation method of the combining platform 13 in this embodiment is provided, a lifting unit 2.1 for driving the combining platform 13 to move up and down is provided on the machine 1, a plurality of positioning columns 2.2 are provided on the top of the positioning columns 2.2, and a limiting column 2.3 is inserted into the top of the positioning columns 2.2, and a placement plane 2.4 for placing the wafer 5 is formed on the top of the positioning columns 2.2, the limiting column 2.3 is in contact with the outer contour of the wafer 5, and a placement groove 2.8 for placing the lens 4 is formed on the limiting column 2.3, and the limiting column 2.3 is in contact with the outer contour of the lens 4.

[0040] When loading, the wafer 5 can be placed on the placement platform, the limit column 2.3 will abut against the outer contour of the wafer 5, and the lens 4 can be placed on the placement groove 2.8. The limit column 2.3 will abut against the outer contour of the lens 4. When the lifting unit 2.1 descends, the wafer 5 on the combining platform 13 will first be placed on the discharge boss 3, and then the lens 4 will be placed on top of the wafer 5, thereby realizing automatic combining and ensuring the accuracy of the combining of the lens 4 and the wafer 5.

[0041] Furthermore, a sliding groove 2.5 for the positioning column 2.2 to be placed is formed on the discharge boss 3, and the positioning column 2.2 abuts against the outer contour of the wafer 5. The sliding groove 2.5 cooperates with the positioning column 2.2 to ensure the stability and accuracy of the lens 4 and wafer 5.

[0042] like Figure 4 As shown, preferably, a slider assembly is provided on the bonding platform 2, and the slider assembly is connected to the placement platform, thereby greatly improving the stability of the placement platform during the up and down sliding process to ensure the accuracy of the placement of the wafer 5 and the lens 4.

[0043] like Figures 1 to 4 As shown in the figure, further explanation of the embodiment of the discharge boss 3 is provided on the machine 1. The heating structure 3.1 includes a lifting plate 3.2, a heating column 3.3 provided on the lifting plate 3.2, and a lifting unit 3.4 for driving the lifting plate 3.2 to rise. The discharge boss 3 is formed with a heating hole 3.5 for the heating column 3.3 to be placed.

[0044] When bonding is performed, the lifting plate 3.2 can be driven upward by the lifting unit 3.4 so that the heating pillars 3.3 on the heating plate are inserted into the heating holes 3.5, thereby heating the discharge boss 3.

[0045] In addition, a cooling water pipe 3.6 is provided on the machine 1, and a water channel 3.7 connected to the cooling water pipe 3.6 is formed on the discharge boss 3. After the hot pressing is completed, the cooling water pipe 3.6 can input the cooling liquid into the water channel 3.7, thereby taking away the heat of the discharge boss 3 for cooling.

[0046] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A wafer bonding device, comprising a machine (1), characterized in that: The machine (1) is provided with a bonding platform (2), and the bonding platform (2) is provided with a plurality of discharge bosses (3) for bonding wafers (5) and lenses (4). A material combining platform (13) for placing wafers (5) and lenses (4) is provided above the discharge bosses (3). The material combining platform (13) is lowered so that the wafers (5) and lenses (4) are stacked on the discharge bosses (3) in sequence. The machine (1) is provided with a mounting bracket (6), a driving platform (7) is slidingly provided on the mounting bracket (6), a vacuum cover (8) is connected to the bottom of the driving platform (7), the vacuum cover (8) abuts against the bonding platform (2) and forms a vacuum area (9), the discharge boss (3) is placed in the vacuum area (9), and a pressing structure (10) is provided on the driving platform (7), the pressing structure (10) includes a driving unit (11) provided on the driving platform (7), and a lower pressing rod (12) inserted in the vacuum cover (8), the driving unit (11) drives the lower pressing rod (12) to descend, and the lower pressing rod (12) squeezes the lens (4) so ​​that the lens (4) is bonded to the wafer (5).

2. The wafer bonding device according to claim 1, wherein: A connecting rod (1.1) is provided at the bottom of the driving platform (7), the connecting rod (1.1) being connected to the vacuum cover (8), and a sliding seat (1.2) is slidably provided on the connecting rod (1.1), the sliding seat (1.2) comprising a first sliding plate (1.3) and a second sliding plate (1.4), the first sliding plate (1.3) being connected to the output end of the driving unit (11), the second sliding plate (1.4) being connected to the lower pressure rod (12), and a pressure sensor (1.5) being provided between the first sliding plate (1.3) and the second sliding plate (1.4).

3. The wafer bonding device according to claim 2, wherein: An elastic element (1.6) is sleeved on the connecting rod (1.1); one end of the elastic element (1.6) abuts against the second sliding plate (1.4), and the other end abuts against the vacuum cover (8).

4. The wafer bonding device according to claim 2, wherein: A sealing tube (1.7) is sleeved on the lower pressing rod (12); one end of the sealing tube (1.7) is connected to the second sliding plate (1.4), and the other end is connected to the vacuum cover (8).

5. The wafer bonding device according to claim 1, wherein: The vacuum cover (8) is provided with a vacuum tube (4.1) and a vacuum detector (4.2).

6. The wafer bonding device according to claim 1, wherein: The machine (1) is provided with a lifting unit (2.1) for driving the material combining platform (13) to move up and down. The material combining platform (13) is provided with a plurality of positioning columns (2.2). A limiting column (2.3) is inserted on the top of each positioning column (2.2). A placement plane (2.4) for placing a wafer (5) is formed on the top of each positioning column (2.2). The limiting column (2.3) is in contact with the outer contour of the wafer (5). A placement groove (2.8) for placing a glass sheet is formed on the limiting column (2.3). The limiting column (2.3) is in contact with the outer contour of the glass sheet.

7. The wafer bonding device according to claim 2, wherein: A sliding groove (2.5) for the positioning column (2.2) to be placed is formed on the discharge boss (3).

8. The wafer bonding device according to claim 1, wherein: A sealing groove (2.6) is formed on the bonding platform (2), a sealing ring (2.7) is provided in the sealing groove (2.6), and the vacuum cover (8) abuts against the sealing ring (2.7).

9. The wafer bonding device according to claim 1, wherein: The machine (1) is provided with a heating structure (3.1), the heating structure (3.1) comprising a lifting plate (3.2), a heating column (3.3) provided on the lifting plate (3.2), and a lifting unit (3.4) for driving the lifting plate (3.2) to rise, and a heating hole (3.5) for inserting the heating column (3.3) is formed on the discharge boss (3).

10. The wafer bonding equipment according to claim 1, characterized in that: A cooling water pipe (3.6) is provided on the machine (1), and a water passage (3.7) connected to the cooling water pipe (3.6) is formed on the discharge boss (3).

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