Power module, power module assembly and power device
By introducing the cooling channel of the cooling shell into the semiconductor power module, the problems of high cost of single-sided radiators and complex process of double-sided radiators in the existing technology are solved, and double-sided heat dissipation is achieved while reducing costs and process requirements.
Patent Information
- Application Number
- CN202422009281.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-08-19
AI Technical Summary
Existing semiconductor power module heat dissipation mainly relies on single-sided radiators. Double-sided radiators are expensive and complex in process, making it difficult to achieve efficient double-sided heat dissipation.
The power module is encapsulated in a cooling shell with internal cooling channels, so that the power module is combined with the radiator to achieve double-sided heat dissipation through a single radiator.
While achieving double-sided heat dissipation, it simplifies the structure and reduces process requirements and costs.
Smart Images
Figure CN223347768U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of power module heat dissipation, and in particular to a power module, a power module assembly, and a power device. Background Art
[0002] Semiconductor power modules such as IGBTs and SiC have a wide range of applications, including inverters for electric vehicles. Because their high power generates significant heat, heat dissipation is a crucial performance characteristic of these modules. Excellent heat dissipation ensures stable and reliable operation.
[0003] Currently, semiconductor power modules primarily rely on heat sinks for heat dissipation. Typically, single-sided cooling is preferred over double-sided cooling. This is because single-sided water cooling requires only one heat sink, simplifies mechanical installation, and requires minimal manufacturing process. Double-sided cooling, on the other hand, requires two heat sinks, which is complex and requires high manufacturing process requirements. Furthermore, double-sided cooling modules with pinfins often require custom heat sinks of the appropriate size, resulting in high manufacturing costs. Utility Model Content
[0004] In order to solve the above technical problems, the present application provides a power module, a power module assembly, and a power device. The power module is packaged together with a cooling shell having a cooling channel inside, so that the power module can achieve double-sided heat dissipation through only one heat sink.
[0005] In a first aspect, the present application provides a power module, comprising:
[0006] semiconductor chips;
[0007] A packaging substrate, wherein one packaging substrate is welded on the top and bottom of the semiconductor chip respectively;
[0008] a heat dissipation substrate, formed on a side of the packaging substrate away from the semiconductor chip, with heat dissipation fins formed on the heat dissipation substrate;
[0009] a cooling housing, the cooling housing covering the top heat dissipation substrate and the sides of the semiconductor chip, the packaging substrate, and the heat dissipation substrate, and having cooling channels formed inside the cooling housing connecting the left and right sides and the top of the power module;
[0010] A sealing member wraps the semiconductor chip, the packaging substrate, the area of the heat dissipation substrate excluding the heat dissipation fins, and the outer wall of the cooling housing.
[0011] According to the first aspect, since the power module package is composed of a cooling shell with a cooling channel inside, double-sided cooling can be achieved with only one heat sink, which simplifies the structure and reduces process requirements and costs.
[0012] According to the first aspect, or any implementation of the first aspect above, the cooling housing includes a bottom shell and a side wall connected to the bottom shell, the bottom shell is formed with a bottom groove, and the side wall is formed with a channel communicating with the bottom groove. This arrangement is simple in structure and low in cost.
[0013] According to the first aspect, or any implementation of the first aspect above, the bottom shell is formed of a single layer of material, the sidewalls include inner and outer layers of material, and a gap between the inner and outer layers of material forms a channel communicating with the bottom trough. This arrangement is structurally simple and low-cost.
[0014] According to the first aspect, or any implementation of the first aspect above, the bottom shell is formed of a layer of material. Such an arrangement can achieve higher heat dissipation efficiency.
[0015] In a second aspect, the present application provides a power module assembly, comprising: using the power module and a heat sink described in any one of the first aspects, the power module is mounted on the heat sink, and the heat dissipation substrate at the bottom of the power module and the heat sink form a bottom cooling channel.
[0016] According to the power module assembly of the second aspect, double-sided heat dissipation can be achieved using only one heat sink, which has a simple structure and low cost.
[0017] According to the second aspect, or any implementation of the second aspect above, at least two power modules are mounted on the heat sink. This allows for installation of an appropriate number of power modules as needed, and since the heat sink is shared, the structure is simplified, process requirements are lowered, and costs are reduced.
[0018] In a third aspect, the present application provides a power device, comprising the power module assembly described in the second aspect. The power device is, for example, an inverter or other device.
[0019] According to the third aspect, the power module assembly according to the second aspect of the present application is adopted, so the cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1A This is a schematic diagram of the structure of a single-sided heat dissipation power module component:
[0021] Figure 1B yes Figure 1A a schematic cross-sectional view of the power module assembly shown;
[0022] Figure 2AThis is a schematic diagram of the structure of a current double-sided heat dissipation power module assembly;
[0023] Figure 2B yes Figure 2A Schematic diagram of the radiator;
[0024] Figure 3 is a cross-sectional schematic diagram of a power module assembly provided in an embodiment of the present application;
[0025] Figure 4 1 is a schematic structural diagram of a cooling housing for encapsulating a power module provided in an embodiment of the present application;
[0026] Figure 5 is a schematic cross-sectional view of a cooling housing for encapsulating a power module provided in an embodiment of the present application;
[0027] Figure 6 is a schematic flow chart of the packaging method provided in an embodiment of the present application;
[0028] Figure 7 This is a schematic diagram of the structure after the power module is placed in the cooling housing;
[0029] Figure 8 This is a schematic diagram of the structure after the power module is placed in the plastic packaging mold. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0031] The term "and / or" in this article is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.
[0032] In the description and claims of the embodiments of this application, the terms "first" and "second" are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first target object" and "second target object" are used to distinguish different objects, rather than to describe a specific order of objects.
[0033] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0034] In the description of the embodiments of this application, unless otherwise specified, "multiple" means two or more. For example, "multiple processing units" means two or more processing units; "multiple systems" means two or more systems.
[0035] Figure 1A This is a structural diagram of a single-sided heat dissipation power module. Figure 1B yes Figure 1A Schematic cross-sectional view of the power module assembly shown.
[0036] like Figure 1A and Figure 1B As shown, the power module assembly of this example includes a power module 100 and a heat sink 200. The power module 100 is, for example, an inverter or other power device composed of an IGBT module or a SiC module, and exemplarily has three power terminals 1, 2, and 3 and a plurality of signal terminals 4, wherein two power terminals are located on the same side, for example, the positive terminal (DC+) and the negative terminal (DC-) are located on the same side, and the other power terminal is located on the opposite side, for example, the alternating current (AC) terminal is located on the opposite side. Exemplarily, the signal terminal 4 and the power terminal 3 are located on the same side for connecting to an external control circuit. The number of signal terminals 4 is, for example, 6, for connecting, for example, gates and sources on different branches. A heat sink 200 is installed at the bottom of the power module 100 (i.e., the side facing the heat sink 200) (i.e., the power module 100 is installed / inserted on the heat sink 200, and multiple power modules 100 share the same heat sink). The heat sink 200 has a water inlet 201 and a water outlet 202. The coolant enters from the water inlet 201, circulates inside the heat sink 200 and exchanges heat with the power module 100, and then flows out from the water outlet 202. A heat sink substrate can be installed at the bottom of the power module 100, and heat sink fins 16 (pinfins) can be formed on the substrate to improve the heat exchange efficiency with the heat sink 200. For example, a slot can be formed on the heat sink 200, and the power module 100 and the heat sink 200 are connected by inserting the heat sink 200. For the heat dissipation structure of the power module shown in Figures 1 and 2, the structure is simple and the process requirements are low, but only single-sided heat dissipation can be achieved, and the heat dissipation capacity is low for high-power modules.
[0037] Figure 2AThis is a schematic diagram of the structure of a current double-sided heat dissipation power module assembly; Figure 2B yes Figure 2A Schematic diagram of the radiator structure.
[0038] like Figure 2A As shown, the power module assembly of this example includes a power module 100 and a heat sink 300 arranged in a stacked manner. The power module 100 is, for example, an IGBT module or a SiC module, which has three power terminals 1, 2, 3 and a plurality of signal terminals 4, wherein two power terminals are located on the same side, for example, the positive terminal (DC+) and the negative terminal (DC-) are located on the same side, and the other power terminal is located on the opposite side, for example, the alternating current (AC) terminal is located on the opposite side. Exemplarily, the signal terminal 4 and the power terminal 3 are located on the same side for connecting to an external control circuit. The number of signal terminals 4 is, for example, 6, for connecting, for example, gates and sources on different branches. In Figure 2A In the example shown, multiple power modules 100 and heat sinks 300 are stacked and spaced apart from each other, with each power module 100 inserted or embedded between two heat sinks 300. The top and bottom of the power module 100 are connected to the heat sink 300, thereby achieving double-sided heat dissipation, having high heat dissipation efficiency, and greatly improving the stability of the power module 100. Multiple heat sinks 300 share the same water inlet 301 and the same water outlet 302. The structure of each heat sink 300 is as shown in FIG. Figure 2B As shown, a groove structure is formed inside the heat sink 300, and a heat dissipation fin 16 is provided in the groove to improve the heat exchange efficiency between the heat sink 300 and the power module 100, thereby improving the heat dissipation capacity of the heat sink 300. Figure 2A and Figure 2B The heat sink 300 shown has a complex structure, is difficult to install, and has high process requirements, so the cost is relatively high.
[0039] Based on the above description, the embodiments of the present application propose an improved power module and a packaging method thereof, which can achieve double-sided heat dissipation while having a simple structure and low process requirements, thereby reducing costs and facilitating wider applications.
[0040] Figure 3 2 is a cross-sectional schematic diagram of a power module assembly provided in an embodiment of the present application.
[0041] like Figure 3As shown, the power module assembly of an embodiment of the present application includes a power module 100 and a heat sink 400. The power module 100 includes a chip stack, a cooling housing 17, and a seal 19. The chip stack includes a semiconductor chip 11, a packaging substrate 12, and a heat sink 15, which are stacked in a vertical direction along the chip surface. The semiconductor chip 11 is, for example, an IGBT chip or a SiC chip. The packaging substrate 12 is soldered to the top and bottom of the semiconductor chip 11. The packaging substrate 12 is, for example, a DBC (direct-bonded copper) substrate. Exemplarily, the packaging substrate 12 includes two upper and lower metal layers 13 and an insulating layer 14 located in the middle. The metal layer 13 is, for example, a copper layer, and the insulating layer 14 is, for example, a ceramic layer or a ceramic substrate. A heat sink 15 is installed on the side of the packaging substrate 12 away from the semiconductor chip 11. Heat sink fins (pinfins) 16 are formed on the heat sink 15. The heat sink 15 is made of a material with good heat dissipation capabilities, such as copper or aluminum. The heat sink 16 can be integrally formed with the adjacent metal layer or soldered.
[0042] The power module 100 further includes a cooling housing 17. The cooling housing 17 is mounted on the chip stack or the power module 100, covering the top and sides of the power module 100. A cooling channel 18 is formed in the cooling housing 17. The cooling channel 18 extends upward from the side of the bottom where no power terminal is formed to the top, passes through the heat dissipation fins 16 of the top heat dissipation substrate 15, and then extends downward from the top to the other side of the bottom where no power terminal is formed. The sealing member 19 is used to wrap and seal the semiconductor chip 11, the packaging substrate 12, and at least part of the heat dissipation substrate 15 and part of the cooling housing 17. For example, as Figure 3 As shown, the heat dissipation fins 16 of the heat dissipation substrate 15 at the bottom are not wrapped by the sealing member 19 but are exposed to the outside.
[0043] It should be understood that Figure 3 The power module shown also has the power terminals and signal terminals shown in Figure 1 (not shown in the cross-sectional view, the cross-section is cut along the two sides where the terminals are not formed), and the cooling shell covers the top of the power module 100 and the two sides where the power terminals and signal terminals are not formed.
[0044] The radiator 400 has a water inlet 401 and a water outlet 402. Multiple power modules 100 can share the same radiator 400. Figure 3As shown, the heat sink 400 has a mounting groove 403. When the power module 100 is installed in the mounting groove 403, the bottom of the power module 100 and the heat sink 400 form a bottom cooling channel. After the coolant (such as water) enters from the water inlet 401, the coolant flows from the bottom of the power module 100 (i.e., the mounting groove 403) and removes the heat generated by the semiconductor chip 11 by exchanging heat with the heat dissipation substrate 15 at the bottom. On the other hand, the coolant flows through the cooling channel 18 in the cooling housing 17 and removes the heat generated by the semiconductor chip 11 by exchanging heat with the heat dissipation substrate 15 at the top. In other words, the power module 100 of the embodiment of the present application can achieve double-sided heat dissipation on both the top and bottom sides while using a single heat sink. It has a simple structure, low process requirements, and therefore low cost.
[0045] It should be understood that a plurality of mounting slots 403 may be formed on the heat sink 400 to mount a plurality of power modules 100 . The plurality of mounting slots 403 are connected to each other via the communication openings 404 .
[0046] Figure 4 1 is a schematic structural diagram of a cooling housing for a power module provided in an embodiment of the present application; Figure 5 It is a schematic cross-sectional view of a cooling housing for a power module provided in an embodiment of the present application.
[0047] like Figure 4 and Figure 5 As shown, the cooling housing 17 for the power module provided in the embodiment of the present application has a concave structure, which includes, for example, a bottom shell 171 and side walls 172 and 173 connected to the bottom shell 171 and located on both sides of the bottom shell 171. A bottom groove 181 is formed inside the bottom shell 171, and vertically penetrating channels 182 and 183 are formed on the side walls 172 and 173, respectively. The bottom groove 181 is connected to the channels 182 and 183 (as shown in FIG. Figure 5 The bottom shell 171 is formed of a layer of material, and the side walls 172 and 173 include inner and outer layers, and the gap between the two layers constitutes the channels 182 and 183.
[0048] The cooling housing 17 can be made of various suitable materials such as metal (eg, aluminum, copper, or other metal materials), plastic, or the like.
[0049] The size of the cooling housing 17 corresponds to the size of the power module 100. Figure 3 As shown, the height of the side wall of the cooling shell 17 (i.e., the height of the inner layer) corresponds to the distance between the two heat dissipation substrates 15 of the power module 100. When the power module 100 is placed in the cooling shell 17, the side wall is aligned with the heat dissipation substrate, so as to ensure that the filling particles in the subsequent packaging completely cover the cooling channel and the heat dissipation fins.
[0050] The power module 100 of the present embodiment utilizes a cooling housing to form cooling channels within the housing. Thus, when the power module 100 is mounted on the heat sink 400, the cooling channels 18 within the cooling housing 17 dissipate heat from the top of the power module 100. Furthermore, a bottom cooling channel is formed between the bottom of the power module 100 and the heat sink 400 to dissipate heat from the bottom of the power module 100. In other words, the power module 100 of the present embodiment utilizes a single heat sink to achieve dual-sided heat dissipation, offering the advantages of a simple structure, low process requirements, and low cost.
[0051] Figure 6 This is a schematic flow chart of a packaging method for a power module provided in an embodiment of the present application.
[0052] like Figure 6 As shown, the packaging method provided in the embodiment of the present application includes:
[0053] Step S601: Place the power module in a cooling housing and fill the cooling channel in the cooling housing with soluble particles so that the soluble particles fill the cooling channel and cover the heat dissipation fins on the top of the power module.
[0054] Step S602: placing the cooling housing into a mold and completing packaging by using the mold through a plastic encapsulation process;
[0055] Step S603: removing the mold and placing the power module into a dissolving solution to remove soluble particles;
[0056] Step S604: drying the power module.
[0057] In step S601, the cooling housing is turned upside down, and the power module is then placed upside down in the cooling housing, that is, the top of the power module is placed toward the bottom of the cooling housing. Then, soluble particles are used to fill the cooling channels in the cooling housing, so that the soluble particles fill the cooling channels and cover the heat dissipation fins at the bottom of the power module. The soluble particles are, for example, sodium chloride particles. The cross-sectional view after filling with sodium chloride particles is as shown in FIG. Figure 7 shown.
[0058] In step S602, Figure 8 As shown, the cooling housing with the power module is placed upside down into a mold 21, and the mold 21 is used to complete the packaging through a molding process. First, a molding material such as epoxy resin is injected into the mold 21 through the molding material injection port to encapsulate the power module and the cooling housing 17 in the molding material. The molding material is then cured by heating or ultraviolet irradiation to complete the packaging.
[0059] In step S603, the mold is first removed, that is, the packaged power module and cooling housing are removed from the mold, and then the power module is placed in a dissolving solution to remove soluble particles, such as water, to dissolve soluble particles such as sodium chloride particles in the cooling channel.
[0060] In step S604 , after the soluble particles such as sodium chloride particles in the cooling channel are dissolved, the power module is taken out of the water and then dried.
[0061] The packaging method of the power module in the embodiment of the present application places the power module in a cooling shell with a cooling channel formed inside, and packages the power module and the cooling shell together so that the power module has a cooling channel inside, thereby enabling the power module to achieve double-sided heat dissipation through only one heat sink, which has the advantages of simple structure, low process requirements and low cost.
[0062] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A power module, characterized in that: include: semiconductor chips; A packaging substrate, wherein one packaging substrate is welded on the top and bottom of the semiconductor chip respectively; a heat dissipation substrate, formed on a side of the packaging substrate away from the semiconductor chip, with heat dissipation fins formed on the heat dissipation substrate; a cooling housing, the cooling housing covering the top heat dissipation substrate and the sides of the semiconductor chip, the packaging substrate, and the heat dissipation substrate, and having cooling channels formed inside the cooling housing connecting the left and right sides and the top of the power module; A sealing member wraps the semiconductor chip, the packaging substrate, the area of the heat dissipation substrate excluding the heat dissipation fins, and the outer wall of the cooling housing.
2. The power module according to claim 1, wherein: The cooling shell includes a bottom shell and a side wall connected to the bottom shell. The bottom shell is formed with a bottom groove, and the side wall is formed with a channel communicating with the bottom groove.
3. The power module according to claim 2, wherein: The bottom shell is formed of a layer of material, and the side wall includes an inner and outer layer of material. The gap between the inner and outer layers of material forms a channel communicating with the bottom groove.
4. The power module according to claim 2, wherein: The bottom shell is formed from a layer of material.
5. A power module assembly, characterized in that: include: The power module and heat sink according to any one of claims 1 to 4, wherein the power module is mounted on the heat sink, and the heat dissipation substrate at the bottom of the power module and the heat sink form a bottom cooling channel.
6. The power module assembly according to claim 5, characterized in that: At least two power modules are mounted on the radiator.
7. A power device, characterized in that: Includes the power module assembly according to claim 5 or 6.