Novel mark for improving alignment precision

Abstract

The utility model relates to a novel mark for improving alignment precision, and belongs to the technical field of Mini LED packaging. Comprising anti-overflow glue grooves and mark marks, and the anti-overflow glue grooves are rectangular grooves and located in the four corners of a cutting channel; the mark marks are cross lines and are positioned on the cutting channels at the four corners; rectangular grooves are formed in the periphery of the cutting channel, and glue is prevented from overflowing and diffusing to the surface of the mark; and the mark marks the cross line, so that the alignment precision is improved.

Description

Technical Field

[0001] The utility model relates to a new type of mark for improving alignment accuracy, belonging to the technical field of Mini LED packaging. Background Art

[0002] Mini LED chips are extremely small, requiring higher precision and alignment during the packaging and assembly process. During the Mini LED packaging process, the PCB mark is placed on the board, which involves solder paste printing, die bonding, and cutting. Deviations in mark shape design, preparation, and residual adhesive can all lead to reduced alignment accuracy, causing consistency and reliability issues, and ultimately reducing overall yield.

[0003] For example, Chinese patent publication number "CN104952846A" discloses a stacking mark comprising a front-layer measurement mark formed in one layer of a semiconductor substrate or its epitaxial layer, and a back-layer measurement mark formed at the same location in the layer following the front-layer measurement mark. The stacking mark also includes dummy patterns evenly distributed in the blank spaces between the front-layer measurement mark and the back-layer measurement mark, thereby preventing stress-induced distortion of the stacking mark that could affect measurement accuracy. However, this does not address the design of marks on PCBs used in the Mini LED packaging process.

[0004] However, a new mark design that improves alignment accuracy can improve alignment accuracy, enhance production yield and product quality. Therefore, designing a new mark point that improves alignment accuracy is of great significance. Utility Model Content

[0005] The main purpose of the utility model is to provide a new type of mark that improves the positioning accuracy, which can improve the positioning accuracy and thus improve the production yield and product quality.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A new type of mark for improving alignment accuracy includes an anti-overflow glue groove and a mark. The anti-overflow glue groove is a rectangular groove located at the four corners of the cutting path; the mark is a cross line located on the cutting path and outside the anti-overflow glue groove.

[0008] Rectangular grooves are added around the cutting path to prevent glue from overflowing and spreading to the mark surface; cross lines are added to the mark to improve the accuracy of alignment.

[0009] Preferably, the mark includes four x-direction cutting alignment cross lines and four y-direction cutting alignment cross lines, one x-direction cutting alignment cross line and one y-direction cutting alignment cross line form a group, and each group is located at the same corner on the cutting path.

[0010] Preferably, four groups of anti-overflow glue grooves are provided, and each group of anti-overflow glue grooves includes two rectangular grooves, one rectangular groove is located on one side of a corner of the cutting path, and the other rectangular groove is located on the other side of the corner of the cutting path.

[0011] Preferably, the mark is a flat cross line.

[0012] Preferably, the mark is a pointed cross line.

[0013] Preferably, the top tip angle of the pointed cross line is 30-50°.

[0014] Preferably, the width of the rectangular groove is in the range of 20-500 μm, and the aspect ratio is in the range of 0.1-5.

[0015] Preferably, the cross line width is in the range of 20-100 μm, and the aspect ratio is in the range of 5-10.

[0016] The beneficial effects of the utility model are as follows:

[0017] The utility model discloses a novel mark for improving alignment accuracy, which can improve alignment accuracy, thereby improving production yield and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of a new type of mark for improving alignment accuracy as described in Example 1 of the present utility model;

[0019] Figure 2 This is a structural diagram of a mark described in the present utility model;

[0020] Figure 3 This is a schematic structural diagram of a new type of mark for improving alignment accuracy as described in Example 2 of the present utility model;

[0021] Figure 4 This is a structural diagram of an old-type mark described in the present utility model.

[0022] In the figure: 1, cutting path; 2, anti-overflow glue groove; 3, mark; 31, first mark; 32, second mark; 33, third mark; 34, fourth mark; 35, fifth mark; 36, sixth mark; 37, seventh mark; 38, eighth mark. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0024] The utility model discloses a new mark for improving alignment accuracy, comprising an anti-overflow glue groove 2 and a mark 3. The anti-overflow glue groove 2 is a rectangular groove located at the four corners of a cutting path 1; the mark 3 is a cross line located on the cutting path 1 at the four corners.

[0025] Rectangular grooves are added around the cutting path 1 to prevent glue from overflowing and spreading to the surface of mark 3; cross lines are added to mark 3 to improve the accuracy of alignment.

[0026] The mark 3 includes four x-direction cutting alignment cross lines and four y-direction cutting alignment cross lines, one x-direction cutting alignment cross line and one y-direction cutting alignment cross line form a group, and each group is located at the same corner on the cutting path 1.

[0027] There are four groups of anti-overflow glue grooves 2 , and each group of anti-overflow glue grooves 2 includes two rectangular grooves, one rectangular groove is located on one side of a corner of the cutting path 1 , and the other rectangular groove is located on the other side of the corner of the cutting path 1 .

[0028] Example 1

[0029] like Figure 1 As shown, this embodiment discloses a new type of mark for improving alignment accuracy, including a cutting path 1;

[0030] Anti-overflow glue groove 2: prevents glue from overflowing onto the surface of mark 3, resulting in a decrease in optical alignment resolution (graphic blurring);

[0031] Mark 3 (cross line, two points in a line, align with the horizontal line): Figure 2 As shown, the first mark 31 and the fourth mark 34 are aligned with the fifth mark 35 and the eighth mark 38 for x-direction cutting alignment; the second mark 32 and the seventh mark 37 and the third mark 33 and the sixth mark 36 are aligned for y-direction cutting alignment.

[0032] Specifically, four marks of the same shape and size are designed around the PCB board. The mark consists of a rectangular anti-overflow glue groove 2 and a pointed cross-shaped mark 3; the width of the rectangular groove is 20-500um, and the aspect ratio is 0.1-5; the width of the cross line is 20-100um, the aspect ratio is 5-10, and the top sharp angle is 30-50°.

[0033] Example 2

[0034] like Figure 1 As shown, this embodiment discloses a new type of mark for improving alignment accuracy, including a cutting path 1;

[0035] Anti-overflow glue groove 2: prevents glue from overflowing onto the surface of mark 3, resulting in a decrease in optical alignment resolution (graphic blurring);

[0036] Mark 3 (cross line, two points in a line, align with the horizontal line): Figure 2 As shown, the first mark 31 and the fourth mark 34 are aligned with the fifth mark 35 and the eighth mark 38 for x-direction cutting alignment; the second mark 32 and the seventh mark 37 and the third mark 33 and the sixth mark 36 are aligned for y-direction cutting alignment.

[0037] Specifically, four marks of the same shape and size are designed around the PCB board. The mark consists of a rectangular anti-overflow glue groove 2 and a flat-head cross-shaped mark 3. The width of the rectangular groove is 20-500um, and the aspect ratio is 0.1-5; the width of the cross line is 20-100um, and the aspect ratio is 5-10.

[0038] Compared with the old mark:

[0039] like Figure 4 As shown, the old marks include:

[0040] Cutting lane 1;

[0041] Anti-overflow glue groove 2: prevents glue from overflowing onto the surface of mark 3, resulting in a decrease in optical alignment resolution (graphic blurring);

[0042] Mark 3 (cross-shaped, two points in a straight line, aligned with a horizontal line): cutting path 3 is in the middle of rectangular mark 3.

[0043] There are the following disadvantages:

[0044] 1. The method of rectangle plus lines is used, and the alignment accuracy is poor.

[0045] 2. During the gluing and molding process, the glue easily spreads onto the mark, resulting in a decrease in the mark identification accuracy. The new mark marking method for improving the alignment accuracy described in the present invention has the following advantages:

[0046] 1. Add rectangular grooves around the PCB board to prevent glue from overflowing and spreading to the surface of mark 3.

[0047] 2. The mark 3 is a pointed or flat cross to improve the accuracy of alignment.

[0048] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A new type of mark for improving alignment accuracy, characterized by: The invention comprises an anti-overflow glue groove (2) and a mark (3), wherein the anti-overflow glue groove (2) is a rectangular groove located at the four corners of the cutting path (1); and the mark (3) is a cross line located on the cutting path (1) and outside the anti-overflow glue groove (2).

2. A new type of mark for improving alignment accuracy according to claim 1, characterized in that: The mark (3) includes four x-direction cutting alignment cross lines and four y-direction cutting alignment cross lines, one x-direction cutting alignment cross line and one y-direction cutting alignment cross line form a group, and each group is located at the same corner on the cutting path (1).

3. The novel mark for improving alignment accuracy according to claim 1, characterized in that: Four groups of anti-overflow glue grooves (2) are provided, and each group of anti-overflow glue grooves (2) includes two rectangular grooves, one rectangular groove is located on one side of a corner of the cutting path (1), and the other rectangular groove is located on the other side of the corner of the cutting path (1).

4. The novel mark for improving alignment accuracy according to claim 1, characterized in that: The mark (3) is a flat cross line.

5. The novel mark for improving alignment accuracy according to claim 1, characterized in that: The mark (3) is a pointed cross line.

6. The novel mark for improving alignment accuracy according to claim 5, characterized in that: The top tip angle of the pointed cross line is 30-50 degrees.

7. The novel mark for improving alignment accuracy according to claim 1, characterized in that: The width of the rectangular groove is in the range of 20-500 μm, and the aspect ratio is in the range of 0.1-5.

8. The novel mark for improving alignment accuracy according to claim 1, characterized in that: The width of the cross line is in the range of 20-100 μm, and the aspect ratio is in the range of 5-10.

Images