Heat dissipation structure for heat dissipation of test board and test machine

Abstract

The utility model provides a heat dissipation structure for heat dissipation of a test board and a test machine, and relates to the technical field of semiconductor testing, the heat dissipation structure provided by the utility model comprises a first water cooling plate, a second water cooling plate and a plurality of single plates which are arranged in a laminated manner, any single plate is connected with at least one other single plate through a connecting assembly, and the first water cooling plate is connected with the second water cooling plate. At least one single plate is arranged between the first water-cooling plate and the second water-cooling plate, and the first water-cooling plate and the second water-cooling plate make contact with the adjacent single plates. The heat dissipation structure for heat dissipation of the test board provided by the utility model can ensure the stability of the multi-layer single board structure under the condition of meeting the heat dissipation requirement of the multi-layer single board.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a heat dissipation structure for dissipating heat on a test board and a test machine. Background Art

[0002] Existing boards are mostly designed with a single-layer water-cooling plate or a single-layer water-cooling plate plus a heat sink. In the case of limited space, a single-layer water-cooling plate or a single-layer water-cooling plate plus a heat sink structure often cannot meet the heat dissipation and structural fixation requirements of a large number of single boards, which can easily lead to poor heat dissipation of the single boards and unstable relative positions between the single boards. Utility Model Content

[0003] The present invention aims to provide a heat dissipation structure for testing board heat dissipation, which can ensure the stability of the multi-layer single board structure while meeting the heat dissipation requirements of the multi-layer single board. In addition, a test machine is provided including the heat dissipation structure for testing board heat dissipation.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] In the first aspect, the utility model provides a heat dissipation structure for dissipating heat from a test board, comprising a first water-cooled plate, a second water-cooled plate, and a plurality of single plates arranged in a stacked manner, any one of the single plates being connected to at least one other single plate through a connecting component, at least one single plate being arranged between the first water-cooled plate and the second water-cooled plate, and the first water-cooled plate and the second water-cooled plate being in contact with the adjacent single plates.

[0006] Furthermore, a water cooling pipe is connected between the first water cooling plate and the second water cooling plate and the first water cooling plate and the second water cooling plate are connected in series through the water cooling pipe.

[0007] Furthermore, the plurality of single boards include a first single board, a second single board, a third single board and a fourth single board, the first water-cooling board is sandwiched between the first single board and the second single board, and the second water-cooling board is sandwiched between the third single board and the fourth single board.

[0008] Furthermore, the first water-cooling plate and the second water-cooling plate each have a length direction and a width direction perpendicular to the length direction, and at least one side end of the first water-cooling plate and the second water-cooling plate in the width direction is connected by a first fixing member.

[0009] Furthermore, the first water-cooling plate and the second water-cooling plate are connected at least at one side end in the length direction by a second fixing member.

[0010] Furthermore, the connection component includes a connector, and the first board and the second board are electrically connected through the connector.

[0011] Furthermore, the connector is arranged between opposite surfaces of the first board and the second board.

[0012] Furthermore, the connection assembly further includes a plurality of adapter plates, and the third single board and the fourth single board are electrically connected to the first single board via one of the adapter plates.

[0013] Furthermore, the adapter plate is arranged at the same side end of the third single board, the fourth single board and the first single board.

[0014] In a second aspect, the present invention further provides a testing machine, comprising the heat dissipation structure described in the above solution.

[0015] The heat dissipation structure and test function provided by the utility model for heat dissipation of a test board can produce the following beneficial effects:

[0016] In the heat dissipation structure for heat dissipation of a test board provided by the first aspect of the present invention, since the first water-cooling plate, the second water-cooling plate and a plurality of single plates are stacked, and at least one single plate is arranged between the first water-cooling plate and the second water-cooling plate, the surfaces on both sides of the first water-cooling plate and the second water-cooling plate can dissipate heat for the single plates, which is suitable for dissipating heat for a large number of single plates. At the same time, since any single plate is connected to at least one other single plate through a connecting component, the structure can be ensured to be more stable while meeting the heat dissipation requirements of multiple layers of single plates.

[0017] The testing machine provided in the second aspect of the present invention has the heat dissipation structure provided in the first aspect of the present invention, and thus has all the beneficial effects of the heat dissipation structure provided in the first aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A schematic diagram of a partial three-dimensional structure of a heat dissipation structure for heat dissipation of a test board provided in an embodiment of the first aspect of the utility model Figure 1 ;

[0020] Figure 2 A schematic diagram of a partial three-dimensional structure of a heat dissipation structure for heat dissipation of a test board provided in an embodiment of the first aspect of the utility model Figure 2 ;

[0021] Figure 3A rear view of a heat dissipation structure for dissipating heat from a test board provided in an embodiment of the first aspect of the present utility model;

[0022] Figure 4 for Figure 3 A-A cross-sectional view;

[0023] Figure 5 for Figure 4 A partial enlarged schematic diagram of point B;

[0024] Figure 6 A schematic diagram of a partial three-dimensional structure of a heat dissipation structure for heat dissipation of a test board provided in an embodiment of the first aspect of the utility model Figure 3 ;

[0025] Figure 7 A schematic diagram of a partial three-dimensional structure of a heat dissipation structure for heat dissipation of a test board provided in an embodiment of the first aspect of the utility model Figure 4 ;

[0026] Figure 8 A three-dimensional structural schematic diagram of a heat dissipation structure for dissipating heat from a test board is provided in an embodiment of the first aspect of the present utility model.

[0027] Icons: 1-first water-cooling plate; 2-second water-cooling plate; 3-water-cooling pipe; 4-first single board; 5-second single board; 6-third single board; 7-fourth single board; 8-first fixing piece; 81-first groove; 82-second groove; 9-second fixing piece; 10-connector; 011-adapter plate; 012-screw; 013-protective case. DETAILED DESCRIPTION

[0028] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0031] The following is a detailed description of the specific embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention.

[0032] Existing water-cooling plates are mostly designed with a single-layer water-cooling plate or a single-layer water-cooling plate plus a heat sink structure, which cannot meet the heat dissipation and structural fixation requirements in a board architecture with multi-layer heat dissipation requirements.

[0033] An embodiment of the first aspect of the present utility model is to provide a heat dissipation structure for dissipating heat from a test board, comprising a first water-cooling plate 1, a second water-cooling plate 2, and a plurality of single boards arranged in a stacked manner, wherein any single board is connected to at least one other single board through a connecting component, and at least one single board is arranged between the first water-cooling plate 1 and the second water-cooling plate 2, and the first water-cooling plate 1 and the second water-cooling plate 2 are in contact with adjacent single boards.

[0034] The heat dissipation structure provided in the above embodiments may include two, three, four or even more single boards. The surfaces on both sides of the first water-cooled plate 1 and the second water-cooled plate 2 can be used to dissipate heat from the single boards, thereby enabling heat dissipation of multiple single boards. At the same time, since any single board is connected to at least one other single board through a connecting component, the connecting component can limit the positional relationship between the single boards, thereby ensuring the stability of the multi-layer single board structure while meeting the heat dissipation requirements of the multi-layer single boards.

[0035] In the above heat dissipation structure, the first water-cooling plate 1 can contact one single board on one side or one single board on both sides. Similarly, the second water-cooling plate 2 can contact one single board on one side or one single board on both sides.

[0036] In the following embodiments, a case where multiple single boards include a first single board 4, a second single board 5, a third single board 6 and a fourth single board 7, the first water-cooled plate 1 is sandwiched between the first single board 4 and the second single board 5, and the second water-cooled plate 2 is sandwiched between the third single board 6 and the fourth single board 7 is used as an example for specific description.

[0037] like Figure 1 As shown, the first single plate 4 and the second single plate 5 are stacked up and down, and the first water-cooling plate 1 is sandwiched between the first single plate 4 and the second single plate 5. Figure 1 At the angle shown, the top surface of the first water-cooling plate 1 can dissipate heat for the first single board 4 , and the bottom surface of the first water-cooling plate 1 can dissipate heat for the second single board 5 , thereby fully utilizing the heat dissipation surfaces on both sides of the first water-cooling plate 1 .

[0038] like Figure 2 As shown, the third single plate 6 and the fourth single plate 7 are stacked up and down, and the second water-cooling plate 2 is sandwiched between the third single plate 6 and the fourth single plate 7. Figure 2 At the angle shown, the top surface of the second water-cooling plate 2 can dissipate heat for the fourth single board 7, and the bottom surface of the second water-cooling plate 2 can dissipate heat for the third single board 6, thereby fully utilizing the heat dissipation surfaces on both sides of the second water-cooling plate 2.

[0039] To more intuitively show the positional relationship between the first water-cooling plate 1, the second water-cooling plate 2 and the above four single plates, as shown in FIG. Figures 3 to 5 As shown, the first single plate 4, the first water-cooling plate 1, the second single plate 5, the third single plate 6, the second water-cooling plate 2 and the fourth single plate 7 are stacked in sequence from top to bottom.

[0040] exist Figure 5 In the left-right direction, the size of the second single board 5 is smaller than the first single board 4, the third single board 6 and the fourth single board 7.

[0041] like Figure 5 As shown, the first single plate 4 and the first water-cooling plate 1 can be fixedly connected by a screw 012 , and the second single plate 5 and the first water-cooling plate 1 can be fixedly connected by another screw 012 .

[0042] In an optional embodiment, if Figure 5 and Figure 6 As shown, the connection assembly includes a connector 10 , and the first single board 4 and the second single board 5 are electrically connected via the connector 10 .

[0043] The connector 10 can not only realize the communication between the first single board 4 and the second single board 5, but also limit the relative position of the first single board 4 and the second single board 5. One end of the connector 10 can be fixedly connected to the first single board 4, and the other end can be fixedly connected to the second single board 5.

[0044] In an optional embodiment, if Figure 5 As shown, the connector 10 is disposed between the opposing surfaces of the first single board 4 and the second single board 5 .

[0045] On the one hand, the above arrangement does not require the connector 10 to occupy a large space. On the other hand, after the first single board 4 is aligned with the second single board 5 and stacked on the first water-cooled plate 1, the connector 10 itself can be docked, which also facilitates the installation of the heat dissipation structure.

[0046] In an optional embodiment, if Figure 2As shown, the connection component also includes several adapter boards 011. The third single board 6 and the fourth single board 7 are electrically connected to the first single board 4 through an adapter board 011 respectively. The adapter board 011 can realize communication between the first single board 4, the third single board 6 and the fourth single board 7.

[0047] In an optional embodiment, since the first single board 4, the third single board 6 and the fourth single board 7 are stacked, in order to facilitate the connection of each adapter board 011 with the above three single boards, each adapter board 011 is arranged at the side end of the third single board 6, the fourth single board 7 and the first single board 4, and the adapter board 011 has a certain extension length in the arrangement direction of the multiple single boards, so that it can contact the single boards at different heights to achieve electrical connection between the above-mentioned single boards.

[0048] In an optional embodiment, if Figure 7 As shown, a water cooling pipe 3 is connected between the first water cooling plate 1 and the second water cooling plate 2 and the first water cooling plate 1 and the second water cooling plate 2 are connected in series through the water cooling pipe 3 .

[0049] The above embodiment can realize the connection between the refrigerant in the first water-cooled plate 1 and the second water-cooled plate 2, so that only one refrigerant inlet and one refrigerant outlet are required for the above heat dissipation structure. There is no need to add a refrigerant source and corresponding refrigerant transmission pipeline to the original test machine, thereby reducing the update cost of the original test machine.

[0050] Specifically, if Figure 7 As shown, the water cooling pipe 3 is tilted, with one end connected to the first water cooling plate 1 and the other end connected to the second water cooling plate 2, so as to adapt to the height difference between the first water cooling plate 1 and the second water cooling plate 2.

[0051] In an optional embodiment, the water cooling pipe 3 and the adapter plate 011 are located at the same side end of the third single board 6, the fourth single board 7 and the first single board 4, and the water cooling pipe 3 and the adapter plate 011 do not interfere with each other.

[0052] In an optional embodiment, if Figure 8 As shown, the outside of the water-cooling pipe 3 is further covered with a protective shell 013 , which can be connected to the first water-cooling plate 1 and the second water-cooling plate 2 by connecting parts such as screws to protect the water-cooling pipe 3 .

[0053] In an optional embodiment, in order to further ensure the stability of the relative position of the first water-cooling plate 1 and the second water-cooling plate 2, as shown in FIG. Figure 8 As shown, the first water-cooling plate 1 and the second water-cooling plate 2 both have a length direction and a width direction perpendicular to the length direction, and at least one side end of the first water-cooling plate 1 and the second water-cooling plate 2 in the width direction is connected by a first fixing member 8.

[0054] The arrangement of the first fixing member 8 can limit the relative positional relationship between the first water-cooling plate 1 and the second water-cooling plate 2 in their arrangement direction, thereby ensuring that the relative position of the first water-cooling plate 1 and the second water-cooling plate 2 is more stable.

[0055] Specifically, if Figure 8 As shown, the first fixing member 8 is clamped between the first water-cooling plate 1 and the second water-cooling plate 2; a first groove 81 is provided on the surface of the first fixing member 8 facing the first water-cooling plate 1, and one end of a connecting member such as a screw can be accommodated in the first groove 81, and the other end passes through the first fixing member 8 and is inserted into the second water-cooling plate 2; a second groove 82 is provided on the surface of the first fixing member 8 facing the second water-cooling plate 2, and one end of a connecting member such as a screw can be accommodated in the second groove 82, and the other end passes through the first fixing member 8 and is inserted into the first water-cooling plate 1.

[0056] The above-mentioned first grooves 81 and second grooves 82 are both configured in multiples, the first fixing member 8 is in a strip shape, the multiple first grooves 81 are evenly spaced along the length direction of the first fixing member 8, the multiple second grooves 82 are evenly spaced along the length direction of the first fixing member 8, and the multiple first grooves 81 and the multiple second grooves 82 are staggered along the length direction of the first fixing member 8.

[0057] In at least one embodiment, both side ends of the first water-cooling plate 1 and the second water-cooling plate 2 in the width direction are connected by a first fixing member 8 .

[0058] In an optional embodiment, if Figure 8 As shown, at least one side end of the first water-cooling plate 1 and the second water-cooling plate 2 in the length direction is connected by a second fixing member 9, and the second fixing member 9 can further strengthen the relative position stability of the first water-cooling plate 1 and the second water-cooling plate 2.

[0059] Specifically, if Figure 8 As shown, the side end of the second fixing member 9 is the same as the side end of the adapter plate 011. The second fixing member 9 can prevent the first water-cooled plate 1 and the second water-cooled plate 2 from loosening at the above-mentioned end, which further causes the adapter plate 011 to loosen, resulting in failure of the connection between the single boards.

[0060] Specifically, if Figure 8 As shown, the second fixing member 9 is clamped between the first water-cooling plate 1 and the second water-cooling plate 2; the second fixing member 9 is provided with a through hole, and some screws and other connecting members can pass through the first water-cooling plate 1 and be inserted at one end of the through hole, and other screws and other connecting members can pass through the second water-cooling plate 2 and be inserted at the other end of the through hole, thereby realizing the connection between the first water-cooling plate 1 and the second water-cooling plate 2 through the second fixing member 9.

[0061] like Figure 8 As shown, the second fixing member 9 may be a rectangular block structure.

[0062] An embodiment of the second aspect of the present invention provides a testing machine. The testing machine provided by the embodiment of the second aspect of the present invention includes the above-mentioned heat dissipation structure for dissipating heat from a testing board.

[0063] The test machine provided in the second aspect of the present invention has the heat dissipation structure for heat dissipation of the test board provided in the embodiment of the first aspect of the present invention, thereby having all the beneficial effects of the heat dissipation structure for heat dissipation of the test board provided in the embodiment of the first aspect of the present invention.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation structure for testing board heat dissipation, characterized in that: The invention comprises a first water-cooling plate (1), a second water-cooling plate (2) and a plurality of single plates arranged in a stacked manner, wherein any single plate is connected to at least one other single plate via a connecting component, at least one single plate is arranged between the first water-cooling plate (1) and the second water-cooling plate (2), and the first water-cooling plate (1) and the second water-cooling plate (2) are in contact with adjacent single plates.

2. The heat dissipation structure according to claim 1, characterized in that: A water cooling pipe (3) is connected between the first water cooling plate (1) and the second water cooling plate (2), and the plates are connected in series via the water cooling pipe (3).

3. The heat dissipation structure according to claim 1, characterized in that: The plurality of single plates include a first single plate (4), a second single plate (5), a third single plate (6) and a fourth single plate (7); the first water-cooling plate (1) is sandwiched between the first single plate (4) and the second single plate (5); and the second water-cooling plate (2) is sandwiched between the third single plate (6) and the fourth single plate (7).

4. The heat dissipation structure according to claim 3, characterized in that: The first water-cooling plate (1) and the second water-cooling plate (2) both have a length direction and a width direction perpendicular to the length direction, and at least one side end of the first water-cooling plate (1) and the second water-cooling plate (2) in the width direction are connected by a first fixing member (8).

5. The heat dissipation structure according to claim 4, characterized in that: The first water-cooling plate (1) and the second water-cooling plate (2) are connected at least at one side end in the length direction via a second fixing member (9).

6. The heat dissipation structure according to claim 3, characterized in that: The connection assembly comprises a connector (10), and the first single board (4) and the second single board (5) are electrically connected via the connector (10).

7. The heat dissipation structure according to claim 6, characterized in that: The connector (10) is arranged between opposite surfaces of the first single board (4) and the second single board (5).

8. The heat dissipation structure according to claim 6, characterized in that: The connection assembly further comprises a plurality of adapter plates (011), and the third single plate (6) and the fourth single plate (7) are electrically connected to the first single plate (4) via one of the adapter plates (011), respectively.

9. The heat dissipation structure according to claim 8, characterized in that: Each adapter plate (011) is arranged at the same side end of the third single plate (6), the fourth single plate (7) and the first single plate (4).

10. A testing machine, characterized in that: The heat dissipation structure comprises the heat dissipation structure according to any one of claims 1 to 9.

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