Ultrathin high-brightness red, blue and white light-emitting diode
Through the ultra-thin high-brightness red, blue and white three-color LED structure, the flip-chip process and phosphor layer design are adopted to solve the problem of white light color deviation and realize high-brightness, low-cost and multi-purpose LED applications.
Patent Information
- Application Number
- CN202422589737.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-25
AI Technical Summary
Existing light-emitting diodes are prone to deviation when mixing white light colors, making it difficult to meet customers' white light requirements.
It adopts an ultra-thin, high-brightness red, blue, and white light-emitting diode structure, including a PCB board, a CSP white light chip, a red light chip, and a blue light chip. It is soldered through a flip-chip process and fixed with solder paste. The phosphor layer design is combined to adjust the white light color, and the phosphor is protected by the first and second adhesive layers.
It achieves accurate adjustment of white light color to meet customer needs, reduce production costs and thickness, improve white light quality, and is suitable for a variety of application scenarios.
Smart Images
Figure CN223349025U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of light emitting diodes, in particular to an ultra-thin, high-brightness, red, blue and white three-color light emitting diode. Background Art
[0002] Currently, the white light color of colorful LEDs is limited to the three primary colors of RGB. When selecting RGB chips, the brightness and wavelength of the three chips must be considered. If any of the parameters is incorrect, the mixed white light color will be biased, making it difficult to meet customer requirements for white light. Utility Model Content
[0003] In response to the shortcomings of the existing technology, the utility model provides an ultra-thin, high-brightness red, blue and white three-color light-emitting diode, which solves the problem that it is difficult to accurately adjust the color of the LED white light of the existing light-emitting diodes, and the mixed white light color easily deviates from the customer's expectations, making it difficult to meet customer requirements.
[0004] To achieve the above objectives, the present invention provides the following technical solution: an ultra-thin, high-brightness, red, blue, and white light-emitting diode, comprising a PCB board, one side of which is provided with four solder pads, and a CSP white light chip, a red light chip, and a blue light chip electrically connected to different solder pads being soldered to the PCB board;
[0005] The CSP white light chip includes a mini blue light chip, and the outer side of the mini blue light chip is covered with phosphor.
[0006] Preferably, solder paste is provided on one side of the pad, and the CSP white light chip, red light chip and blue light chip are all soldered to the pad via the solder paste.
[0007] Preferably, the thickness of the PCB board is 0.28 mm, and the aspect ratio of the PCB board is 1:1.
[0008] Preferably, the tolerance range of the thickness of the PCB board is ±0.05 mm, and the tolerance range of the length and width of the PCB board is ±0.1 mm.
[0009] Preferably, the thickness of the CSP white light chip, red light chip and blue light chip are the same, the overall thickness of the PCB board, solder paste and CSP white light chip is 0.6 mm, and the tolerance range of the overall thickness of the PCB board, solder paste and CSP white light chip is ±0.05 mm.
[0010] Preferably, a first adhesive layer in a dot array is provided on the outside of the mini blue light chip, a partition bar is fixedly connected to the outside of the first adhesive layer, phosphor covers the outside of the first adhesive layer, the thickness of the phosphor is less than the thickness of the partition bar, and a second adhesive layer fixedly connected to the partition bar is provided on the outside of the first adhesive layer, and phosphor covers the outside of the second adhesive layer.
[0011] Preferably, the CSP white light chip, red light chip and blue light chip are all flip-chip mounted on a PCB board.
[0012] Compared with the existing technology, the present invention provides an ultra-thin, high-brightness red, blue, and white light-emitting diode, which has the following beneficial effects:
[0013] 1. Through the CSP white light chip, the color of LED white light can be accurately adjusted to avoid the problem that the white light color mixed by the existing three primary colors is easily deviated from the customer's expectations, and can meet the customer's demand for a specified white light type.
[0014] 2. By setting up CSP white light chips, red light chips and blue light chips, the colorful effect of LED is achieved, which can be used in various application scenarios, such as atmosphere lights, backlighting, notebook keyboards, ultra-thin LOGOs, etc.
[0015] 3. By setting up three flip-chip CSP white light chip, red light chip and blue light chip, the production process of die bonding baking and wire bonding will be reduced compared with the traditional process, saving labor and time, and also eliminating the cost of bonding wires, effectively reducing product thickness and saving costs.
[0016] 4. By setting the first adhesive layer and the second adhesive layer, the inner and outer phosphors can cooperate to better reflect the light emitted by the chip, thereby improving the quality of white light. After long-term use, the outer phosphor falls off and the inner phosphor can continue to work, ensuring that the light-emitting diode can still emit the required white light after long-term use. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0018] Figure 1 A schematic diagram of the utility model as a whole;
[0019] Figure 2 A top view of the entire utility model;
[0020] Figure 3 It is a side view of the entire utility model;
[0021] Figure 4 This is the PIN foot diagram at the bottom of the PCB board of this utility model;
[0022] Figure 5 This is a partial cross-sectional view of the CSP white light chip of the present invention.
[0023] In the figure: 1. PCB board; 2. Solder pad; 3. CSP white light chip; 31. Mini blue light chip; 32. Phosphor; 4. Red light chip; 5. Blue light chip; 6. First adhesive layer; 7. Separator; 8. Second adhesive layer. DETAILED DESCRIPTION
[0024] The following will describe the implementation methods of the present application in detail with reference to the accompanying drawings and examples, so that the implementation process of how the present application applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.
[0025] Example 1
[0026] In order to prevent the deviation of the color of the white light produced by mixing the three primary colors, which may cause the white light of the product to not meet the customer's requirements, refer to Figure 1-Figure 4 As one embodiment of the present invention, an ultra-thin, high-brightness, red, blue, and white light-emitting diode is proposed. The invention uses a flip-chip CSP white light chip 3 to emit white light that meets customer requirements, and the color of the flip-chip CSP white light chip 3 can be adjusted according to the specific requirements of the customer. The invention comprises a PCB board 1, one side of the PCB board 1 is provided with a solder pad 2, the number of the solder pads 2 is four, and the PCB board 1 is soldered with a CSP white light chip 3, a red light chip 4, and a blue light chip 5 electrically connected to different solder pads 2. The CSP white light chip 3 includes a mini blue light chip 31, and the outer side of the mini blue light chip 31 is covered with a fluorescent When using the phosphor powder 32, first understand the type of white light required by the customer, then select the appropriate phosphor 32 and coat it on the mini blue light chip 31 to produce a flip-chip CSP white light chip 3 that meets the customer's white light requirements. Then, the CSP white light chip 3 is flip-chip soldered to the pad 2 on the PCB board 1, so that the CSP white light chip 3 is connected to the circuit on the PCB board 1, so that the required white light is emitted after power is turned on. This can accurately adjust the color of the LED white light, avoid the problem that the white light color mixed by the existing three primary colors is easily deviated from the customer's expectations, and can meet the customer's needs for a specified white light type.
[0027] This embodiment not only flips the CSP white light chip 3 on the PCB board 1, but also flips the red light chip 4 and the blue light chip 5, achieving the colorful effect of LED, which can be used in various application scenarios, such as atmosphere lighting, backlighting, notebook keyboards, ultra-thin LOGO, etc.
[0028] In order to shorten the time required for light-emitting diode production and reduce the size of the light-emitting diode, the CSP white light chip 3, red light chip 4 and blue light chip 5 in this embodiment all adopt a flip-chip process. Solder paste is provided on one side of the pad 2. The CSP white light chip 3, red light chip 4 and blue light chip 5 are all soldered to the pad 2 through the solder paste. The CSP white light chip 3, red light chip 4 and blue light chip 5 are all flip-chip mounted on the PCB board 1. When in use, the three flip-chip chips of the CSP white light chip 3, red light chip 4 and blue light chip 5 are fixed on the PCB board 1 using solder paste, and then reflow soldering is performed to fix them. Finally, they are packaged, cut, tested, etc. Compared with the traditional process of selecting upright chips, the chips are fixed to the PCB board with die-bonding glue and then baked. After baking, they need to be cleaned with a plasma cleaning machine before continuing the wire bonding process. The flip-chip structure in this embodiment will save the production process of die-bonding baking and wire bonding compared to the traditional process, saving labor and time, and also eliminating the cost of bonding wires, effectively reducing product thickness and saving costs.
[0029] In order to solder the CSP white light chip 3, red light chip 4 and blue light chip 5 on the PCB board, refer to Figure 1 and Figure 4 , a square PCB board 1 is selected to provide sufficient solder pads 2, and at the same time, the flip-chip chip is used to reduce the volume of the light-emitting diode. In this embodiment, the thickness of the PCB board 1 is correspondingly reduced. The thickness of the PCB board 1 is 0.28 mm, the aspect ratio of the PCB board 1 is 1:1, the thickness tolerance range of the PCB board 1 is ±0.05 mm, and the length and width tolerance ranges of the PCB board 1 are ±0.1 mm. The thickness of the CSP white light chip 3, the red light chip 4 and the blue light chip 5 are the same. The overall thickness of the PCB board 1, solder paste and the CSP white light chip 3 is 0.6 mm, and the overall thickness tolerance range of the PCB board 1, solder paste and the CSP white light chip 3 is ±0.05 mm. When in use, four solder pads 2 are set on the square PCB board 1, two of which are used to solder the larger CSP white light chip 3, and the other two solder pads 2 are respectively soldered to the red light chip 4 and the blue light chip 5, so as to achieve the purpose of soldering multiple colors of light-emitting chips on the PCB board 1 to provide a colorful effect.
[0030] Example 2
[0031] In order to achieve better white light quality, refer to Figure 1-Figure 5On the basis of the first embodiment, a first adhesive layer 6 in a dot array is provided on the outside of the mini blue light chip 31. A separator 7 is fixedly connected to the outside of the first adhesive layer 6. The phosphor 32 covers the outside of the first adhesive layer 6. The thickness of the phosphor 32 is less than that of the separator 7. A second adhesive layer 8 fixedly connected to the separator 7 is provided on the outside of the first adhesive layer 6. The phosphor 32 covers the outside of the second adhesive layer 8. When in use, compared with the existing method of first coating the outer side of the chip with a transparent adhesive layer and then coating the phosphor 32, the outer layer of this embodiment adopts the same combination of a transparent adhesive layer and a phosphor 32 as the existing method, and adds a dot pattern on the inner layer. The first adhesive layer 6 and a layer of phosphor 32 are arranged in an array-like manner. After the inner phosphor 32 is fixed to the chip by the first adhesive layer 6, the outer layer is wrapped by the second adhesive layer to form a protective layer. In this way, even after the phosphor 32 on the outer second adhesive layer 8 falls off after long-term use, the inner phosphor 32 can still be ensured to always remain on the chip. The cooperation between the inner and outer phosphor layers can better reflect the light emitted by the chip, thereby improving the quality of white light. After long-term use, even after the outer phosphor 32 falls off, the inner phosphor 32 can still work, ensuring that the light-emitting diode can still emit the required white light after long-term use.
[0032] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An ultra-thin, high-brightness, red, blue, and white light-emitting diode, comprising a PCB board (1), characterized in that: One side of the PCB plate (1) is provided with a soldering pad (2), the number of the soldering pads (2) being four, and a CSP white light chip (3), a red light chip (4), and a blue light chip (5) electrically connected to different soldering pads (2) are soldered on the PCB plate (1); The CSP white light chip (3) comprises a mini blue light chip (31), and the outer side of the mini blue light chip (31) is covered with phosphor (32).
2. The ultra-thin, high-brightness, red, blue, and white light-emitting diode according to claim 1, characterized in that: One side of the soldering pad (2) is provided with solder paste, and the CSP white light chip (3), red light chip (4) and blue light chip (5) are all soldered to the soldering pad (2) via the solder paste.
3. The ultra-thin, high-brightness, red, blue, and white light-emitting diode according to claim 1, characterized in that: The thickness of the PCB plate (1) is 0.28 mm, and the aspect ratio of the PCB plate (1) is 1:
1.
4. The ultra-thin, high-brightness, red, blue, and white light-emitting diode according to claim 2, characterized in that: The tolerance range of the thickness of the PCB board (1) is ±0.05 mm, and the tolerance range of the length and width of the PCB board (1) is ±0.1 mm.
5. The ultra-thin, high-brightness, red, blue, and white light-emitting diode according to claim 1, characterized in that: The thicknesses of the CSP white light chip (3), the red light chip (4) and the blue light chip (5) are the same; the overall thickness of the PCB board (1), the solder paste and the CSP white light chip (3) is 0.6 mm; and the tolerance range of the overall thickness of the PCB board (1), the solder paste and the CSP white light chip (3) is ±0.05 mm.
6. The ultra-thin, high-brightness, red, blue, and white light-emitting diode according to claim 1, characterized in that: A first adhesive layer (6) in a dot array is provided on the outside of the mini blue light chip (31); a separator bar (7) is fixedly connected to the outside of the first adhesive layer (6); phosphor powder (32) covers the outside of the first adhesive layer (6); the thickness of the phosphor powder (32) is less than the thickness of the separator bar (7); a second adhesive layer (8) fixedly connected to the separator bar (7) is provided on the outside of the first adhesive layer (6); and the phosphor powder (32) covers the outside of the second adhesive layer (8).
7. The ultra-thin, high-brightness, red, blue, and white light-emitting diode according to claim 1, characterized in that: The CSP white light chip (3), red light chip (4) and blue light chip (5) are all flip-chip mounted on the PCB board (1).