Glass powder feeding device

Abstract

The utility model discloses a glass powder feeding device which comprises a machine frame, a rotating disc is arranged on the machine frame, a plurality of wafer placing stations are arranged on the rotating disc, an installation adjusting frame is arranged on one side of the rotating disc, and a material storage disc for containing glass powder is horizontally arranged on the installation adjusting frame. A mesh area is arranged at the position, corresponding to the wafer placing station, of the middle of the material storage disc, a coating assembly moving left and right in a reciprocating mode is arranged on the installation adjusting frame, and the coating assembly is located in the material storage disc and makes contact with the surface of the material storage disc. According to the utility model, the coating assembly automatically moves to extrude the glass powder onto the wafer through the mesh area to realize powdering, after the wafer on one wafer placing station finishes powdering, the rotating disc automatically rotates to the next wafer placing station to continuously finish powdering and continuous actions, so that automatic powdering of the wafer is realized, the powdering efficiency is improved, and the production cost is reduced. And meanwhile, compared with manual powdering, the uniformity is higher, and the quality of the wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component production, and particularly relates to a glass powder loading device. Background Art

[0002] A wafer is a silicon wafer used in the manufacture of semiconductor integrated circuits. Due to its round shape, it's called a wafer. Wafers can be processed into various circuit component structures, resulting in integrated circuit products with specific electrical functions. During the wafer production process, glass frit is applied to the wafers to ensure a protective layer on the chips after dicing.

[0003] Currently, applying glass powder to wafers is mostly done manually, mixing the glass powder with water and then applying it to the wafer. However, this method is inefficient and uneven, which can easily lead to a low pass rate for electronic components. Utility Model Content

[0004] In view of the above-mentioned shortcomings, the purpose of the present invention is to provide a glass powder coating device, which solves the problem in the prior art that manual coating of glass powder is inefficient and has poor uniformity, resulting in a low qualified rate of electronic components.

[0005] In order to achieve the above purpose, the technical solution provided by the present utility model is:

[0006] A glass powder coating device comprises a frame, a rotating disk is provided on the frame, a plurality of wafer placement stations are provided on the rotating disk, a mounting and adjusting frame is provided on one side of the rotating disk, a storage tray for mounting glass powder is horizontally provided on the mounting and adjusting frame, a mesh area is provided in the middle of the storage tray corresponding to the wafer placement stations, a coating component that moves back and forth left and right is provided on the mounting and adjusting frame, and the coating component is located in the storage tray and contacts the surface of the storage tray.

[0007] With this structural design, wafers are manually placed on the wafer placement station. The rotating disk rotates to move the wafer placement station with the wafers to the corresponding mesh area below the storage tray. At this time, the coating assembly automatically moves to squeeze the glass powder through the mesh area onto the wafers to achieve powder coating. When the wafers on one wafer placement station are powdered, the rotating disk automatically rotates to the next wafer placement station to continue powder coating, in a continuous operation. This achieves automatic powder coating of the wafers, improves powder coating efficiency, and at the same time, achieves higher uniformity than manual powder coating, thereby improving wafer quality.

[0008] Preferably, a controller and a drive motor are provided in the frame, the drive motor is driven and connected to the rotating disk, and the controller is electrically connected to the drive motor for operation.

[0009] Preferably, the wafer placement station is provided with two placement grooves, the depth of the placement grooves is less than the thickness of the wafer to facilitate placement and limiting, and a plurality of vacuum adsorption holes are provided in the placement grooves to facilitate fixing the wafer.

[0010] With the above structural design, the depth of the placement groove is small, so the wafer can be limited without affecting the placement of the wafer. At the same time, the wafer is vacuum-adsorbed in the placement groove, which has good stability and will not cause damage to the wafer. The vacuum adsorption in the placement groove on each workstation can be controlled individually, making operation more convenient.

[0011] Preferably, the mounting and adjustment frame includes a vertical frame and a horizontal frame, the vertical frame is fixedly mounted on the frame, the horizontal frame is slidably mounted on the vertical frame, the horizontal frame is provided with a slide rail, the coating assembly is slidably mounted on the slide rail through a slider, and the slider is provided with a linear motor to drive the coating assembly to move back and forth left and right.

[0012] With the above structural design, the height of the coating assembly can be adjusted by moving the horizontal frame up and down. At the same time, the coating assembly is driven by a linear motor to move left and right along the horizontal frame to push the glass powder into the mesh area to coat the wafer.

[0013] Preferably, the coating assembly further comprises a mounting frame, in which an adjusting block is movably mounted, the upper end of the adjusting block is connected via a cylinder and is height-adjustable, and the lower end of the adjusting block is connected to a feeding brush.

[0014] With the above structural design, the height of the feeding brush is fine-tuned by driving the adjustment block up and down by the cylinder, thereby ensuring that the feeding brush has sufficient squeezing force to squeeze the glass powder out of the mesh area.

[0015] Preferably, the number of the feeding brushes is two, and two adjustment blocks are provided in the corresponding installation frame. The upper end of the installation frame is provided with two cylinders for adjusting the height of the feeding brushes respectively.

[0016] By adopting the above structural design and setting two sets of feeding brushes, the process of twice powdering in one movement can be realized, thereby improving the powdering efficiency and quality of the wafer.

[0017] Preferably, the feeding brush is detachably mounted on the adjusting block, wherein a holding block is provided at the lower end of the adjusting block, and a corresponding card slot is provided at the upper end of the feeding brush, and the feeding brush is mounted on the holding block by being held in the card slot.

[0018] With the above structural design, when the feeding brush is damaged and needs to be replaced after long-term use, disassembly and assembly is more convenient.

[0019] Preferably, the mesh area has a mesh size of 120 meshes, and uses tiny meshes. Under normal conditions, the glass powder mixture will not flow down from the meshes, and needs to be squeezed by a feeding brush above to be coated on the wafer. Moreover, the meshes are dense, and the glass powder has good uniformity after being coated on the wafer surface.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. The utility model moves the wafer placement station equipped with wafers to the mesh area by rotating the rotating disk. The coating assembly automatically moves to squeeze the glass powder through the mesh area onto the wafer to achieve powder coating. When the wafer on a wafer placement station is completed with powder coating, the rotating disk automatically rotates to the next wafer placement station to continue with powder coating. The continuous action realizes automatic powder coating of the wafers, improves powder coating efficiency, and at the same time, has higher uniformity than manual powder coating, thereby improving the quality of the wafers.

[0022] 2. The utility model provides two sets of feeding brushes, thereby realizing the process of two powder feedings in one movement, further improving the powder feeding efficiency and quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 It is a structural diagram of the utility model;

[0025] Figure 2 for Figure 1 Enlarged view at point A.

[0026] In the picture:

[0027] Frame 1, rotating disk 2, wafer placement station 3, placement slot 3a, vacuum adsorption hole 3b, installation and adjustment frame 4, vertical frame 4a, horizontal frame 4b, slide rail 4c, storage tray 5, mesh area 6, coating assembly 7, slider 7a, linear motor 7b, mounting frame 7c, adjustment block 7d, holding block 71d, cylinder 7e, loading brush 7f, and card slot 71f. DETAILED DESCRIPTION

[0028] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the embodiments and the accompanying drawings.

[0029] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. In the description of the present invention, it should be noted that the orientation or position relationship indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] See also Figure 1 and Figure 2 , a glass powder coating device, comprising a frame 1, in which a controller and a drive motor are provided. A rotating disk 2 is provided on the frame 1, and the drive motor drives and connects to the rotating disk 2, and the controller is electrically connected to the drive motor to work. The rotating disk 2 is provided with multiple wafer placement stations 3, and multiple wafers can be placed at the same time for processing. A mounting and adjusting frame 4 is provided on one side of the rotating disk 2, and a storage tray 5 for glass powder is horizontally provided on the mounting and adjusting frame 4. The adjusting mounting frame 4 can adjust the height of the storage tray 5 relative to the wafer placement station 3. A mesh area 6 is provided in the middle of the storage tray 5 corresponding to the wafer placement station 3, and the glass powder mixed solution installed in the storage tray 5 is squeezed out of the mesh area 6 and coated on the wafer. A coating component 7 that moves back and forth left and right is provided on the mounting and adjusting frame 4, and the coating component 7 is located in the storage tray 5 and in contact with the surface of the storage tray 5. In this embodiment, the mesh of the mesh area 6 is 120 mesh, and its aperture is small. Under normal conditions, the glass powder mixture in the storage tray 5 will not flow down. When the coating component 7 moves left and right to extrude the glass powder, the glass powder will be squeezed out of the mesh area 6 and coated on the wafer. This coating method adopts automatic coating, with low labor intensity and better uniformity.

[0031] Furthermore, the wafer placement station 3 is provided with two placement grooves 3a, the depth of the placement grooves 3a is less than the thickness of the wafer to facilitate placement and limiting, and the placement grooves 3a are provided with a plurality of vacuum adsorption holes 3b to facilitate fixing the wafer.

[0032] Specifically, the mounting and adjustment frame 4 includes a vertical frame 4a and a horizontal frame 4b. The vertical frame 4a is fixedly mounted on the frame 1, and the horizontal frame 4b is slidably mounted on the vertical frame 4a. The horizontal frame 4b is provided with a slide rail 4c. The coating assembly 7 is slidably mounted on the slide rail 4c via a slider 7a, and the slider 7a is provided with a linear motor 7b to drive the coating assembly 7 to move back and forth left and right. The horizontal frame 4a is driven up and down by a drive device (not shown) to adjust the height of the coating assembly 7. This drive method is a conventional technical solution and will not be described in detail here. The linear motor 7b drives the coating assembly 7 to move back and forth along the slide rail 4c. The up and down movement and left and right movement of the coating assembly 7 are both controlled by a controller, which is automatically controlled by a PLC control system. This PLC control system is conventional and will not be described in detail here. An infrared device is provided on one side of the rotating disk 2, which is connected to the controller to achieve precise stopping of the rotating disk 2 at the corresponding position.

[0033] Furthermore, the coating assembly 7 includes a mounting frame 7c, within which is movably mounted an adjustment block 7d. The upper end of the adjustment block 7d is connected via a cylinder 7e for height adjustment, and the lower end of the adjustment block 7d is connected to a feeding brush 7f. Two feeding brushes 7f are provided, corresponding to the two adjustment blocks 7d within the mounting frame 7c. Two corresponding cylinders 7e are located at the upper end of the mounting frame 7c for adjusting the height of the feeding brushes 7f. In this embodiment, the two feeding brushes 7f can be set at different or the same height.

[0034] The feeding brush 7f is detachably mounted on the adjustment block 7d. A holding block 71d is provided at the lower end of the adjustment block 7d, and a corresponding slot 71f is provided at the upper end of the feeding brush 7f. The feeding brush 7f is held in place on the holding block 71d via the slot 71f. Therefore, the above design facilitates replacement of the feeding brush 7f.

[0035] The working principle of this utility model is as follows:

[0036] First, pour the mixed glass powder into the storage tray 5, and adjust the height of the storage tray 5 relative to the wafer placement station 3 as needed. During operation, turn on the power, manually place the wafer on the wafer placement station 3, and fix the wafer by vacuum adsorption. The drive motor drives the rotating disk 2 to rotate until the wafer on the wafer placement station 3 is directly below the mesh area 6. The stop of the drive motor is fed back to the controller through the infrared device, and the controller controls the drive motor to stop. At this time, the wafer is in contact with the mesh area 6 or the gap is very small. During the process of the linear motor 7b driving the coating assembly 7 to move left and right, the loading brush 7f squeezes the glass powder in the storage tray 5, and the glass powder is coated on the wafer below through the mesh area 6, thereby completing the coating of the wafer. When the wafer on the wafer placement station 3 is coated, the rotating disk 2 rotates, and the next wafer placement station 3 moves to this position. The above action is repeated to complete the coating of the glass powder on the wafer. When the coated wafer moves to the manual position, the wafer can be removed.

[0037] Based on the disclosures and teachings of the above description, those skilled in the art may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and modifications and variations of the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although certain specific terms are used in this description, these terms are for convenience only and do not constitute any limitation to the present invention. Other devices that are identical or similar to the above devices are also within the scope of protection of the present invention.

Claims

1. A glass powder loading device, characterized in that: The invention comprises a frame (1), a rotating disk (2) is provided on the frame (1), a plurality of wafer placement stations (3) are provided on the rotating disk (2), a mounting and adjusting frame (4) is provided on one side of the rotating disk (2), a storage tray (5) for storing glass powder is horizontally provided on the mounting and adjusting frame (4), a mesh area (6) is provided in the middle of the storage tray (5) corresponding to the wafer placement stations (3), a coating assembly (7) which moves back and forth left and right is provided on the mounting and adjusting frame (4), and the coating assembly (7) is located in the storage tray (5) and contacts the surface of the storage tray (5).

2. A glass powder loading device according to claim 1, characterized in that: A controller and a drive motor are provided in the frame (1); the drive motor is driven and connected to the rotating disk (2); and the controller is electrically connected to the drive motor for operation.

3. The glass powder loading device according to claim 1, characterized in that: The wafer placement station (3) is provided with two placement grooves (3a), the depth of the placement grooves (3a) being less than the thickness of the wafer for easy placement and positioning, and a plurality of vacuum adsorption holes (3b) are provided in the placement grooves (3a) for easy fixation of the wafer.

4. The glass powder loading device according to claim 1, characterized in that: The mounting and adjusting frame (4) comprises a vertical frame (4a) and a horizontal frame (4b), wherein the vertical frame (4a) is fixedly mounted on the frame (1), and the horizontal frame (4b) is slidably mounted on the vertical frame (4a), and a slide rail (4c) is provided on the horizontal frame (4b), and the coating assembly (7) is slidably mounted on the slide rail (4c) via a slider (7a), and a linear motor (7b) is provided on the slider (7a) to drive the coating assembly (7) to move back and forth left and right.

5. The glass powder loading device according to claim 4, characterized in that: The coating assembly (7) also includes a mounting frame (7c), in which an adjustment block (7d) is movably mounted. The upper end of the adjustment block (7d) is connected via a cylinder (7e) and is height-adjustable. The lower end of the adjustment block (7d) is connected to a feeding brush (7f).

6. The glass powder loading device according to claim 5, characterized in that: The number of the feeding brushes (7f) is two, and two adjustment blocks (7d) are provided in the corresponding installation frame (7c). The upper end of the installation frame (7c) is correspondingly provided with two cylinders (7e) for respectively adjusting the height of the feeding brushes (7f).

7. A glass powder loading device according to claim 5 or 6, characterized in that: The feeding brush (7f) is detachably mounted on the adjusting block (7d), wherein a holding block (71d) is provided at the lower end of the adjusting block (7d), and a clamping groove (71f) is correspondingly provided at the upper end of the feeding brush (7f), and the feeding brush (7f) is clamped and mounted on the clamping block (71d) via the clamping groove (71f).

8. The glass powder loading device according to claim 1, characterized in that: The mesh size of the mesh area (6) is 120 meshes.

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