Semiconductor lead frame bending structure

Abstract

The utility model relates to the technical field of semiconductor lead frame processing, and discloses a semiconductor lead frame bending structure which comprises a base, a placing table is fixedly connected to the middle of the top end of the base, an electric push rod is fixedly connected to the bottom end of the inner wall of the placing table, and the extending end of the electric push rod is fixedly connected with a push block. The inner wall of the push block is connected with a first extension frame and a second extension frame through a first gear set so as to be used for extending the two sides of the push block, the top of the inner wall of the containing table is sleeved with a plurality of multi-layer containing frames and bending frames, and the left side of the top end of the base is fixedly connected with a supporting frame. According to the utility model, the bending frame is arranged, so that when the semiconductor lead frames with different sizes are placed on the lower placing table, the placing positions are accurate and do not deviate, the pins can be bent at different distances, and all the pins on one side of the semiconductor lead frames with different lengths and widths can be stably bent at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lead frame processing, in particular to a semiconductor lead frame bending structure. Background Art

[0002] The semiconductor lead frame is an important component used to package semiconductor chips. It is usually made of conductive materials. Its main functions are to provide electrical connections, support semiconductor chips and help dissipate heat. In order to improve its packaging performance and efficiency, its edge pins need to be bent during the production process.

[0003] At present, the commonly used method is to achieve the bending requirements of the pin part and the heat sink part on the lead frame by manual bending before the lead frame undergoes subsequent processing. Most of the angles of manual bending will have errors.

[0004] During manual bending, the position of the semiconductor lead frame is not completely straight, which may cause the edges of the pins to bend unevenly. In addition, it is difficult to bend the pins on the same side of semiconductor lead frames of different sizes together during the bending process. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor lead frame bending structure, so that semiconductor lead frames of different sizes can be stably placed on the top when placed on the placement table and pushed out a certain distance to stably accept the bending operation.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A semiconductor lead frame bending structure, comprising:

[0008] A base, wherein the middle portion of the top of the base is fixedly connected to a placing table, the bottom end of the inner wall of the placing table is fixedly connected to an electric push rod, the extended end of the electric push rod is fixedly connected to a push block, the inner wall of the push block is connected to a first extension rack and a second extension rack through a gear set 1, so as to extend both sides of the push block, and a plurality of multi-layer placing racks are sleeved on the top of the inner wall of the placing table;

[0009] The foldable frame is fixedly connected to the support frame on the left side of the top end of the base, and the left end of the foldable frame is slidably connected to the outer wall of the support frame. The inner wall of the foldable frame is rotatably connected to the second bidirectional screw rod in the front and rear directions, and the inner wall of the foldable frame is rotatably connected to the first bidirectional screw rod in the left and right directions. The left and right sides of the outer wall of the first bidirectional screw rod and the front and rear sides of the outer wall of the second bidirectional screw rod are threadedly connected to the bending plates, and both sides of the outer wall of the bending plate are slidably connected to the inner wall of the bending frame, and the inner wall of the bending plate is connected to the inner wall of the bending frame through an extension component.

[0010] Furthermore, the gear group 1 includes a micro motor fixedly connected to the front side of the inner wall of the push block, the driving end of the micro motor passes through the outer wall of the push block and is fixedly connected to the first gear, the upper side of the outer diameter of the first gear is meshed with an upper tooth plate, the top end of the upper tooth plate is fixedly connected to the inner wall of the first extension frame, the lower side of the outer diameter of the first gear is meshed with a lower tooth plate, and the bottom end of the lower tooth plate is fixedly connected to the inner wall of the second extension frame.

[0011] Furthermore, a slider is fixedly connected to the left side of the bottom end of the first extension frame and the right side of the bottom end of the second extension frame. The first extension frame and the second extension frame are slidably connected to the bottom end of the inner wall of the push block through the slider, and the upper tooth plate and the lower tooth plate are staggered front and back.

[0012] Furthermore, combination grooves are provided on all four sides of the inner walls of adjacent multi-layer racks, and combination blocks are fixedly connected to the bottoms of the four sides of the outer walls of adjacent multi-layer racks. The outer walls of one end of the outer side of the combination blocks are slidably connected to the inner walls of the combination grooves on the adjacent outer sides. The bottom end of the innermost multi-layer rack is tightly attached to the top surface of the push block, and an observation window is provided at the front end of the placement table.

[0013] Furthermore, the extension component includes a connecting rod rotatably connected to both sides of the inner wall of the bending plate, and both sides of the outer wall of the bending plate are fixedly connected to the limit frame, the top of the connecting rod passes through the outer wall of the bending plate and is fixedly connected to the second gear, and the second gear is located on the inner wall of the limit frame, the bottom end of the connecting rod on one side is fixedly connected to the first driven gear, and the bottom end of the connecting rod on the other side is fixedly connected to the second driven gear, the first driven gear is meshed with the first extension plate on the inner side of the outer diameter, and the second driven gear is meshed with the second extension plate on the outer side, and the outer ends of the outer walls of the first extension plate and the second extension plate are both slidably connected to the inner wall of the bending plate, and the inner wall of the bending frame is provided with teeth grooves, and the outer sides of the outer diameters of adjacent second gears are respectively meshed and connected to the opposite ends of the adjacent teeth grooves, and laser lights are fixedly installed on the bottom ends of the bending plates.

[0014] Furthermore, the length difference of the connecting rods on both sides is the height of the first driven gear, and the positions of the first extension plate and the second extension plate on both sides of the outer wall of the bending plate are connected to the outside, and the lower side of the inner wall of the first extension plate is slidably connected with an arc-shaped slide.

[0015] Furthermore, a linear motor is fixedly connected to the right inner wall of the support frame, and the left inner wall of the bending frame is slidably connected to the outer wall of the linear motor.

[0016] Furthermore, the front end of the second bidirectional screw rod and the right end of the first bidirectional screw rod both pass through the outer wall of the bending frame, and the second bidirectional screw rod and the first bidirectional screw rod are placed in a cross shape and have a height difference.

[0017] The utility model has the following beneficial effects:

[0018] 1. In the present invention, by setting up a multi-layer placement rack, semiconductor lead frames of different sizes can be stably placed on the top when placed on the placement table, and can be pushed out a certain distance to stably accept the bending operation, and the pins are bent neatly.

[0019] 2. In the present invention, by providing a bending rack, when semiconductor lead frames of different sizes are placed on the lower placement table, the placement position is accurate and does not shift, the pins can be bent at different distances, and all the pins on one side of semiconductor lead frames of different lengths and widths can be stably and neatly bent at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional diagram of a semiconductor lead frame bending structure proposed by the present invention;

[0021] Figure 2 This is a cross-sectional view of a placement platform for a semiconductor lead frame bending structure proposed in the present invention;

[0022] Figure 3 A half-section diagram of a push block of a semiconductor lead frame bending structure proposed by the present invention;

[0023] Figure 4 This is a schematic diagram of a multi-layer placement rack structure of a semiconductor lead frame bending structure proposed by the present invention;

[0024] Figure 5 A half-section diagram of a bending frame of a semiconductor lead frame bending structure proposed in the present invention;

[0025] Figure 6 A half-section diagram of a bending plate of a semiconductor lead frame bending structure proposed in the present invention;

[0026] Figure 7 This is a half-section view of the first extension plate of a semiconductor lead frame bending structure proposed by the present invention.

[0027] Legend:

[0028] 1. Base; 2. Placement table; 3. Observation window; 4. First bidirectional lead screw; 5. Bending frame; 6. Second bidirectional lead screw; 7. Support frame; 8. Multi-layer placement frame; 9. Linear motor; 10. Electric push rod; 11. Push block; 12. First extension frame; 13. Second extension frame; 14. First gear; 15. Upper gear plate; 16. Lower gear plate; 17. Combination groove; 18. Combination block; 19. Tooth groove; 20. Bending plate; 21. Second gear; 22. Connecting rod; 23. First driven gear; 24. First extension plate; 25. Second driven gear; 26. Second extension plate; 27. Arc slide; 28. Micro motor. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Reference Figure 1-Figure 3 The utility model provides an embodiment of a semiconductor lead frame bending structure, comprising a base 1, a placement table 2 fixedly connected to the middle of the top of the base 1, an electric push rod 10 fixedly connected to the bottom of the inner wall of the placement table 2, a push block 11 fixedly connected to the extended end of the electric push rod 10, a micro motor 28 fixedly connected to the front side of the inner wall of the push block 11 for extending both sides of the push block 11, a driving end of the micro motor 28 passes through the outer wall of the push block 11 and is fixedly connected to a first gear 14, and an upper gear plate 15 is meshed with the upper side of the outer diameter of the first gear 14. The top of the upper tooth plate 15 is fixedly connected to the inner wall of the first extension frame 12, the lower side of the outer diameter of the first gear 14 is meshed with the lower tooth plate 16, the bottom end of the lower tooth plate 16 is fixedly connected to the inner wall of the second extension frame 13, and the top of the inner wall of the placement table 2 is sleeved with multiple multi-layer placement racks 8. The left side of the bottom end of the first extension frame 12 and the right side of the bottom end of the second extension frame 13 are fixedly connected with a slider. The first extension frame 12 and the second extension frame 13 are both slidably connected to the bottom end of the inner wall of the push block 11 through the slider. The upper tooth plate 15 and the lower tooth plate 16 are staggered front and back. Figure 4 , the four sides of the inner wall of the adjacent multi-layer placement rack 8 are provided with a combination groove 17, the bottom of the four sides of the outer wall of the adjacent multi-layer placement rack 8 are fixedly connected with a combination block 18, the outer wall of one end of the outer side of the combination block 18 is slidably connected to the inner wall of the adjacent outer combination groove 17, the bottom end of the innermost multi-layer placement rack 8 is tightly attached to the top surface of the push block 11, and the front end of the placement table 2 is provided with an observation window 3;

[0031] Specifically, a controller is installed on the outer wall of the front side of the placement table 2, and the controller can control the start of the micro motor 28 and the internal electric push rod 10. The width between adjacent multi-layer placement racks 8 will be designed according to the various common size types of existing semiconductor lead frames. The sizes are all range values. It is not necessary for the frame of the semiconductor lead frame to completely cover the top of the multi-layer placement rack 8. It is only necessary to ensure that the pins are exposed. The distance extended by the first extension rack 12 and the second extension rack 13 is enough to touch the bottom of the outermost multi-layer placement rack 8. The combination block 18 is used to slide inside the combination groove 17 to prevent the adjacent multi-layer placement rack 8 brackets from sliding out. The outside of the first extension rack 12 and the second extension rack 13 are both set to the same U-shaped shape, but the difference is in the position of the internal upper tooth plate 15 and the lower tooth plate 16, so that it is convenient to directly contact the bottom of the top multi-layer placement rack 8 after sliding out.

[0032] refer to Figure 5-Figure 7 The left and right sides of the outer wall of the first and second bidirectional screw rods 6 are threadedly connected to the bending plate 20, and the two sides of the outer wall of the bending plate 20 are slidably connected to the inner wall of the bending frame 5. The connecting rod 22 on both sides of the outer wall of the bending plate 20 is fixedly connected to the limited position frame, and the top of the connecting rod 22 passes through the outer wall of the bending plate 20 and is fixedly connected to the second gear 21. The second gear 21 is located in the inner wall of the limit frame, and the bottom end of the connecting rod 22 on one side is fixedly connected to the first driven gear 23, and the bottom end of the connecting rod 22 on the other side is fixedly connected to the second driven gear 25. The inner diameter of the first driven gear 23 is meshed with the first extension plate 24. The outer diameters of the two driven gears 25 are meshed with the second extension plate 26, and the outer ends of the outer walls of the first extension plate 24 and the second extension plate 26 are both slidably connected to the inner wall of the bending plate 20. Tooth grooves 19 are opened on all four sides of the inner wall of the bending frame 5, and the outer diameters of adjacent second gears 21 are respectively meshed with the opposite ends of the adjacent tooth grooves 19. The bottom end of the bending plate 20 is fixedly installed with a laser lamp, and the length difference between the connecting rods 22 on both sides is the height of a first driven gear 23. The positions of the first extension plate 24 and the second extension plate 26 on both sides of the outer wall of the bending plate 20 are connected to the outside. The lower side of the inner wall of the first extension plate 24 is slidably connected with an arc slide 27. The right inner wall of the support frame 7 is fixedly connected to the linear motor 9, and the inner wall of the left end of the bending frame 5 is slidably connected to the outer wall of the linear motor 9. The front end of the second bidirectional screw rod 6 and the right end of the first bidirectional screw rod 4 both pass through the outer wall of the bending frame 5. The second bidirectional screw rod 6 and the first bidirectional screw rod 4 are placed crosswise and there is a height difference;

[0033] Specifically, the left and right sides of the outer wall of the first bidirectional screw rod 4 have opposite thread directions, and the front and rear sides of the outer wall of the second bidirectional screw rod 6 have opposite thread directions. The first bidirectional screw rod 4 and the second bidirectional screw rod 6 can be started separately to level the edges of the semiconductor lead frame in pairs. The arc slide 27 is pushed out of the first extension plate 24 and will slide out under the action of gravity, so that the first extension plate 24 and the second extension plate 26 below will contact the pins on the same horizontal line, which is convenient for smoother bending. When retracted, the arc surface of the arc slide 27 will squeeze the inner wall of the bending plate 20 to retract the inner wall of the first extension plate 24, and the limit frame facilitates the bending plate 20 to slide stably on the inner wall of the tooth groove 19.

[0034] Working principle: First, according to the length and width of the semiconductor lead frame of different sizes that need to be bent, the micro motor 28 is started by the external controller to drive the first gear 14 to rotate, thereby driving the upper tooth plate 15 and the lower tooth plate 16 on the upper and lower sides of the outer diameter to push the first extension frame 12 and the second extension frame 13 to slide a certain distance outward on the inner wall of the push block 11, so that the top of the push block 11 contacts the layer placement rack 8 at different positions, and observe through the observation window 3 whether the sliding distance corresponds to the size of the semiconductor frame, and then start the electric push rod 10 to push the push block 11 upward so that different numbers of multi-layer placement racks 8 are pushed out together from the inside to the outside, so that the size of the multi-layer placement rack 8 extending from the top of the placement table 2 is close to the size of the semiconductor lead frame, and then rotate the first bidirectional screw rod 4 and the second bidirectional screw rod 6 respectively to make the front and rear sides and the left and right sides of the bending plate 20 slide outward synchronously, and then through the bottom laser light Illuminate and judge whether the placement position of the semiconductor lead frame on the placement table 2 is correct. If the position is skewed, adjust it to the correct position parallel to the four sides of the placement table 2, and in the process of rotating the first bidirectional screw 4 and the second bidirectional screw 6, the bending plate 20 slides outward on the inner wall of the bending frame 5, and at the same time, the second gears 21 on both sides will start to rotate under the action of the tooth groove 19, thereby driving the connecting rod 22 to rotate, and then driving the lower first driven gear 23 and the second driven gear 25 to rotate, and through the meshing action, drive the first extension plate 24 and the second extension plate 26 to slide toward the outside of the outer wall of the bending plate 20 on both sides, thereby extending the length of both sides of the bending plate 20 to facilitate the bending operation of the pins of semiconductor lead frames of different sizes. After adjusting the position, start the linear motor 9 to drive the bending frame 5 to slide downward, so that the middle part of the bottom end of the bending frame 5 presses the center of the semiconductor lead frame, and the four-side bending plates 20 bend the edge pins.

[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor lead frame bending structure, characterized in that: include: A base (1), wherein the middle portion of the top of the base (1) is fixedly connected to a placement table (2), the bottom end of the inner wall of the placement table (2) is fixedly connected to an electric push rod (10), the extended end of the electric push rod (10) is fixedly connected to a push block (11), the inner wall of the push block (11) is connected to a first extension frame (12) and a second extension frame (13) through a gear set 1, so as to extend both sides of the push block (11), and a plurality of multi-layer placement frames (8) are sleeved on the top of the inner wall of the placement table (2); A bending frame (5), wherein the left side of the top end of the base (1) is fixedly connected to a support frame (7), the left end of the bending frame (5) is slidably connected to the outer wall of the support frame (7), the inner wall of the bending frame (5) is rotatably connected to a second bidirectional screw rod (6) in the front-back direction, the inner wall of the bending frame (5) is rotatably connected to a first bidirectional screw rod (4) in the left-right direction, the left and right sides of the outer wall of the first bidirectional screw rod (4) and the front and back sides of the outer wall of the second bidirectional screw rod (6) are both threadedly connected to bending plates (20), both sides of the outer wall of the bending plate (20) are slidably connected to the inner wall of the bending frame (5), and the inner wall of the bending plate (20) is connected to the inner wall of the bending frame (5) through an extension component.

2. The semiconductor lead frame bending structure according to claim 1, wherein: The gear set 1 includes a micro motor (28) fixedly connected to the front side of the inner wall of the push block (11), the driving end of the micro motor (28) passes through the outer wall of the push block (11) and is fixedly connected to the first gear (14), the upper side of the outer diameter of the first gear (14) is meshed with an upper tooth plate (15), the top end of the upper tooth plate (15) is fixedly connected to the inner wall of the first extension frame (12), the lower side of the outer diameter of the first gear (14) is meshed with a lower tooth plate (16), and the bottom end of the lower tooth plate (16) is fixedly connected to the inner wall of the second extension frame (13).

3. The semiconductor lead frame bending structure according to claim 2, wherein: The left side of the bottom end of the first extension frame (12) and the right side of the bottom end of the second extension frame (13) are both fixedly connected with a slider, and the first extension frame (12) and the second extension frame (13) are both slidably connected to the bottom end of the inner wall of the push block (11) through the slider, and the upper tooth plate (15) and the lower tooth plate (16) are staggered with each other front and back.

4. The semiconductor lead frame bending structure according to claim 1, wherein: Combination grooves (17) are provided on the four sides of the inner walls of the adjacent multi-layer placement racks (8), and combination blocks (18) are fixedly connected to the bottoms of the four sides of the outer walls of the adjacent multi-layer placement racks (8). The outer walls of one end of the outer side of the combination blocks (18) are slidably connected to the inner walls of the adjacent outer combination grooves (17), and the bottom end of the innermost multi-layer placement rack (8) is tightly attached to the top surface of the push block (11), and an observation window (3) is provided at the front end of the placement platform (2).

5. The semiconductor lead frame bending structure according to claim 1, wherein: The extension assembly includes a connecting rod (22) rotatably connected to both sides of the inner wall of the bending plate (20), and both sides of the outer wall of the bending plate (20) are fixedly connected to the limit frame, and the top of the connecting rod (22) passes through the outer wall of the bending plate (20) and is fixedly connected to the second gear (21), and the second gear (21) is located on the inner wall of the limit frame. The bottom end of the connecting rod (22) on one side is fixedly connected to the first driven gear (23), and the bottom end of the connecting rod (22) on the other side is fixedly connected to the second driven gear (25). The first The inner side of the outer diameter of the driven gear (23) is meshedly connected to the first extension plate (24), the outer diameter of the second driven gear (25) is meshedly connected to the second extension plate (26), the outer ends of the outer walls of the first extension plate (24) and the second extension plate (26) are slidably connected to the inner wall of the bending plate (20), and tooth grooves (19) are provided on four sides of the inner wall of the bending frame (5), and the outer sides of the outer diameters of adjacent second gears (21) are respectively meshedly connected to the opposite ends of adjacent tooth grooves (19), and a laser lamp is fixedly installed at the bottom end of each bending plate (20).

6. The semiconductor lead frame bending structure according to claim 5, characterized in that: The length difference between the connecting rods (22) on both sides is the height of the first driven gear (23), and the positions of the first extension plate (24) and the second extension plate (26) on both sides of the outer wall of the bending plate (20) are connected to the outside, and the lower side of the inner wall of the first extension plate (24) is slidably connected with an arc-shaped slide plate (27).

7. The semiconductor lead frame bending structure according to claim 1, wherein: The right inner wall of the support frame (7) is fixedly connected to a linear motor (9), and the left inner wall of the bending frame (5) is slidably connected to the outer wall of the linear motor (9).

8. The semiconductor lead frame bending structure according to claim 1, wherein: The front end of the second bidirectional screw rod (6) and the right end of the first bidirectional screw rod (4) both pass through the outer wall of the bending frame (5), and the second bidirectional screw rod (6) and the first bidirectional screw rod (4) are placed in a cross shape and have a height difference.

Images