Taper-free laser cutting and drilling machining device
By combining a laser processing device with a trapezoidal adjustment lens and a focusing mirror, the problem of taper control in deep micro-hole processing by the laser processing device is solved, and high-precision cutting and drilling without taper is achieved.
Patent Information
- Application Number
- CN202422620412.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-10-29
AI Technical Summary
Existing laser processing devices are prone to forming tapers when processing deep microholes, which increases the difficulty of subsequent processing and makes it difficult to achieve taper-free laser cutting and drilling.
A device including a laser component, a rotation module, an adjustment lens, a focusing component and a displacement platform is used. By combining a trapezoidal adjustment lens and a focusing mirror, the angle of the laser beam and the movement of the displacement platform are controlled by the rotation module to achieve taper-free cutting and drilling.
It realizes high-precision processing of taper-free laser cutting and drilling, ensuring the quality of cutting and drilling.
Smart Images
Figure CN223353256U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser processing equipment, in particular to a processing device for non-taper laser cutting and drilling. Background Art
[0002] Compared with other drilling methods, laser drilling has significant advantages such as large drilling depth-to-diameter ratio, no contact, no tool loss, fast processing speed, small surface deformation, and the ability to process various materials. It can well meet the requirements of modern industrial product processing and is widely used in key components of high-precision and cutting-edge products such as aerospace, electronic instruments and medical devices.
[0003] When laser processing microholes with a large aspect ratio, the distribution characteristics of the laser energy will lead to a material removal rate that is larger in the middle and smaller on both sides, resulting in a taper in the hole at the initial stage of hole formation, with the top larger and the bottom smaller. Once the taper is formed, when the subsequent laser is incident on the hole wall, a large amount of reflection will be generated due to the sharp increase in the incident angle, making it difficult to further remove the tapered side wall material, resulting in further increased difficulty in deep microhole processing. Therefore, the taper control of the hole shape has always been the difficulty in deep microhole processing.
[0004] A laser cutting and drilling device is needed that is convenient for processing non-tapered holes. Utility Model Content
[0005] The technical problem to be solved by the utility model is to provide a non-taper laser cutting and drilling processing device which has a reasonable structure and is easy to operate.
[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is: a processing device for taperless laser cutting and drilling, including a laser component, a rotation module, an adjustment lens, a focusing component and a displacement platform, the laser component is used to output a laser beam, the adjustment lens, the focusing component and the displacement platform are arranged in sequence along the optical path, the rotation module is used to drive the adjustment lens to rotate around the optical axis of the input light, the laser beam passes through the adjustment lens to become a processing laser beam, the focusing component is used to focus the processing laser beam on the workpiece to be processed, and the displacement platform is used to drive the workpiece to be processed to move in the vertical direction.
[0007] Furthermore, the adjustment lens is a trapezoidal adjustment lens, which includes an incident surface and an exit surface. The incident surface is one side surface of the trapezoidal adjustment lens, and the exit surface is the other side surface of the trapezoidal adjustment lens.
[0008] Furthermore, the included angle between the incident surface and the bottom surface of the trapezoidal adjustment lens is a first bottom angle, and the included angle between the exit surface and the bottom surface of the trapezoidal adjustment lens is a second bottom angle, wherein the first bottom angle is smaller than the second bottom angle.
[0009] Furthermore, the angle of the second base angle is β, 0°<β<90°.
[0010] Furthermore, the laser assembly includes a laser, a first reflector, a second reflector and a third reflector, and the first reflector, the second reflector and the third reflector are arranged in sequence along the optical path.
[0011] Furthermore, the laser is a continuous laser or a pulsed laser.
[0012] Furthermore, the focusing assembly includes a focusing lifting module and a focusing mirror. The focusing lifting module is arranged below the rotating module, and the focusing lifting module is used to lift the focusing mirror.
[0013] Furthermore, it also includes a control module, which is connected to the laser component, the rotation module, the focusing component and the displacement platform respectively.
[0014] Furthermore, the rotation module includes a drive motor, and the drive motor is a stepper motor or a Hall motor.
[0015] Furthermore, the displacement platform is a three-axis displacement platform.
[0016] The beneficial effect of the utility model is that it provides a taper-free laser cutting and drilling processing device with a reasonable structure and easy operation. The device can control the taper of the cutting surface by combining a rotatable trapezoidal lens with a focusing mirror. In conjunction with the displacement platform, it can achieve vertical cutting of the device to be processed, thereby effectively ensuring the quality of cutting and drilling. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The specific structure of the utility model is described in detail below with reference to the accompanying drawings:
[0018] Figure 1 This is a schematic diagram of the overall structure of the processing device of the present utility model;
[0019] Figure 2 This is a schematic diagram of the processing device of the present invention when the adjustment lens is at 0°;
[0020] Figure 3 This is a schematic diagram of the state of the processing device of the present invention when the adjustment lens is rotated 180° along the optical axis of the input light;
[0021] Figure 4 This is a schematic diagram of the processing device of the present invention in a processing state;
[0022] 101 - laser; 201 - first reflector; 202 - second reflector; 203 - third reflector; 301 - adjustment lens; 401 - focusing lens; 501 - workpiece to be processed; 511 - first processing hole; 512 - second processing hole; 601 - displacement platform; 701 - control computer. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.
[0026] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0027] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0028] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.
[0029] Example
[0030] See also Figures 1 to 4 This embodiment provides a processing device for taperless laser cutting and drilling, including a laser assembly, a rotation module, an adjustment lens, a focusing assembly, and a displacement platform. The laser assembly is used to output a laser beam, and the adjustment lens, focusing assembly, and displacement platform are arranged in sequence along the optical path. The rotation module is used to drive the adjustment lens to rotate around the optical axis of the input light. The laser beam passes through the adjustment lens to become a processing laser beam. The focusing assembly is used to focus the processing laser beam on a workpiece to be processed. The displacement platform is used to drive the workpiece to be processed to move axially along the optical axis of the input light.
[0031] In this embodiment, the laser assembly includes a laser 101, a first reflector 201, a second reflector 202, and a third reflector 203. The first reflector 201, the second reflector 202, and the third reflector 203 are arranged sequentially along the optical path. The laser 101 has a built-in beam expander that can directly emit a parallel light beam. The parallel light beam passes through the first reflector 201, the second reflector 202, and the third reflector 203 to obtain a laser beam output in a desired direction. The laser 101 can be a continuous laser or a pulsed laser. Both continuous lasers and pulsed lasers can generate high-energy laser beams for cutting materials. The type and parameters of the laser can be adjusted and adapted according to different objects to be processed.
[0032] The output laser beam enters the adjustment lens 301 along the optical axis of the input light of the adjustment lens 301 , and is refracted and reflected by the adjustment lens 301 to form a processing laser beam. The processing laser beam forms a certain angle with the optical axis of the input light.
[0033] Preferably, the adjustment lens 301 is a trapezoidal adjustment lens, comprising an incident surface and an exit surface. The incident surface is one side of the trapezoidal adjustment lens, and the exit surface is the other side of the trapezoidal adjustment lens. A laser beam enters the interior of the trapezoidal adjustment lens from the incident surface along the optical axis of the input light, is refracted to the bottom surface of the trapezoidal adjustment lens, is then totally reflected to the exit surface, and is refracted again out of the trapezoidal adjustment lens to form the desired processing laser beam.
[0034] To ensure that a processing laser beam in a desired direction is obtained, the angle between the incident surface and the bottom surface of the trapezoidal adjustment lens is a first base angle, and the angle between the exit surface and the bottom surface of the trapezoidal adjustment lens is a second base angle, wherein the first base angle is smaller than the second base angle. Preferably, the second base angle is β, where 0°<β<90°.
[0035] It should be noted that the wavelength of the laser, the refractive index of the adjustment lens 301, and the two bottom angles of the trapezoidal adjustment lens affect each other. Different laser wavelengths and the refractive index of the adjustment lens 301 simultaneously affect the two bottom angles of the trapezoidal adjustment lens. There is no limitation on the wavelength of the laser, the refractive index of the adjustment lens 301, and the two bottom angles of the trapezoidal adjustment lens.
[0036] The use of a single trapezoidal adjustment lens can simplify the structure of the adjustment lens 301, making it easier for the rotation module to drive the adjustment lens to rotate, thereby improving processing accuracy.
[0037] The focusing assembly specifically includes a focusing lifting module and a focusing mirror 401. The focusing lifting module is disposed below the rotating module and is used to lift the focusing mirror 401. The focusing lifting module lifts the focusing mirror 401 to focus the processing laser beam.
[0038] The machining laser beam is focused by the focusing assembly to produce a focused laser beam. The angle of the focused laser beam determines the taper of the machined hole. When the focused laser beam is applied to the workpiece 501 at a certain angle, with the focal point of the focused laser beam located within the workpiece 501, a machined hole is formed in the workpiece 501.
[0039] At this point, the rotation module drives the adjustment lens to rotate about the input light axis, thereby forming a circular machining hole with the desired taper on the workpiece 501. Preferably, the rotation module includes a drive motor, which can be a stepper motor or a Hall effect motor. The stepper motor or Hall effect motor can precisely control the rotation speed of the adjustment lens to achieve high-precision machining without taper.
[0040] When the adjustment lens 301 is at 0°, the focused laser beam can form a first processing hole 511 on the left side of the hole to be processed of the workpiece 501 to be processed. When the adjustment lens 301 is at 180°, the focused laser beam can form a second processing hole 512 on the right side of the hole to be processed of the workpiece 501 to be processed. Therefore, when the adjustment lens 301 rotates, the focused laser beam can perform laser ring cutting at the hole to be processed of the workpiece 501 to be processed, thereby obtaining a ring-shaped processing hole with an expected taper.
[0041] In order to drill the required through hole at the hole to be processed of the workpiece 501, the displacement platform 601 is a three-axis displacement platform, which can move along the three directions of X-axis, Y-axis and Z-axis, wherein the X-axis, Y-axis and Z-axis are perpendicular to each other, and the Z-axis is consistent with the direction of the input light axis.
[0042] The three-axis displacement platform can be used to drive the workpiece to be processed to move along the X-axis and Y-axis directions to locate different drilling positions. The three-axis displacement platform can be used to drive the workpiece to be processed 501 to move along the Z-axis toward the focusing mirror 401. Finally, the focused laser beam is used to form a processing through hole with an expected taper on the workpiece to be processed 501, wherein the central axis of the processing through hole is consistent with the optical axis of the input light.
[0043] In order to make the various components work together to achieve high-precision cutting or drilling, the processing device also includes a control module, which is connected to the laser assembly, rotation module, focusing assembly and displacement platform respectively. Preferably, the control module is a control computer 701.
[0044] The specific steps are:
[0045] The control computer 701 controls the operation of the laser 101. The laser beam is reflected by the first reflector 201, the second reflector 202 and the third reflector 203 to obtain a laser beam traveling along the optical axis of the input light. The laser beam enters the interior of the adjustment lens 301 from the incident surface, is refracted for the first time, and is emitted to the bottom surface of the adjustment lens 301. It is totally reflected by the bottom surface of the adjustment lens 301 to the exit surface of the adjustment lens 301, and is emitted from the adjustment lens 301 after the second refraction to obtain a processing laser beam. The control computer 701 controls the focusing lifting module of the focusing assembly to lift the focusing mirror 401 to focus the processing laser beam to obtain a focused laser beam. The focused laser beam acts on the workpiece 501 to be processed at a certain angle, and the focus of the focused laser beam is located inside the workpiece 501 to form a processing hole on the workpiece 501. The control computer 701 controls the rotation module to drive the adjustment lens 301 to rotate about the input light axis, achieving laser circular cutting, thereby forming a circular processing hole with the desired taper on the workpiece 501. While the rotation module drives the adjustment lens to rotate about the input light axis, the control computer 701 controls the displacement platform 601 to drive the workpiece 501 upward along the input light axis, gradually bringing the workpiece 501 closer to the focusing lens 401, ultimately forming a processing hole with the desired taper.
[0046] From the above description, it can be seen that the beneficial effect of the utility model is that it provides a taper-free laser cutting and drilling processing device with a reasonable structure and easy operation. The device can control the taper of the cutting surface by combining a rotatable trapezoidal lens with a focusing mirror. In conjunction with the displacement platform, it can achieve vertical cutting of the device to be processed, thereby effectively ensuring the quality of cutting and drilling.
[0047] It is easy for those skilled in the art to understand that the above embodiments can be freely combined and superimposed without conflict.
[0048] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A processing device for non-taper laser cutting and drilling, characterized in that: The laser device comprises a laser assembly, a rotation module, an adjustment lens, a focusing assembly and a displacement platform. The laser assembly is used to output a laser beam. The adjustment lens, the focusing assembly and the displacement platform are sequentially arranged along the optical path. The rotation module is used to drive the adjustment lens to rotate around the optical axis of the input light. The laser beam passes through the adjustment lens to become a processing laser beam. The focusing assembly is used to focus the processing laser beam on the workpiece to be processed. The displacement platform is used to drive the workpiece to be processed to move in the vertical direction.
2. The taperless laser cutting and drilling processing device according to claim 1, characterized in that: The adjustment lens is a trapezoidal adjustment lens, which includes an incident surface and an exit surface. The incident surface is one side surface of the trapezoidal adjustment lens, and the exit surface is the other side surface of the trapezoidal adjustment lens.
3. The taperless laser cutting and drilling processing device according to claim 2, characterized in that: The included angle between the incident surface and the bottom surface of the trapezoidal adjustment lens is a first bottom angle, and the included angle between the exit surface and the bottom surface of the trapezoidal adjustment lens is a second bottom angle, wherein the first bottom angle is smaller than the second bottom angle.
4. The taperless laser cutting and drilling processing device according to claim 3, characterized in that: The second base angle is β, 0°<β<90°.
5. The taperless laser cutting and drilling processing device according to claim 1, characterized in that: The laser assembly includes a laser, a first reflector, a second reflector and a third reflector, wherein the first reflector, the second reflector and the third reflector are arranged in sequence along the optical path.
6. The taperless laser cutting and drilling processing device according to claim 5, characterized in that: The laser is a continuous laser or a pulsed laser.
7. The taperless laser cutting and drilling processing device according to claim 1, characterized in that: The focusing assembly includes a focusing lifting module and a focusing mirror. The focusing lifting module is arranged below the rotating module, and is used to lift the focusing mirror.
8. The taperless laser cutting and drilling processing device according to claim 1, characterized in that: It also includes a control module, which is connected to the laser component, the rotation module, the focusing component and the displacement platform respectively.
9. The taperless laser cutting and drilling processing device according to claim 1, characterized in that: The rotation module includes a driving motor, which is a stepping motor or a Hall motor.
10. The taperless laser cutting and drilling processing device according to claim 1, characterized in that: The displacement platform is a three-axis displacement platform.