Positioning assembly and laser drilling machine

Abstract

The utility model discloses a positioning assembly and a laser drilling machine, the positioning assembly comprises a workbench, the end face of the workbench is respectively provided with a plurality of first adsorption holes and a plurality of second adsorption holes in a penetrating mode; the surface of one side of the base plate is tightly attached to the end face of the workbench, the surface of the other side of the base plate is used for bearing the circuit board, a plurality of receding holes are formed in the end face of the base plate in a penetrating mode, and the receding holes correspond to the first adsorption holes in position one to one; wherein the second adsorption hole is used for adsorbing and fixing the base plate, and the first adsorption hole can be communicated with the clearance hole so as to adsorb and fix the circuit board. The laser is effectively isolated from the working table, the service life of the working table is remarkably prolonged, the production cost is reduced, the defective product rate is reduced, the production efficiency and the drilling precision are improved, the maintenance process is simplified, and wide applicability and flexibility are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a positioning component and a laser drilling machine with the positioning component. Background Art

[0002] With the rapid development of electronic technology, printed circuit boards (PCBs), a crucial component of electronic devices, are subject to increasingly stringent manufacturing requirements for precision and quality. Laser drilling technology, particularly in the manufacture of high-density interconnect (HDI) and multilayer PCBs, is widely used due to its high precision and efficiency. However, the problem of work surface burns during laser drilling seriously impacts production efficiency and product quality. Therefore, effectively preventing these burns has become a pressing technical challenge.

[0003] Currently, when laser drilling PCBs are processed, the machine features a fixed work surface, upon which the PCB is placed for laser drilling. In related art, the work surface is designed with numerous holes, and a vacuum pump is connected beneath the holes. This vacuum secures the PCB to the surface, preventing displacement during the drilling process. However, laser drilling is generally divided into two types: blind vias, where the laser penetrates only a portion of the PCB layer, and X-shaped vias, where blind vias are drilled at the same location, one from each side. The two blind vias overlap to form a hole that penetrates both sides. X-shaped vias are commonly used in the core layer of HDI boards. However, when drilling X-shaped vias, the laser drills holes from both sides, potentially causing burns to the work surface. This is particularly problematic for plastic work surfaces, where laser burns are more severe. Once the work surface is severely burned, it must be replaced, which not only increases production costs but also affects efficiency. To prevent burns on the work surface, some new laser drilling machines use aluminum or stainless steel as the work surface. These materials have high heat resistance and burn resistance. However, these materials are expensive and still have certain limitations in practical use. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a positioning assembly that effectively isolates the laser from the workbench, significantly extending the workbench's service life, reducing production costs, lowering defective product rates, improving production efficiency and drilling accuracy, simplifying maintenance, and possessing wide applicability and flexibility.

[0005] The utility model also provides a laser drilling machine with the above positioning component.

[0006] A positioning assembly according to the present invention includes:

[0007] A workbench, wherein the end surface of the workbench is respectively provided with a plurality of first adsorption holes and a plurality of second adsorption holes;

[0008] A pad, one side of which is closely attached to the end surface of the workbench and the other side of which is used to support the circuit board. The end surfaces of the pad are respectively provided with a plurality of air-avoidance holes, and the air-avoidance holes are arranged in a one-to-one correspondence with the positions of the first adsorption holes.

[0009] The second adsorption hole is used to adsorb and fix the pad, and the first adsorption hole can be connected to the air-avoiding hole to adsorb and fix the circuit board.

[0010] According to the positioning assembly of the utility model, there are at least the following beneficial effects:

[0011] 1. Effectively isolate the laser from the workbench: The design of the pad prevents the laser from directly irradiating the workbench during the drilling process. In this way, the workbench will not be burned even when drilling X-shaped holes, thereby extending the service life of the workbench.

[0012] 2. Improve the fixing stability of the circuit board: The alignment design of the first adsorption hole and the air-avoidance hole ensures the stability and fixing effect of the circuit board during the drilling process. Through vacuum adsorption, the circuit board is firmly fixed on the pad, reducing the defective rate caused by displacement.

[0013] 3. Flexible adsorption hole layout: The design of the first adsorption hole and the second adsorption hole enables the pad to be firmly fixed on the workbench. At the same time, the connection design of the first adsorption hole and the air avoidance hole ensures that the circuit board can obtain uniform adsorption force at different positions, thereby improving the accuracy and stability of drilling.

[0014] 4. Easy to maintain and replace: The pad can be replaced regularly without frequently replacing the entire workbench, which not only reduces maintenance costs, but also reduces downtime caused by damage to the workbench and improves production efficiency.

[0015] 5. Wide range of applications: The design of the pad can be adjusted according to the size and shape of different circuit boards. It is suitable for various types of circuit boards and has strong adaptability.

[0016] According to a positioning assembly described in some embodiments of the present invention, the first adsorption holes and the second adsorption holes are arranged in an alternating manner.

[0017] According to a positioning assembly described in some embodiments of the present invention, in a linear direction, the first adsorption holes and the second adsorption holes are equidistantly and staggeredly arranged.

[0018] According to a positioning assembly described in some embodiments of the present invention, the diameter of the first adsorption hole is equal to the diameter of the second adsorption hole.

[0019] According to a positioning assembly described in some embodiments of the present invention, the diameters of the air avoidance hole, the first adsorption hole, and the second adsorption hole are all equal.

[0020] According to a positioning assembly described in some embodiments of the present invention, an alignment structure is provided between the pad and the workbench to drive the air avoidance hole to be aligned with the first adsorption hole.

[0021] According to a positioning assembly described in some embodiments of the present invention, the cross-sections of the workbench and the pad are both square.

[0022] According to a positioning assembly described in some embodiments of the present invention, the length of the workbench is equal to the length of the pad.

[0023] According to a positioning assembly described in some embodiments of the present invention, the width of the workbench is equal to the width of the pad.

[0024] The laser drilling machine according to the utility model includes a positioning component according to the utility model.

[0025] The laser drilling machine according to the utility model has at least the following beneficial effects: by integrating the above-mentioned positioning components, the overall performance of the laser drilling machine is significantly improved, among which the effective isolation design of the positioning components significantly reduces the risk of burns on the workbench, extends the service life of the workbench, and reduces maintenance and replacement costs; secondly, the optimized layout of the pad and adsorption holes improves the fixing stability and drilling accuracy of the PCB, reduces the defective rate caused by displacement, and further improves production efficiency; in addition, the alignment structure and consistent aperture design ensure the convenience of installation and uniform distribution of adsorption force, simplify the operation process, and reduce debugging and maintenance time; finally, the square cross-section design and the matching of length and width enable the pad to completely cover the workbench, avoiding the problems of light leakage at the edge and insufficient adsorption force, and improving the reliability and aesthetics of the equipment.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0028] Figure 1This is a cross-sectional view of a positioning assembly according to an embodiment of the present utility model;

[0029] Figure 2 This is an exploded view of a positioning component according to an embodiment of the present utility model.

[0030] Description of Figure Numbers:

[0031] Workbench 100; first adsorption hole 101; second adsorption hole 102;

[0032] Pad 200; air-avoiding hole 201;

[0033] Circuit board 300. DETAILED DESCRIPTION

[0034] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0035] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0036] In the description of this utility model, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0037] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0038] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0039] With the rapid development of electronic technology, printed circuit boards (PCBs), a crucial component of electronic devices, are subject to increasingly stringent manufacturing requirements for precision and quality. Laser drilling technology, particularly in the manufacture of high-density interconnect (HDI) and multilayer PCBs, is widely used due to its high precision and efficiency. However, the problem of work surface burns during laser drilling seriously impacts production efficiency and product quality. Therefore, effectively preventing these burns has become a pressing technical challenge.

[0040] Currently, when laser drilling PCBs are processed, the machine features a fixed work surface, upon which the PCB is placed for laser drilling. In related art, the work surface is designed with numerous holes, and a vacuum pump is connected beneath the holes. This vacuum secures the PCB to the surface, preventing displacement during the drilling process. However, laser drilling is generally divided into two types: blind vias, where the laser penetrates only a portion of the PCB layer, and X-shaped vias, where blind vias are drilled at the same location, one from each side. The two blind vias overlap to form a hole that penetrates both sides. X-shaped vias are commonly used in the core layer of HDI boards. However, when drilling X-shaped vias, the laser drills holes from both sides, potentially causing burns to the work surface. This is particularly problematic for plastic work surfaces, where laser burns are more severe. Once the work surface is severely burned, it must be replaced, which not only increases production costs but also affects efficiency. To prevent burns on the work surface, some new laser drilling machines use aluminum or stainless steel as the work surface. These materials have high heat resistance and burn resistance. However, these materials are expensive and still have certain limitations in practical use.

[0041] For this reason, Figure 1 and Figure 2As shown, a positioning assembly proposed by the present invention includes a workbench 100 and a pad 200, one side surface of the pad 200 is tightly arranged on the end face of the workbench 100, and the other side surface is used to support the circuit board 300. Specifically, the end face of the workbench 100 is respectively penetrated with a plurality of first adsorption holes 101 and a plurality of second adsorption holes 102, and the end face of the pad 200 is respectively penetrated with a plurality of air-avoidance holes 201, and the positions of the air-avoidance holes 201 and the first adsorption holes 101 are arranged in a one-to-one correspondence. In some applications, the second adsorption holes 102 are used to adsorb and fix the pad 200, and the first adsorption holes 101 can be connected to the air-avoidance holes 201 to adsorb and fix the circuit board 300. It is easy to understand that the design of the pad 200 effectively isolates the direct contact between the laser and the workbench 100. When performing laser drilling, especially X-shaped hole drilling, the laser will not directly irradiate the workbench 100, which greatly reduces the risk of burns to the workbench 100, extends the service life of the workbench 100, and reduces the cost of frequent replacement due to damage to the workbench 100. Secondly, the use of the pad 200 improves the fixing stability of the circuit board 300. Through the alignment design of the first adsorption hole 101 and the air avoidance hole 201, the circuit board 300 is firmly fixed on the pad 200 during the drilling process, reducing the defective rate due to displacement and improving the accuracy and quality of drilling. In addition, the design of the second adsorption hole 102 ensures that the pad 200 itself can also be firmly fixed on the workbench 100, further enhancing the overall stability. Finally, the replaceability of the pad 200 makes maintenance easier, reduces downtime caused by damage to the workbench 100, and improves production efficiency. In summary, the present invention not only solves the problem in the prior art that the workbench 100 is easily burned during the laser drilling process, but also significantly improves production efficiency and drilling accuracy, and reduces production costs.

[0042] In some embodiments of the present invention, Figure 1 and Figure 2As shown, the first adsorption holes 101 and the second adsorption holes 102 are staggered to ensure uniform distribution of adsorption force across the entire workbench 100, avoiding the problem of insufficient or excessive local adsorption force, thereby improving the fixation stability and flatness of the circuit board 300. Secondly, this design enhances the fixation effect of the circuit board 300 and the backing plate 200, especially when performing high-precision drilling, providing more reliable support and reducing displacement and deformation caused by unstable fixation. In addition, the evenly distributed adsorption holes help maintain the stability of the circuit board 300 during the drilling process, improve the accuracy and consistency of the drilling, further reduce the defective rate, and improve production efficiency. This not only improves the adsorption effect, but also enhances the stability and reliability of the overall system. Specifically, in the linear direction, the first adsorption holes 101 and the second adsorption holes 102 are staggered, which can be staggered in a single direction or in two directions on the plane. For example, in the longitudinal direction of the workbench 100, the first adsorption holes 101 and the second adsorption holes 102 are staggered. For example, in the length direction and width direction of the workbench, the first adsorption holes and the second adsorption holes are staggered, that is, the first adsorption hole is surrounded by the second adsorption holes, and the second adsorption hole is surrounded by the first adsorption holes (not shown in the figure). Furthermore, in the linear direction, the first adsorption holes 101 and the second adsorption holes 102 are staggered at equal intervals, which further improves the uniformity and stability of the adsorption force and avoids the problem of insufficient or excessive local adsorption force due to uneven spacing between the adsorption holes. Secondly, the evenly distributed adsorption holes after equal spacing help maintain the flatness and stability of the circuit board 300 during the drilling process, improve the accuracy and consistency of drilling, further reduce the defective rate, and improve production efficiency. In addition, the equidistant arrangement of the first adsorption holes 101 and the second adsorption holes 102 is also conducive to the convenience of processing and manufacturing the workbench 100. Further, referring to Figure 1 and Figure 2, the diameter of the first adsorption hole 101 is equal to the diameter of the second adsorption hole 102, which further simplifies the manufacturing process and can be processed using drilling tools of the same specification, reducing manufacturing costs and production difficulty. In addition, in some embodiments, the diameter of the air-avoiding hole 201 is also equal to the diameter of the first adsorption hole 101, which makes the adsorption system more stable, reduces the debugging and maintenance time caused by different pore sizes, and improves production efficiency. It is easy to understand that the design of the same pore size of the air-avoiding hole 201, the first adsorption hole 101 and the second adsorption hole 102 ensures a high consistency of adsorption force, avoids the difference in adsorption force caused by different pore sizes, thereby improving the fixing stability and drilling accuracy of the circuit board 300. Secondly, the consistent pore size design simplifies the design and manufacturing process, reduces manufacturing errors, and improves product reliability and consistency. In addition, the uniform pore size distribution makes the debugging and maintenance of the adsorption system more convenient, reduces the complex operations caused by different pore sizes, and improves production efficiency. In some manufacturing processes, the workbench 100 is provided with 16*16 through holes, and the pad 200 is provided with 16*8 through holes. Correspondingly, half of the through holes on the workbench 100 are first adsorption holes 101, and correspond to the through holes on the pad 200. Conversely, the other half of the through holes on the workbench 100 are second adsorption holes 102, which are used to adsorb and fix the pad 200.

[0043] Furthermore, in some embodiments of the present invention, an alignment structure is provided between the pad 200 and the workbench 100 to drive the air-avoidance hole 201 to be aligned with the first adsorption hole 101. It is easy to understand that the alignment structure ensures that the air-avoidance hole 201 on the pad 200 is precisely aligned with the first adsorption hole 101 on the workbench 100, thereby avoiding the problems of uneven adsorption force and unstable fixation of the circuit board 300 due to inaccurate alignment. Secondly, precise alignment improves the stability and flatness of the circuit board 300 during the drilling process, thereby improving the accuracy and consistency of drilling and reducing the defective rate. In addition, the alignment structure simplifies the installation process of the pad 200, reduces the time and error of manual alignment, and improves installation efficiency and production efficiency. Optionally, refer to Figure 2In some embodiments of the present invention, the cross-sections of the workbench 100 and the pad 200 are both square, providing a larger contact area, enhancing the stability between the pad 200 and the workbench 100, and reducing the problem of unstable fixation caused by irregular shapes. In addition, the square design facilitates processing and installation, reduces the complexity of manufacturing and assembly, and improves production efficiency and product reliability. In addition, the square cross-sectional design makes the overall structure more regular, improves the aesthetics and professionalism of the equipment, and also facilitates maintenance and inspection by operators. In some embodiments, the length of the workbench 100 is equal to the length of the pad 200, so that the workbench 100 and the pad 200 can be aligned side by side on the long side. In some embodiments, the width of the workbench 100 is equal to the width of the pad 200, so that the workbench 100 and the pad 200 can be aligned side by side on the short side. In some embodiments, the horizontal cross-sections of the workbench 100 and the pad 200 are both square, and their length and width are equal. It should be noted that, on the one hand, the design of the workbench 100 and the pad 200 being equal in length and width ensures that the pad 200 completely covers the workbench 100, avoids the problems of light leakage and insufficient adsorption force at the edge, and improves the fixing effect and stability of the circuit board 300. On the other hand, the full coverage design not only reduces material waste and improves material utilization, thereby reducing production costs, but also makes the fixation of the circuit board 300 more uniform and stable during the drilling process, reduces the defective rate caused by light leakage at the edges, and further improves production efficiency and drilling accuracy. In addition, the design of equal length and width makes the alignment between the pad 200 and the workbench 100 more accurate and convenient, reduces the alignment error during the installation process, and improves installation efficiency. This design also makes the overall structure more regular and compact, improves the aesthetics and professionalism of the equipment, and is also convenient for operators to perform maintenance and inspection.

[0044] According to the embodiment of the present invention, the laser drilling machine includes a positioning assembly according to the embodiment of the present invention. By integrating the above-mentioned positioning assembly, the overall performance of the laser drilling machine is significantly improved. Among them, the effective isolation design of the positioning assembly significantly reduces the risk of burns on the workbench 100, extends the service life of the workbench 100, and reduces maintenance and replacement costs; secondly, the optimized layout of the pad 200 and the adsorption holes improves the fixing stability and drilling accuracy of the PCB, reduces the defective rate caused by displacement, and further improves production efficiency; in addition, the alignment structure and consistent aperture design ensure the convenience of installation and the uniform distribution of adsorption force, simplify the operation process, and reduce debugging and maintenance time; finally, the square cross-section design and the matching of length and width enable the pad 200 to completely cover the workbench 100, avoiding the problems of light leakage at the edge and insufficient adsorption force, and improving the reliability and aesthetics of the equipment.

[0045] Other structures and operations of the laser drilling machine according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0046] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A positioning component, characterized in that: include: A workbench, wherein the end surface of the workbench is respectively provided with a plurality of first adsorption holes and a plurality of second adsorption holes; A pad, one side of which is closely attached to the end surface of the workbench and the other side of which is used to support the circuit board. The end surfaces of the pad are respectively provided with a plurality of air-avoidance holes, and the air-avoidance holes are arranged in a one-to-one correspondence with the positions of the first adsorption holes. The second adsorption hole is used to adsorb and fix the pad, and the first adsorption hole can be connected to the air-avoiding hole to adsorb and fix the circuit board.

2. A positioning assembly according to claim 1, characterized in that: The first adsorption holes and the second adsorption holes are arranged alternately.

3. A positioning assembly according to claim 2, characterized in that: In a linear direction, the first adsorption holes and the second adsorption holes are equidistantly and staggeredly arranged.

4. A positioning assembly according to any one of claims 1 to 3, characterized in that: The diameter of the first adsorption hole is equal to the diameter of the second adsorption hole.

5. A positioning assembly according to claim 4, characterized in that: The diameters of the air-avoiding hole, the first adsorption hole, and the second adsorption hole are all equal.

6. A positioning assembly according to claim 1, characterized in that: An alignment structure is provided between the pad and the workbench to drive the air-avoiding hole to be aligned with the first adsorption hole.

7. A positioning assembly according to claim 1 or 6, characterized in that: The cross sections of the workbench and the pad are both square.

8. A positioning assembly according to claim 7, characterized in that: The length of the workbench is equal to the length of the pad.

9. The positioning assembly according to claim 7, characterized in that: The width of the workbench is equal to the width of the pad.

10. Laser drilling machine, characterized by: The invention comprises a positioning assembly according to any one of claims 1 to 9.

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