Bonding workbench

Abstract

The utility model discloses a bonding workbench which is used for fixing a pumping source base, the bonding workbench comprises a bottom plate, a heating assembly, a clamp and a vacuum adsorption device, the heating assembly comprises a heating plate, the heating plate is arranged on the bottom plate, and a first vacuum adsorption hole is formed in the heating plate; the clamp comprises a supporting plate, the supporting plate is detachably installed on the heating plate, a second vacuum adsorption hole is formed in the supporting plate, and the first vacuum adsorption hole is communicated with the second vacuum adsorption hole; and the vacuum adsorption device is communicated with the first vacuum adsorption hole and the second vacuum adsorption hole and is used for adsorbing and fixing the pumping source base on the clamp in a vacuum manner. The pumping source base can be fixed to the clamp in a vacuum adsorption mode through the vacuum adsorption device, the fixing mode is simple, fixing is firm, and reliable welding is guaranteed.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and in particular relates to a bonding workbench. Background Art

[0002] As the output power of semiconductor lasers increases, the power of the pump source inside the laser also increases. The power of the pump source can be increased by increasing the number of pump source chips.

[0003] The pump source includes a pump base and multiple chips. During the pump source processing, thermal ultrasonic welding technology is used to bond the chips to the pins with gold wire. The specific bonding process is as follows: Place the base to be wired in a designated position on the hot plate; fix the base to the hot plate with 4 or 6 screws; After it is firmly fixed, turn on the hot plate heating switch. When the temperature rises to the set temperature, ultrasonic welding is used to connect the positive pole of the designated chip on the base to the corresponding pin with gold wire; when both pins are welded, turn off the hot plate heating switch, wait until the temperature drops to room temperature, loosen the screws, remove the welded base, and place it in a turnover box. However, the base and the hot plate are fixed with screws, which is complicated to operate and has low production efficiency. In addition, the threaded holes on the hot plate are easily slipped due to constant loosening and tightening of the screws, resulting in an unstable base fixation, which can easily cause poor welding and affect the reliability of the pump source. Utility Model Content

[0004] The embodiment of the present application provides a bonding workbench to solve the problems of low production efficiency and poor welding caused by base fixation in the existing pump source processing process.

[0005] In a first aspect, an embodiment of the present application provides a bonding workbench for fixing a pump source base, comprising:

[0006] base plate;

[0007] A heating assembly, comprising a heating plate, the heating plate being arranged on the bottom plate and having a first vacuum adsorption hole;

[0008] A fixture comprising a support plate, the support plate being detachably mounted on the heating plate, the support plate being provided with a second vacuum adsorption hole, the first vacuum adsorption hole being in communication with the second vacuum adsorption hole;

[0009] A vacuum adsorption device is connected to the first vacuum adsorption hole and the second vacuum adsorption hole, and is used to fix the pump source base on the fixture by vacuum adsorption.

[0010] Optionally, an adjustment mechanism is further included, which is installed on the base plate, and the heating plate is installed on the adjustment mechanism, and the adjustment mechanism is used to adjust the distance between the heating plate and the base plate.

[0011] Optionally, the adjustment mechanism includes a sliding member, a sliding fitting member and a driving member, the sliding fitting member is fixed to the base plate, the sliding member is slidably installed on the sliding fitting member, the heating plate is installed on the side of the sliding member away from the base plate, and the driving member and the sliding member slide along the sliding fitting member.

[0012] Optionally, the driving member includes a crank and a rocker, the rocker is connected to the crank, the crank is connected to one end of the sliding member away from the heating plate, the rocker drives the crank to rotate, and the crank drives the sliding member to rise and fall.

[0013] Optionally, the adjusting mechanism also includes an adjusting screw, a connecting block and a fixed block, the fixed block is fixedly connected to the sliding member, the connecting block is movably connected to the sliding member, the connecting block is in contact with the crank, the adjusting screw is rotatably connected to the connecting block and the fixed block, and the adjusting screw is used to drive the fixed block to move relative to the connecting block so that the fixed block drives the sliding member to rise and fall.

[0014] Optionally, the vacuum adsorption device further includes a control mechanism, an air pipe and a vacuum pumping device, wherein the air pipe is used to connect the first vacuum adsorption hole and the vacuum pumping device, and the control mechanism is arranged on the air pipe, and the control mechanism is used to control the conduction or cutoff of the air pipe.

[0015] Optionally, the control mechanism is provided with a vacuum degree display screen, and the vacuum degree display screen is used to display the current vacuum degree;

[0016] And / or, the control mechanism is provided with a switch, and the switch is used to control the gas pipeline to be turned on or off.

[0017] Optionally, the heating assembly further includes a temperature controller disposed on the bottom plate, the temperature controller being connected to the heating plate, and the temperature controller being used to control the temperature of the heating plate.

[0018] Optionally, a positioning piece is provided on the side of the support plate facing away from the heating plate.

[0019] Optionally, a handle is provided on the bottom plate.

[0020] The bonding workbench provided in the embodiment of the present application includes a base plate, a heating component, a clamp and a vacuum adsorption device. The heating plate of the heating component is arranged on the base plate, and a first vacuum adsorption hole is provided on the heating plate. The clamp can be detachably mounted on the heating plate, and can be adjusted according to the model of the fixed pump source, and has a wide range of applications. A second vacuum adsorption hole is provided on the clamp, and the second vacuum adsorption hole is connected to the first vacuum adsorption hole and is connected to the vacuum adsorption device. The pump source base can be vacuum adsorbed and fixed on the clamp through the vacuum adsorption device. The fixing method is simple and firm, ensuring reliable welding. The pump source base can be fixed and disassembled by vacuuming and breaking the vacuum, which is simple to operate and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0022] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0023] Figure 1 This is a front view of the bonding workbench provided in an embodiment of the present application.

[0024] Figure 2 A three-dimensional diagram of the bonding workbench provided in an embodiment of the present application.

[0025] Figure 3 This is an exploded view of the bonding workbench provided in an embodiment of the present application.

[0026] Figure 4 A partial schematic diagram of the bonding workbench provided in an embodiment of the present application.

[0027] Figure 5 for Figure 4 Middle AA section view.

[0028] Figure 6 A partial stereoscopic view of the bonding workbench provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0030] See also Figure 1 、 Figure 2 and Figure 3 , an embodiment of the present application provides a bonding workbench for fixing a pump source base 600. The bonding workbench includes a base plate 100, a heating assembly 200, a clamp 300 and a vacuum adsorption device 400. The base plate 100 is a flat structure, such as a metal plate, and has good structural strength. The heating assembly 200 includes a heating plate 210, which is a flat structure and is provided with a heating rod. The heating plate 210 is heated by the heating rod. The heating plate 210 is arranged on the base plate 100. The heating plate 210 is integrated on the base plate 100, so that the bonding workbench has a high degree of integration and is convenient for transfer. A first vacuum adsorption hole 211 is provided on the heating plate 210, and the first vacuum adsorption hole 211 passes through the upper and lower sides of the base plate 100. The first vacuum adsorption hole 211 is arranged in an area near the middle of the heating plate 210, and the first vacuum adsorption hole 211 avoids the position of the heating rod on the heating plate 210. The fixture 300 includes a support plate 310, which is removably mounted on the heating plate 210. The support plate 310 is a flat plate structure, and one side of the support plate 310 is in contact with the heating plate 210. The heating plate 210 is provided with bolt holes, and the support plate 310 is also provided with through holes. The through holes are arranged in alignment with the bolt holes, and the heating plate 210 and the support plate 310 are removably fixedly connected by bolts. Different fixtures 300 can be easily replaced according to the specifications of the pump source base 600 to be processed. The fixture 300 is easy to replace, which increases the applicability of the bonding platform. The fixture 300 is provided with a second vacuum adsorption hole 311, and the first vacuum adsorption hole 211 is connected to the second vacuum adsorption hole 311. For example, along the thickness direction of the fixture 300, the second vacuum adsorption hole 311 is located above the first vacuum adsorption hole 211, and the first vacuum adsorption hole 211 is connected to the second vacuum adsorption hole 311. The vacuum adsorption device 400 is connected to the first vacuum adsorption hole 211 and the second vacuum adsorption hole 311. The vacuum adsorption device 400 can be a vacuum pump. The vacuum adsorption device 400 draws a vacuum, and the negative pressure adsorbs and fixes the pump source base 600 to the fixture 300. The vacuum adsorption device 400 breaks the vacuum, and the pump source base 600 separates from the fixture 300.

[0031] In this embodiment, the pump source base 600 is fixed to the fixture 300 by vacuum suction. The fixture 300 is heated by a heating plate 210, transferring heat to the pump source base 600. At a certain temperature, ultrasonic bonding is used to bond the chip to the pins, completing the pump source bonding process. The pump source base 600 is secured and removed by vacuum suction or vacuum rupture, simplifying the process and improving pump source production efficiency. During the bonding process, the pump source base 600 remains fixed to the fixture 300 by vacuum suction, ensuring bonding reliability and improving the yield and reliability of the pump source.

[0032] In some embodiments, see Figure 1 and Figure 2 Positioning members 320 are provided on the side of the support plate 310 facing away from the heating plate 210. Positioning members 320 are positioning posts, and multiple positioning posts are provided on the side of the support plate 310 facing away from the heating plate 210. These positioning posts can correspond to pin holes on the pump source base 600, or multiple positioning posts can define the installation area of ​​the pump source base 600. Positioning the pump source base 600 on the support plate 310 facilitates operation and improves processing efficiency.

[0033] In some embodiments, see Figure 1 , a handle 110 is provided on the base plate 100. The handle 110 is provided on the base plate 100 to facilitate the overall movement of the bonding workbench.

[0034] In some embodiments, see Figure 1 、 Figure 2 and Figure 3 , further comprising an adjusting mechanism 500 , which is mounted on the base plate 100 , and the heating plate 210 is mounted on the adjusting mechanism 500 , and the adjusting mechanism 500 is used to adjust the distance between the heating plate 210 and the base plate 100 .

[0035] During the bonding process, the distance between the pump source base 600 and the ultrasonic generator varies depending on the specifications. To adjust the distance between the pump source base 600 and the ultrasonic generator to meet bonding requirements, in this embodiment of the present application, the heating plate 210 is integrated onto the base plate 100 via an adjustment mechanism 500. The adjustment mechanism 500 can adjust the height of the heating plate 210, thereby adjusting the distance between the pump source base 600 and the transmitting end of the ultrasonic generator, ensuring a good bonding effect and simplifying the adjustment operation.

[0036] In some embodiments, see Figure 3 、 Figure 4 and Figure 5 The adjustment mechanism 500 includes a sliding member 510, a sliding fitting member 520, and a driving member 530. The sliding fitting member 520 is fixed to the base plate 100, and the sliding member 510 is slidably mounted on the sliding fitting member 520. The heating plate 210 is mounted on the side of the sliding member 510 facing away from the base plate 100. The driving member 530 and the sliding member 510 slide along the sliding fitting member 520.

[0037] For example, see Figure 3 、 Figure 4 、 Figure 5 and Figure 6The sliding member 520 includes a fixed plate 521, which is vertically fixed to the base plate 100. A slide rail 522 is provided on one side of the fixed plate 521. The sliding member 520 is a slider 511 that cooperates with the slide rail 522. The slider 511 is slidably mounted on the slide rail 522. The heating plate 210 is mounted on the end of the slider 511 facing away from the base plate 100. The driving member 530 is connected to the end of the slider 511 closest to the base plate 100. The driving member 530 drives the slider 511 to move along the slide rail 522, and the slider 511 drives the heating plate 210 to move up and down.

[0038] In some embodiments, see Figure 4 and Figure 5 The driving member 530 includes a crank 531 and a rocker 532. The rocker 532 is fixedly connected to the crank 531, and the rocker 532 drives the crank 531 to rotate. The crank 531 is connected to the end of the sliding member 510 that is away from the heating plate 210. The rocker 532 drives the crank 531 to rotate, and the crank 531 drives the sliding member 510 to move up and down.

[0039] Illustratively, crank 531 is a semi-lunar wheel. The convex surface of the semi-lunar wheel abuts against slider 511. Rocker 532 comprises a handle, a rotating shaft, and a mounting base. The mounting base is fixed to base plate 100. The handle is fixedly connected to one end of the rotating shaft, which is rotatably mounted on the mounting base. The other end of the rotating shaft is fixedly connected to the semi-lunar wheel. The handle rotates the rotating shaft, which in turn rotates the semi-lunar wheel, which in turn pushes slider 511 up and down.

[0040] In the embodiment of the present application, the driving member 530 adopts a crank rocker mechanism, which has the characteristics of smooth movement, high transmission efficiency and high reliability.

[0041] In some embodiments, see Figure 3 、 Figure 4 and Figure 5 The adjustment mechanism 500 also includes an adjusting screw 540, a connecting block 550, and a fixed block 560. The fixed block 560 is fixedly connected to the sliding member 510, and the adjusting screw 540 is rotatably connected to the fixed block 560. The connecting block 550 is movably connected to the sliding member 510. For example, the sliding member 510 is provided with a waist hole, and the connecting block 550 is installed in the waist hole. The side of the connecting block 550 facing away from the fixed block 560 abuts against the crank 531. The adjusting screw 540 is threadedly connected to the connecting block 550. For example, one end of the adjusting screw 540 is threadedly connected to the connecting block 550, and the part near the other end is rotatably connected to the fixed block 560. A knob is provided on the end of the adjusting screw 540 facing away from the connecting block 550. By rotating the knob, the adjusting screw 540 rotates, and the adjusting screw 540 moves up and down along its axis, driving the fixed block 560 to move up and down, and the fixed block 560 drives the sliding member 510 to move up and down.

[0042] In the embodiment of the present application, the adjusting screw 540 drives the fixing block 560 to move the sliding member 510 relative to the connecting block 550 , thereby driving the sliding member 510 up and down to achieve fine adjustment of the height direction of the heating plate 210 .

[0043] In some embodiments, a scale is provided on the adjusting screw 540. The scale is provided to facilitate intuitive understanding of the adjustment height of the heating plate 210.

[0044] In some embodiments, see Figure 3 and Figure 4 Adjustment mechanism 500 also includes a spring 570, one end of which is fixed to base plate 100 and the other end is fixedly connected to slider 510. When slider 510 moves away from the base plate, spring 570 is stretched. The spring 570 in adjustment mechanism 500 ensures smooth movement of slider 510, reduces vibration, and protects the pump source.

[0045] In other embodiments, the adjustment mechanism 500 may be a telescopic cylinder or a screw mechanism, so as to drive the heating plate 210 to move up and down.

[0046] In some embodiments, the adjustment mechanism 500 further includes a protective cover 580, which is connected to the fixing plate 521. The protective cover 580 and the fixing plate 521 form a receiving space, and the sliding member 510 is installed in the receiving space.

[0047] In some embodiments, see Figure 1 and Figure 2 The vacuum adsorption device 400 further includes a control mechanism 410, an air supply pipe 420, and a vacuum pump. The control mechanism 410 is fixed to the base plate 100. The air supply pipe 420 is used to connect the first vacuum adsorption hole 211 and the vacuum pump. The control mechanism 410 is disposed on the air supply pipe 420 and is used to control whether the air supply pipe 420 is open or closed.

[0048] In the embodiment of the present application, the control mechanism 410 is used to control the gas pipe 420 to be turned on or off, thereby facilitating the adjustment of the vacuum degree, ensuring that the pump source base 600 is firmly fixed, and simplifying the adjustment operation.

[0049] In some embodiments, see Figure 1 and Figure 2 The control mechanism 410 is provided with a vacuum degree display screen 411, which is used to display the current vacuum degree. The vacuum degree display screen 411 intuitively displays the current vacuum degree, which is convenient for the operator to operate and ensures that the Puyuan base is firmly fixed.

[0050] In some embodiments, see Figure 1 and Figure 2The control mechanism 410 is provided with a switch 412, which is used to control the conduction or cutoff of the gas pipe 420. The conduction or cutoff of the gas pipe 420 is controlled by the switch 412, which is convenient for the operator to operate.

[0051] In some embodiments, see Figure 1 and Figure 2 The control mechanism 410 is fixed on the base plate 100, and the bonding workbench has a compact structure, a small size, and is easy to move.

[0052] In some embodiments, see Figure 1 and Figure 2 The heating assembly 200 further includes a temperature controller 230, which is disposed on the base plate 100 and connected to the heating plate 210. The temperature controller 230 is used to control the temperature of the heating plate 210. A temperature threshold is preset in the temperature controller 230. When the temperature of the heating plate 210 reaches the temperature threshold, the temperature controller 230 controls the heating plate 210 to stop heating. By controlling the temperature of the heating plate 210 through the temperature controller 230, the degree of automation is high. The temperature controller 230 is fixed to the base plate 100, and the bonding workbench has a compact structure, a small size, and is easy to move.

[0053] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0054] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more features.

[0055] The above is a detailed introduction to the bonding workbench provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A bonding workbench for fixing a pump source base (600), characterized in that: include: Bottom plate (100); A heating assembly (200) comprises a heating plate (210), wherein the heating plate (210) is arranged on the bottom plate (100), and a first vacuum adsorption hole (211) is provided on the heating plate (210); The clamp (300) comprises a support plate (310), the support plate (310) being detachably mounted on the heating plate (210), the support plate (310) being provided with a second vacuum adsorption hole (311), the first vacuum adsorption hole (211) being in communication with the second vacuum adsorption hole (311); A vacuum adsorption device (400) is connected to the first vacuum adsorption hole (211) and the second vacuum adsorption hole (311), and the vacuum adsorption device (400) is used to fix the pump source base (600) on the fixture (300) by vacuum adsorption.

2. The bonding workbench according to claim 1, characterized in that It also includes an adjustment mechanism (500) installed on the bottom plate (100), the heating plate (210) is installed on the adjustment mechanism (500), and the adjustment mechanism (500) is used to adjust the distance between the heating plate (210) and the bottom plate (100).

3. The bonding workbench according to claim 2, characterized in that: The adjustment mechanism (500) comprises a sliding member (510), a sliding fitting member (520) and a driving member (530), wherein the sliding fitting member (520) is fixed on the base plate (100), the sliding member (510) is slidably mounted on the sliding fitting member (520), the heating plate (210) is mounted on the side of the sliding member (510) facing away from the base plate (100), and the driving member (530) and the sliding member (510) slide along the sliding fitting member (520).

4. The bonding workbench according to claim 3, characterized in that: The driving member (530) includes a crank (531) and a rocker (532), wherein the rocker (532) is connected to the crank (531), and the crank (531) is connected to an end of the sliding member (510) facing away from the heating plate (210), and the rocker (532) drives the crank (531) to rotate, and the crank (531) drives the sliding member (510) to rise and fall.

5. The bonding workbench according to claim 4, characterized in that: The adjusting mechanism (500) further comprises an adjusting screw (540), a connecting block (550) and a fixed block (560), wherein the fixed block (560) is fixedly connected to the sliding member (510), the connecting block (550) is movably connected to the sliding member (510), the connecting block (550) is in contact with the crank (531), the adjusting screw (540) is rotatably connected to the connecting block (550) and the fixed block (560), and the adjusting screw (540) is used to drive the fixed block (560) to move relative to the connecting block (550), so that the fixed block (560) drives the sliding member (510) to rise and fall.

6. The bonding workbench according to claim 1, wherein: The vacuum adsorption device (400) further comprises a control mechanism (410), an air delivery pipe (420) and a vacuum pumping device. The air delivery pipe (420) is used to connect the first vacuum adsorption hole (211) and the vacuum pumping device. The control mechanism (410) is arranged on the air delivery pipe (420) and is used to control the opening or closing of the air delivery pipe (420).

7. The bonding workbench according to claim 6, characterized in that: The control mechanism (410) is provided with a vacuum degree display screen (411), and the vacuum degree display screen (411) is used to display the current vacuum degree; And / or, the control mechanism (410) is provided with a switch (412), and the switch (412) is used to control the opening or closing of the gas delivery pipe (420).

8. The bonding workbench according to claim 1, wherein: The heating assembly (200) further comprises a temperature controller (230) which is arranged on the bottom plate (100), the temperature controller (230) being connected to the heating plate (210), and the temperature controller (230) being used to control the temperature of the heating plate (210).

9. The bonding workbench according to claim 1, wherein: A positioning member (320) is provided on the side of the support plate (310) facing away from the heating plate (210).

10. The bonding workbench according to claim 1, wherein: A handle (110) is provided on the bottom plate (100).

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