Double-sided wafer scribing machine for chip processing

Abstract

The utility model provides a double-sided wafer scribing machine for chip processing, which comprises a scribing machine main body, an operation room is arranged on the scribing machine main body, an opening and closing door is arranged on the operation room, a scribing device is arranged in the upper end of the operation room, and a cleaning assembly is arranged in the operation room; a clamping rotating assembly; the clamping and rotating assembly comprises a fixing block installed on the side wall of the scribing machine body, a hole is formed in the fixing block, a sliding groove is formed in the inner wall of the operation chamber, the sliding groove is communicated with the hole, two symmetrical sliding blocks are slidably connected into the hole, and the two sliding blocks are slidably connected into the sliding groove. According to the utility model, double-sided wafers with different specifications can be stably clamped and conveniently overturned, so that the scribing machine can rapidly process the two surfaces of the double-sided wafers, and meanwhile, cooling water generated during processing can be cleaned out of the scribing machine.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a double-sided wafer dicing machine for chip processing. Background Art

[0002] Scribing machines include grinding wheel scribers and laser scribers. Grinding wheel scribers are precision CNC equipment that integrates water-gas-electric, air-static high-speed spindle, precision mechanical transmission, sensors and automatic control technologies. They are mainly used for dicing of silicon integrated circuits, light-emitting diodes, lithium niobate, piezoelectric ceramics and other materials.

[0003] Existing dicing machines require workers to manually flip the double-sided wafer over after dicing so that they can process the other side of the double-sided wafer. This is time-consuming, labor-intensive and dangerous. Water cooling is often required to protect the device during processing, but cold water treatment is troublesome and affects the next round of processing. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a double-sided wafer dicing machine for chip processing.

[0005] The embodiment of the present invention provides a double-sided wafer dicing machine for chip processing, comprising:

[0006] A dicing machine body, wherein the dicing machine body is provided with an operating room, the operating room is provided with a switch door, a dicing device is provided inside the upper end of the operating room, and a cleaning assembly is provided in the operating room;

[0007] The two sliding blocks are connected in a sliding manner to form a pair of symmetrical slide blocks, each of which is slidably connected to the two slide blocks, and one end of the two slide blocks is threadedly passed through a bidirectional screw thread, and one end of the bidirectional screw is rotatably connected to the hole, and the other end of the bidirectional screw is rotatably connected to the fixed block. The slide block is fixedly connected to the slide block, and one end of the two slide blocks slides through the slide rod, and the two ends of the slide blocks away from the slide slot are rotatably connected to the rotating rod, and one end of the two rotating rods is fixedly connected to the clamping block, and a rotating motor is fixedly installed on one end of one of the slide blocks, and the motor shaft of the rotating motor rotates through the slide block and is fixedly connected to one end of the rotating rod.

[0008] Furthermore, the cleaning assembly includes an opening on the dicing machine body, and two symmetrical sliding grooves are opened in the operating room. A cleaning plate is slidably connected in the two sliding grooves. A threaded rod is threaded through one end of the cleaning plate, and both ends of the threaded rod are rotatably connected in the sliding groove. A limiting rod is slid through the other end of the cleaning plate, and both ends of the limiting rod are fixedly connected in the sliding groove. A rotating motor is fixedly installed on the outer wall of the dicing machine body, and the motor shaft of the rotating motor rotates through the dicing machine body and is fixedly connected to one end of the threaded rod.

[0009] Furthermore, a group of feet are installed on the lower end surface of the dicing machine body.

[0010] Furthermore, a knob is installed on one end of the bidirectional screw.

[0011] Furthermore, the rotating motor adopts a waterproof casing.

[0012] Furthermore, a protective layer is installed on both of the clamping blocks.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The utility model can stably clamp double-sided wafers of different specifications through the clamping and rotating components, and can automatically and easily flip them, which facilitates the processing of different sides of the double-sided wafers and reduces the danger to workers. At the same time, the cooling water used for cooling protection during processing can be quickly cleaned through the cleaning component, which is convenient for the next round of work. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a front perspective structural diagram of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0016] Figure 2 This is a schematic diagram of the back three-dimensional structure of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0017] Figure 3 It is a three-dimensional structural cross-sectional view of a clamping and rotating assembly of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of a cleaning component of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0019] In the above drawings: 1 dicing machine body, 2 operating room, 3 switch door, 4 dicing device, 5 fixed block, 6 hole, 7 slide groove, 8 slider, 9 bidirectional screw, 10 slide rod, 11 rotating rod, 12 clamping block, 13 rotating motor, 14 sliding groove, 15 cleaning plate, 16 threaded rod, 17 limiting rod, 18 rotating motor. DETAILED DESCRIPTION

[0020] The technical solution of the present invention is further described below with reference to the accompanying drawings and embodiments.

[0021] like Figures 1-4 As shown, the embodiment of the present invention provides a double-sided wafer dicing machine for chip processing, comprising:

[0022] The dicing machine body 1 is provided with a set of feet installed on the lower end surface of the dicing machine body 1. The feet have a stabilizing effect. The staff can place the dicing machine body 1 more stably in the designated position by using the feet. The dicing machine body 1 is provided with an operating room 2. The operating room 2 is provided with a switch door 3. A dicing device 4 is installed inside the upper end of the operating room 2. The dicing device 4 is a part of the dicing machine body 1. It can be controlled by the dicing machine body 1 to perform dicing work. At the same time, it is provided with a cooling water nozzle for cooling protection. A cleaning component is installed in the operating room 2. The cleaning component includes an opening on the dicing machine body 1. Two mutually symmetrical sliding grooves 14 are provided in the operating room 2. A cleaning plate 15 is slidably connected in the two sliding grooves 14. A threaded rod 16 is threaded through one end of the cleaning plate 15.

[0023] Both ends of the threaded rod 16 are rotatably connected in the sliding groove 14, and the other end of the cleaning plate 15 slides through the limiting rod 17. Both ends of the limiting rod 17 are fixedly connected in the sliding groove 14. A rotating motor 18 is fixedly installed on the outer wall of the dicing machine body 1. The rotating motor 18 is a prior art that can rotate the object connected to its motor shaft. The motor shaft of the rotating motor 18 rotates and passes through the dicing machine body 1 and is fixedly connected to one end of the threaded rod 16. Through the above structure, when the threaded rod 16 is rotated, the cleaning plate 15 is driven to move and the cold water is swept out from the opening to complete the cleaning work, clamping the rotating assembly, clamping The rotating assembly includes a fixed block 5 mounted on the side wall of the dicing machine body 1, with a hole 6 opened on the fixed block 5, and a slide groove 7 opened on the inner wall of the operating chamber 2, which is connected to the hole 6. Two symmetrical sliders 8 are slidably connected in the hole 6, and the two sliders 8 are slidably connected in the slide groove 7. One end of the two sliders 8 is threaded with a bidirectional screw 9, which is a prior art. The bidirectional screw 9 has two different directions and can make the two objects connected thereto move in different directions when rotated. One end of the bidirectional screw 9 is rotatably connected in the hole 6, and the other end of the bidirectional screw 9 rotates and penetrates the fixed block 5;

[0024] A knob is installed on one end of the bidirectional screw 9, through which the staff can easily rotate the bidirectional screw 9, and a slide rod 10 is fixedly connected in the slide groove 7. One end of the two sliders 8 slides through the slide rod 10, and the ends of the two sliders 8 away from the slide groove 7 are rotatably connected to the rotating rod 11. One end of the two rotating rods 11 is fixedly connected to a clamping block 12, and a protective layer is installed on the two clamping blocks 12. The protective effect of the protective layer can reduce the damage of the clamping block 12 to the double-sided wafer. A rotating motor 13 is fixedly installed on one end of one of the sliders 8. The rotating motor 13 is a prior art that can rotate the object connected to its motor shaft. The rotating motor 13 adopts a waterproof shell. Since the rotating motor 13 works for a long time in the operating room 2 and is often sprayed with water cooling, the waterproof shell can prevent cold water from entering and causing damage to the rotating motor 13. The motor shaft of the rotating motor 13 rotates through the slider 8 and is fixedly connected to one end of the rotating rod 11.

[0025] The detailed working process of this utility model is as follows:

[0026] The staff first uses the pads to place the device stably in the designated position. Then the staff takes out the double-sided wafer and places it between the two clamping blocks 12. Then, the staff rotates the knob to drive the bidirectional screw 9 to rotate, so that the two sliders 8 slide in the slide groove 7 and the two clamping blocks 12 stably clamp the double-sided wafer. Then, the staff closes the switch door 3 and opens the dicing device 4 to process the double-sided wafer. After completing the processing of one side, the staff turns on the rotating motor 13, drives the rotating rod 11 to rotate through the rotating motor 13, and causes the clamping block 12 to rotate, while driving the other clamping block 12 and the rotating rod 11 to rotate, thereby completing the automatic and easy flipping of the double-sided wafer. Then, the above operation is repeated to process the other side. After completing the processing, the dicing device 4 is closed and the rotating motor 18 is turned on at this time. The rotating motor 18 drives the threaded rod 16 to rotate, so that the cleaning plate 15 moves, sweeps the cold water out of the opening, and collects it. Then, the staff opens the switch door 3 and takes out the double-sided wafer, completing the processing.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A double-sided wafer dicing machine for chip processing, characterized in that: include: A dicing machine body (1), wherein an operating room (2) is provided on the dicing machine body (1), a switch door (3) is installed on the operating room (2), a dicing device (4) is installed inside the upper end of the operating room (2), and a cleaning component is installed in the operating room (2); A clamping and rotating assembly; the clamping and rotating assembly comprises a fixed block (5) mounted on the side wall of the dicing machine body (1), a hole (6) being opened on the fixed block (5), a slide groove (7) being opened on the inner wall of the operating chamber (2), the slide groove (7) being connected to the hole (6), two mutually symmetrical sliders (8) being slidably connected in the hole (6), both sliders (8) being slidably connected in the slide groove (7), one end of the two sliders (8) being threaded with a bidirectional screw (9), one end of the bidirectional screw (9) being rotatably connected in the hole (6), the two sliders (8) being slidably connected in the slide groove (7), the two sliders (8) having a common thread passing through them, the two bidirectional screws ... The other end of the bidirectional screw (9) rotates and passes through the fixed block (5), and a slide rod (10) is fixedly connected in the slide groove (7). One end of the two sliders (8) slides and passes through the slide rod (10), and the ends of the two sliders (8) away from the slide groove (7) are rotated and connected to a rotating rod (11), and one end of the two rotating rods (11) is fixedly connected to a clamping block (12). A rotating motor (13) is fixedly installed on one end of one of the sliders (8), and the motor shaft of the rotating motor (13) rotates and passes through the slider (8) and is fixedly connected to one end of the rotating rod (11).

2. A double-sided wafer dicing machine for chip processing according to claim 1, characterized in that: in: The cleaning assembly includes an opening on the dicing machine body (1), two symmetrical sliding grooves (14) are opened in the operating chamber (2), and a cleaning plate (15) is slidably connected in the two sliding grooves (14), one end of the cleaning plate (15) is threaded through a threaded rod (16), both ends of the threaded rod (16) are rotatably connected in the sliding groove (14), the other end of the cleaning plate (15) is slid through a limiting rod (17), both ends of the limiting rod (17) are fixedly connected in the sliding groove (14), and a rotating motor (18) is fixedly installed on the outer wall of the dicing machine body (1), and the motor shaft of the rotating motor (18) rotates through the dicing machine body (1) and is fixedly connected to one end of the threaded rod (16).

3. A double-sided wafer dicing machine for chip processing according to claim 1, characterized in that: in: A set of feet are installed on the dicing machine body (1).

4. A double-sided wafer dicing machine for chip processing according to claim 1, characterized in that: in: A knob is installed on one end of the bidirectional screw (9).

5. The double-sided wafer dicing machine for chip processing according to claim 1, characterized in that: in: The rotating motor (13) adopts a waterproof housing.

6. A double-sided wafer dicing machine for chip processing according to claim 2, characterized in that: in: A protective layer is installed on both of the clamping blocks (12).

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