Injection molding processing device for semiconductor lead frame

Abstract

The utility model relates to the technical field of semiconductor lead frame injection molding, and discloses a semiconductor lead frame injection molding processing device which comprises a base plate, fixing rods are fixedly connected to the four corners of the top end of the base plate, and a top plate is fixedly connected to the top ends of the fixing rods. An injection molding pipe is fixedly connected to the middle of the front side of the inner wall of the pressing plate and penetrates through the upper side and the lower side, the pressing plate is connected with an upper mold through a second limiting assembly, a hydraulic rod is fixedly connected to the left side of the bottom end of the top plate, and the driving end of the hydraulic rod is fixedly connected to the top end of the pressing plate. According to the utility model, the stop block is pressed into the limiting block and extrudes the spring II, then the limiting plate slides towards the opposite side, so that the limiting plate is far away from the outer wall of the limiting block, the limiting on the limiting block is relieved, and then the lower die is lifted out from the inner wall of the cooling seat, so that the lower die is conveniently disassembled and maintained; the service life of the lower die is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lead frame injection molding, in particular to a semiconductor lead frame injection molding processing device. Background Art

[0002] The semiconductor lead frame is an important component of semiconductor devices. The semiconductor lead frame needs to be injection molded during the semiconductor device manufacturing process, so that the semiconductor lead frame can be encapsulated in a plastic package to protect it from mechanical damage, corrosion or other external environmental influences.

[0003] After searching, the publication number CN220409555U discloses a semiconductor lead frame processing and injection molding device, comprising a fixed base, on the middle side of which the lower mold is fixedly installed; a fixed frame, which is fixedly installed on the outer side of the upper end of the fixed base, and the inner upper side of the fixed frame is connected to an adjustment mechanism, the adjustment mechanism comprising a first movable rod, a second movable rod, a mounting rod, a movable block and a connecting wheel, and the lower side of the adjustment mechanism is connected to a connecting block, and the outer side of the connecting block is fixedly connected to a fixed block; a mounting plate, which is installed on the lower side of the connecting block, and the inner side of the mounting plate is fixedly provided with a spring, and the inner side of the spring is installed with a limit block, the lower end of the mounting plate is fixedly installed with an upper mold, and the middle side of the upper mold is connected to an injection molding tube. This semiconductor lead frame processing and injection molding device is convenient for cooling the lead frame, convenient for replacing the molded block, and has a good injection molding effect on the semiconductor lead frame.

[0004] Based on the above patent, by rotating the fixing rod, the fixing rod is threadedly connected to the middle side of the fixing block, so that the fixing rod is separated on the upper side of the mounting plate, and then the connecting block is pulled upward to push the limit block to slide inward, so that the limit block drives the spring to be compressed, and then the limit block is separated on the outside of the connecting block, which is convenient for replacing the mounting plate. However, in the above patent, the mounting plate and the upper mold are fixed together, so the upper mold cannot be well maintained, and the condenser is directly fixed and connected to the lower mold, so it is inconvenient to maintain the lower mold, which makes the mold maintenance more difficult and difficult to increase its service life. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor lead frame injection molding processing device, which releases the limit of the limit block and then lifts the lower mold out from the inner wall of the cooling seat to perform maintenance on it and increase the service life of the lower mold.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A semiconductor lead frame injection molding processing device includes a base plate, the four corners of the top of the base plate are fixedly connected to fixing rods, the top of the fixing rods is fixedly connected to a top plate, the right side of the top of the base plate is fixedly connected to a condensation box, the left side of the top of the base plate is fixedly connected to a cooling seat, the cooling seat is connected to a lower mold through a limiting component 1, the left and right sides of the top of the cooling seat are fixedly connected to guide rods, the outer wall of the guide rod is slidably connected to a pressure plate, the middle part of the front side of the inner wall of the pressure plate is fixedly connected to an injection molding tube and passes through the upper and lower sides, the pressure plate is connected to the upper mold through a limiting component 2, and slots are provided on the left and right sides of the top of the pressure plate, the left side of the bottom end of the top plate is fixedly connected to a hydraulic rod, and the driving end of the hydraulic rod is fixedly connected to the top of the pressure plate.

[0008] Furthermore, the limiting component 1 includes a limiting plate that is slidably connected to the inner walls on both sides of the front end of the cooling seat and a limiting block that is fixedly connected to the left and right sides of the front end of the lower mold. The inner wall on the opposite side of the front end of the limiting block is slidably connected to a stopper, and a spring 2 is installed between the limit block and the stopper.

[0009] Furthermore, the second limiting component includes a slider fixedly connected to the top of the pressure plate near the opposite side of the card slot and a card block fixedly connected to the left and right sides of the top of the upper mold. The inner wall of the slider is slidably connected to the plug block, and the opposite end of the plug block is fixedly connected to the pull plate, and the pull plate is connected to the slider through spring 1.

[0010] Furthermore, a guide pipe is fixedly connected to the bottom end of the inner wall of the cooling seat, and the front and rear sides of the right end of the guide pipe both penetrate the outer wall of the cooling seat and are fixedly connected to the front and rear sides of the left end of the condensation box.

[0011] Furthermore, one end of the second spring is fixedly connected to the rear end of the stop block, and the other end of the second spring is fixedly connected to the inner wall of the limit block.

[0012] Furthermore, one end of the spring 1 is fixedly connected to the front and rear inner walls of the opposite end of the pull plate, and the other end of the spring 1 is fixedly connected to the front and rear inner walls of the opposite end of the slider.

[0013] Furthermore, the shape of the top end of the card block matches the shape of the inner wall of the card slot, and the shape of the opposite end of the insert block matches the shape of the inner wall of the slot on the upper part of the card block.

[0014] Furthermore, the shape of the opposite end of the limiting block matches the shape of the inner wall of the through groove at the front of the limiting plate.

[0015] The utility model has the following beneficial effects:

[0016] 1. In the utility model, by pulling the pull plates on both sides and simultaneously stretching the spring, the insert block is disengaged from the slot of the card block. After the card block is free from restriction, it can be disengaged from the card slot, so that the upper mold can be easily disassembled, and then the upper mold can be taken out separately for maintenance, thereby increasing the service life of the upper mold.

[0017] 2. In the utility model, the stop block is pressed into the limit block and the spring 2 is squeezed, and then the limit plate is slid to the opposite side so that the limit plate is away from the outer wall of the limit block, thereby releasing the limit on the limit block. Then, the lower mold is punched out from the inner wall of the cooling seat, thereby realizing convenient disassembly of the lower mold for maintenance and improving the service life of the lower mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional diagram of a semiconductor lead frame injection molding device proposed by the present invention;

[0019] Figure 2 This is a half-section diagram of a pressing plate of a semiconductor lead frame injection molding device proposed by the present invention;

[0020] Figure 3 This is a schematic diagram of the pressing plate structure of a semiconductor lead frame injection molding device proposed by the present invention;

[0021] Figure 4 This is a schematic diagram of the lower mold structure of a semiconductor lead frame injection molding device proposed by the present invention;

[0022] Figure 5 This is a schematic structural diagram of a cooling base for a semiconductor lead frame injection molding device proposed by the present invention;

[0023] Figure 6 This is a cross-sectional view of a limiting block of a semiconductor lead frame injection molding device proposed by the present invention.

[0024] Legend:

[0025] 1. Base plate; 2. Top plate; 3. Fixed rod; 4. Hydraulic rod; 5. Press plate; 6. Guide rod; 7. Cooling seat; 8. Lower mold; 9. Condensation box; 10. Guide pipe; 11. Slider; 12. Block; 13. Upper mold; 14. Injection tube; 15. Insert block; 16. Slot; 17. Pull plate; 18. Spring 1; 19. Limit block; 20. Limit plate; 21. Stop block; 22. Spring 2. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Reference Figure 1-6 The utility model provides an embodiment: a semiconductor lead frame injection molding processing device, including a base plate 1, the four corners of the top of the base plate 1 are fixedly connected to the fixing rod 3, the top of the fixing rod 3 is fixedly connected to the top plate 2, the right side of the top of the base plate 1 is fixedly connected to the condensation box 9, the condensation box 9 has a built-in water pump, stores a large amount of coolant and is equipped with related liquid cooling equipment inside to provide a cooling effect for the coolant, the left side of the top of the base plate 1 is fixedly connected to the cooling seat 7, the left and right sides of the top of the cooling seat 7 are fixedly connected to the guide rod 6, the outer The wall is slidably connected to a pressure plate 5, and an injection tube 14 is fixedly connected to the middle of the front inner wall of the pressure plate 5 and passes through the upper and lower sides. A through hole groove is opened on the front inner wall of the upper mold 13 to match the shape of the outer wall of the injection tube 14. Slots 16 are opened on the left and right sides of the top of the pressure plate 5. A hydraulic rod 4 is fixedly connected to the left side of the bottom end of the top plate 2. The driving end of the hydraulic rod 4 is fixedly connected to the top of the pressure plate 5. Start the hydraulic rod 4 to push the pressure plate 5 downward until the upper mold 13 is embedded in the inner cavity of the lower mold 8, and then injection molding is performed between the upper mold 13 and the lower mold 8 through the injection tube 14.

[0028] Specifically, the limit plates 20 are slidably connected to the inner walls on the left and right sides of the front end of the cooling seat 7, and the limit blocks 19 are fixedly connected to the left and right sides of the front end of the lower mold 8. The shape of the opposite end of the limit block 19 is consistent with the shape of the inner wall of the front through groove of the limit plate 20. The inner wall on the opposite side of the front end of the limit block 19 is slidably connected with a stopper 21. A spring 22 is installed between the limit block 19 and the stopper 21. One end of the spring 22 is fixedly connected to the rear end of the stopper 21, and the other end of the spring 22 is fixedly connected to the inner wall of the limit block 19. When maintaining the upper mold 13, it is only necessary to pull the pull plates 17 on both sides while the spring 18 is stretched, so that the insert block 15 is disengaged from the notch of the block 12. The block 12 is not restricted After that, it can be detached from the card slot 16, and then the upper mold 13 can be taken out separately for maintenance. The bottom end of the inner wall of the cooling seat 7 is fixedly connected to the guide pipe 10, and the shape of the inner wall of the bottom end of the lower mold 8 is consistent with the shape of the outer wall of the guide pipe 10. The front and rear sides of the right end of the guide pipe 10 pass through the outer wall of the cooling seat 7 and are fixedly connected to the front and rear sides of the left end of the condensation box 9. Start the built-in water pump in the condensation box 9 to pump the coolant in the condensation box 9 into the guide pipe 10 to flow. After passing through the cooling seat 7 and the inner wall of the lower mold 8, the temperature of the coolant cools the lower mold 8 through the surface of the guide pipe 10, and then cools the internal injection molded parts through the temperature conduction of the material of the lower mold 8 itself. The coolant re-enters the condensation box 9 along the direction of the guide pipe 10 for refrigeration again.

[0029] Specifically, the top of the pressure plate 5 is fixedly connected to the slider 11 on the opposite side of the card slot 16, and the card blocks 12 are fixedly connected on the left and right sides of the top of the upper mold 13. The inner wall of the slider 11 is slidably connected with the plug block 15, and the opposite end of the plug block 15 is fixedly connected with the pull plate 17. The pull plate 17 is connected to the slider 11 through a spring 18. One end of the spring 18 is fixedly connected to the inner wall of the front and rear sides of the opposite end of the pull plate 17, and the other end of the spring 18 is fixedly connected to the opposite end of the inner wall of the slider 11. On the front and rear sides, the shape of the top of the card block 12 is consistent with the shape of the inner wall of the card slot 16, and the shape of the opposite end of the insert block 15 is consistent with the shape of the inner wall of the upper notch of the card block 12. When maintaining the lower mold 8, you only need to press the block 21 into the limit block 19 and squeeze the spring 22, and then slide the limit plate 20 to the opposite side to make the limit plate 20 away from the outer wall of the limit block 19, release the limit on the limit block 19, and then lift the lower mold 8 out from the inner wall of the cooling seat 7 for maintenance.

[0030] Working principle: First, start the hydraulic rod 4 to push the pressure plate 5 downward until the upper mold 13 is embedded in the inner cavity of the lower mold 8, and then perform injection molding between the upper mold 13 and the lower mold 8 through the injection tube 14. Then start the built-in water pump in the condenser box 9 to pump the coolant in the condenser box 9 to flow into the guide tube 10. After passing through the cooling seat 7 and the inner wall of the lower mold 8, the coolant temperature cools the lower mold 8 through the surface of the guide tube 10, and then cools the internal injection molded parts through the temperature conduction of the material of the lower mold 8 itself. After that, start the hydraulic rod 4 to lift the upper mold 13, take out the molded injection molded parts, and the coolant re-enters along the direction of the guide tube 10. The condensation box 9 is cooled again. When performing maintenance on the upper mold 13, it is only necessary to pull the pull plates 17 on both sides while the spring 18 is stretched to make the insert block 15 disengage from the slot of the block 12. After the block 12 is no longer restricted, it can be disengaged from the slot 16, and then the upper mold 13 can be taken out separately for maintenance. When performing maintenance on the lower mold 8, it is only necessary to press the block 21 into the limit block 19 and squeeze the spring 2 22, and then slide the limit plate 20 to the opposite side to make the limit plate 20 away from the outer wall of the limit block 19, release the limit on the limit block 19, and then lift the lower mold 8 out from the inner wall of the cooling seat 7 for maintenance.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor lead frame injection molding device, comprising a base plate (1), characterized in that: The four corners of the top of the base plate (1) are fixedly connected to fixed rods (3), the top of the fixed rods (3) are fixedly connected to the top plate (2), the right side of the top of the base plate (1) is fixedly connected to a condensation box (9), the left side of the top of the base plate (1) is fixedly connected to a cooling seat (7), the cooling seat (7) is connected to the lower mold (8) through a limiting component 1, the left and right sides of the top of the cooling seat (7) are fixedly connected to guide rods (6), the outer wall of the guide rod (6) is slidably connected to a pressure plate (5), the middle part of the front side of the inner wall of the pressure plate (5) is fixedly connected to an injection tube (14) and passes through the upper and lower sides, the pressure plate (5) is connected to the upper mold (13) through a limiting component 2, and the left and right sides of the top of the pressure plate (5) are provided with a card slot (16), the left side of the bottom end of the top plate (2) is fixedly connected to a hydraulic rod (4), and the driving end of the hydraulic rod (4) is fixedly connected to the top of the pressure plate (5).

2. The semiconductor lead frame injection molding device according to claim 1, characterized in that: The limiting component 1 includes a limiting plate (20) that is slidably connected to the inner walls on both sides of the front end of the cooling seat (7) and a limiting block (19) that is fixedly connected to the left and right sides of the front end of the lower mold (8). The inner wall on the opposite side of the front end of the limiting block (19) is slidably connected to a stopper (21), and a spring 2 (22) is installed between the limiting block (19) and the stopper (21).

3. The semiconductor lead frame injection molding device according to claim 1, characterized in that: The second limiting component includes a slider (11) fixedly connected to the top of the pressure plate (5) on the opposite side of the card slot (16) and a card block (12) fixedly connected to the left and right sides of the top of the upper mold (13). The inner wall of the slider (11) is slidably connected to the plug block (15), and the opposite end of the plug block (15) is fixedly connected to the pull plate (17). The pull plate (17) is connected to the slider (11) through a spring (18).

4. The semiconductor lead frame injection molding device according to claim 1, characterized in that: The bottom end of the inner wall of the cooling seat (7) is fixedly connected to a guide pipe (10), and the front and rear sides of the right end of the guide pipe (10) both pass through the outer wall of the cooling seat (7) and are fixedly connected to the front and rear sides of the left end of the condensation box (9).

5. The semiconductor lead frame injection molding device according to claim 2, characterized in that: One end of the second spring (22) is fixedly connected to the rear end of the stopper (21), and the other end of the second spring (22) is fixedly connected to the inner wall of the limit block (19).

6. The semiconductor lead frame injection molding device according to claim 3, characterized in that: One end of the spring (18) is fixedly connected to the front and rear inner walls of the opposite end of the pull plate (17), and the other end of the spring (18) is fixedly connected to the front and rear inner walls of the opposite end of the slider (11).

7. The semiconductor lead frame injection molding device according to claim 3, characterized in that: The shape of the top end of the card block (12) matches the shape of the inner wall of the card slot (16), and the shape of the opposite end of the insert block (15) matches the shape of the inner wall of the upper notch of the card block (12).

8. The semiconductor lead frame injection molding device according to claim 2, characterized in that: The shape of the opposite end of the limiting block (19) matches the shape of the inner wall of the front through groove of the limiting plate (20).

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