Adhesive tape clamping and cutting device for packaging semiconductor carrier tape disc

Abstract

The utility model provides an adhesive tape clamping and cutting device for packaging a semiconductor carrier tape disc. The adhesive tape clamping and cutting device comprises a workbench, an idle wheel set, a fixing clamp mechanism, a drawing module, a mechanical arm module, two clamping jaw mechanisms and a cutting mechanism. In the working process, an adhesive tape of an adhesive tape disc passes through the idle wheel set and is fixed to the fixing clamp mechanism, the drawing module drives the clamping jaw mechanism to move to one side of the end of the adhesive tape, the mechanical arm module drives the first clamping jaw mechanism to vertically move downwards to the end of the adhesive tape, and the first clamping jaw mechanism can be used for clamping a section of adhesive tape; at the moment, the fixing clamp mechanism is started, the adhesive tape is released, then the drawing module drives the clamping jaw mechanisms to move by a certain distance, the mechanical arm module drives the second clamping jaw mechanism to vertically move downwards to the tail of the adhesive tape, the drawing module continues to drive the two clamping jaw mechanisms to move by a certain distance, and the end of the adhesive tape is drawn out by the required length; and then the fixing clamp mechanism is closed, the adhesive tape is fixed and cut off through the cutting-off mechanism, and therefore clamping and cutting-off of the adhesive tape are completed.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor carrier tape and reel packaging, and in particular relates to a tape clamping and cutting device for semiconductor carrier tape and reel packaging. Background Art

[0002] Semiconductor tape and reel packaging is an important method for semiconductor component packaging. It primarily consists of a carrier tape and a reel. The carrier tape is primarily used to package electronic components such as semiconductor chips, providing protection and facilitating handling during transportation, storage, and production. It can also organize individual electronic components in an orderly manner, facilitating subsequent automated placement and other processes. The reel is a disc-shaped container for winding the carrier tape, facilitating storage, transportation, and subsequent production and processing operations. Furthermore, adhesive tape can be used to secure items within the reel.

[0003] When packaging semiconductor carrier trays, one or more wraps of foam or tape are wrapped around the outside to protect the product inside from bumps and damage during transport. The tail of the foam or tape is secured to the tray using tape. However, conventional semiconductor carrier tray packaging typically uses manual packaging, which is inefficient, labor-intensive, and results in significant variation in packaging quality. Furthermore, due to the self-adhesive nature of the tape, manual operation is not convenient when wearing gloves, and sweat and dirt can significantly impact the reliability of the tape. To avoid manual errors and standardize the packaging process, companies can save production costs without damaging the trays.

[0004] Therefore, automating this process is of great significance to the automation of tape and tray packaging. Utility Model Content

[0005] The purpose of the utility model is to provide a tape clamping and cutting device for semiconductor carrier tape packaging, which can realize the clamping and cutting of the tape on the semiconductor carrier tape.

[0006] In order to solve the above technical problems, the utility model provides a tape clamping and cutting device for semiconductor carrier tape reel packaging, comprising a workbench, an inert wheel set, a fixing clamp mechanism, a pulling module, a robotic arm module, at least two clamping claw mechanisms and a cutting mechanism;

[0007] The workbench is respectively provided with a first mounting position and a second mounting position for rotatably connecting the tape reel and the idler wheel assembly. The tape on the tape reel passes through the idler wheel assembly and the fixing clamp mechanism in sequence, and the fixing and release of the tape end are controlled by the fixing clamp mechanism.

[0008] The movable end of the pulling module is connected to the fixed end of the robotic arm module, and all the clamping mechanisms are arranged at the movable end of the robotic arm module. The clamping mechanism is used to clamp the end of the tape to achieve pulling and grabbing. The pulling module is used to drive the robotic arm module and the clamping mechanism to move along the pulling direction of the tape, and the robotic arm module is used to drive each of the clamping mechanisms to approach the end of the tape. The cutting mechanism is arranged at the end of the fixed clamping mechanism and is used to cut the tape.

[0009] Optionally, the tape clamping and cutting device for the above-mentioned semiconductor carrier tape packaging further includes an alarm and a tape sensor for detecting whether there is the tape. The alarm is electrically connected or signal-connected to the tape sensor and is used to alarm when the tape sensor detects that there is no tape on the tape reel.

[0010] Optionally, the above-mentioned tape clamping and cutting device for semiconductor carrier tape reel packaging further includes a guide mechanism arranged between the idler wheel set at the end and the fixed clamp mechanism, and the guide mechanism is used to limit the position of the tape.

[0011] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape reel packaging, the guide mechanism includes a fixed plate, a movable plate, a movable plate positioning rod and a movable plate compression spring;

[0012] The fixed plate is fixed on the workbench, the movable plate can move closer to and farther from the fixed plate, and a tape channel for limiting the direction of the tape is formed between the movable plate and the fixed plate;

[0013] One end of the movable plate positioning rod is fixedly connected to the fixed plate, and the other end of the movable plate positioning rod passes through the movable plate and is provided with the movable plate compression spring.

[0014] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape reel packaging, a movable plate pull button for easy gripping is provided on the movable plate.

[0015] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tray packaging, the cutting mechanism includes a cutting cylinder and a cutting knife, the fixed end of the cutting cylinder is arranged on the workbench, and the movable end is connected to the cutting knife, and the cutting knife is used to cut the tape between the guide mechanism and the fixed clamp mechanism.

[0016] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tray packaging, the fixing clamp mechanism includes a fixing clamp cylinder and a group of fixing clamps, and a group of fixing clamps have fixing positions for fixing the tape, and the fixing clamp cylinder is used to drive a group of fixing clamps to move closer and farther away.

[0017] Optionally, the tape clamping and cutting device for semiconductor carrier tape packaging further includes a module bracket for supporting the fixed end of the pulling module, wherein the module bracket is a gantry, and the module bracket is arranged on the side of the workbench.

[0018] Optionally, the tape clamping and cutting device for semiconductor carrier tape packaging further includes an operating platform, on which is provided at least a fixing clamp switch for controlling the opening or closing of the fixing clamp mechanism.

[0019] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape packaging, the pulling module is a linear module arranged in the horizontal direction, and the robotic arm module includes two lifting linear modules arranged at intervals, one lifting linear module corresponds to one clamping mechanism, the fixed end of the lifting linear module is connected to the movable end of the pulling module, and the movable end of the lifting linear module is connected to the clamping mechanism, and the two lifting linear modules operate independently.

[0020] The utility model provides a tape clamping and cutting device for semiconductor carrier tape reel packaging, which has the following beneficial effects:

[0021] During operation, the tape on the tape reel passes through the inert wheel group and is fixed on the fixed clamping mechanism. The pulling module drives the clamping mechanism to move to one side of the tape end, and the robotic arm module drives the first clamping mechanism to move vertically downward to the tape end, and the first clamping mechanism can be used to clamp a section of tape. At this time, the fixed clamping mechanism is opened and the tape is released. After the clamping mechanism is driven to move a certain distance by the pulling module, the robotic arm module drives the second clamping mechanism to move vertically downward to the tail of the tape. The pulling module continues to drive the two clamping mechanisms to move an end distance, so that the end of the tape is pulled out to the required length, and then the fixed clamping mechanism is closed and the tape is fixed. The tape between the clamping mechanism and the fixed clamping mechanism is cut off by the cutting mechanism, thereby completing the clamping and cutting of the tape.

[0022] Through the cooperation of the fixed clamp mechanism, the pulling module, the robotic arm module and the clamping claw mechanism, the tape can be clamped and fixed before the cutting operation, thereby avoiding the displacement of the tape during the cutting process. At the same time, the tape can be pulled after the clamping is released, and the cutting operation of the tape can be performed using the cutting mechanism, thereby realizing the clamping and cutting of the tape on the semiconductor carrier reel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0024] Figure 1 A schematic structural diagram of a tape clamping and cutting device for semiconductor tape reel packaging provided by an embodiment of the present utility model;

[0025] Figure 2 A schematic structural diagram of a workbench provided in an embodiment of the present invention and a fixing clamp mechanism, a cutting mechanism, and a guiding mechanism arranged thereon;

[0026] Figure 3 A schematic structural diagram of an operating platform provided in an embodiment of the present utility model.

[0027] In the above picture:

[0028] A-tape reel; A1-tape;

[0029] 100- workbench;

[0030] 200-Idler wheel set;

[0031] 300-fixed clamp mechanism; 310-fixed clamp cylinder; 320-fixed clamp head;

[0032] 400-pull-out module; 410-module bracket;

[0033] 500-Robotic arm module;

[0034] 600-grip mechanism;

[0035] 700-cutting mechanism; 710-cutting cylinder; 720-cutting knife;

[0036] 800-Tape sensor;

[0037] 900-guide mechanism; 910-fixed plate; 920-movable plate; 930-movable plate positioning rod; 940-movable plate compression spring; 950-movable plate pull button;

[0038] 1000-operating platform. DETAILED DESCRIPTION

[0039] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0040] The core of the utility model is to provide a tape clamping and cutting device for semiconductor carrier tape reel packaging, which can realize the clamping and cutting of the tape on the semiconductor carrier tape reel.

[0041] In order to enable those skilled in the art to better understand the technical solution provided by the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Specifically, please refer to Figure 1-Figure 3 The utility model provides a tape clamping and cutting device for semiconductor carrier tape packaging, including: a workbench 100, an idler wheel group 200, a fixed clamp mechanism 300, a pulling module 400, a robotic arm module 500, at least two clamping claw mechanisms 600 and a cutting mechanism 700.

[0043] The workbench 100 serves as a support platform, and is provided with a first mounting location and a second mounting location for rotatably connecting the tape reel A and the idler pulley assembly 200. A fixing clamp mechanism 300 may also be mounted on the workbench 100. The top surface of the workbench 100 can be a flat surface, and arranging the various components on the workbench 100 on the same plane improves operational smoothness. The tape reel A is a roll of tape and is rotatably mounted on the first mounting location.

[0044] The idler wheel assembly 200 can be a pair of idler wheels, with a clearance between the two idler wheels for the adhesive tape A1 to pass through. The idler wheel assembly 200 can provide guidance for the withdrawal and steering of the adhesive tape A1. Of course, in specific applications, multiple idler wheel assemblies 200 can be adaptively arranged according to the actual layout of various components to achieve bending of the adhesive tape A1 at different angles and directions.

[0045] The clamp mechanism 300 can control its opening and closing. When open, tape A1 can be moved into or out of the opening of the clamp mechanism 300, releasing the tape A1. When closed, the clamp mechanism 300 tightens the tape A1 at the opening, securing it. In actual operation, the tape A1 on the tape reel A passes sequentially through the idler pulley assembly 200 and the clamp mechanism 300, with the clamp mechanism 300 controlling the securing and release of the end of the tape A1.

[0046] The movable end of the pull-out module 400 is connected to the fixed end of the robotic arm module 500. All gripping mechanisms 600 are located at the movable end of the robotic arm module 500 along the length of the end of the tape A1. The gripping mechanisms 600 are used to grip the end of the tape A1 to pull and grasp it. The pull-out module 400 drives the robotic arm module 500 and gripping mechanisms 600 in the direction of pulling the tape A1, while the robotic arm module 500 drives each gripping mechanism 600 toward the end of the tape A1. A cutting mechanism 700 is located at the end of the fixed clamping mechanism 300 and is used to cut the tape A1. It should be noted that the pulling module 400 can drive the clamping mechanism 600 to move in the first direction, which is the pulling direction of the tape A1 (i.e. the horizontal direction). The robotic arm module 500 can drive the clamping mechanism 600 to move in the second direction (i.e. the vertical direction). The first direction and the second direction are perpendicular to each other. The robotic arm module 500 can drive the clamping mechanism 600 to move closer to and away from the tape A1 through compound drive.

[0047] The tape clamping and cutting device for semiconductor carrier tape packaging provided by this solution has two clamping mechanisms 600, namely a first clamping mechanism and a second clamping mechanism. When working, the tape A1 is fixed on the fixed clamping mechanism 300, and the clamping mechanism 600 is driven to move to one side of the end of the tape A1 by the pulling module 400. The first clamping mechanism of the clamping mechanism 600 is driven vertically downward to the end of the tape A1 by the mechanical arm module 500, and a section of the tape A1 can be clamped by the first clamping mechanism. At this time, the fixed clamping mechanism 300 is opened and the tape A1 is released. , and then the pulling module 400 drives the two clamping mechanisms 600 to move a distance L1, and the robotic arm module 500 drives the second clamping mechanism of the clamping mechanism 600 to move vertically downward to the tail of the tape A1, and the pulling module 400 continues to drive the clamping mechanism 600 to move one end distance L2, so that the end of the tape A1 is pulled out to the required length, and then the fixed clamping mechanism 300 is closed and the tape A1 is fixed, and the cutting mechanism 700 is used to cut the tape A1 between the clamping mechanism 600 and the fixed clamping mechanism 300, thereby completing the clamping and cutting of the tape A1.

[0048] Through the cooperation of the fixing clamp mechanism 300, the pulling module 400, the robotic arm module 500 and the clamping claw mechanism 600, the tape A1 can be clamped and fixed before the cutting operation, thereby avoiding the displacement of the tape A1 during the cutting process, thereby greatly improving the cutting accuracy of the equipment; at the same time, the tape A1 can be pulled after the clamping is released, and the cutting operation of the tape A1 can be performed using the cutting mechanism 700, which can realize the clamping and cutting of the tape on the semiconductor carrier reel.

[0049] The above device can be used to perform the following operations: 1. Pulling the tape from the rolled tape reel A; 2. Cutting the pulled tape into a fixed length; 3. Placing the cut tape at a fixed position, waiting to be picked up and pasted.

[0050] Specifically, the robotic arm module 500 includes two lifting linear modules arranged at intervals, one lifting linear module corresponds to a clamping mechanism 600, the fixed end of the lifting linear module is connected to the movable end of the pulling module 400, and the movable end of the lifting linear module is connected to the clamping mechanism 600, and the two lifting linear modules operate independently.

[0051] In a specific embodiment, the present solution further includes an alarm and a tape sensor 800 for detecting the presence or absence of the tape A1 on the tape reel A.

[0052] The alarm is electrically or signal-connected to tape sensor 800 and is configured to sound an alarm when tape sensor 800 detects the absence of tape A1 on tape reel A. Sensor 800 detects the absence of tape A1 and, upon detecting the absence of tape A1, issues an alarm indicating a shortage of tape, shuts down the machine, and prompts manual tape replacement. The machine then restarts normally when tape is present.

[0053] This solution further includes a guide mechanism 900 disposed between the idler wheel assembly 200 at the end and the fixing clamp mechanism 300 . The guide mechanism 900 is used to limit the position of the adhesive tape A1 .

[0054] In a specific embodiment, Figure 2 As shown, the guide mechanism 900 includes a fixed plate 910, a movable plate 920, a movable plate positioning rod 930 and a movable plate compression spring 940. The movable plate positioning rod 930 and the movable plate compression spring 940 correspond to each other one by one and can be provided in one or more groups.

[0055] The fixed plate 910 is fixed on the workbench 100, and the movable plate 920 can move closer to and farther away from the fixed plate 910, and a limiting member is set between the movable plate 920 and the fixed plate 910 to form a tape channel between the two for limiting the direction of the tape A1, and the width of the tape channel is slightly larger than the width of the tape A1.

[0056] One end of the movable plate positioning rod 930 is fixedly connected to the fixed plate 910 , and the other end of the movable plate positioning rod 930 passes through the movable plate 920 and is provided with a movable plate compression spring 940 . The movable plate compression spring 940 can provide a tendency for the movable plate 920 to move toward the fixed plate 910 .

[0057] In order to achieve the movement of the movable plate 920 relative to the fixed plate 910, in one form, a movable plate pull button 950 that is easy to hold can be provided on the movable plate 920, and the movable plate pull button 950 is used to pull the movable plate 920 to move along the movable plate positioning rod 930, while the movable plate compression spring 940 provides a pre-tightening force. Specifically, the movable plate 920 moves closer to and further away from two guide posts fixed to the fixed plate 910 by pulling the movable plate pull button 950; in another form, the present solution also includes a linear module for driving the movable plate 920 to move closer to and away from the fixed plate 910. The movable end of the linear module is connected to the movable plate 920, and the movable plate 920 is driven by an electric drive to move along the movable plate positioning rod 930.

[0058] It should be noted that when the tape clamping and cutting device of the semiconductor carrier tape packaging is initially used or when the tape reel A needs to be replaced, the tape A1 needs to pass through the tape material channel of the guide mechanism 900. Pulling open the movable plate button 950 or controlling it through the linear module can make the tape A1 easily pass through the guide mechanism 900.

[0059] Furthermore, the cutting mechanism 700 includes a cutting cylinder 710 and a cutting knife 720. The fixed end of the cutting cylinder 710 is set on the workbench 100, and the movable end is connected to the cutting knife 720. The cutting knife 720 is used to cut the tape A1 between the guide mechanism 900 and the fixing clamp mechanism 300.

[0060] The fixing clamp mechanism 300 includes a fixing clamp cylinder 310 and a group of fixing clamps 320 . There are fixing positions between the group of fixing clamps 320 for fixing the tape A1 . The fixing clamp cylinder 310 is used to drive the group of fixing clamps 320 to move closer and farther away.

[0061] The control component in the fixing clamp cylinder 310 can control the opening and closing of the fixing clamp 320. That is, when replacing the tape, the fixing clamp 320 is opened, the head of the tape A1 is pulled out from the tape reel A, bypasses the idler wheel assembly 200, passes through the tape channel of the guide mechanism 900, and passes through the opened fixing clamp 320. At this time, the fixing clamp 320 is closed by the controller to cut off the excess tape.

[0062] like Figure 2As shown, tape reel A is mounted on the first mounting position of workbench 100. The pull-out module 400 pulls tape A1 a certain distance, allowing tape A1 to pass through the guide mechanism 900 and the fixed clamp mechanism 300. Simultaneously, the movable plate compression spring 940, guided by the movable plate positioning rod 930, causes the movable plate 920 and the fixed plate 910 to form a tape channel for accommodating and limiting the extension direction of tape A1. The fixed clamp cylinder 310 drives a set of fixed clamps 320 toward each other, thereby securing the end of tape A1 by the fixed clamp mechanism 300. The cutting cylinder 710 drives the cutting blade 720 to move, causing the cutting blade 720 to cut the tape A1 between the guide mechanism 900 and the fixed clamp mechanism 300.

[0063] The tape reel A is a single rolled product. To take out the fixed-length tape A1 from the tape reel A, first pull out the tape head from the tape reel A, fix the tape through the above-mentioned guide mechanism 900 and the fixing clamp mechanism 300, and after taking out the required length of tape, cut it through the cutting mechanism 700 to achieve fixed-length tape removal.

[0064] This solution also includes a module support 410 for supporting the fixed end of the pull-out module 400. The module support 410 is a gantry frame and is arranged on the side of the workbench 100. The top crossbeam of the gantry frame is arranged parallel to the guide mechanism 900, which facilitates the clamping and pulling operations of the end of the tape A1.

[0065] Furthermore, to facilitate operator operation, this solution also includes an operating platform 1000, which is provided with at least a clamp switch for controlling the opening or closing of the clamp mechanism 300. Of course, a screen or other operating buttons may also be provided on the operating platform 1000. The controller and other control devices described in the above solution may all be located within the operating platform 1000.

[0066] In a specific embodiment, the pull-out module 400 is a horizontally arranged linear module, and the robotic arm module 500 is capable of driving each gripper mechanism 600 to perform linear motion in the vertical direction. The linear module can be a pneumatic cylinder or a linear motor. There can be multiple gripper mechanisms 600, and the opening and closing of each gripper mechanism 600 can be controlled by multiple gripper cylinders.

[0067] This solution also includes a control system, which is used to control the actions of the clamping mechanism 300, the pull-out module 400, the robotic arm module 500, the gripping mechanism 600, and the cutting mechanism 700. The control system is composed of sensors, actuators, controllers, and controlled objects. It can achieve control by continuously measuring feedback information and making adjustments based on specific time signals or trigger signals between various mechanisms.

[0068] like Figure 1As shown, the entire tape clamping and cutting device operates as follows:

[0069] In the initial stage, before the device is started, the tape head is pulled out from the tape reel A and drawn through the idler wheel assembly 200, the tape material channel of the guide mechanism 900 and the fixed clamp mechanism 300 in sequence. The fixed clamp switch of the operating platform 1000 is activated, and the fixed position of the fixed clamp head 320 is controlled to be closed by the fixed clamp cylinder 310, so that the fixed clamp mechanism 300 clamps the end of the tape.

[0070] During operation, the tape sensor 800 detects the presence of tape at a workstation and feeds the signal back to the controller. The pull-out module 400 and the robotic arm module 500 drive the first clamping mechanism to move between the guide mechanism 900 and the fixed clamping mechanism 300. The first clamping mechanism's clamping cylinder actuates the clamping jaws to grip the tape A1. The fixed clamping mechanism 300 then opens, and the pull-out module 400 drives the first clamping mechanism 600 to move horizontally, pulling the tape A1 (enabling the clamping jaw 600 to pass through the opening created by the open fixed clamping mechanism 300). The robotic arm module 500 then drives the second clamping mechanism down between the first and fixed clamping mechanisms 300, allowing the second clamping jaw to precisely grip the tape A1 between them. The pull-out module 400 drives the two clamping mechanisms 600 to move the section of tape A1 they have grasped, allowing both clamping mechanisms 600 to pass through the fixed clamping mechanism 300. Subsequently, the clamp mechanism 300 is closed, allowing it to grip the newly pulled tape A1. The cutting mechanism 700 then cuts off the portion of tape A1 held by the gripper mechanism 600, completing the tape removal and cutting process. The cut portion can be used in the next step, and the pull-out module 400 and the robotic arm module 500 can then reset the gripper mechanism 600, repeating the cycle.

[0071] It should be noted that when the fixed position of the fixing clamp mechanism 300 can be opened a large distance, it is convenient for the clamping claw mechanism 600 to pass smoothly during the pulling operation.

[0072] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0073] In the description of this application, the meaning of "plurality" is more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0074] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0075] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0076] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A tape clamping and cutting device for semiconductor carrier tape packaging, characterized in that: It comprises a workbench (100), an idler wheel assembly (200), a fixing clamp mechanism (300), a drawing module (400), a mechanical arm module (500), at least two clamping claw mechanisms (600), and a cutting mechanism (700); The workbench (100) is provided with a first mounting position and a second mounting position for rotatably connecting the tape reel (A) and the idler wheel assembly (200), respectively. The tape (A1) on the tape reel (A) passes through the idler wheel assembly (200) and the fixing clamp mechanism (300) in sequence, and the fixing and release of the end of the tape (A1) are controlled by the fixing clamp mechanism (300); The movable end of the pulling module (400) is connected to the fixed end of the robotic arm module (500), and all the clamping mechanisms (600) are arranged at the movable end of the robotic arm module (500). The clamping mechanisms (600) are used to clamp the end of the tape (A1) to achieve pulling and grabbing. The pulling module (400) is used to drive the robotic arm module (500) and the clamping mechanisms (600) to move along the pulling direction of the tape (A1). The robotic arm module (500) is used to drive each of the clamping mechanisms (600) to approach the end of the tape (A1). The cutting mechanism (700) is arranged at the end of the fixed clamping mechanism (300) and is used to cut the tape (A1).

2. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, characterized in that: It also includes an alarm and a tape sensor (800) for detecting whether the tape (A1) is on the tape reel (A). The alarm is electrically connected or signal-connected to the tape sensor (800) and is used to sound an alarm when the tape sensor (800) detects that there is no tape (A1) on the tape reel (A).

3. The tape clamping and cutting device for semiconductor carrier tape reel packaging according to claim 1, characterized in that: It also includes a guide mechanism (900) disposed between the idler wheel set (200) at the end and the fixing clamp mechanism (300), wherein the guide mechanism (900) is used to limit the position of the adhesive tape (A1).

4. The tape clamping and cutting device for semiconductor carrier tape reel packaging according to claim 3, characterized in that: The guide mechanism (900) comprises a fixed plate (910), a movable plate (920), a movable plate positioning rod (930), and a movable plate compression spring (940); The fixed plate (910) is fixed on the workbench (100), the movable plate (920) can move closer to and farther from the fixed plate (910), and a tape channel for limiting the direction of the tape (A1) is formed between the movable plate (920) and the fixed plate (910); One end of the movable plate positioning rod (930) is fixedly connected to the fixed plate (910), and the other end of the movable plate positioning rod (930) passes through the movable plate (920) and is provided with the movable plate compression spring (940).

5. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 4, characterized in that: The movable plate (920) is provided with a movable plate pull button (950) that is easy to hold.

6. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 3, characterized in that: The cutting mechanism (700) comprises a cutting cylinder (710) and a cutting knife (720), wherein the fixed end of the cutting cylinder (710) is arranged on the workbench (100) and the movable end is connected to the cutting knife (720), and the cutting knife (720) is used to cut the tape (A1) between the guide mechanism (900) and the fixing clamp mechanism (300).

7. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 3, characterized in that: The fixing clamp mechanism (300) comprises a fixing clamp cylinder (310) and a group of fixing clamps (320), wherein a fixing position for fixing the adhesive tape (A1) is provided between the fixing clamps (320), and the fixing clamp cylinder (310) is used to drive the group of fixing clamps (320) to move closer and farther away.

8. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, wherein: It also includes a module support (410) for supporting the fixed end of the drawer module (400), wherein the module support (410) is a gantry frame, and the module support (410) is arranged on the side of the workbench (100).

9. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, wherein: It also includes an operating platform (1000), on which at least a fixing clamp switch for controlling the opening or closing of the fixing clamp mechanism (300) is provided.

10. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, wherein: The pulling module (400) is a linear module arranged in the horizontal direction, and the robotic arm module (500) includes two lifting linear modules arranged at intervals, one lifting linear module corresponds to one clamping mechanism (600), the fixed end of the lifting linear module is connected to the movable end of the pulling module (400), and the movable end of the lifting linear module is connected to the clamping mechanism (600), and the two lifting linear modules operate independently.

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