Light source heat dissipation structure and optical measuring instrument

Abstract

The utility model relates to the technical field of optical measurement, in particular to a light source heat dissipation structure and an optical measuring instrument.The optical heat dissipation structure comprises a light source assembly, a mounting base and a heat dissipation structure, the light source assembly comprises a light source and a substrate, the substrate is provided with a base material layer and a circuit layer, and the light source is electrically connected with the circuit layer and located on the side, facing the circuit layer, of the base material layer; the substrate is provided with a first heat dissipation surface positioned on the base material layer; the mounting seat is used for mounting and fixing the substrate and is provided with a light passing channel corresponding to the light source, the heat dissipation assembly comprises a heat dissipation plate fixed relative to the mounting seat, and the heat dissipation plate is provided with a first heat dissipation contact surface in heat conduction contact with the first heat dissipation surface, so that the substrate of the light source assembly is located between the mounting seat and the heat dissipation assembly; the heat dissipation plate is in direct heat conduction contact with the substrate of the light source assembly, the distance between the light source and the heat dissipation assembly can be reduced, the heat transfer efficiency and the heat dissipation efficiency of the light source are improved, the heat dissipation efficiency of the light source heat dissipation structure is improved, and the cooling requirement of the high-power light source is met.

Description

Technical Field

[0001] The present application relates to the field of optical measurement technology, and in particular to a light source heat dissipation structure and an optical measuring instrument. Background Art

[0002] Precision optical instruments such as confocal microscopes and white-light interferometers typically have internal light sources. To improve brightness, these sources are typically operated at high power, which results in higher peripheral temperatures. For light sources soldered to substrates, sustained high temperatures can melt the solder, ultimately causing the light source to separate from the substrate. Therefore, heat dissipation is essential.

[0003] The substrate includes a base material layer and a circuit layer. The light source and other circuit devices can be arranged on the circuit layer. The heat generated during their operation can be conducted to the base material layer, and the base material layer transfers the heat to achieve heat dissipation. The existing heat dissipation method mainly lies in selecting materials with high thermal conductivity as the base material layer, or setting fans, water cooling systems or heat sinks and other heat dissipation equipment around the light source to further improve the heat dissipation effect. However, the above heat dissipation methods still cannot meet the cooling requirements of existing high-power light sources. Utility Model Content

[0004] The present application provides a light source heat dissipation structure and an optical measuring instrument to solve the technical problem that existing heat dissipation means cannot meet the cooling requirements of high-power light sources.

[0005] According to the first aspect, an embodiment provides a light source heat dissipation structure, including:

[0006] A light source assembly comprising a light source and a substrate, wherein the substrate comprises a substrate layer and a circuit layer, the light source being electrically connected to the circuit layer, the light source being located on a side of the substrate layer facing the circuit layer, and the substrate having a first heat dissipation surface located on the substrate layer;

[0007] A mounting base, used for mounting and fixing the substrate, the mounting base having a light passage corresponding to the light source;

[0008] The heat dissipation assembly comprises a heat dissipation plate, which is fixed relative to the mounting seat and has a first heat dissipation contact surface which is in thermal contact with the first heat dissipation surface.

[0009] In an optional embodiment, the heat sink is mounted on the mounting base, the substrate is pressed and fixed between the mounting base and the heat sink in the arrangement direction of the mounting base and the heat sink, and the area of ​​the first heat dissipation contact surface is greater than or equal to the area of ​​the first heat dissipation surface.

[0010] In an optional embodiment, the substrate has a second heat dissipation surface arranged opposite to the first heat dissipation surface, the mounting seat has a second heat dissipation contact surface in thermal contact with the second heat dissipation surface, and the second heat dissipation contact surface is arranged around the light passage.

[0011] In an optional embodiment, the mounting seat has a mounting groove with a notch facing the heat sink, the light passage is located on the bottom wall of the mounting groove, the substrate is located in the mounting groove, the shape of the mounting groove is adapted to the outer contour of the substrate, and the bottom wall of the mounting groove forms the second heat dissipation contact surface.

[0012] In an optional embodiment, the area of ​​the second heat dissipation contact surface is 1 / 2-3 / 4 of the area of ​​the second heat dissipation surface.

[0013] In an optional embodiment, the base material layer is a metal layer, the substrate has an insulating layer located between the base material layer and the circuit layer, the substrate has a groove, the base material layer forms the bottom wall of the groove, the light source is located in the groove, and the light source is in thermal contact with the bottom wall of the groove.

[0014] In an optional embodiment, the light source heat dissipation structure includes a heat-conducting structure, the heat-conducting structure is located between the heat dissipation plate and the first heat dissipation surface, and the heat-conducting structure includes thermal grease or thermal paste.

[0015] In an optional embodiment, the heat dissipation assembly includes a heat sink connected to a side of the heat dissipation plate facing away from the light source assembly, and the heat sink is arranged perpendicular to the heat dissipation plate.

[0016] In an optional embodiment, the light source heat dissipation structure includes a temperature sensor, and the temperature sensor is arranged on the substrate to detect the temperature of the light source.

[0017] According to the second aspect, an embodiment provides an optical measuring instrument, comprising a base, a measuring head, a workbench and the light source heat dissipation structure described in any of the above embodiments, wherein the measuring head and the workbench are both mounted on the base, the light source heat dissipation structure is mounted on the measuring head and / or the workbench, and a plurality of optical elements for adjusting the light path are mounted on the mounting base, and the optical elements are located in the light passage.

[0018] According to the light source heat dissipation structure and optical measuring instrument of the above-mentioned embodiments, the optical heat dissipation structure includes a light source assembly, a mounting seat and a heat dissipation structure. The light source assembly includes a light source and a substrate. The substrate has a substrate layer and a circuit layer. The light source is electrically connected to the circuit layer. The light source is located on the side of the substrate layer facing the circuit layer. The substrate has a first heat dissipation surface, and the first heat dissipation surface is located on the substrate layer; the mounting seat is used to install and fix the substrate, and the mounting seat has a light-passing channel corresponding to the light source. The heat dissipation assembly includes a heat dissipation plate, which is relatively fixed to the mounting seat. The heat dissipation plate has a first heat dissipation contact surface that is in thermal contact with the first heat dissipation surface. In this way, the substrate of the light source assembly is located between the mounting seat and the heat dissipation assembly, and the heat dissipation plate is in direct thermal contact with the substrate of the light source assembly, which can reduce the distance between the light source and the heat dissipation assembly, increase the heat transfer efficiency and heat dissipation efficiency of the light source, and help to improve the heat dissipation efficiency of the light source heat dissipation structure to meet the heat dissipation and cooling requirements of high-power light sources. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 1 is a schematic structural diagram of an optical measuring instrument according to an embodiment;

[0020] Figure 2 This is a schematic structural diagram of a light source heat dissipation structure according to an embodiment;

[0021] Figure 3 This is a schematic diagram of the internal structure of a light source heat dissipation structure according to an embodiment;

[0022] Figure 4 The figure is a schematic diagram of the installation position structure of the light source and the substrate in an embodiment.

[0023] In the figure: 1. base; 2. measuring head; 3. workbench; 4. optical heat dissipation structure; 41. light source; 42. substrate; 420. base material layer; 421. insulation layer; 422. circuit layer; 423. protective layer; 424. first heat dissipation surface; 425. second heat dissipation surface; 426. groove; 43. mounting seat; 431. mounting groove; 432. stopper; 433. second heat dissipation contact surface; 434. light passage; 44. heat dissipation assembly; 441. heat dissipation plate; 442. heat sink; 443. first heat dissipation contact surface; 5. optical element. DETAILED DESCRIPTION

[0024] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0025] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various implementations, and the operational steps involved in each embodiment may be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a particular embodiment and do not imply a required composition and / or sequence.

[0026] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0027] An embodiment of the present application discloses a light source heat dissipation structure, which is mainly used in optical measuring instruments, such as a confocal microscope, or a white light interferometer, so as to improve the structure, position and installation method of the light source component and the heat dissipation component 44 so that the light source heat dissipation structure can meet the heat dissipation and cooling requirements of a high-power light source.

[0028] For the light source heat dissipation structure disclosed in the embodiment of this application, please refer to Figure 2 and Figure 3 , including a mounting base 43, a light source assembly and a heat dissipation assembly 44. The light source assembly includes a light source 41 and a substrate 42. The substrate 42 has a base material layer 420 and a circuit layer 422. The light source 41 includes a light source body and a lead. The light source body can be electrically connected to the circuit layer 422 of the substrate 42 through the lead. For example, the lead and the circuit layer 422 can be connected by soldering to simultaneously realize the installation and fixation of the light source 41 on the substrate 42.

[0029] For some examples, please refer to Figure 4The base material layer 420 of the substrate 42 can be a metal layer with good thermal conductivity, such as a copper layer or an iron layer, or a composite layer of multiple metals. If the base material layer 420 is a metal layer, an insulating layer 421 needs to be provided between the base material layer 420 and the circuit layer 422 to meet the basic functions of the electronic components connected to the substrate 42; of course, in other embodiments, the base material layer 420 can also be a plastic layer or a ceramic layer. If a plastic layer or a ceramic layer is selected, the insulating layer 421 may not be provided.

[0030] In order to prevent the circuit layer 422 from being exposed, the substrate 42 further has a protection layer 423 attached to the circuit layer 422 . The protection layer 423 may be formed of polyurethane or epoxy resin.

[0031] In the light source heat dissipation structure of the embodiment of the present application, the light source 41 is located on the side of the base material layer 420 on the substrate 42 facing the circuit layer 422. In one embodiment, the main body of the light source 41 can be arranged on the side of the circuit layer 422 facing away from the insulating layer 421 in the arrangement direction of the circuit layer 422 and the base material layer 420. In this way, the heat of the light source 41 can be transferred to the metal layer through the insulating layer 421, thereby achieving heat dissipation of the light source 41.

[0032] In one embodiment, please refer to Figure 4 The light source body of the light source 41 can also be set on the side of the substrate layer 420 facing the circuit layer 422, and the light source body is also in thermal contact with the substrate layer 420 to shorten the heat transfer path between the light source body and the substrate layer 420, thereby increasing the heat transfer efficiency and heat dissipation efficiency of the light source 41.

[0033] Specifically, the base material layer 420 can be set as a metal layer, and the substrate 42 has an insulating layer 421 located between the base material layer 420 and the circuit layer 422. The substrate 42 has a groove 426, and the notch of the groove 426 is facing the light source 41 in the arrangement direction of the base material layer 420 and the circuit layer 422. The base material layer 420 forms the bottom wall of the groove 426, that is, the groove 426 is processed at the position where the light source 41 is installed on the substrate 42, exposing the metal layer, and the light source body of the light source 41 is set in the groove 426, so that the light source body is fitted with the bottom wall of the groove 426 to achieve thermal contact, thereby improving the heat transfer efficiency and heat dissipation efficiency of the light source 41; the leads of the light source 41 are welded to the circuit layer 422.

[0034] In order to facilitate the installation of the light source 41 on the substrate 42, in one embodiment, please continue to refer to Figure 4 The outer contour size of the groove 426 on the substrate 42 is also set to match the outer contour size of the light source body. The light source body is located in the groove 426 to achieve pre-positioning of the light source 41 on the substrate 42, facilitating welding of the light source 41 and the substrate 42.

[0035] In the light source heat dissipation structure of the embodiment of the present application, please refer to Figure 3 The mounting seat 43 is used to install and fix the substrate 42. The substrate 42 can be directly fixed on the mounting seat 43, or the heat dissipation component 44 can also be fixed on the mounting seat 43. The substrate 42 is located between the heat dissipation component 44 and the mounting seat 43, so that the substrate 42 is clamped and fixed between the heat dissipation component 44 and the mounting seat 43; the substrate 42 has a first heat dissipation surface 424, which is located on the base material layer 420, and the first heat dissipation surface 424 is located on the side of the base material layer 420 facing away from the circuit layer 422 in the arrangement direction of the base material layer 420 and the circuit layer 422.

[0036] The heat dissipation assembly 44 includes a heat sink 441, which is fixed relative to the mounting base 43. The heat sink 441 can be directly mounted on the mounting base 43, or the heat sink 441 can be fixed to the mounting base 43 via the substrate 42. The substrate 42 of the light source assembly is located between the heat sink 441 and the mounting base 43. The first heat dissipation surface 424 of the substrate 42 faces the heat sink 441. The heat sink 441 has a first heat dissipation contact surface 443 facing the light source 41. The first heat dissipation contact surface 443 of the heat sink 441 is in thermal contact with the first heat dissipation surface 424 of the substrate 42. The heat dissipation of the light source assembly is achieved through the thermal contact between the heat sink 441 and the substrate 42. This helps to improve the heat dissipation efficiency of the light source 41 to meet the heat dissipation and cooling requirements of the high-power light source.

[0037] For some embodiments, please refer to Figure 3 The heat sink 441 is mounted on the mounting base 43 by screws. There are multiple screws, and the multiple screws are arranged around the substrate 42. The substrate 42 is pressed and fixed between the mounting base 43 and the heat sink 441 in the arrangement direction of the mounting base 43 and the heat sink 441 to achieve relative fixation of the substrate 42 and the mounting base 43.

[0038] The area of ​​the first heat dissipation contact surface 443 on the heat dissipation plate 441 is greater than or equal to the area of ​​the first heat dissipation surface 424. For example, in one embodiment, the area of ​​the first heat dissipation contact surface 443 is greater than the area of ​​the first heat dissipation surface 424, so as to achieve heat dissipation of the light source 41 through the larger size of the heat dissipation plate 441, thereby further improving the heat dissipation efficiency of the light source 41.

[0039] In another embodiment, under the condition that the installation space of the light source heat dissipation structure is limited, the area of ​​the first heat dissipation contact surface 443 can also be equal to the area of ​​the first heat dissipation surface 424, and a connecting ear plate is provided on the heat dissipation plate 441, and screws pass through the connecting ear plate to fix it to the mounting base 43.

[0040] In other embodiments, the substrate 42 of the light source assembly can be installed on the mounting base 43 by screws, and the heat sink 441 is located on the side of the substrate 42 facing away from the mounting base 43. The heat sink 441 is fixedly connected to the substrate 42 by screws, and the first heat dissipation contact surface 443 of the heat sink 441 is in thermal contact with the first heat dissipation surface 424 of the substrate 42 to achieve relative fixation of the heat sink 441 and the mounting base 43.

[0041] In the light source heat dissipation structure of the embodiment of the present application, the mounting base 43 has a blocking portion 432 that abuts against the substrate 42 in the arrangement direction of the substrate 42 and the heat dissipation plate 441. The blocking portion 432 is arranged around the light source body so that the blocking portion 432 encloses a light channel 434 corresponding to the light source 41. The light emitted by the light source 41 can be transmitted to the object to be tested along the light channel 434.

[0042] In order to further increase the heat dissipation efficiency of the light source 41, in some embodiments, please continue to refer to Figure 3 The substrate 42 is provided with a second heat dissipation surface 425 arranged opposite to the first heat dissipation surface 424. The second heat dissipation surface 425 can be located on the protective layer 423. The light source body can transfer heat to the protective layer 423 through the lead and the circuit layer 422, or the light source 41 can directly transfer heat to the protective layer 423 by heat conduction. In addition, a second heat dissipation contact surface 433 is provided on the supporting portion 432 of the mounting seat 43. The second heat dissipation contact surface 433 faces the substrate 42. The second heat dissipation contact surface 433 is arranged around the light passage 434, and the second heat dissipation contact surface 433 is in direct thermal contact with the second heat dissipation surface 425 to achieve heat dissipation of the light source 41 through the mounting seat 43.

[0043] In one embodiment, the surfaces on the substrate 42 that are arranged opposite to the first heat dissipation surface 424 and are not covered by the light source body, leads, and solder are all second heat dissipation surfaces 425. The area of ​​the second heat dissipation contact surface 433 on the blocking portion 432 can be set to be 1 / 2-3 / 4 of the area of ​​the second heat dissipation surface 425. For example, the second heat dissipation contact surface 433 can be set to cover 50% of the second heat dissipation surface 425, or to cover 75% of the second heat dissipation surface 425, or to cover 60% of the second heat dissipation surface 425. In this way, the heat dissipation efficiency of the mounting base 43 to the light source 41 is improved through the larger contact area between the mounting base 43 and the substrate 42.

[0044] Of course, if the heat dissipation requirements of the high-power light source can be met only by the thermal contact between the heat dissipation plate 441 and the first heat dissipation surface 424, it is also possible to set the contact area between the support portion 432 and the second heat dissipation surface 425 to be less than half of the area of ​​the second heat dissipation surface 425, so that the support portion 432 mainly plays a supporting role on the substrate 42.

[0045] For some embodiments, please refer to Figure 3In order to facilitate the installation and positioning of the substrate 42 on the mounting seat 43, the mounting seat 43 is provided with a mounting groove 431, the notch of the mounting groove 431 faces the heat dissipation plate 441, the blocking portion 432 forms the bottom wall of the mounting groove 431, and the light passage 434 is located on the bottom wall of the mounting groove 431, and the bottom wall surface of the mounting groove 431 forms the second heat dissipation contact surface 433 of the mounting seat 43; the substrate 42 is located in the mounting groove 431, and the shape of the mounting groove 431 can be set to be adapted to the outer contour shape of the substrate 42 to ensure that the substrate 42 is just placed in the mounting groove 431 and does not fall off, or the substrate 42 and the mounting groove 431 can be set to have an interference fit, so that the substrate 42 can be pre-positioned on the mounting seat 43 through the mounting groove 431, which facilitates the subsequent relative fixation of the substrate 42 and the mounting seat 43.

[0046] Of course, in other embodiments, the heat sink 441 is mounted on the mounting base 43 by multiple screws, and positioning notches corresponding to the positions of the screws can be set on the substrate 42. In the process of fixedly connecting the heat sink 441 and the mounting base 43, the screws are located in the notches, so as to achieve pre-positioning of the substrate 42 on the mounting base 43, making it convenient for the substrate 42 to be clamped and fixed between the mounting base 43 and the heat sink 441.

[0047] In some embodiments, in order to further increase the heat dissipation efficiency of the light source 41, a light source heat dissipation structure may be provided including a heat-conducting structure (not shown in the figure). The heat-conducting structure may include thermal grease or thermal paste. The heat-conducting structure may be provided between the heat dissipation plate 441 and the substrate 42. The heat-conducting structure is coated or pasted on the first heat dissipation surface 424, so that the first heat dissipation surface 424 is in thermal contact with the first heat dissipation contact surface 443 on the heat dissipation plate 441 through the heat-conducting structure, thereby improving the heat transfer efficiency between the first heat dissipation surface 424 and the first heat dissipation contact surface 443.

[0048] In addition, a heat conducting structure can be provided between the mounting base 43 and the substrate 42 so that the second heat dissipation surface 425 can be in thermal contact with the second heat dissipation contact surface 433 on the mounting base 43 through the heat conducting structure, thereby improving the heat transfer efficiency between the second heat dissipation surface 425 and the second heat dissipation contact surface 433.

[0049] Alternatively, the above-mentioned heat-conducting structure may be provided between the light source body and the base material layer 420 of the substrate 42 to improve the heat transfer efficiency between the light source body and the substrate 42 .

[0050] Of course, in order to save costs, if the heat dissipation and cooling effect of a high-power light source can be met, the setting of the heat-conducting structure can be cancelled, and only the first heat dissipation surface 424 is fitted with the first heat dissipation contact surface 443, the second heat dissipation surface 425 is fitted with the second heat dissipation contact surface 433, and the light source body is fitted with the base material layer 420 of the substrate 42.

[0051] In some embodiments, in order to increase the heat dissipation area of ​​the heat dissipation component 44, please refer to Figure 2 and Figure 3 A heat dissipation component 44 may also be provided, including a heat sink 442. The heat sink 442 is connected to the side of the heat sink 441 facing away from the light source component. A plurality of heat sinks 442 are provided. The plurality of heat sinks 442 are arranged in parallel and at intervals. The heat sinks 442 are arranged perpendicular to the heat sink 441. This can form a chimney effect, enhance air convection, and improve the heat dissipation effect of the light source.

[0052] In addition, in order to reduce the volume of the light source heat dissipation structure, the heat dissipation component 44 and the mounting seat 43 are configured as a cylindrical structure as a whole, and the diameter of the mounting seat 43 is substantially the same as the diameter of the heat dissipation component 44 .

[0053] In some embodiments, in order to detect the temperature of the light source 41 in real time, a light source heat dissipation structure is provided including a temperature sensor (not shown in the figure). The temperature sensor can be provided on the substrate 42. By measuring the temperature of the substrate 42 to monitor the temperature of the light source 41, it is convenient to understand the heat dissipation condition of the light source 41 in real time, which helps to ensure the normal operation of the electronic components around the light source 41.

[0054] The present application also provides an optical measuring instrument, which can be a confocal microscope, or a white light interferometer or other device that measures samples using optical principles. Figures 1 to 3 The optical measuring instrument includes a base 1, a measuring head 2, a workbench 3 and the light source heat dissipation structure of any of the above embodiments. The measuring head 2 and the workbench 3 can be reciprocally mounted on the base 1. The optical heat dissipation structure 4 can be mounted on the measuring head 2 as needed, or can also be mounted on the workbench 3, or the optical heat dissipation structure 4 can be mounted on both the measuring head 2 and the workbench 3. A plurality of optical elements 5 for adjusting the light path are mounted in the light passage 434 of the mounting base 43, such as an aperture, a focusing lens, a wave plate, etc., to meet various lighting requirements.

[0055] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art of the present invention can make some simple deductions, modifications or substitutions based on the concept of the present invention.

Claims

1. A light source heat dissipation structure, characterized in that: include: A light source assembly comprising a light source and a substrate, wherein the substrate comprises a substrate layer and a circuit layer, the light source being electrically connected to the circuit layer, the light source being located on a side of the substrate layer facing the circuit layer, and the substrate having a first heat dissipation surface located on the substrate layer; A mounting base, used for mounting and fixing the substrate, the mounting base having a light passage corresponding to the light source; The heat dissipation assembly comprises a heat dissipation plate, which is fixed relative to the mounting seat and has a first heat dissipation contact surface which is in thermal contact with the first heat dissipation surface.

2. The light source heat dissipation structure according to claim 1, wherein: The heat sink is mounted on the mounting seat, the substrate is press-fitted and fixed between the mounting seat and the heat sink in their arrangement direction, and the area of ​​the first heat dissipation contact surface is greater than or equal to the area of ​​the first heat dissipation surface.

3. The light source heat dissipation structure according to claim 1, wherein: The substrate has a second heat dissipation surface arranged opposite to the first heat dissipation surface, the mounting seat has a second heat dissipation contact surface in thermal contact with the second heat dissipation surface, and the second heat dissipation contact surface is arranged around the light passage.

4. The light source heat dissipation structure according to claim 3, wherein: The mounting seat has a mounting groove with a notch facing the heat dissipation plate, the light passage is located on the bottom wall of the mounting groove, the substrate is located in the mounting groove, the shape of the mounting groove is adapted to the outer contour of the substrate, and the bottom wall of the mounting groove forms the second heat dissipation contact surface.

5. The light source heat dissipation structure according to claim 3, wherein: The area of ​​the second heat dissipation contact surface is 1 / 2-3 / 4 of the area of ​​the second heat dissipation surface.

6. The light source heat dissipation structure according to any one of claims 1 to 5, characterized in that: The base material layer is a metal layer, the substrate has an insulating layer located between the base material layer and the circuit layer, the substrate has a groove, the base material layer forms the bottom wall of the groove, the light source is located in the groove, and the light source is in thermal contact with the bottom wall of the groove.

7. The light source heat dissipation structure according to any one of claims 1 to 5, characterized in that: The light source heat dissipation structure includes a heat-conducting structure, the heat-conducting structure is located between the heat dissipation plate and the first heat dissipation surface, and the heat-conducting structure includes thermal grease or thermal paste.

8. The light source heat dissipation structure according to any one of claims 1 to 5, characterized in that: The heat dissipation assembly includes a heat dissipation fin connected to a side of the heat dissipation plate facing away from the light source assembly, and the heat dissipation fin is arranged perpendicular to the heat dissipation plate.

9. The light source heat dissipation structure according to any one of claims 1 to 5, characterized in that: The light source heat dissipation structure includes a temperature sensor, which is arranged on the substrate to detect the temperature of the light source.

10. An optical measuring instrument, characterized in that: The device comprises a base, a measuring head, a workbench and the light source heat dissipation structure according to any one of claims 1 to 9, wherein the measuring head and the workbench are both mounted on the base, the light source heat dissipation structure is mounted on the measuring head and / or the workbench, and a plurality of optical elements for adjusting the light path are mounted on the mounting base, and the optical elements are located in the light passage.

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