Wafer surface color difference detection device

Abstract

The utility model relates to the technical field of chromatic aberration detection, in particular to a wafer surface chromatic aberration detection device, which comprises a base and a mounting frame, the lower end of the mounting frame is fixedly connected with the upper end of the base, a mounting block is fixedly connected to the inner wall of the mounting frame, a positioning clamp is fixedly connected to the inner wall of the mounting frame, a sliding groove is formed in one side of the mounting block, a plurality of fixing plates are fixedly connected to the inner wall of the sliding groove, and the distance between the fixing plates is customized. And a connecting strip is inserted between the fixing plates. By arranging the positioning clamp and the limiting clamp, one side of the wafer is attached to the positioning clamp, then the connecting strip is pulled upwards, and then the connecting strip slides in the sliding groove, so that the limiting clamp is driven to move, the limiting clamp is attached to the other side of the wafer, the wafer is firmly fixed, and the wafers with different diameters can be fixed. And the accuracy of color difference detection of the wafer product is improved, so that the control on the production process and the product quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of color difference detection, in particular to a device for detecting color difference on a wafer surface. Background Art

[0002] A wafer surface color difference detection device is a specially designed and meticulously manufactured high-precision inspection device. Its core function focuses on detecting color differences on the wafer surface. By employing advanced detection technology and sophisticated instrumentation, it aims to achieve accurate and rapid detection of color differences on the wafer surface. The device's application aims to ensure that wafer product quality meets high standards through precise testing, thereby further enhancing product reliability and market competitiveness.

[0003] While this device can detect color differences on wafer surfaces, due to the wide variety of wafer diameters, the insecure mounting method caused by these differences makes it difficult to effectively control vibrations or minor movements during the inspection process, which in turn affects the accuracy of the inspection results. This fluctuation in accuracy further affects the accuracy of color difference inspection of wafer products, posing a potential risk to production processes and product quality control. Therefore, we propose a device for detecting color differences on wafer surfaces. Utility Model Content

[0004] Technical problems solved

[0005] To address the above-mentioned shortcomings of the existing technology, the present invention provides a wafer surface color difference detection device that solves the problem that due to the various wafer diameter specifications, the unstable fixing method caused by the wafer diameter differences can make it difficult to effectively control vibrations or small movements during the detection process, which in turn affects the accuracy of the detection results to a certain extent. This fluctuation in accuracy further affects the accurate assessment of wafer product quality, thereby posing potential risks to the control of production processes and product quality.

[0006] Technical Solution

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The utility model provides a wafer surface color difference detection device, comprising a base and a mounting frame; the lower end of the mounting frame is fixedly connected to the upper end of the base, the inner wall of the mounting frame is fixedly connected with a mounting block, the inner wall of the mounting frame is fixedly connected with a positioning clamp, a sliding groove is opened on one side of the mounting block, a plurality of fixed plates are fixedly connected to the inner wall of the sliding groove, the distance between the fixed plates is customized, a connecting strip is inserted between the fixed plates, and one side of the connecting strip is fixedly connected to a limiting clamp.

[0009] Furthermore, a side of the limiting clamp away from the connecting bar is fixedly connected to a sliding bar, and a side of the mounting bracket away from the mounting block is fixedly connected to a sliding block.

[0010] Furthermore, a moving groove is formed on the inner wall of the sliding block, and the moving groove passes through the sliding block.

[0011] Furthermore, the inner walls of the limiting clamp and the positioning clamp are fixedly connected with a friction film.

[0012] Furthermore, a detection head is fixedly connected to the lower end of the inner wall of the mounting frame, and a control panel is fixedly connected to the outer side of the mounting frame.

[0013] Furthermore, the lower end of the base is fixedly connected to a supporting foot, and the lower end of the supporting foot is fixedly connected to a baffle.

[0014] Furthermore, the lower end of the baffle is slidably connected to a fixed block, the upper end of the fixed block is provided with a mounting groove, and the inner wall of the mounting groove is fixedly connected to an electric telescopic column.

[0015] Beneficial effects

[0016] Compared with the known public technologies, the technical solution provided by this utility model has the following beneficial effects:

[0017] The utility model is provided with a positioning clamp and a limiting clamp. One side of the wafer is attached to the positioning clamp, and then the connecting bar is pulled up and then the connecting bar is slid in the sliding groove, thereby driving the limiting clamp to move, so that the limiting clamp is attached to the other side of the wafer, thereby firmly fixing the wafer, thereby being able to fix wafers of different diameters, improving the accuracy of color difference detection of wafer products, and thus improving the control of production process and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the detection device of the present utility model;

[0020] Figure 2 This is a schematic diagram of the explosion structure of the detection device of the utility model;

[0021] Figure 3 This is a schematic diagram of the connection structure between the mounting block and the sliding block of the utility model;

[0022] Figure 4 This is a schematic diagram of the internal structure of the fixed block of the present utility model.

[0023] The numbers in the figure represent:

[0024] 100. Base; 200. Mounting frame; 201. Positioning clamp; 202. Mounting block; 203. Sliding slot; 204. Fixing plate; 205. Connecting bar; 206. Limiting clamp; 207. Sliding bar; 208. Sliding block; 209. Moving slot; 210. Friction film; 300. Detection head; 400. Control panel; 500. Support foot; 501. Baffle; 502. Fixing block; 503. Mounting slot; 504. Electric telescopic column. DETAILED DESCRIPTION

[0025] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0026] The present invention will be further described below with reference to the embodiments.

[0027] An embodiment of a wafer surface color difference detection device includes a base 100 and a mounting frame 200; the lower end of the mounting frame 200 is fixedly connected to the upper end of the base 100, the inner wall of the mounting frame 200 is fixedly connected to a mounting block 202, the inner wall of the mounting frame 200 is fixedly connected to a positioning clamp 201, a sliding groove 203 is opened on one side of the mounting block 202, and a plurality of fixed plates 204 are fixedly connected to the inner wall of the sliding groove 203, the distance between the fixed plates 204 is customized, and connecting strips 205 are inserted between the fixed plates 204, and a limiting clamp 206 is fixedly connected to one side of the connecting strip 205. Specifically, in the present application, a positioning clamp 201 and a limiting clamp 206 are provided, one side of the wafer is attached to the positioning clamp 201, and then the connecting bar 205 is pulled up, and then the connecting bar 205 is slid in the sliding groove 203, thereby driving the limiting clamp 206 to move, so that the limiting clamp 206 is attached to the other side of the wafer, thereby firmly fixing the wafer, so that wafers of different diameters can be fixed, thereby improving the accuracy of color difference detection of wafer products, thereby improving the control of production processes and product quality.

[0028] A sliding bar 207 is fixedly connected to the side of the limiting clamp 206 away from the connecting bar 205. A sliding block 208 is fixedly connected to the side of the mounting frame 200 away from the mounting block 202. A moving groove 209 is defined in the inner wall of the sliding block 208 and extends through the sliding block 208. A friction film 210 is fixedly connected to the inner walls of the limiting clamp 206 and the positioning clamp 201. The sliding bar 207 slides within the moving groove 209 in the sliding block 208, thereby enabling the limiting clamp 206 to move smoothly. The friction film 210 in the limiting clamp 206 and the positioning clamp 201 can securely fix the wafer.

[0029] The lower end of the inner wall of the mounting frame 200 is fixedly connected to the inspection head 300, and the outer side of the mounting frame 200 is fixedly connected to the control panel 400. The lower end of the base 100 is fixedly connected to the support leg 500, and the lower end of the support leg 500 is fixedly connected to the baffle 501. The lower end of the baffle 501 is slidably connected to the fixed block 502. The upper end of the fixed block 502 has a mounting slot 503, and the inner wall of the mounting slot 503 is fixedly connected to the electric telescopic column 504. The inspection head 300 can be used to detect color differences on the wafer surface, and the control panel 400 can be used to control the electric telescopic column 504, so that the electric telescopic column 504 pushes the baffle 501 to slide within the mounting slot 503, thereby driving the support leg 500 upward, thereby moving the base 100 to the appropriate height.

[0030] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A wafer surface color difference detection device, characterized in that: include: Base (100); A mounting frame (200) is provided, wherein the lower end of the mounting frame (200) is fixedly connected to the upper end of the base (100), the inner wall of the mounting frame (200) is fixedly connected to a mounting block (202), the inner wall of the mounting frame (200) is fixedly connected to a positioning clamp (201), a sliding groove (203) is provided on one side of the mounting block (202), a plurality of fixing plates (204) are fixedly connected to the inner wall of the sliding groove (203), the distance between the fixing plates (204) is customized, a connecting strip (205) is inserted between the fixing plates (204), and a limiting clamp (206) is fixedly connected to one side of the connecting strip (205).

2. The device for detecting color difference on a wafer surface according to claim 1, wherein: The side of the limiting clamp (206) away from the connecting bar (205) is fixedly connected to a sliding bar (207), and the side of the mounting frame (200) away from the mounting block (202) is fixedly connected to a sliding block (208).

3. The device for detecting color difference on a wafer surface according to claim 2, wherein: The inner wall of the sliding block (208) is provided with a moving groove (209), and the moving groove (209) passes through the sliding block (208).

4. The wafer surface color difference detection device according to claim 1, characterized in that: The inner walls of the limiting clamp (206) and the positioning clamp (201) are fixedly connected with a friction film (210).

5. The wafer surface color difference detection device according to claim 1, characterized in that: A detection head (300) is fixedly connected to the lower end of the inner wall of the mounting frame (200), and a control panel (400) is fixedly connected to the outer side of the mounting frame (200).

6. The wafer surface color difference detection device according to claim 1, characterized in that: The lower end of the base (100) is fixedly connected to a supporting foot (500), and the lower end of the supporting foot (500) is fixedly connected to a baffle (501).

7. The wafer surface color difference detection device according to claim 6, characterized in that: The lower end of the baffle (501) is slidably connected to a fixed block (502), the upper end of the fixed block (502) is provided with a mounting groove (503), and the inner wall of the mounting groove (503) is fixedly connected to an electric telescopic column (504).

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