Auxiliary heat dissipation device for cloud computer all-in-one machine

Abstract

The utility model discloses an auxiliary heat dissipation device for a cloud computer all-in-one machine, which comprises a machine body, a circuit board arranged in the back of the machine body, a heat dissipation seat arranged on one side of the circuit board, a heat dissipation rear cover fixedly connected with one side of the machine body on the circuit board through screws, and a heat conduction plate arranged on one end of the heat dissipation seat on the heat dissipation rear cover. The heat dissipation base is provided with a heat conduction plate, heat conduction silica gel is attached to the same side of the heat dissipation base and the heat conduction plate, the side, opposite to the heat dissipation base, of the heat conduction silica gel is attached to the inner side of the heat dissipation rear cover, and an air guide partition plate is arranged on the inner side of the heat dissipation base. When the exhaust fan on the heat dissipation base dissipates heat, dust in the external environment cannot enter the interior of the all-in-one machine and fall on the circuit board, the cleanliness is further guaranteed, heat can be transmitted to the heat dissipation rear cover through the heat dissipation base, the heat conduction plate and the heat conduction silica gel to dissipate heat outwards, the heat dissipation area can be effectively increased through the heat dissipation rear cover, and the heat dissipation speed is further guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of all-in-one heat dissipation devices, and in particular to an auxiliary heat dissipation device for a cloud computer all-in-one. Background Art

[0002] A cloud-based all-in-one computer is a new type of computer device that combines cloud computing technology with all-in-one hardware design. Typically consisting of a monitor and a keyboard and mouse, all computing resources are centralized in the cloud. Users simply activate the monitor, log in to their account, and connect to a cloud server, gaining access to the computing power they need, enabling them to easily handle various office, creative, and entertainment activities.

[0003] However, since big data cloud computing all-in-one machines have high requirements for operating speed and data processing capabilities, they also place high demands on the hardware configuration of the machines themselves. Existing heat dissipation methods for big data cloud computing all-in-one machines typically only use a radiator and a cooling fan to dissipate heat from the CPU inside the all-in-one machine. This method not only has limited heat dissipation, but also allows dust from the outside air to easily enter the all-in-one machine and adhere to the circuit boards when the cooling fan on the radiator exchanges heat with the outside world. Therefore, an auxiliary heat dissipation device for a cloud computer all-in-one machine is provided to solve the above problems. Utility Model Content

[0004] In order to solve the problems in the above background technology, the technical solution adopted by the present invention to solve the technical problems is: an auxiliary heat dissipation device for a cloud computer all-in-one machine, which includes: a body, a circuit board is installed inside the back of the body, a heat dissipation seat is provided on one side of the circuit board, the body is located on one side of the circuit board and is fixedly connected to a heat dissipation back cover by screws, the heat dissipation seat is located at one end of the heat dissipation back cover and is provided with a heat conducting plate, thermal conductive silicone is adhered to the same side of the heat dissipation seat as the heat conducting plate, the thermal conductive silicone is adhered to the inner side of the heat dissipation back cover on the opposite side of the heat dissipation seat, and an air guide baffle is provided on the inner side of the heat dissipation seat.

[0005] As an optimal technical solution of the present invention, there are two air guide baffles, a fan seat is installed between the two air guide baffles, an exhaust fan is installed inside the fan seat, and there are two exhaust fans.

[0006] As a preferred technical solution of the present invention, a heat sink is provided on a side of the heat sink facing the air guide baffle, and a plurality of heat sinks are provided, each of which is provided with a through hole.

[0007] As a preferred technical solution of the present invention, a distance is reserved between the heat sink and the air guide baffle, and an air inlet is reserved between the air guide baffle and the inner side of the heat sink.

[0008] As an optimal technical solution of the present invention, a fixing seat is provided on one side of the heat sink close to the circuit board. The fixing seat is fixedly connected to the circuit board by screws. The heat sink is located on the outer side of one end of the circuit board and is fitted with CPU heat dissipation silicone.

[0009] As an optimal technical solution of the present invention, the heat sink and the heat conducting plate are both made of copper, the heat sink back cover is made of aluminum, heat sink fins are provided on the outside of the heat sink back cover, and a dustproof net is fixed to the outside of one end of the heat sink back cover facing the heat sink by screws.

[0010] The utility model has the following advantages: the utility cloud computer all-in-one adopts a heat sink that is attached to the heat dissipation back cover through thermal conductive silicone, so that when the exhaust fan on the heat sink is dissipating heat, dust in the external environment will not enter the all-in-one machine and fall on the circuit board, thereby further ensuring cleanliness;

[0011] Heat can be transferred to the heat dissipation back cover and dissipated outward through the heat dissipation seat, heat conduction plate and thermal conductive silicone. The heat dissipation back cover can effectively increase the heat dissipation area and further ensure the heat dissipation speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of a cloud computer all-in-one machine according to a preferred embodiment of the present invention;

[0013] Figure 2 This is a schematic diagram of the disassembled structure of the heat dissipation rear cover and the body of the preferred embodiment of the utility model;

[0014] Figure 3 This is a schematic cross-sectional structural diagram of the heat dissipation seat of a preferred embodiment of the present utility model;

[0015] Figure 4 This is a preferred embodiment of the utility model Figure 3 Schematic diagram of the side structure of the heat sink.

[0016] Explanation of the accompanying symbols: 1. Body; 2. Circuit board; 3. Heat dissipation back cover; 4. Heat dissipation seat; 5. Air guide baffle; 6. Fan seat; 7. Exhaust fan; 8. Heat conduction plate; 9. Thermal conductive silicone; 10. Heat sink; 11. Through hole; 12. Fixing seat; 13. Heat dissipation fins; 14. Dustproof net; 15. CPU heat dissipation silicone. DETAILED DESCRIPTION

[0017] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," "outside," and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0019] The present invention will be further described below with reference to the accompanying drawings.

[0020] Please refer to Figures 1-4 The utility model is an auxiliary heat dissipation device for a cloud computer all-in-one, comprising: a body 1, a circuit board 2 is installed inside the back of the body 1, a heat sink 4 is provided on one side of the circuit board 2, the body 1 is fixedly connected to a heat dissipation back cover 3 by screws on one side of the circuit board 2, the heat dissipation seat 4 is located at one end of the heat dissipation back cover 3 and is provided with a heat conducting plate 8, a heat conducting silicone rubber 9 is adhered to the same side of the heat dissipation seat 4 as the heat conducting plate 8, and the heat conducting silicone rubber 9 is adhered to the inner side of the heat dissipation back cover 3 on the opposite side of the heat dissipation seat 4, and an air guide baffle 5 is provided inside the heat dissipation seat 4.

[0021] Combine Figure 3 and Figure 4 As shown, there are two air guide baffles 5, and a fan seat 6 is installed between the two air guide baffles 5. The heat inside the heat sink 4 is then discharged outward from the exhaust fan 7. An exhaust fan 7 is installed inside the fan seat 6. There are two exhaust fans 7. A heat sink 10 is provided on the side of the heat sink 4 facing the air guide baffle 5. There are several heat sinks 10. The heat sink 10 is provided with through holes 11. A spacing is reserved between the heat sink 10 and the air guide baffles 5. The heat sink 10 and the through holes 11 make it easier for air to circulate and take away heat during circulation. An air inlet is reserved between the air guide baffle 5 and the inner side of the heat sink 4. The air guide baffle 5 facilitates external air to enter from the upper and lower ends of the heat sink 4.

[0022] Among them, the heat sink 4 is provided with a fixing seat 12 on the side close to the circuit board 2, and the fixing seat 12 is fixedly connected to the circuit board 2 by screws. The heat sink 4 is located on the outer side of one end of the circuit board 2 and is attached with CPU heat dissipation silicone 15, thereby preventing the heat sink 4 from directly contacting the CPU and causing wear on the CPU. The heat sink 4 and the heat conducting plate 8 are both made of copper. Figure 2 As shown, the heat dissipation back cover 3 is made of aluminum, and heat dissipation fins 13 are provided on the outside of the heat dissipation back cover 3, thereby increasing the heat dissipation area of ​​the heat dissipation back cover 3. The outside of one end of the heat dissipation back cover 3 facing the heat dissipation seat 4 is fixed with a dustproof net 14 by screws.

[0023] Specifically, when the present invention is in use, the heat generated by the CUP on the circuit board 2 is transferred to the heat sink 4 through the CPU heat dissipation silica gel 15, and then the heat sink 4 transfers the heat to the heat conducting plate 8 and the heat sink 10, and then the heat conducting plate 8 transfers the heat to the heat conducting silica gel 9, and the heat is transferred to the heat dissipation back cover 3 through the heat conducting silica gel 9 for outward heat dissipation, and at the same time, the exhaust fan 7 is operated to draw air out from the inside of the heat sink 4, and then the outside air enters from the air inlet between the air guide partition 5 and the inner side of the heat sink 4. The incoming fresh air takes away the heat from the heat sink 10 inside the heat sink 4 and is discharged outward from the exhaust fan 7, thereby achieving heat dissipation of the CPU.

[0024] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

[0025] Other parts of the present invention that are not described in detail belong to the prior art and will not be described in detail here.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An auxiliary heat dissipation device for a cloud computer all-in-one, comprising: The machine body (1) is characterized in that a circuit board (2) is installed inside the back of the machine body (1), a heat sink (4) is provided on one side of the circuit board (2), the machine body (1) is fixedly connected to a heat sink back cover (3) on one side of the circuit board (2) by screws, the heat sink (4) is provided with a heat conducting plate (8) at one end of the heat sink back cover (3), a heat conducting silica gel (9) is attached to the same side of the heat sink (4) as the heat conducting plate (8), the heat conducting silica gel (9) is attached to the inner side of the heat sink back cover (3) on the opposite side of the heat sink (4), and an air guide baffle (5) is provided on the inner side of the heat sink (4).

2. The auxiliary heat dissipation device for a cloud computer as claimed in claim 1, characterized in that: There are two air guide baffles (5), a fan seat (6) is installed between the two air guide baffles (5), an exhaust fan (7) is installed inside the fan seat (6), and there are two exhaust fans (7).

3. The auxiliary heat dissipation device for a cloud computer as claimed in claim 1, characterized in that: A heat sink (10) is provided on one side of the heat sink seat (4) facing the air guide baffle (5). There are a plurality of heat sinks (10), and each heat sink (10) is provided with a through hole (11).

4. The auxiliary heat dissipation device for a cloud computer as claimed in claim 3, characterized in that: A spacing is reserved between the heat sink (10) and the air guide baffle (5), and an air inlet is reserved between the air guide baffle (5) and the inner side of the heat sink (4).

5. The auxiliary heat dissipation device for a cloud computer as claimed in claim 1, characterized in that: A fixing seat (12) is provided on one side of the heat sink (4) close to the circuit board (2); the fixing seat (12) is fixedly connected to the circuit board (2) by screws; and a CPU heat dissipation silica gel (15) is attached to the outer side of one end of the heat sink (4) on the circuit board (2).

6. The auxiliary heat dissipation device for a cloud computer as claimed in claim 1, characterized in that: The heat sink (4) and the heat conducting plate (8) are both made of copper, the heat sink rear cover (3) is made of aluminum, heat sink fins (13) are provided on the outside of the heat sink rear cover (3), and a dust screen (14) is fixedly connected to the outside of one end of the heat sink rear cover (3) facing the heat sink (4) by screws.

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