Electronic device

Abstract

The embodiment of the utility model provides an electronic device which comprises a screen module, an ultrasonic fingerprint module and a conductive supporting structure, the ultrasonic fingerprint module is bonded to the screen module, and a conductive connecting layer is arranged on the side, back to the screen module, of the ultrasonic fingerprint module; the conductive supporting structure is supported on the side, back to the screen module, of the ultrasonic fingerprint module and is electrically connected with the conductive connecting layer. The conductive supporting structure not only can be electrically connected with the conductive connecting layer, but also can support the ultrasonic fingerprint module from one side back to the screen module, so that the ultrasonic fingerprint module is prevented from being damaged when the screen module is pressed or impacted, and the stability of the ultrasonic fingerprint module is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic information technology, and in particular to an electronic device. Background Art

[0002] With the continuous development of electronic information technology, electronic devices such as smartphones and tablets have become widely used and have become indispensable electronic products in users' lives. As screen transmittance decreases, the performance of optical fingerprints gradually declines, and ultrasonic fingerprints have attracted widespread attention. However, in related technologies, ultrasonic fingerprints attached to the screen are easily damaged by external impacts, making the reliability of ultrasonic fingerprints a pressing issue. Utility Model Content

[0003] The present disclosure provides an electronic device to solve at least one technical problem in the related art.

[0004] The electronic device provided by the present disclosure includes:

[0005] Screen module;

[0006] An ultrasonic fingerprint module is bonded to the screen module, and a conductive connection layer is provided on the side of the ultrasonic fingerprint module facing away from the screen module;

[0007] A conductive supporting structure is supported on a side of the ultrasonic fingerprint module facing away from the screen module and is electrically connected to the conductive connecting layer.

[0008] Optionally, the ultrasonic fingerprint module includes a substrate and a sensor, the sensor is bonded to the screen module, and the substrate is connected to a side of the sensor facing away from the screen module;

[0009] The substrate is provided with a conductive interface, and the conductive connection layer covers the conductive interface and is electrically connected to the sensor.

[0010] Optionally, the conductive connection layer includes:

[0011] a conductive seed layer, at least partially located within the conductive interface and electrically connected to the sensor;

[0012] an insulating layer covering the conductive seed layer;

[0013] A plurality of conductive channels are formed in the insulating layer and electrically connected to the conductive seed layer.

[0014] Optionally, a portion of the conductive connection layer covers the conductive interface, and another portion covers a portion of the substrate located around the conductive interface; and / or

[0015] The edges of the conductive seed layer and the insulating layer are flush.

[0016] Optionally, the conductive support structure includes:

[0017] Flexible circuit boards;

[0018] a conductive layer connected between the flexible circuit board and the conductive connecting layer;

[0019] The insulating support layer is connected between the flexible circuit board and the ultrasonic fingerprint module.

[0020] Optionally, the conductive layer is an anisotropic conductive film; and / or

[0021] The conductive layer is a welding layer; and / or

[0022] The insulating support layer is an adhesive layer.

[0023] Optionally, it further includes an abutment member abutting against the side of the flexible circuit board facing away from the ultrasonic fingerprint module.

[0024] Optionally, a side of the abutment member facing the flexible circuit board is flat, and the flexible circuit board is arranged in close contact with the abutment member.

[0025] Optionally, a protrusion is provided on a portion of the abutment member facing the flexible circuit board and corresponding to the insulating support layer, and an avoidance groove is provided on the flexible circuit board corresponding to the protrusion.

[0026] Optionally, it further includes an abutment member abutting against a side of the conductive support module facing away from the ultrasonic fingerprint module.

[0027] Optionally, the abutment member includes a VC heat spreader.

[0028] Optionally, it also includes a foam layer connected to the side of the screen module facing the ultrasonic fingerprint module, the foam layer is provided with a receiving groove perpendicular to the direction of the screen module, at least part of the ultrasonic fingerprint module is located in the receiving groove and is bonded to the screen module.

[0029] Optionally, in a direction perpendicular to the depth direction of the accommodating groove, a difference between a size of the accommodating groove and a size of the ultrasonic fingerprint module is not greater than a set limit.

[0030] Optionally, an adhesive layer is also included, connected between the screen module and the ultrasonic fingerprint module.

[0031] Optionally, in a direction from the screen module toward the ultrasonic fingerprint module, the bonding layer includes an adhesive layer, a metal shielding layer, and an ink coating layer connected in sequence.

[0032] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0033] It can be seen from the above embodiments that the electronic device disclosed in the present invention includes a screen module, an ultrasonic fingerprint module and a conductive support structure. The ultrasonic fingerprint module is bonded to the screen module to facilitate the collection of fingerprint information that contacts the screen module, and a conductive connection layer is provided on the side of the ultrasonic fingerprint module that is away from the screen module, and the ultrasonic fingerprint module communicates through the conductive connection layer. The conductive support structure is supported on the side of the ultrasonic fingerprint module that is away from the screen module and is electrically connected to the conductive connection layer. In this way, the conductive support structure can not only be electrically connected to the conductive connection layer and communicate with the ultrasonic fingerprint module, but also support the ultrasonic fingerprint module from the side facing away from the screen module, thereby avoiding damage to the ultrasonic fingerprint module when the screen module is subjected to pressure or impact, and improving the stability of the ultrasonic fingerprint module.

[0034] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0036] Figure 1 is a schematic structural diagram of an electronic device according to an exemplary embodiment;

[0037] Figure 2 for Figure 1 A schematic diagram of the internal structure of the electronic device shown;

[0038] Figure 3 for Figure 2 A schematic structural diagram of an embodiment of an ultrasonic fingerprint module and a conductive support structure in an electronic device is shown;

[0039] Figure 4 for Figure 2 A schematic structural diagram of another embodiment of an ultrasonic fingerprint module and a conductive support structure in an electronic device is shown;

[0040] Figure 5 for Figure 4 A top view of the ultrasonic fingerprint module and conductive support structure in the electronic device is shown.

[0041] Figure numerals: electronic device 10, screen module 20, display layer 21, touch layer 22, cover layer 23, foam layer 24, accommodating groove 241, adhesive layer 25, ultrasonic fingerprint module 30, conductive connecting layer 31, conductive seed layer 311, substrate 32, sensor 33, conductive interface 34, conductive support structure 40, flexible circuit board 41, conductive layer 42, insulating support layer 43, avoidance groove 411, abutment 50. DETAILED DESCRIPTION

[0042] Here, the technical solutions in the embodiments (or "implementations") of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0043] If there are terms related to directional indications or positional relationships in the embodiments of the present disclosure (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first" and "second" in the embodiments of the present disclosure are only used for the purpose of convenience of description and should not be understood as indicating or implying relative importance.

[0044] See also Figure 1 and Figure 2 As shown, Figure 1 FIG. 1 is a schematic structural diagram of an electronic device according to an exemplary embodiment. Figure 2 for Figure 1 Schematic diagram of the internal structure of the electronic device shown.

[0045] An embodiment of the present disclosure provides an electronic device 10, which may be a portable electronic product such as a mobile phone, tablet computer, laptop computer, wearable device, smart bracelet, smart watch, etc. that includes a screen and uses fingerprint unlocking, or an electronic product such as a fingerprint door lock and fingerprint car lock.

[0046] The electronic device 10 provided in this disclosure includes a screen module 20, an ultrasonic fingerprint module 30, and a conductive support structure 40. The ultrasonic fingerprint module 30 is bonded to the screen module 20, and a conductive connection layer 31 is provided on the side of the ultrasonic fingerprint module 30 facing away from the screen module 20. The conductive support structure 40 is supported on the side of the ultrasonic fingerprint module 30 facing away from the screen module 20 and is electrically connected to the conductive connection layer 31.

[0047] The electronic device 10 disclosed in the present invention includes a screen module 20, an ultrasonic fingerprint module 30, and a conductive support structure 40. The ultrasonic fingerprint module 30 is bonded to the screen module 20 to facilitate the collection of fingerprint information that contacts the screen module 20, and a conductive connection layer 31 is provided on the side of the ultrasonic fingerprint module 30 that faces away from the screen module 20, and the ultrasonic fingerprint module 30 communicates through the conductive connection layer 31. The conductive support structure 40 is supported on the side of the ultrasonic fingerprint module 30 that faces away from the screen module 20 and is electrically connected to the conductive connection layer 31. In this way, the conductive support structure 40 can not only be electrically connected to the conductive connection layer 31 and communicate with the ultrasonic fingerprint module 30, but can also support the ultrasonic fingerprint module 30 from the side facing away from the screen module 20, thereby preventing the ultrasonic fingerprint module 30 from being damaged when the screen module 20 is subjected to pressure or impact, thereby improving the stability of the ultrasonic fingerprint module 30.

[0048] exist Figure 1 and Figure 2 In the illustrated embodiment, the electronic device 10 is a mobile phone with an ultrasonic fingerprint unlocking function, and the mobile phone includes a screen module 20 and an ultrasonic fingerprint module 30 located below the screen. From the direction close to the ultrasonic fingerprint module 30 to the direction away from the ultrasonic fingerprint module 30, the screen module 20 includes a display layer 21, a touch layer 22 and a cover layer 23 connected in sequence. The display layer 21 is responsible for displaying images and information. Depending on different technologies, the display layer 21 can be an LCD (liquid crystal display), an OLED (organic light emitting diode), etc. The touch layer 22 covers the display layer 21 and is responsible for sensing touch operations. The touch layer 22 can use capacitive or resistive technology. The cover layer 23 covers the touch layer 22 and is usually made of glass or plastic material. It protects the display layer 21 and the touch layer 22, and also provides certain structural support.

[0049] like Figure 1 As shown, when the electronic device 10 is unlocked, a fingerprint recognition indication will be displayed at the bonding position of the ultrasonic fingerprint module 30 on the screen module 20. When the finger touches the top of the screen, the position is first reported through the touch layer 22, and the processor decides whether to wake up the ultrasonic fingerprint module 30 based on the reported position information. If the finger touches the bonding position of the ultrasonic fingerprint module 30 on the screen module 20, the ultrasonic fingerprint module 30 will be awakened to work. The ultrasonic fingerprint module 30 emits ultrasonic waves, and the ultrasonic signal will propagate in the form of sound waves and come into contact with the fingerprint. When the ultrasonic wave encounters the ridges and valleys on the surface of the fingerprint, part of the signal will be reflected back to the ultrasonic fingerprint module 30. Due to the different surface features of the fingerprint, the reflected signal intensity and time will be different. The received signal is processed by digital signal and compared with the fingerprint template stored in the database to determine whether they are consistent, and prompt whether the unlocking is successful or failed.

[0050] The ultrasonic fingerprint module 30 is bonded to the screen module 20, which can fix the ultrasonic module and prevent the ultrasonic fingerprint module 30 from moving relative to the screen module 20. It can also ensure a tight connection between the ultrasonic fingerprint module 30 and the screen module 20, avoiding bubbles and gaps between the ultrasonic fingerprint module 30 and the screen module 20, which would affect the ultrasonic fingerprint module 30 from collecting fingerprint information covered by the screen module 20.

[0051] In this embodiment, the electronic device 10 also includes a foam layer 24, which is connected to the side of the screen module 20 facing the ultrasonic fingerprint module 30. The foam layer 24 is provided with a receiving groove 241 perpendicular to the direction of the screen module. At least part of the ultrasonic fingerprint module 30 is located in the receiving groove 241 and is bonded to the screen module 20.

[0052] The foam layer 24 provides shock absorption, cushioning, and cushioning, protecting the screen assembly. It also forms a good seal between the screen and the housing. The foam layer 24 improves the overall performance and reliability of the screen module 20. A recess 241 perpendicular to the screen is provided in the foam layer 24, allowing at least a portion of the ultrasonic fingerprint module 30 to reside within it. This provides space for and protects the ultrasonic fingerprint module 30.

[0053] In the direction perpendicular to the depth direction of the accommodating groove 241, the difference between the size of the accommodating groove 241 and the size of the ultrasonic fingerprint module 30 is not greater than the set limit. In some embodiments, the size of the accommodating groove 241 is the same as the size of the ultrasonic fingerprint module 30. Taking into account factors such as processing errors, the tolerance of the accommodating groove 241 is 0.5 mm, that is, the size of the accommodating groove 241 is not greater than 0.5 mm of the size of the ultrasonic fingerprint module 30. In this way, not only can the size of the groove of the foam layer 24 be reduced without affecting the protection of the foam layer 24 to the screen module 20, but also the accommodating groove 241 can be closely fitted to the ultrasonic fingerprint module 30, protecting the ultrasonic fingerprint module 30 in the circumferential direction of the ultrasonic fingerprint module 30.

[0054] In this embodiment, the electronic device 10 further includes an adhesive layer 25 connected between the screen module 20 and the ultrasonic fingerprint module 30. The adhesive layer 25 is used to connect the screen module 20 and the ultrasonic fingerprint module 30.

[0055] From the screen module 20 toward the ultrasonic fingerprint module 30, the adhesive layer 25 includes an adhesive layer, a metal shielding layer, and an ink coating layer connected in sequence. The adhesive layer provides good bonding performance, ensuring a tight bond between the screen module 20 and the ultrasonic fingerprint module 30, and avoiding separation due to thermal expansion and contraction or mechanical impact. The metal shielding layer provides electromagnetic shielding to prevent electromagnetic interference between the screen module 20 and the ultrasonic fingerprint module 30, thereby improving the stability and reliability of the electronic device 10. The ink coating layer can reduce reflections, preventing the ultrasonic fingerprint module 30 from adhering to the screen module 20 and affecting the display effect of the screen module 20.

[0056] Please refer to Figure 3 , Figure 3 for Figure 2 FIG. 1 is a schematic diagram of an embodiment of an ultrasonic fingerprint module 30 and a conductive support structure 40 in an electronic device 10. Figure 3 As shown, the ultrasonic fingerprint module 30 includes a substrate 32 and a sensor 33. The sensor 33 is bonded to the screen module 20, and the substrate 32 is connected to the side of the sensor 33 facing away from the screen module 20. The substrate 32 has a conductive interface 34, and the conductive connection layer 31 covers the conductive interface 34 and is electrically connected to the sensor 33.

[0057] The substrate 32 provides mechanical support for the sensor 33 and is provided with a conductive interface 34, which is electrically connected to the sensor 33. The sensor 33 transmits signals to other circuits and systems via the conductive interface 34 provided on the substrate 32. The ultrasonic sensor 33 is responsible for capturing fingerprint information. The conductive connection layer 31 covers the conductive interface 34 and is electrically connected to the sensor 33. The sensor 33 can communicate with the conductive connection layer 31, which covers the conductive interface 34.

[0058] In some embodiments, the conductive connection layer 31 includes a conductive seed layer 311, an insulating layer, and multiple conductive channels. The conductive seed layer 311 is at least partially located within the conductive interface 34 and electrically connected to the sensor 33. The insulating layer covers the conductive seed layer 311. Multiple conductive channels are formed within the insulating layer and electrically connected to the conductive seed layer 311. One end of the multiple conductive channels is connected to the sensor 33 through the conductive seed layer 311, and the other end is connected to the conductive support structure 40, facilitating communication between the sensor 33 and the conductive support structure 40.

[0059] The fabrication of the conductive connection layer 31 generally includes the following steps: First, a conductive seed layer 311 is deposited or sputtered at the conductive interface 34 of the ultrasonic fingerprint module 30. The conductive seed layer 311 is at least partially located within the conductive interface 34, and a portion of the conductive seed layer 311 is located on the substrate 32 near the conductive interface 34. The substrate 32 provides support for the conductive seed layer 311. The conductive seed layer 311 is electrically connected to the sensor 33. The conductive seed layer 311 is deposited or sputtered using physical vapor deposition (PVD) technology to deposit a thin layer of conductive material at the conductive interface 34 to facilitate the subsequent electroplating process.

[0060] Next, an insulating layer is spin-coated on the conductive seed layer 311 using a spin-coating technique to achieve a uniform thickness. The insulating layer is then hardened by thermal or photocuring, and the unwanted portions are removed using etching techniques to form the desired pattern. Generally, the desired pattern is in the shape of a conductive path. Electroplating is then performed on the previously deposited conductive seed layer 311 to form the desired conductive path. Finally, polishing and other processes are used to remove excess metal and surface irregularities.

[0061] In some embodiments, a portion of the conductive connection layer 31 covers the conductive interface 34, and another portion covers a portion of the substrate 32 located around the conductive interface 34. In this way, the area of ​​the conductive connection layer 31 can be larger than the area of ​​the conductive interface 34, providing more space for the formation of multiple conductive channels, thereby avoiding the performance of the conductive connection layer 31 being affected by space issues. In addition, the conductive connection layer 31 covers a portion of the substrate 32 around the conductive interface 34, and the substrate 32 can provide support for the conductive connection layer 31, thereby improving the stability of the conductive connection layer 31. In some embodiments, the edges of the conductive seed layer 311 and the insulating layer are flush, which can reduce the volume occupied by the portion of the conductive connection layer 31 where no conductive channels are formed, making the conductive connection layer 31 neat and compact.

[0062] In some embodiments, the conductive support structure 40 includes a flexible circuit board 41, a conductive layer 42, and an insulating support layer 43. The conductive layer 42 is connected between the flexible circuit board 41 and the conductive connection layer 31. The insulating support layer 43 is connected between the flexible circuit board 41 and the ultrasonic fingerprint module 30.

[0063] By providing a flexible circuit board 41 and a conductive layer 42, and connecting the conductive layer 42 between the flexible circuit board 41 and the conductive connecting layer 31, communication between the conductive connecting layer 31 and the flexible circuit board 41 can be facilitated through the conductive layer 42. In this way, not only can communication between the sensor 33 and the flexible circuit board 41 be achieved, but the flexible circuit board 41 can also bend when subjected to force, thereby providing a buffering effect and reducing damage to the ultrasonic fingerprint module 30 caused by external impact.

[0064] The area of ​​the flexible circuit board 41 is larger than that of the conductive connection layer 31. Thus, in addition to covering the conductive connection layer 31, the flexible circuit board 41 also extends to the portion of the substrate 32 that is not covered by the conductive connection layer 31. By providing an insulating support layer 43 between the portion of the substrate 32 that is not covered by the conductive connection layer 31 and the corresponding portion of the flexible circuit board 41, it provides insulation, filling, and support. The insulating support layer 43 is an adhesive layer. In some embodiments, the adhesive layer can be made of silicone, rubber, or other materials, which are not limited in this disclosure.

[0065] The flexible circuit board 41 is electrically connected to the main board, and the communication between the sensor 33 and the main board is realized through the flexible circuit board 41, so that the sensor 33 can send the collected fingerprint information to the main board, and the main board can make a judgment and give a judgment on whether the verification is passed.

[0066] In some embodiments, the conductive layer 42 is an anisotropic conductive film. Anisotropic conductive film is generally composed of conductive particles, an adhesive, and a substrate. The conductive particles of the anisotropic conductive film can be metal particles or carbon-based particles. The metal particles can be silver, copper, or nickel, and the carbon-based particles can be graphite or carbon nanotubes. The conductive particles have good electrical conductivity and can provide a conductive path between electronic components. The adhesive is used to fix the conductive particles on the substrate and provide adhesion properties to the anisotropic conductive film. The substrate is generally a polyamide film or a polyester film, which has good mechanical properties and heat resistance.

[0067] Anisotropic Conductive Film (ACF) is a special type of conductive material that is widely used in electronic packaging and connection applications. The conductive properties of anisotropic conductive film are different in different directions. It usually has good conductivity in the vertical direction and is insulating in the horizontal direction. ACF can achieve precise component docking, ensure the effective transmission of electrical signals, and avoid short circuits. Due to the flexible properties of ACF, it is compatible with the flexible circuit board 41 and can adapt to various bending and deformation situations. ACF can absorb impact to a certain extent, protect sensitive components, and reduce the impact of mechanical stress on the circuit. Anisotropic conductive film is easy to operate during the bonding and curing process and is suitable for large-scale production. ACF has good environmental adaptability and can maintain conductivity and stability under different temperature and humidity conditions. By making the conductive layer 42 an anisotropic conductive film, a reliable electrical connection can be achieved between the flexible circuit board 41 and the conductive layer 42, and the ultrasonic fingerprint module 30 can be protected.

[0068] In other embodiments, the conductive layer may also be a soldering layer, which is used to achieve reliable electrical connection between the flexible circuit board 41 and the conductive layer 42. The soldering layer may be a tin soldering layer or an aluminum soldering layer, etc., which is not limited in this disclosure.

[0069] Please refer again Figure 2 The electronic device 10 further includes an abutment member 50 that abuts against the side of the conductive support structure 40 facing away from the ultrasonic fingerprint module 30. Specifically, the abutment member 50 abuts against the side of the flexible circuit board 41 in the conductive support structure 40 facing away from the ultrasonic fingerprint module 30. By providing the abutment member 50 and abutting the side of the flexible circuit board 41 in the conductive support structure 40 facing away from the ultrasonic fingerprint module 30, the flexible circuit board 41 can be supported from the side facing away from the ultrasonic fingerprint module 30, further supporting the ultrasonic fingerprint module 30 through the flexible circuit board 41. This improves the stability of the ultrasonic fingerprint module 30.

[0070] The electronic device 10 generally also includes a back cover and a battery. The battery may be provided with a heat sink, which may be a VC heat sink (vapor chamber heat sink) or a graphite sheet. Some electronic devices 10 may also be provided with a middle frame for fixing internal components. In different electronic devices 10, the abutment 50 may also be different. The abutment 50 may be a battery, a VC heat sink or a graphite sheet for dissipating heat from the battery, or a middle frame provided in the electronic device 10. Figure 2 In the illustrated embodiment, the abutment member 50 comprises a VC vapor chamber.

[0071] In some embodiments, the flexible circuit board 41 is disposed in contact with the abutting member 50. In this way, the abutting member 50 evenly supports the flexible circuit board 41 and supports the ultrasonic fingerprint module 30 through the insulating support member and the conductive support member.

[0072] Please refer to Figure 4 and Figure 5 , Figure 4 for Figure 2 FIG. 1 is a schematic structural diagram of another embodiment of an ultrasonic fingerprint module 30 and a conductive support structure 40 in an electronic device 10. Figure 5 for Figure 4 The top view of the ultrasonic fingerprint module 30 and the conductive support structure 40 in the electronic device 10 is shown. Figure 4 and Figure 5In the illustrated embodiment, the side of the abutment 50 facing the flexible circuit board 41 is not flat. For example, the abutment 50 is a VC heat spreader. To allow the VC heat spreader to dissipate heat better, some VC heat spreaders have local protrusions. A protrusion is provided on the side of the abutment 50 facing the flexible circuit board 41, corresponding to the insulating support layer 43, and an avoidance groove 411 is provided on the flexible circuit board 41 corresponding to the protrusion. The avoidance groove 411 is provided corresponding to the protrusion to prevent the flexible circuit board 41 from warping up at the part corresponding to the protrusion, causing uneven force on the flexible circuit board 41 and affecting the support of the ultrasonic fingerprint module 30. The avoidance groove 411 is provided in the part of the flexible circuit board 41 corresponding to the insulating support layer 43. After being provided, it will not affect the original communication performance of the flexible circuit board 41, and can better support the ultrasonic fingerprint module 30.

[0073] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this disclosure is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this disclosure shall be included in the scope of protection of this disclosure.

Claims

1. An electronic device, characterized in that: include: Screen module; An ultrasonic fingerprint module is bonded to the screen module, and a conductive connection layer is provided on the side of the ultrasonic fingerprint module facing away from the screen module; A conductive supporting structure is supported on a side of the ultrasonic fingerprint module facing away from the screen module and is electrically connected to the conductive connecting layer.

2. The electronic device according to claim 1, wherein The ultrasonic fingerprint module includes a substrate and a sensor, the sensor is bonded to the screen module, and the substrate is connected to the side of the sensor facing away from the screen module; The substrate is provided with a conductive interface, and the conductive connection layer covers the conductive interface and is electrically connected to the sensor.

3. The electronic device according to claim 2, wherein: The conductive connection layer comprises: a conductive seed layer, at least partially located within the conductive interface and electrically connected to the sensor; an insulating layer covering the conductive seed layer; A plurality of conductive channels are formed in the insulating layer and electrically connected to the conductive seed layer.

4. The electronic device according to claim 3, wherein: A portion of the conductive connection layer covers the conductive interface, and another portion covers a portion of the substrate located around the conductive interface; and / or The edges of the conductive seed layer and the insulating layer are flush.

5. The electronic device according to claim 1, wherein The conductive support structure comprises: Flexible circuit boards; a conductive layer connected between the flexible circuit board and the conductive connecting layer; The insulating support layer is connected between the flexible circuit board and the ultrasonic fingerprint module.

6. The electronic device according to claim 5, characterized in that The conductive layer is an anisotropic conductive film; and / or The conductive layer is a welding layer; and / or The insulating support layer is an adhesive layer.

7. The electronic device according to claim 5, wherein: It also includes an abutment member abutting against a side of the flexible circuit board facing away from the ultrasonic fingerprint module.

8. The electronic device according to claim 7, wherein: The side of the abutment member facing the flexible circuit board is a plane, and the flexible circuit board is arranged in contact with the abutment member.

9. The electronic device according to claim 7, wherein: A protrusion is provided on a portion of the side of the abutment member facing the flexible circuit board corresponding to the insulating support layer, and an avoidance groove is provided on the flexible circuit board corresponding to the protrusion.

10. The electronic device according to claim 1, wherein It also includes an abutment member abutting against a side of the conductive support module facing away from the ultrasonic fingerprint module.

11. The electronic device according to claim 10, characterized in that The abutting member includes a VC heat spreader.

12. The electronic device according to claim 1, wherein It also includes a foam layer connected to the side of the screen module facing the ultrasonic fingerprint module. The foam layer is provided with a receiving groove perpendicular to the direction of the screen module. At least part of the ultrasonic fingerprint module is located in the receiving groove and is bonded to the screen module.

13. The electronic device according to claim 12, wherein: In a direction perpendicular to the depth direction of the accommodating groove, a difference between a size of the accommodating groove and a size of the ultrasonic fingerprint module is not greater than a set limit.

14. The electronic device according to claim 1, wherein It also includes an adhesive layer connected between the screen module and the ultrasonic fingerprint module.

15. The electronic device according to claim 14, characterized in that From the screen module toward the ultrasonic fingerprint module, the bonding layer includes an adhesive layer, a metal shielding layer and an ink coating layer connected in sequence.

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