Feeding system capable of automatically expanding film and correcting deviation of wafer
Through the high-speed moving mechanism and the adjustment film expansion mechanism, the problem that the wafer loading equipment is inconvenient to adjust the angle and expand the film is solved, the automatic film expansion and angle correction of the wafer are realized, and the stability and efficiency of the loading equipment are improved.
Patent Information
- Application Number
- CN202422685402.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-11-05
AI Technical Summary
Existing wafer loading equipment is not convenient for adjusting the wafer angle and performing film expansion operations.
It adopts a high-speed moving mechanism and an adjustment film expansion mechanism, drives the wafer to move along the XY axis through the X-axis linear module and the Y-axis linear module, and combines the adjustment motor and the lifting motor to realize the angle adjustment and film expansion operation of the wafer.
Automatic wafer expansion and angle correction are achieved, improving the stability and efficiency of the loading equipment.
Smart Images

Figure CN223363114U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer production, in particular to a wafer automatic film expansion and deviation correction feeding system. Background Art
[0002] In the semiconductor industry, wafers are a necessary form of transportation in many processes. Various process equipment needs to remove chips from wafers or attach chips. They are often used in many testing and packaging equipment such as IC sorting machines, chip mounters, and die bonders. In existing technologies, wafer loading equipment is not convenient for adjusting the wafer angle and expanding the wafer film.
[0003] For example, patent publication number CN221226189U is specifically a wafer loading device, including: a support frame, a limit assembly, and a detection assembly; a wafer box is placed on the support frame, a plurality of wafers are stacked in the wafer box, one side of the wafer box has an opening for wafer loading, the limit assembly is arranged on the support frame and is located on one side of the wafer box opening, the limit assembly is used to block the wafer when the wafer is not loaded and to detect the wafer when loading, the detection assembly is arranged on the support frame for detecting whether a wafer box is placed on the support frame, the limit assembly includes: a support frame and a retaining edge; the support frame is installed on one side of the support frame, and the support frame is located at the opening of the wafer box. The utility model has the advantage of improving the stability of wafer box loading, but there is a problem that this wafer loading equipment is inconvenient to adjust the wafer angle and expand the wafer. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a wafer loading system with automatic film expansion and deviation correction, which solves the problem that the wafer loading equipment is inconvenient to adjust the wafer angle and expand the wafer.
[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer automatic film expansion and deviation correction loading system, comprising a base, a high-speed moving mechanism is provided on the top of the base, an adjusting film expansion mechanism is provided on the high-speed moving mechanism, a wafer is provided on the adjusting film expansion mechanism, and a drag chain is installed on one side of the high-speed moving mechanism;
[0006] The high-speed moving mechanism includes two X-axis guide rails, each of which is slidably connected to an X-axis guide seat, and each side of each of the two X-axis guide seats is equipped with an X-axis linear module, and each of the two X-axis guide seats is equipped with a mounting plate, and the top of the mounting plate is fixedly connected to two Y-axis guide rails, each of which is slidably connected to a Y-axis guide seat, and each side of each of the two Y-axis guide seats is equipped with a Y-axis linear module;
[0007] The film expansion adjustment mechanism includes a shell, a plurality of rotating seats fixedly connected to the inside of the shell, a plurality of screws are rotatably connected to the inside of the rotating seats, a plurality of screws are threadedly connected to an internal threaded sleeve, a plurality of internal threaded sleeves are fixedly connected to the top of a film pressing ring, one of the screws is connected to a lifting motor through a synchronous wheel and a synchronous belt transmission, a first tensioning wheel is provided on one side of the synchronous belt, and a plurality of bottom ends of the screws are transmission-connected, a jig is rotatably connected to the inside of the shell through a bearing, an angle adjustment driven wheel is fixedly connected to the outside of the jig, an angle adjustment driven wheel is provided on one side of the angle adjustment driven wheel, the bottom end of the angle adjustment driving wheel is fixedly connected to the adjustment motor, an angle adjustment belt is provided between the angle adjustment driving wheel and the angle adjustment driven wheel, and a second tensioning wheel is provided on both sides of the angle adjustment belt.
[0008] Preferably, the two X-axis guide rails are fixedly mounted on the top surface of the base, and both of the X-axis guide rails are detachably connected to the base, so that the X-axis guide rails can be easily replaced and repaired.
[0009] Preferably, the two Y-axis guide rails are fixedly mounted on the top surface of the mounting plate, and the two Y-axis guide rails are detachably connected to the mounting plate, so that the Y-axis guide rails can be easily replaced and repaired.
[0010] Preferably, the top surfaces of the two Y-axis guide seats are fixedly connected to the housing by bolts, and the drag chain is installed on the mounting plate, so that it can protect the cables.
[0011] Preferably, the bottom ends of the plurality of screw rods pass through the rotating seat and extend to the bottom of the shell, and the number of the plurality of screw rods is set to four, so that the transmission structure of the four screw rods can be easily installed, so that the four screw rods can rotate synchronously.
[0012] Preferably, the transmission structure between the four screw rods includes four transmission wheels, which are respectively fixedly mounted on the four screw rods. A transmission belt is sleeved between the four transmission wheels, and multiple third tensioning wheels are provided on the outside of the transmission belt, so that the multiple screw rods can rotate synchronously.
[0013] The utility model provides a wafer loading system with automatic film expansion and deviation correction. Compared with the existing technology, it has the following advantages:
[0014] 1. The wafer automatic expansion and correction loading system loads the wafer onto the fixture, and the X-axis linear module and the Y-axis linear module drive the wafer to move at high speed along the XY axis, thereby adjusting the position of the wafer.
[0015] 2. The wafer automatic film expansion and deflection correction loading system drives the angle adjustment driving wheel to rotate by adjusting the motor. The rotation of the angle adjustment driving wheel drives the angle adjustment driven wheel to rotate through the angle adjustment belt. The rotation of the angle adjustment driven wheel drives the rotation of the fixture to rotate and adjust the angle of the wafer.
[0016] 3. The wafer automatic film expansion and deviation correction loading system uses a lifting motor to simultaneously drive four screws through synchronous wheels and synchronous belts. The rotation of the four screws drives the internal threaded sleeve to move up and down. The movement of the internal threaded sleeve drives the film pressing ring to move, automatically expanding the wafer so that the equipment can remove the chip from the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the high-speed moving mechanism structure of the utility model;
[0019] Figure 3 This is a schematic diagram of the structure of the membrane expansion mechanism for adjusting the membrane in the present invention;
[0020] Figure 4 This is a schematic diagram of the internal structure of the shell of the utility model;
[0021] Figure 5 This is a schematic diagram of the bottom structure of the shell of the present utility model.
[0022] 1. Base; 2. High-speed moving mechanism; 201. X-axis guide rail; 202. X-axis linear module; 203. X-axis guide seat; 204. Mounting plate; 205. Y-axis guide rail; 206. Y-axis guide seat; 207. Y-axis linear module; 3. Adjustment and expansion mechanism; 301. Housing; 302. Fixture; 303. Rotating seat; 304. Internal threaded sleeve; 305. Screw; 306. Synchronous wheel; 307. Synchronous belt; 308. Lifting motor; 309. First tensioning wheel; 310. Angle adjustment driven wheel; 311. Bearing; 312. Angle adjustment belt; 313. Angle adjustment driving wheel; 314. Adjustment motor; 315. Second tensioning wheel; 316. Film pressing ring; 317. Transmission belt; 318. Third tensioning wheel; 319. Transmission wheel; 4. Wafer; 5. Drag chain. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0024] See also Figure 1-5 The utility model provides a technical solution: a wafer automatic film expansion and deviation correction loading system, including a base 1, a high-speed moving mechanism 2 is provided on the top of the base 1, an adjusting film expansion mechanism 3 is provided on the high-speed moving mechanism 2, a wafer 4 is provided on the adjusting film expansion mechanism 3, and a drag chain 5 is installed on one side of the high-speed moving mechanism 2. The high-speed moving mechanism 2 can be used to move at high speed along the XY axis, and the adjusting film expansion mechanism 3 can be used to automatically expand the film and adjust the angle of the wafer 4, and the wafer 4 can be loaded by a worker or with an industrial robot, so that the equipment can take the chip off the wafer 4.
[0025] The high-speed moving mechanism 2 includes two X-axis guide rails 201, which are fixedly mounted on the top surface of the base 1 and are detachably connected to the base 1, so that the X-axis guide rails 201 can be easily replaced and repaired. The two X-axis guide rails 201 are slidably connected to an X-axis guide seat 203, so that the X-axis guide seat 203 can move along the X-axis guide rails 201. An X-axis linear module 202 is installed on one side of the two X-axis guide seats 203, so that the X-axis linear module 202 can drive the X-axis guide seat 203 to move along the X-axis. A mounting plate 204 is installed on the two X-axis guide seats 203, and the mounting plate 204 is installed on the mounting plate 204. 04 There are two Y-axis guide rails 205 fixedly connected to the top, and the two Y-axis guide rails 205 are fixedly mounted on the top surface of the mounting plate 204, and the two Y-axis guide rails 205 are detachably connected to the mounting plate 204, so that the Y-axis guide rails 205 can be easily replaced and repaired. The two Y-axis guide rails 205 are slidably connected to the Y-axis guide seat 206, which can guide the movement of the Y-axis guide seat 206. A Y-axis linear module 207 is installed on one side of the two Y-axis guide seats 206. The top surfaces of the two Y-axis guide seats 206 are fixedly connected to the housing 301 by bolts. The drag chain 5 is installed on the mounting plate 204, so that it can protect the cables.
[0026] The film expansion adjustment mechanism 3 includes a shell 301, and a plurality of rotating seats 303 are fixedly connected to the inside of the shell 301. The plurality of rotating seats 303 are rotatably connected to the inside of the plurality of rotating seats 303. The bottom ends of the plurality of screw rods 305 pass through the rotating seat 303 and extend to the bottom of the shell 301. The number of the plurality of screw rods 305 is set to four, which makes it convenient to install the transmission structure of the four screw rods 305, so that the four screw rods 305 can rotate synchronously. The plurality of screw rods 305 are all threadedly connected to the internal threaded sleeves 304, and the tops of the plurality of internal threaded sleeves 304 are fixedly connected to the film pressing ring 316, which can be used to perform film expansion operations on the wafer 4. The film pressing ring 316 is connected to the lifting motor 308 through the synchronous wheel 306 and the synchronous belt 307. A first tensioning pulley 309 is provided on one side of the synchronous belt 307, so that the synchronous belt 307 can maintain a tensioned state. The bottom ends of the plurality of screw rods 305 are transmission-connected, and the four screw rods 305 are connected. The transmission structure includes four transmission wheels 319, which are respectively fixedly mounted on four screw rods 305. A transmission belt 317 is sleeved between the four transmission wheels 319. A plurality of third tensioning pulleys 318 are provided on the outside of the transmission belt 317, so that the transmission belt 317 can be kept in a tensioned state, so that the plurality of screw rods 305 can rotate synchronously. The inside of the housing 301 is rotatably connected to the fixture 302 through a bearing 311, which can install and carry the wafer 4. An angle adjustment driven wheel 310 is fixedly connected to the outside of the fixture 302, and an angle adjustment driving wheel 313 is provided on one side of the angle adjustment driven wheel 310. An adjustment motor 314 is fixedly connected to the bottom end of the angle adjustment driving wheel 313. An angle adjustment belt 312 is provided between the angle adjustment driving wheel 313 and the angle adjustment driven wheel 310. Second tensioning pulleys 315 are provided on both sides of the angle adjustment belt 312, so that the angle adjustment belt 312 can be kept in a tensioned state.
[0027] During operation, the wafer 4 is loaded onto the fixture 302, and the X-axis linear module 202 and the Y-axis linear module 207 drive the wafer 4 to move at high speed along the XY axis. The adjustment motor 314 drives the angle adjustment active wheel 313 to rotate. The rotation of the angle adjustment active wheel 313 drives the angle adjustment driven wheel 310 to rotate through the angle adjustment belt 312. The rotation of the angle adjustment driven wheel 310 drives the fixture 302 to rotate, and the angle of the wafer 4 is rotationally adjusted. The lifting motor 308 drives the four screw rods 305 to rotate at the same time through the synchronous wheel 306 and the synchronous belt 307. The rotation of the four screw rods 305 drives the internal threaded sleeve 304 to move up and down. The movement of the internal threaded sleeve 304 drives the film pressing ring 316 to move, and the wafer 4 is automatically expanded so that the equipment can remove the chip on the wafer 4.
[0028] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.
Claims
1. A wafer automatic film expansion and deflection correction loading system, comprising a base (1), characterized in that: A high-speed moving mechanism (2) is provided on the top of the base (1), an adjusting and expanding film mechanism (3) is provided on the high-speed moving mechanism (2), a wafer (4) is provided on the adjusting and expanding film mechanism (3), and a drag chain (5) is installed on one side of the high-speed moving mechanism (2); The high-speed moving mechanism (2) comprises two X-axis guide rails (201), each of the two X-axis guide rails (201) is slidably connected to an X-axis guide seat (203), one side of each of the two X-axis guide seats (203) is mounted with an X-axis linear module (202), each of the two X-axis guide seats (203) is mounted with a mounting plate (204), the top of each mounting plate (204) is fixedly connected with two Y-axis guide rails (205), each of the two Y-axis guide rails (205) is slidably connected to a Y-axis guide seat (206), and one side of each of the two Y-axis guide seats (206) is mounted with a Y-axis linear module (207); The film expansion adjustment mechanism (3) includes a shell (301), a plurality of rotating seats (303) are fixedly connected inside the shell (301), a plurality of rotating seats (303) are rotatably connected inside the plurality of screw rods (305), a plurality of screw rods (305) are threadedly connected to internal thread sleeves (304), a plurality of internal thread sleeves (304) are fixedly connected to film pressing rings (316) at the top, a lifting motor (308) is connected to one screw rod (305) through a synchronous wheel (306) and a synchronous belt (307), a first tensioning wheel (309) is provided on one side of the synchronous belt (307), and a plurality of screw rods (305) are connected to the lifting motor (308) through a synchronous wheel (306) and a synchronous belt (307). (305) are connected by transmission between the bottom ends, the inside of the housing (301) is rotatably connected to a jig (302) through a bearing (311), the outside of the jig (302) is fixedly connected to an angle adjustment driven wheel (310), one side of the angle adjustment driven wheel (310) is provided with an angle adjustment driving wheel (313), the bottom end of the angle adjustment driving wheel (313) is fixedly connected to an adjustment motor (314), an angle adjustment belt (312) is provided between the angle adjustment driving wheel (313) and the angle adjustment driven wheel (310), and a second tensioning wheel (315) is provided on both sides of the angle adjustment belt (312).
2. The wafer automatic film expansion and deflection correction loading system according to claim 1, characterized in that: The two X-axis guide rails (201) are fixedly mounted on the top surface of the base (1), and both the two X-axis guide rails (201) are detachably connected to the base (1).
3. The wafer automatic film expansion and deflection correction loading system according to claim 1, characterized in that: The two Y-axis guide rails (205) are both fixedly mounted on the top surface of the mounting plate (204), and the two Y-axis guide rails (205) are both detachably connected to the mounting plate (204).
4. The wafer automatic film expansion and deflection correction loading system according to claim 1, characterized in that: The top surfaces of the two Y-axis guide seats (206) are fixedly connected to the housing (301) via bolts, and the drag chain (5) is installed on the mounting plate (204).
5. The wafer automatic film expansion and deflection correction loading system according to claim 1, characterized in that: The bottom ends of the plurality of screw rods (305) pass through the rotating seat (303) and extend to the bottom of the housing (301), and the number of the plurality of screw rods (305) is set to four.
6. The wafer automatic film expansion and deflection correction loading system according to claim 1, characterized in that: The transmission structure between the four screw rods (305) includes four transmission wheels (319), which are respectively fixedly mounted on the four screw rods (305). A transmission belt (317) is sleeved between the four transmission wheels (319), and a plurality of third tensioning wheels (318) are provided on the outside of the transmission belt (317).
Citation Information
Patent Citations
Wafer feeding device
CN221226189U