Wafer carrier and system including the same

Abstract

The utility model relates to a wafer carrier and a system comprising the same. The wafer carrier includes: a substrate including a main body defining a wafer region having a recessed shape to receive a wafer on one side of the main body, the wafer region having a bottom surface opposite to a lower surface of the wafer and an inner side surface opposite to a side surface of the wafer; and a plurality of adhesive members disposed between the bottom surface and the wafer in the wafer region for attaching a lower surface of the wafer to the bottom surface, the substrate including a plurality of pin holes disposed adjacent to at least a portion of the plurality of adhesive members in the wafer region and formed to penetrate the body.

Description

Technical Field

[0001] The utility model relates to a wafer carrier and a system comprising the same, and more particularly to a wafer carrier for transferring wafers to be included in electronic equipment. Background Art

[0002] With the development of information technology, the importance of display devices as a connection medium between users and information has become increasingly prominent. Accordingly, the use of display devices such as liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs) is increasing.

[0003] Typical display devices are produced through multiple manufacturing steps, each of which can be completed in different locations. For example, display devices can be manufactured by processing wafers using semiconductor equipment. Specifically, the wafers are placed on carriers and transported to various processes, then mounted on corresponding process equipment, loaded into and unloaded from chambers. In this case, the wafers may require wafer-specific process equipment.

[0004] The above-mentioned contents are only used to help understand the background technology related to the technical idea of ​​the present invention, and therefore the above-mentioned contents should not be understood as equivalent to the content of the prior art known to those skilled in the technical field of the present invention. Utility Model Content

[0005] Embodiments of the present invention are used to provide a wafer carrier with improved productivity and a system including the same, for example, to provide a wafer carrier that can further reduce costs by utilizing existing process equipment.

[0006] A chip carrier according to an embodiment of the present invention includes: a base, including a main body, wherein the main body defines a chip area having a concave shape for accommodating a chip on one side of the main body, the chip area having a bottom surface opposite to the lower surface of the chip and an inner side surface opposite to the side surface of the chip; and a plurality of adhesive components arranged in the chip area between the bottom surface and the chip for attaching the lower surface of the chip to the bottom surface, the base including a plurality of pin holes, the plurality of pin holes being arranged in the chip area to be adjacent to at least a portion of the plurality of adhesive components and being formed to pass through the main body.

[0007] The base may be configured such that when the wafer is received in the wafer region, first sides of the plurality of pin holes are blocked by a lower surface of the wafer.

[0008] The base may be configured such that when a plurality of detachment pins are inserted into the second sides of the plurality of pin holes, the wafer is separated from the wafer region.

[0009] The plurality of pin holes may be arranged between two adjacent adhesive members among the plurality of adhesive members.

[0010] The plurality of adhesive components may be directly disposed on the bottom surface of the wafer region.

[0011] The plurality of adhesive members may be arranged along an edge of the bottom surface of the wafer region.

[0012] The plurality of pin holes may be arranged along an edge of the bottom surface of the wafer region.

[0013] The body may include a transparent substance, and the substrate may further include a plurality of alignment marks arranged in a peripheral region of the wafer region on the body.

[0014] The depth of the inner side surface may be equal to or greater than the thickness of the wafer.

[0015] The body may include a plasma resistant material.

[0016] The base may further include a plurality of support members fixed to the body in a peripheral region of the wafer region, the plurality of support members being configured to clamp the wafer.

[0017] The plurality of supporting members may respectively include: a fixing member arranged in the peripheral area; and a moving member fixed to the fixing member and configured to move in a direction perpendicular to a circumferential direction in which the inner side surface of the wafer area extends to clamp the wafer.

[0018] A wafer carrier system according to another embodiment of the present invention includes: the wafer carrier as described above for receiving and transferring wafers; and a pressurizing device for coupling the wafers to the wafer carrier and detaching the wafers from the wafer carrier.

[0019] The pressurizing device may be disposed above or below the wafer carrier and may be raised or lowered in a direction toward the wafer carrier.

[0020] The pressurizing device may include: a first pressurizing device disposed above the wafer carrier for bonding the wafer to the wafer carrier; and a second pressurizing device disposed below the wafer carrier for detaching the wafer from the wafer carrier.

[0021] The second pressurizing device may further include a plurality of detachment pins inserted into the plurality of pin holes to pressurize the wafers accommodated in the wafer area.

[0022] According to an embodiment of the present invention, a wafer carrier with improved productivity and a system including the same are provided.

[0023] The effects of the embodiment are not limited to the above-exemplified contents, and include more various effects in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a perspective view showing a wafer carrier according to an embodiment of the present invention.

[0025] Figure 2 yes Figure 1 A top view of a wafer carrier.

[0026] Figure 3 yes Figure 2 I-I' cross-sectional view.

[0027] Figure 4 Yes Figure 1 A top view of the multiple support components of a wafer carrier.

[0028] Figure 5 Yes Figure 4 A three-dimensional view of one of the multiple support components.

[0029] Figures 6 to 8 It is a cross-sectional view showing the structure of a system including a wafer carrier according to another embodiment of the present invention. DETAILED DESCRIPTION

[0030] Below, preferred embodiments of the present invention are described in detail with reference to the accompanying drawings. Please note that the following description only covers the parts necessary to understand the operation of the present invention, and descriptions of other parts will be omitted to avoid obscuring the key points of the present invention. Furthermore, the present invention is not limited to the embodiments described herein and may be embodied in other forms. However, the embodiments described herein are provided to provide a detailed description that allows those with ordinary knowledge in the technical field to easily implement the technical concepts of the present invention.

[0031] Throughout the specification, when it is mentioned that a part is "connected" to other parts, this includes not only the case of "direct connection", but also the case of "indirect connection" when other elements are provided in between. The terms used herein are used to illustrate specific embodiments and are not used to limit the present invention. Throughout the specification, when it is mentioned that a part "includes" a certain structural element, unless otherwise stated, this means that other structural elements are not excluded, but other structural elements may be further included. "At least one of X, Y and Z" and "at least one selected from X, Y and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y and Z (for example, XYZ, XY, YZ, XZ). Here, "and / or" includes all combinations of one or more of the mentioned structures.

[0032] Here, terms such as "first" and "second" may be used to describe various structural elements, but such structural elements are not limited to these terms. These terms are used to distinguish one structural element from other structural elements. Therefore, within the scope of the disclosure herein, a first structural element may refer to a second structural element.

[0033] Figure 1 It is a perspective view showing a wafer carrier according to an embodiment of the present invention.

[0034] Reference Figure 1 , the wafer carrier WC includes a base 100 and a plurality of adhesive members 200 .

[0035] According to one embodiment, the base 100 of the wafer carrier WC may include a body 110. The body 110 may have an overall rectangular parallelepiped shape. The body 110 may include an upper surface UP and a lower surface DP that are parallel to a plane defined by a first direction DR1 and a second direction DR2 that intersects the first direction DR1. Furthermore, the body 110 may include side surfaces SP that are perpendicular to a plane defined by the first and second directions DR1 and DR2. The side surfaces SP of the body 110 may be arranged to surround an edge of the lower surface DP and extend along a third direction DR3 between the upper surface UP and the lower surface DP. The third direction DR3 may intersect the first and second directions DR1 and DR2.

[0036] Furthermore, the main body 110 may include a plasma-resistant material. This minimizes damage to the main body 110 even when the main body 110 is exposed to plasma for a long period of time within the chamber. For example, the plasma-resistant material may be, but is not limited to, an oxide ceramic material such as yttrium oxide, zirconium oxide, or aluminum oxide.

[0037] The upper surface UP of the main body 110 may define a wafer area 120 having a recessed shape for accommodating a wafer. The wafer area 120 may be formed in the center of the upper surface UP in the same circular shape as the wafer. The wafer area 120 may be a flat plate for accommodating the wafer, recessed at a predetermined depth. The bottom surface 111 of the wafer area 120 may have a flat surface for accommodating the wafer. However, the wafer area 120 is not limited to a circular shape, as long as it can accommodate a wafer.

[0038] The wafer area 120 may have a bottom surface 111 opposite the lower surface of the wafer and an inner side surface 112 opposite the side surface of the wafer. For example, the bottom surface 111 of the wafer area 120 may be parallel to the upper surface UP and the lower surface DP of the body 110. Furthermore, the inner side surface 112 of the wafer area 120 may be a surface perpendicular to the bottom surface 111 along the third direction DR3. The inner side surface 112 of the wafer area 120 may be formed as a circular closed loop to accommodate the wafer.

[0039] The substrate 100 may include a plurality of adhesive members 200 disposed between the bottom surface 111 of the wafer region 120 and the wafer. The adhesive members 200 may be disposed directly on the bottom surface 111 of the wafer region 120. The adhesive members 200 may protrude from the bottom surface 111 in the third direction DR3. Furthermore, the adhesive members 200 may have a cylindrical shape. However, the shape of the adhesive members 200 is not limited thereto.

[0040] The adhesive force can be adjusted based on the number of adhesive members 200 and the diameter of each adhesive member 200. For example, the greater the number of adhesive members 200, the greater the adhesive force between the substrate 100 and the wafer. Furthermore, the greater the diameter of each adhesive member 200, the greater the adhesive force between the substrate 100 and the wafer.

[0041] The substrate 100 may include a plurality of pin holes 300 formed in the wafer region 120 to penetrate the body 110. The pin holes 300 may be formed to penetrate the body 110 along a third direction DR3 perpendicular to the bottom surface 111 of the wafer region 120. Detailed descriptions regarding the arrangement of the adhesive member 200 and the pin holes 300 will be described later. Figure 2 Provide a description.

[0042] The pin holes 300 can be used to detach the wafer contained in the wafer area 120. For example, the detachment pins (711, 713, see FIG. 1 ) of the pressurizing device can be inserted into the pin holes 300 of the main body 110. Figure 7 Furthermore, the detachment pins can lift up the lower surface of the wafer accommodated in the wafer area 120 .

[0043] Figure 2 yes Figure 1 A top view of a wafer carrier.

[0044] Reference Figure 2 The wafer carrier WC may include a base 100 defining a wafer area 120 and a plurality of adhesive members 200 attached to a bottom surface 111 of the wafer area 120. Furthermore, the base 100 may include a plurality of pin holes 300 formed in the wafer area 120 to penetrate the body 110.

[0045] The substrate 100 may include a main body 110 having a rectangular parallelepiped shape as a whole. Figure 1 ) may define a wafer area 120 on the upper surface UP, which may accommodate a wafer. The wafer area 120 may include a circular bottom surface 111 parallel to the upper surface UP. When a wafer is accommodated in the wafer area 120, the bottom surface 111 may be opposite to the lower surface of the wafer.

[0046] The substrate 100 may further include a plurality of alignment marks 410 and 420 arranged in a peripheral region of the wafer region 120. The alignment marks 410 and 420 may be arranged on the upper surface UP of the main body 110. The alignment marks 410 and 420 may be provided to align the wafer to the wafer carrier WC. Furthermore, the alignment marks 410 and 420 may be utilized in various manufacturing equipment to identify the position of the wafer and / or the wafer carrier WC during the manufacturing process.

[0047] The main body 110 may include a transparent material. Thus, when viewing the wafer from above or below the main body 110, the alignment marks 410 and 420 can be clearly visually identified. The first alignment marks 410 may be arranged in each corner region of the main body 110. For example, the 1-1 sub-alignment mark 411 and the 1-2 sub-alignment mark 412 of the first alignment marks 410 may be arranged at the right corner of the main body 110 in the second direction DR2. Furthermore, the 1-3 sub-alignment mark 413 and the 1-4 sub-alignment mark 414 may be arranged at the left corner of the main body 110 in the second direction.

[0048] Furthermore, the second alignment mark 420 may be arranged in a peripheral area of ​​the body 110 surrounding the wafer area 120. In the case where the wafer area 120 is circular in shape, the second alignment mark 420 may be arranged in a peripheral area surrounding the wafer area 120. For example, the second alignment mark 420 may be arranged at prescribed intervals in the peripheral area of ​​the wafer area 120. Thus, in the case where the second alignment mark 420 includes four sub-alignment marks, the 2-1 sub-alignment mark 421 and the 2-3 sub-alignment mark 423 may be symmetrically arranged across the wafer area 120. Furthermore, the 2-2 sub-alignment area 422 and the 2-4 sub-alignment area 424 may be symmetrically arranged across the wafer area 120. Although in Figure 2 The second alignment mark 420 is shown as a "+" shape, but is not limited thereto. Figure 2 The alignment marks 410 and 420 shown in the figure are merely examples, and the arrangement intervals, sizes, and numbers of the alignment marks 410 and 420 can be variously changed.

[0049] Adhesive member 200 may be formed to protrude from bottom surface 111 of wafer region 120 in third direction DR3. Adhesive member 200 may be disposed between bottom surface 111 and the wafer in wafer region 120. Adhesive member 200 may adhere the lower surface of the wafer to bottom surface 111. Adhesive member 200 may adhere and support the lower surface of the wafer to bottom surface 111 through physical adhesion or physical adsorption. For example, adhesive member 200 may include, but is not limited to, a physical sticky chucking (PSC) material.

[0050] A plurality of adhesive members 200 may be arranged along the edge of the bottom surface 111 of the wafer region 120. The adhesive members 200 may cause deformation of the wafer due to stress caused by temperature distribution or adsorption during the manufacturing process.

[0051] The substrate 100 may include a plurality of pin holes 300 arranged adjacent to at least a portion of the plurality of adhesive members 200. The plurality of pin holes 300 may be arranged along the edge of the bottom surface 111 in the wafer region 120 where the wafer is placed. Each pin hole 300 may be formed along the third direction DR3 from the bottom surface 111 through the main body 110. Each pin hole 300 may be formed in a cylindrical shape that passes through the main body 110. However, the shape of the pin hole 300 may be any shape as long as it can be used for the disassembly pins (711, 713, see Figure 7 ) is inserted, it is not limited to a cylindrical shape.

[0052] According to one embodiment, the plurality of pin holes 300 may be arranged at equal intervals in the wafer region 120. Furthermore, each pin hole 300 may be symmetrical with respect to the other pin holes with respect to the center of the wafer region 120. For example, when the plurality of pin holes 300 includes first to fourth pin holes 301-304, the first pin hole 301 and the third pin hole 303 may be arranged on a line passing through the center of the wafer region 120 and extending along the first direction DR1. In this case, the first pin hole 301 and the third pin hole 303 may be symmetrical with respect to a line passing through the center of the wafer region 120 and extending along a second direction DR2 perpendicular to the first direction DR1. Furthermore, the second pin hole 302 and the fourth pin hole 304 may be arranged on a line passing through the center of the wafer region 120 and extending along the second direction DR2. In this case, the second pin hole 302 and the fourth pin hole 304 may be symmetrical with respect to a line passing through the center of the wafer region 120 and extending along the first direction DR1.

[0053] However, in Figure 2Schematically illustrating the number of the pin holes 300 is four, the intervals between the pin holes 300 may be changed according to the number of the pin holes 300 .

[0054] According to one embodiment, the plurality of pin holes 300 may be arranged adjacent to at least a portion of the plurality of adhesive members 200 in the wafer region 120 . Furthermore, the plurality of pin holes 300 may be arranged between two of the plurality of adhesive members 200 in the wafer region 120 .

[0055] For example, the first pin hole 301 may be adjacent to the first adhesive component 201 and the second adhesive component 202. The first adhesive component 201 and the second adhesive component 202 may be arranged symmetrically with respect to the first pin hole 301. The first pin hole 301 may be arranged between adjacent first adhesive components 201 and second adhesive components 202.

[0056] The second pin hole 302 may be adjacent to the third adhesive member 203 and the fourth adhesive member 204. The third adhesive member 203 and the fourth adhesive member 204 may be symmetrically arranged with respect to the second pin hole 302. The second pin hole 302 may be arranged between the third adhesive member 203 and the fourth adhesive member 204.

[0057] The third pin hole 303 may be adjacent to the fifth adhesive member 205 and the sixth adhesive member 206. The fifth adhesive member 205 and the sixth adhesive member 206 may be arranged symmetrically with respect to the third pin hole 303. The third pin hole 303 may be arranged between the fifth adhesive member 205 and the sixth adhesive member 206.

[0058] Furthermore, the fourth pin hole 304 may be adjacent to the seventh adhesive member 207 and the eighth adhesive member 208. The seventh adhesive member 207 and the eighth adhesive member 208 may be arranged symmetrically with respect to the fourth pin hole 304. The fourth pin hole 304 may be arranged between the seventh adhesive member 207 and the eighth adhesive member 208.

[0059] Figure 3 yes Figure 2 Ⅰ-Ⅰ' sectional view.

[0060] Reference Figure 3 A wafer area 120 may be defined in the main body 110 of the substrate 100 as a recessed area. Specifically, the substrate 100 may include a wafer area 120 recessed to a predetermined depth from the upper surface UP of the main body 110. Wafers WF may be accommodated within the wafer area 120 of the substrate 100 of the wafer carrier WC. Accommodating the wafers WF within the wafer area 120 shields the side surfaces of the wafers WF, preventing gas from being supplied to the side surfaces of the wafers WF.

[0061] The adhesive member 200 may be disposed on the bottom surface 111 of the wafer area 120. When the wafer WF is received in the wafer area 120, the adhesive member 200 may come into contact with the lower surface A1 of the wafer WF.

[0062] The depth D1 of the wafer region 120 may be determined in consideration of the thickness T of the wafer WF. The depth D1 of the inner side surface 112 of the wafer region 120, which is opposite to the side surface of the wafer WF, may be greater than or equal to the thickness T of the wafer WF. Thus, the wafer WF may not protrude beyond the upper surface UP of the body 110, thereby preventing damage to the wafer WF while stably supporting the wafer WF.

[0063] For example, Figure 3 As shown, a first adhesive member 201 and a sixth adhesive member 206 may be provided in the wafer area 120. Wafer WF may be received in the wafer area 120 with the first adhesive member 201 and the sixth adhesive member 206 in contact with the lower surface A1 of wafer WF. The thickness of the first adhesive member 201 and the sixth adhesive member 206 may be determined by taking into account the difference between the depth D1 of the wafer area 120 and the thickness T of wafer WF. The thickness of the first adhesive member 201 and the sixth adhesive member 206 may be substantially uniform. This minimizes the gap between the lower surface A1 of wafer WF and the bottom surface 111 of the wafer area 120.

[0064] Pin hole 300 (see Figure 2 ) may be formed in the wafer region 120 to penetrate the body 110. Also, a plurality of pin holes 300 may be arranged on the bottom surface 111 of the wafer region 120 to be adjacent to a portion of the plurality of adhesive members 200. For example, Figure 3 As shown, the first pin hole 301 may be arranged adjacent to the first adhesive component 201 , and the third pin hole 303 may be arranged adjacent to the sixth adhesive component 206 .

[0065] When the wafer WF is received in the wafer area 120, one side S1 of the pin hole 300 (refer to Figure 7 ) can be blocked by the lower surface A1 of the wafer WF. In this state, when the disassembly pin of the pressurizing device is inserted into the other side S2 of the pin hole 300 (refer to Figure 7 ), the wafer WF can be separated from the wafer area 120. Accordingly, the wafer WF fixed to the wafer area 120 by the adhesive member 200 can be separated without being damaged by the detachment pins inserted into the pin holes 300.

[0066] Figure 4 Yes Figure 1 A top view of the support components of a wafer carrier.

[0067] Reference Figure 4The base 100 of the wafer carrier WC may further include a plurality of support members 500 fixed to the body 110 . The plurality of support members 500 may be configured to clamp the wafer WF in a peripheral region of the wafer region 120 .

[0068] In one embodiment, the plurality of support members 500 may be formed in a clip shape and may clamp the side of the wafer WF to fix the wafer WF. In addition, the support member 500 may be formed in a plate shape including metal, resin, etc. The plurality of support members 500 may be arranged at predetermined intervals in the peripheral area of ​​the wafer area 120. Thus, when two support members 500 are constructed, the first support member 501 and the second support member 502 may be arranged symmetrically with the center of the wafer area 120 as a reference. However, although Figure 4 2 is shown as an example, but a greater number of support members 500 may be provided. The intervals between the support members 500 may be changed according to the number of support members 500.

[0069] In this manner, the wafer WF is further fixed to the wafer carrier WC by the support member 500 of the main body 110 , thereby further preventing the wafer WF from falling during transfer or manufacturing process.

[0070] Figure 5 Yes Figure 4 A three-dimensional view of one of the multiple support components.

[0071] Reference Figure 3 、 Figure 4 and Figure 5 The first support member 501 may include a fixed member 510 disposed in the peripheral region and a movable member 520 for clamping the wafer WF. The second support member 502 may also be configured similarly to the first support member 501. Hereinafter, repeated descriptions will be omitted.

[0072] The fixed member 510 may be arranged in the peripheral area of ​​the wafer area 120 such that the upper surface of the fixed member 510 is parallel to the upper surface UP of the main body 110. The movable member 520 may be coupled to the fixed member 510 and move in a direction parallel to the upper surface of the fixed member 510. The movable member 520 may be linearly movable a predetermined distance. The direction in which the movable member 520 moves may be perpendicular to the circumferential direction in which the inner side surface 112 of the wafer area 120 extends. Alternatively, the direction in which the movable member 520 moves may be toward the center of the wafer area 120. For example, the movable member 520 may move to a first position P1 protruding from the fixed member 510 to clamp the wafer WF. Furthermore, the movable member 520 may move to a second position P2 inserted into the fixed member 510 to release the wafer WF.

[0073] The fixing member 510 may include a first hole 541 and a second hole 542 symmetrically arranged with respect to the movable member 520. Furthermore, the fixing member 510 may include a first locking member 531 and a second locking member 532 for fixing the position of the movable member 520. The fixing member 510 may include a third locking member 533 and a fourth locking member 534 for securing the fixing member 510 to the main body 110. The first locking member 531, the second locking member 532, the third locking member 533, and the fourth locking member 534 may be included in the locking member 530.

[0074] The first locking member 531 and the second locking member 532 may be respectively disposed in a first hole 541 and a second hole 542 formed in the fixed member 510 and fixed to a shaft connected to the movable member 520. For example, the first locking member 531 and the second locking member 532 may be movably coupled to the first hole 541 and the second hole 542 and may move along the first hole 541 and the second hole 542. In addition, the first locking member 531 and the second locking member 532 may be respectively connected to the movable member 520 via a fixed shaft.

[0075] The first hole 541 and the second hole 542 can guide the first locking member 531 and the second locking member 532 to perform linear movement, respectively. The first locking member 531 and the second locking member 532 can perform linear movement along the first hole 541 and the second hole 542. As the first locking member 531 and the second locking member 532 perform linear movement, the movable member 520 can also perform linear movement. In this case, the linear movement of the movable member 520 can be restricted by the first hole 541 and the second hole 542. The distance that the movable member 520 can move can be determined by the length of the first hole 541 and the second hole 542.

[0076] Furthermore, the moving member 520 may include a support surface 521 that supports the wafer WF by contacting the side surface of the wafer WF. The support surface 521 may include a soft material such as rubber or resin to prevent damage to the wafer WF when the moving member 520 contacts the side surface of the wafer WF.

[0077] but, Figure 4 and Figure 5 The support members 500 shown are merely examples, and the arrangement intervals, sizes, and numbers of the support members 500 may be variously modified.

[0078] Below, references to Figures 1 to 5 A description of a wafer carrier system is provided.

[0079] Figures 6 to 8 It is a cross-sectional view showing the structure of a system including a wafer carrier according to another embodiment of the present invention.

[0080] Reference Figure 6 The wafer system WS may include a wafer carrier WC for receiving and transferring a wafer WF and a first pressurizing device PD1 for bonding the wafer WF to the wafer carrier WC. The first pressurizing device PD1 may be disposed above the wafer carrier WC and bond the wafer WF to the wafer carrier WC.

[0081] According to one embodiment, the first pressurizing device PD1 may include a first pressurizing body 600 and a plurality of coupling pins 610. The first pressurizing body 600 and coupling pins 610 may rise or fall in the third direction DR3. In particular, the first pressurizing body 600 and coupling pins 610 may descend in a direction opposite to the third direction DR3 toward the wafer WF and the wafer carrier WC. For example, the first pressurizing body 600 and coupling pins 610 may descend toward the upper surface A2 of the wafer WF. Furthermore, the coupling pins 610 may contact the upper surface A2 of the wafer WF to pressurize the wafer WF. Thus, the wafer WF may be accommodated in the wafer area 120 of the wafer carrier WC. At this time, the lower surface A1 of the wafer WF may be adjacent to or coupled to the bottom surface 111 of the wafer area 120.

[0082] The first pressurizing body 600 may include a surface B1 parallel to a plane defined by the first direction DR1 and the second direction DR2. The surface B1 of the first pressurizing body 600 may be positioned opposite the upper surface UP of the main body 110 of the wafer carrier WC. Furthermore, coupling pins 610 are arranged at regular intervals on the surface B1 of the first pressurizing body 600, thereby pressurizing the wafer WF with uniform force.

[0083] The coupling pin 610 may be formed to protrude from the first pressurizing body 600 in a direction opposite to the third direction DR3. The coupling pin 610 may also be formed integrally with the first pressurizing body 600. In addition, the coupling pin 610 may include a metal substance with high hardness to minimize deformation caused by external pressure.

[0084] Although Figure 6 Although not shown in the figure, the first pressurizing device PD1 may further include a driving device for raising or lowering the first pressurizing body 600 and the coupling pin 610. The driving device may include a servo motor that can be connected to the first pressurizing body 600 to precisely control the raising or lowering operation.

[0085] Thus, the first pressurizing device PD1 can pressurize the wafer WF and couple the wafer WF to the wafer carrier WC using the coupling pins 610. By coupling the wafer WF and the wafer carrier WC using the first pressurizing device PD1, the wafer WF can be further accurately aligned and uniformly pressurized.

[0086] Reference Figure 7The wafer system WS may further include a second pressurizing device PD2 for detaching the wafer WF from the wafer carrier WC. The second pressurizing device PD2 may be disposed below the wafer carrier WC to detach the wafer WF from the wafer carrier WC.

[0087] According to one embodiment, the second pressurizing device PD2 may include a second pressurizing body 700 and a plurality of disassembly pins 710. The second pressurizing body 700 and the disassembly pins 710 may rise or fall in the third direction DR3. In particular, the second pressurizing body 700 and the disassembly pins 710 may rise toward the wafer WF and the wafer carrier WC along the third direction DR3. For example, the second pressurizing body 700 and the disassembly pins 710 may rise toward the lower surface DP of the body 110 of the wafer carrier WC. Furthermore, the disassembly pins 710 may be inserted into the pin holes 300 (refer to FIG. 3 ) of the body 110. Figure 1 ). The removal pin 710 can contact the lower surface A1 of the wafer WF through the pin hole 300 to pressurize the wafer WF. Specifically, the removal pin 710 can lift the lower surface A1 of the wafer WF housed in the wafer area 120 through the pin hole 300. This allows the lower surface A1 of the wafer WF to be removed from the bottom surface 111 of the wafer area 120.

[0088] The second pressurizing body 700 may include a surface C1 parallel to a plane defined by the first direction DR1 and the second direction DR2. The surface C1 of the second pressurizing body 700 may be disposed opposite the lower surface DP of the body 110 of the wafer carrier WC. Furthermore, a detachment pin 710 may be disposed on the surface C1 of the second pressurizing body 700 at a position corresponding to the pin hole 300 of the wafer carrier WC.

[0089] The detachment pin 710 may be formed to protrude in the third direction DR3 from the second pressurizing body 700. The detachment pin 710 may also be formed integrally with the second pressurizing body 700. In addition, the detachment pin 710 may include a metal substance having high hardness in order to minimize deformation caused by external pressure.

[0090] Although Figure 7 Although not shown in the figure, the second pressurizing device PD2 may further include a driving device for raising or lowering the second pressurizing body 700 and the detachment pin 710. The driving device may include a servo motor that can be connected to the second pressurizing body 700 to precisely control the raising or lowering operation.

[0091] Reference Figure 8 , the detachment pin 710 of the second pressurizing device PD2 may be inserted into the pin hole 300 of the body 110 of the wafer carrier WC.

[0092] The detachment pin 710 can penetrate the body 110 in the wafer area 120 to lift the wafer WF. Figure 8As shown, the first disassembly pin 711 of the second pressurizing device PD2 can be inserted into the first pin hole 301 of the chip carrier WC. The first disassembly pin 711 of the second pressurizing device PD2 can pass through the first pin hole 301 to lift the lower surface A1 of the chip WF. Here, the first pin hole 301 for the first disassembly pin 711 to be inserted can be adjacent to the first adhesive component 201. In addition, the third disassembly pin 713 of the second pressurizing device PD2 can be inserted into the third pin hole 303 of the chip carrier WC. The third disassembly pin 713 of the second pressurizing device PD2 can pass through the third pin hole 303 to lift the lower surface A1 of the chip WF. Here, the third pin hole 303 for the third disassembly pin 713 to be inserted can be adjacent to the sixth adhesive component 206. In this way, the disassembly pin 710 can pass through the pin hole 300 (refer to Figure 2 ) to lift the lower surface A1 of the wafer WF.

[0093] According to one embodiment, the height H of the detachment pins 710 can be determined taking into account the thickness D2 of the main body 110 in the wafer area 120. The height H of the detachment pins 710 can be greater than the thickness D2 of the main body 110 in the wafer area 120. Thus, the detachment pins 710 can protrude beyond the bottom surface 111 of the wafer area 120 to separate the wafer WF from the wafer area 120. For example, the height H of each detachment pin 710 can be substantially uniform. This allows the lower surface A1 of the wafer WF to be pressed with uniform force to prevent damage.

[0094] Thus, the second pressurizing device PD2 can pressurize the wafer WF using the detachment pins 710 to detach the wafer WF from the wafer carrier WC. By detaching the wafer WF from the wafer carrier WC using the second pressurizing device PD2, the wafer WF attached by the adhesive member 200 can be separated stably without being damaged.

[0095] Although specific embodiments and application examples have been described herein, other embodiments and variations can be derived from the above description. Therefore, the concept of the present invention is not limited to the embodiments, but extends to the claims, various obvious variations, and equivalents.

Claims

1. A wafer carrier, characterized in that include: A substrate comprising a main body, wherein a wafer area having a concave shape for receiving a wafer is defined on one side of the main body, wherein the wafer area has a bottom surface opposite to the lower surface of the wafer and an inner side surface opposite to the side surface of the wafer; as well as a plurality of adhesive members arranged between the bottom surface and the wafer in the wafer region for attaching the lower surface of the wafer to the bottom surface, The base includes a plurality of pin holes that are arranged adjacent to at least a portion of the plurality of adhesive members in the wafer region and formed through the body.

2. The wafer carrier according to claim 1, wherein: The base is configured such that when the wafer is received in the wafer region, first sides of the plurality of pin holes are blocked by a lower surface of the wafer.

3. The wafer carrier according to claim 2, wherein: The base is configured such that when a plurality of detachment pins are inserted into the second sides of the plurality of pin holes, the wafer is separated from the wafer area.

4. The wafer carrier according to claim 1, wherein: The plurality of pin holes are arranged between two adjacent adhesive members among the plurality of adhesive members.

5. The wafer carrier according to claim 1, wherein: The plurality of adhesive components are directly arranged on the bottom surface of the wafer area.

6. The wafer carrier according to claim 1, wherein: The plurality of adhesive members are arranged along an edge of the bottom surface of the wafer area.

7. The wafer carrier according to claim 1, wherein: The plurality of pin holes are arranged along an edge of the bottom surface of the wafer area.

8. The wafer carrier according to claim 1, wherein: The substrate further includes a plurality of support members fixed to the main body in a peripheral area of ​​the wafer area, The plurality of support members are configured to clamp the wafer.

9. The wafer carrier according to claim 8, wherein: The plurality of supporting components respectively include: a fixing member disposed in the peripheral area; and The moving member is fixed to the fixing member and is configured to move in a direction perpendicular to a circumferential direction in which the inner side surface of the wafer area extends to clamp the wafer.

10. A wafer carrier system, characterized in that: include: A wafer carrier according to any one of claims 1 to 9 for receiving and transferring wafers; as well as A pressurizing device is used to bond the wafer to the wafer carrier and detach the wafer from the wafer carrier.

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