Motion table for semiconductor wafer positioning

Abstract

The utility model discloses a motion platform for positioning a semiconductor wafer. The motion platform comprises a base; the bearing part is used for bearing the semiconductor wafer; the fixing assembly is mounted on the base; the bearing part is mounted and connected; the jacking assembly is telescopically mounted between the fixing assembly and the bearing part and used for driving the bearing part to move in the first direction; the rotating assembly is movably installed on the fixing assembly, the rotating assembly comprises a driving part and at least two hinge structures connected to the fixing assembly in the circumferential direction at intervals, the driving part is connected with one hinge structure, and the other hinge structures are all fixedly connected to the base; the driving part is used for driving the hinge structures to deform and driving the fixing assembly to rotate around a center shaft extending in the first direction. According to the motion platform for positioning the semiconductor wafer, the height and angle of the wafer can be comprehensively adjusted, and the accuracy of the adjustment position is ensured.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a motion stage for positioning semiconductor wafers. Background Art

[0002] In the semiconductor industry, motion stages are essential for assembling and testing semiconductor wafers. These stages are required to perform actions such as leveling and corner rotation to precisely position the wafer.

[0003] However, current motion stages generally only have the functions of rotation or lifting, and are unable to perform comprehensive adjustments to the height and angle of the wafer, thereby failing to guarantee the accuracy of the final wafer position. Utility Model Content

[0004] The present application provides a motion stage for positioning semiconductor wafers, which can comprehensively adjust the height and angle of the wafer to ensure the accuracy of the adjusted position.

[0005] The present application provides a moving platform for positioning semiconductor wafers, which includes: a base; a carrier for carrying the semiconductor wafer; a fixed assembly installed on the base; a mounting and connecting carrier; a lifting assembly telescopically installed between the fixed assembly and the carrier for driving the carrier to move in a first direction; a rotating assembly, the rotating assembly being movably installed on the fixed assembly, the rotating assembly including a driving member and at least two hinge structures connected to the fixed assembly at circumferential intervals, the driving member being connected to one of the hinge structures, and the remaining hinge structures being fixedly connected to the base, the driving member being used to drive the multiple hinge structures to deform and drive the fixed assembly to rotate around a central axis extending along the first direction.

[0006] As described above, a moving table for positioning semiconductor wafers, wherein the rotating component includes a first hinge structure and a second hinge structure arranged symmetrically with respect to the center of the fixed component, the driving member is fixedly mounted on the base, the driving member is telescopically connected to the first hinge structure along the circumference of the fixed component, the second hinge structure is fixedly mounted on the base, and the driving member can drive the first hinge structure and the second hinge structure to deform along the circumference of the fixed component to rotate the fixed component.

[0007] The movable table for positioning semiconductor chips as above, wherein the first hinge structure includes a driving connection part, a first hinge part and a second hinge part connected along the extension and contraction direction of the driving member, the driving member is connected to the driving connection part, and is used to drive the driving connection part to move along the extension and contraction direction of the driving member, the second hinge part is fixedly connected to the fixed component, and there are a first movable gap and a second movable gap separated from each other between the first hinge part and the second hinge part, the first movable gap is arranged on a side close to the center of the fixed component, and the second movable gap is arranged on a side away from the center of the fixed component, the driving connection part can drive the first hinge part to move along the extension and contraction direction of the driving member, so that the gap width of the first movable gap is reduced, the gap width of the second movable gap is increased, and the second hinge part drives the fixed component to rotate.

[0008] The above-mentioned moving table for positioning semiconductor chips, wherein the second hinge structure includes a fixed connection part, a third hinge part and a fourth hinge part connected along the extension and contraction direction of the driving part, the fixed connection part is fixedly connected to the base, the fourth hinge part is fixedly connected to the fixed assembly, and a third movable gap and a fourth movable gap are separated from each other between the third hinge part and the fourth hinge part. The third movable gap is arranged on a side close to the center of the fixed assembly, and the fourth movable gap is arranged on a side away from the center of the fixed assembly. The fixed assembly can drive the fourth hinge part to move circumferentially so that the gap width of the third movable gap is reduced and the gap width of the fourth movable gap is increased.

[0009] As above, a moving table for positioning semiconductor wafers, wherein the first hinged part includes a first connecting plate and two first flexible plates spaced apart along a first direction, the two ends of the two first flexible plates are respectively connected to the first connecting plate and the driving connecting part and together form a square ring structure, and the first flexible plate is a flexible part; the third hinged part includes a second connecting plate and two second flexible plates spaced apart along the first direction, the two ends of the two second flexible plates are respectively connected to the second connecting plate and the fixed connecting part and together form a square ring structure, and the second flexible plate is a flexible part.

[0010] As described above, a moving table for positioning semiconductor chips is provided, wherein the connection between each first flexible plate and the first connecting plate and the driving connecting part has a first thinning groove with an inwardly arranged recessed arrangement, and the first thinning groove is used to assist the first flexible plate to deform; the connection between each second flexible plate and the second connecting plate and the fixed connecting part has a second thinning groove with an inwardly arranged recessed arrangement, and the second thinning groove is used to assist the second flexible plate to deform.

[0011] As described above, a moving table for positioning semiconductor wafers, wherein the driving member includes a driving rod, a driving portion and a mounting portion, the driving portion is connected to the mounting portion, the mounting portion is fixed to the base, the driving rod is telescopically mounted on the driving portion, the driving rod is sequentially passed through the second hinge portion and the first hinge portion, and the end of the driving rod is connected to the driving connection portion.

[0012] As described above, a moving table for positioning semiconductor wafers, wherein the fixing component has two supporting protrusions symmetrically arranged along its center, both supporting protrusions protrude from the circumferential edge of the fixing component, the driving member and the first hinge structure are respectively installed on the opposite sides of one of the supporting protrusions, and the driving rod can be slidably passed through the supporting protrusion, and the second hinge structure is installed on the other supporting protrusion.

[0013] As above, a moving table for positioning semiconductor wafers, wherein the fixed component includes a support plate and a fixed suction cup, the fixed suction cup has a suction cup groove and an air suction port that are connected to each other, the air suction port is used to inflate and deflate the suction cup groove, and the support plate is detachably connected to the base through the fixed suction cup.

[0014] As described above, the moving platform for positioning semiconductor wafers, wherein the lifting assembly includes a plurality of lifting structures distributed at intervals along the circumference of the carrier, and the plurality of lifting structures are all connected to the bottom of the carrier, and each lifting structure is retractably arranged along the first direction.

[0015] The motion platform for positioning semiconductor chips of the present application includes a base, a carrier, a fixed assembly, a lifting assembly and a rotating assembly, wherein the carrier is used to carry the semiconductor chip, the carrier is installed on the fixed assembly through the lifting assembly, and the fixed assembly is installed on the base, the lifting assembly is retractable, and under the drive of the lifting assembly, the carrier can drive the chip to move along the first direction, thereby realizing the height adjustment of the chip; the rotating assembly is movably installed on the fixed assembly, the rotating assembly includes a driving member and at least two hinge structures connected to the fixed assembly along the circumferential interval, the driving member is connected to one of the hinge structures, the driving member can drive the hinge structure connected thereto to deform, thereby driving the fixed assembly to rotate around the central axis extending along the first direction, and the other hinge structures are deformed at the same time under the drive of the fixed assembly, and since the remaining hinge structures are fixedly connected to the base, the height of the fixed assembly can be fixed when it rotates, so that the fixed assembly and the lifting assembly and the carrier installed on the fixed assembly rotate together, thereby realizing stable adjustment of the chip rotation angle. Therefore, under the joint action of the carrier, fixed assembly, lifting assembly and rotating assembly of the motion stage, the motion stage can comprehensively adjust the height and angle of the wafer to ensure the accuracy of the adjusted position. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic diagram of the overall structure of the exercise platform according to an embodiment of the present application;

[0018] Figure 2 A schematic diagram of a bottom perspective of a sports platform according to an embodiment of the present application;

[0019] Figure 3 Schematic diagram of the connection between the driving member and the first hinge structure of the exercise platform according to an embodiment of the present application;

[0020] Figure 4 This is a schematic structural diagram of the second hinge structure of the exercise platform according to an embodiment of the present application;

[0021] Figure 5 This is a schematic structural diagram of a first hinge structure of a sports platform according to an embodiment of the present application;

[0022] Figure 6 This is a schematic structural diagram of a lifting assembly of a sports platform according to an embodiment of the present application;

[0023] Figure 7 A schematic diagram of the specific structure of the movable gap of the exercise platform according to an embodiment of the present application;

[0024] Figure 8 Schematic diagram of the fixed suction cup of the exercise table according to an embodiment of the present application.

[0025] Description of Figure Numbers:

[0026] 10. Base; 20. Carrying member; 30. Fixing assembly; 31. Support plate; 311. Supporting protrusion; 32. Fixing suction cup; 321. Suction cup groove; 322. Air inlet; 40. Lifting assembly; 41. Lifting structure; 411. Piezoelectric deforming element; 412. Guide member; 413. Elastic member; 414. Lifting base; 50. Rotating assembly; 51. Driving member; 511. Driving rod; 512. Driving unit; 513. Mounting unit; 52. First hinge structure; 521. Driving connection unit; 522. First hinge unit; 522 1. First connecting plate; 5222. First flexible plate; 5223. First thinning groove; 523. Second hinged portion; 524. First movable gap; 525. Second movable gap; 526. Circular hole gap; 527. Strip gap; 53. Second hinge structure; 531. Fixed connecting portion; 532. Third hinged portion; 5321. Second connecting plate; 5322. Second flexible plate; 5323. Second thinning groove; 533. Fourth hinged portion; 534. Third movable gap; 535. Fourth movable gap; 60. Height measuring member;

[0027] X, first direction. DETAILED DESCRIPTION

[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0029] like Figures 1 to 8 As shown, an embodiment of the present application provides a motion stage for positioning semiconductor wafers, which includes: a base 10; a carrier 20 for carrying a semiconductor wafer, the carrier 20 can fix the wafer to the surface of the carrier 20 by means of adsorption or clamping, so as to avoid the wafer falling off the surface of the carrier 20 during the overall adjustment of the motion stage, resulting in inaccurate wafer position; a fixing assembly 30, mounted on the base 10; used for mounting the carrier 20; a lifting assembly 40, retractably mounted between the fixing assembly 30 and the carrier 20, used for driving the carrier 20 to move along a first direction X; a rotating assembly 50, the rotating assembly 50 is movably mounted on the fixing assembly 30, the rotating assembly 50 includes a driving member 51 and at least two hinge structures connected to the fixing assembly 30 at intervals along the circumferential direction, the driving member 51 is connected to one of the hinge structures, and the remaining hinge structures are fixedly connected to the base 10, the driving member 51 is used to drive the multiple hinge structures to deform and drive the fixing assembly 30 to rotate around the central axis extending along the first direction X.

[0030] In a specific implementation, the motion platform for positioning a semiconductor wafer in an embodiment of the present application includes a base 10, a carrier 20, a fixed assembly 30, a lifting assembly 40 and a rotating assembly 50, wherein the carrier 20 is used to carry the semiconductor wafer, the carrier 20 is mounted on the fixed assembly 30 through the lifting assembly 40, and the fixed assembly 30 is mounted on the base 10, and the lifting assembly 40 is retractable. Under the drive of the lifting assembly 40, the carrier 20 can drive the wafer to move along the first direction X, thereby achieving height adjustment of the wafer; the rotating assembly 50 is movably mounted on the fixed assembly 30, and the rotating assembly 50 includes a driving member 51 and a circumferential space between the driving member 51 and the fixed assembly 30. At least two hinge structures are connected to the fixed assembly 30, and the driving member 51 is connected to one of the hinge structures. The driving member 51 can drive the hinge structure connected to it to deform, thereby driving the fixed assembly 30 to rotate around the central axis extending along the first direction. The other hinge structures are simultaneously deformed under the drive of the fixed assembly 30. Since the remaining hinge structures are all fixedly connected to the base 10, the height of the fixed assembly 30 can be fixed when it rotates, so that the fixed assembly 30 and the lifting assembly 40 and the supporting member 20 installed on the fixed assembly 30 rotate together, achieving stable adjustment of the wafer rotation angle. Therefore, under the joint action of the supporting member 20, the fixed assembly 30, the lifting assembly 40 and the rotating assembly 50 of the moving stage, the moving stage can comprehensively adjust the height and angle of the wafer to ensure the accuracy of the adjusted position.

[0031] Moreover, the rotating component 50 is directly installed on the fixed component 30, and the power of the rotating component 50 can directly act on the fixed component 30 to rotate the fixed component 30, while the lifting component 40 is telescopically installed between the fixed component 30 and the carrier 20, and its telescopic movement can only drive the carrier 20 to move up and down. Therefore, the rotating component 50 and the lifting component 40 can move and adjust independently, and will not affect each other during the adjustment process. In addition, the height and rotation angle of the carrier 20 and the chip can be adjusted at the same time, which can improve the adjustment efficiency.

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the rotating component 50 includes a driving member 51 and a first hinge structure 52 and a second hinge structure 53 symmetrically arranged at the center of the fixed component 30, the driving member 51 is installed on the base 10, the driving member 51 is installed on the first hinge structure 52, the driving member 51 can drive the first hinge structure 52 and the second hinge structure 53 to deform along the circumference of the fixed component 30, and the second hinge structure 53 is fixed to the base 10.

[0033] In practice, the driving member 51 and second hinge structure 53 of the rotating assembly 50 are both fixedly mounted to the base 10. Thus, fixed points are provided on either side of the center of the fixed assembly 30. Driven by the driving member 51, the first hinge structure 52 and the second hinge structure 53 can both undergo slight deformation, thereby causing the fixed assembly 30 to rotate slightly to achieve angle adjustment of the carrier 20 and the wafer. Furthermore, since fixed points are provided on either side of the center of the fixed assembly 30, precise control of the angle can be achieved during rotational adjustment, preventing excessive rotation or low angle adjustment accuracy.

[0034] Optionally, multiple pairs of hinge components symmetrical with respect to the center of the fixing component 30 may be provided on the peripheral side of the fixing component 30 to improve the accuracy of the rotation, thereby making the rotation angle of the carrier 20 and the wafer more accurate.

[0035] Specifically, if Figure 2 As shown, both the base 10 and the fixing assembly 30 have through holes extending along the first direction X. The through holes of the two are located at the same center. The through holes of the base 10 and the fixing assembly 30 are used to pass a height measuring member 60. The height measuring member 60 can measure the movement distance of the carrier 20 along the first direction X to calculate the specific height of the wafer. The height measuring member 60 can be an absolute grating measuring ruler or a combined photoelectric and incremental grating measuring ruler.

[0036] like Figure 3 and Figure 5 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the first hinge structure 52 includes a driving connection part 521, a first hinge part 522 and a second hinge part 523 connected to each other, the driving connection part 521 is connected to the driving member 51, and the second hinge part 523 is fixedly connected to the fixed component 30, and there are a first movable gap 524 and a second movable gap 525 separated from each other between the first hinge part 522 and the second hinge part 523, the first movable gap 524 is arranged on a side close to the center of the fixed component 30, and the second movable gap 525 is arranged on a side away from the center of the fixed component 30.

[0037] In a specific implementation, when the driving member 51 drives the driving connection portion 521, since the driving member 51 can drive the driving connection portion 521 of the first hinge structure 52 to move, the driving connection portion 521 can drive the first hinge portion 522 connected thereto to move along the fixed assembly 30, thereby causing the first hinge portion 522 to tilt relative to the second hinge portion 523, reducing the first movable gap 524 on the side closer to the center of the fixed assembly 30 and increasing the second movable gap 525 on the side farther from the center of the fixed assembly 30, thereby achieving the driving effect of the first hinge structure 52 driving the fixed assembly 30 to rotate. In addition, by driving the fixed assembly 30 to rotate through the first movable gap 524 and the second movable gap 525 between the first hinge portion 522 and the second hinge portion 523, precise control of the angle can be achieved, avoiding situations where the overall rotation angle is too large or the angle adjustment accuracy is low.

[0038] like Figure 4 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the second hinge structure 53 includes a fixed connection part 531, a third hinge part 532 and a fourth hinge part 533 connected to each other, the fixed connection part 531 is fixedly connected to the base 10, the fourth hinge part 533 is fixedly connected to the fixed assembly 30, and a third movable gap 534 and a fourth movable gap 535 are separated from each other between the third hinge part 532 and the fourth hinge part 533, the third movable gap 534 is arranged on a side close to the center of the fixed assembly 30, and the fourth movable gap 535 is arranged on a side away from the center of the fixed assembly 30.

[0039] During specific implementation, under the driving action of the first hinge structure 52, the fixed component 30 rotates as a whole, and the second hinge structure 53 arranged opposite to the first hinge structure 52 moves together with the fixed component 30. The fixed connection part 531 of the second hinge structure 53 is fixed to the base 10, which supports the overall rotation movement of the fixed component 30, thereby preventing the part of the fixed component 30 close to the second hinge structure 53 from moving up and down along the first direction X during the rotation process, so that the fixed component 30 as a whole can rotate within the same horizontal plane.

[0040] After the fixing component 30 is driven by the first hinge structure 52, the fixing component 30 transmits the driving force to the third hinge part 532 connected to it, and the third hinge part 532 moves together with the fixing component 30. The third movable gap 534 on the side close to the center of the fixing component 30 is reduced, and the fourth movable gap 535 on the side away from the center of the fixing component 30 is increased, so that the side of the fixing component 30 connected to the third hinge part 532 can move circumferentially around the center of the fixing component 30, and the fixing component 30 is rotated as a whole.

[0041] Specifically, if Figure 7 As shown, the first movable gap 524, the second movable gap 525, the third movable gap 534, and the fourth movable gap 535 are all formed by combining a circular hole gap 526 and a strip gap 527. The circular hole gap 526 has an opening, and the strip gap 527 is connected to the opening of the circular hole gap 526. When the movable gap is squeezed as a whole, the opening of the circular hole gap 526 is reduced, and the width of the strip gap 527 is reduced; when the movable gap is stretched as a whole, the opening of the circular hole gap 526 is expanded, and the width of the strip gap 527 is increased. The provision of the circular hole gap 526 provides a larger deformation space when the movable gap is squeezed or stretched as a whole, and the width of the strip gap 527 is more easily changed. The driving member 51 can more easily adjust the movable gap, thereby improving the adjustment accuracy of the rotation angle of the fixing assembly 30.

[0042] It should be noted that the first movable gap 524, the second movable gap 525, the third movable gap 534 and the fourth movable gap 535 are not limited to the combination of the circular hole gap 526 and the strip gap 527, but can also be formed only by the strip gap 527, or only by the circular hole gap 526, as long as they can be deformed under extrusion or stretching.

[0043] like Figure 3 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the driving member 51 includes a driving rod 511, a driving portion 512 and a mounting portion 513, the driving portion 512 is fixed to the base 10 through the mounting portion 513, the driving rod 511 is telescopically mounted on the driving portion 512, the driving rod 511 is sequentially passed through the second hinge portion 523 and the first hinge portion 522, and the end of the driving rod 511 is connected to the driving connection portion 521.

[0044] During specific implementation, the driving rod 511 and the driving part 512 are fixed to the base 10 through the mounting part 513, and the driving rod 511 is connected to the driving connection part 521 of the first hinge structure 52. Therefore, the fixed component 30 connected to the first hinge structure 52 has a fixed base on the side close to the first hinge structure 52, so that the fixed component 30 will not move up and down along the first direction X during the rotation process, so that the fixed component 30 as a whole can rotate in the same horizontal plane, ensuring the adjustment accuracy of the carrier 20 and the chip.

[0045] Among them, the driving rod 511 is retractably arranged. Under the drive of the driving part 512, the driving rod 511 moves as a whole in a straight line direction, can pass through the second hinge part 523 and the first hinge part 522, and drive the driving connection part 521 to move in a straight line. The driving connection part 521 is connected to the first hinge part 522, thereby driving the first hinge part 522 to move in a straight line. Since the first movable gap 524 is close to the rotation center of the fixed component 30 and the second movable gap 525 is away from the rotation center of the fixed component 30, the first movable gap 524 is reduced and the second movable gap 525 is increased, and the first hinge structure 52 is converted from linear motion to rotational motion that drives the fixed component 30 together.

[0046] The coordinated design of the driving member 51, the first hinge structure 52 and the second hinge structure 53 of the rotating component 50 can convert linear motion into rotational motion of the fixed component 30. The overall structure is simple and can fine-tune the rotation angle of the fixed component 30. Compared with directly using a rotating motor or other device, the adjustment accuracy of the rotating component 50 is higher, and it can achieve precise adjustment of the rotation angle of the chip.

[0047] Specifically, the driving part 512 is a device or structure such as a piezoelectric actuator or a linear motor that can drive the driving rod 511 to perform linear extension and retraction, so that the linear movement of the driving rod 511 can drive the fixing component 30 to perform rotational movement to achieve adjustment of the chip rotation angle.

[0048] like Figure 2 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the fixing assembly 30 includes a support plate 31 and a fixed suction cup 32, the support plate 31 is detachably connected to the base 10 via the fixed suction cup 32, the support plate 31 has two supporting protrusions 311 symmetrically arranged along its center, the two supporting protrusions 311 both protrude from the side surfaces of the support plate 31, and the first hinge structure 52 and the second hinge structure 53 are respectively installed on the two supporting protrusions 311.

[0049] During specific implementation, when it is necessary to lock the support plate 31, the support plate 31 is fixed to the surface of the base 10 by the fixed suction cup 32. At this time, the rotating assembly 50 cannot drive the support plate 31 to rotate, and the supporting member 20 can only be adjusted in height along the first direction X under the drive of the jacking assembly 40; when it is necessary to adjust the rotation angle, the fixed suction cup 32 is separated from the base 10. At this time, the rotating assembly 50 can drive the support plate 31 to rotate, thereby adjusting the supporting member 20 installed on the support plate 31. At this time, the height and angle of the supporting member 20 can be adjusted at the same time.

[0050] The two supporting protrusions 311 of the supporting plate 31 are protruding from the side of the supporting plate 31, providing an installation basis for the first hinge structure 52 and the second hinge structure 53, so that when the first hinge structure 52 and the second hinge structure 53 are deformed internally, the supporting protrusions 311 can be pushed to move in a circular direction, thereby realizing the rotation adjustment of the fixing component 30.

[0051] Specifically, the cross-sectional shape of the two supporting protrusions 311 perpendicular to the first direction X is a triangle, and the cross-sectional shape of the supporting plate 31 perpendicular to the first direction X is a rectangle. The two supporting protrusions 311 are respectively arranged at the diagonals of the supporting plate 31. Such an arrangement facilitates the installation of the driving rod 511 and the driving part 512. The driving rod 511 and the driving part 512 both extend along one side of the supporting plate 31 so as to be able to perform linear motion. The driving rod 511 and the driving part 512 are connected to the supporting protrusions 311 at the diagonals of the supporting plate 31, and can have sufficient installation space to avoid the driving member 51 protruding from the support plate 31 as a whole, causing the overall volume of the sports platform to be too large.

[0052] like Figure 8 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the fixed suction cup 32 is a suction cup structure arranged at the bottom of the support plate 31, and the fixed suction cup 32 has a suction cup groove 321 and an air suction port 322 that are connected to each other, and the air suction port 322 is used to inflate and deflate the suction cup groove 321.

[0053] In a specific implementation, the fixed suction cup 32 is a suction cup structure, including a suction cup groove 321 and an air inlet 322. By deflating the suction cup groove 321 through the air inlet 322, the support plate 31 can be adsorbed on the surface of the base 10, thereby achieving fixation between the support plate 31 and the base 10; by inflating the suction cup groove 321 through the air inlet 322, the support plate 31 can be detached from the surface of the base 10. Setting the fixed suction cup 32 as a suction cup structure can facilitate the removal of the support plate 31 from the base 10, thereby improving the overall positioning efficiency.

[0054] Optionally, the fixing suction cup 32 may also be configured as an electromagnet, which can obtain magnetism by being energized, thereby achieving a fixing effect between the support plate 31 and the base 10 .

[0055] like Figure 4 and Figure 5As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the first hinge portion 522 includes a first connecting plate 5221 and two first flexible plates 5222 spaced apart along a first direction X, the two ends of the first flexible plates 5222 are respectively connected to the first connecting plate 5221 and the driving connecting portion 521 and together form a square ring structure, and the first flexible plate 5222 is a flexible member; the third hinge portion 532 includes a second connecting plate 5321 and two second flexible plates 5322 spaced apart along the first direction X, the two ends of the second flexible plates 5322 are respectively connected to the second connecting plate 5321 and the fixed connecting portion 531 and together form a square ring structure, and the second flexible plate 5322 is a flexible member.

[0056] In practice, when air is drawn from the suction cup groove 321, the support plate 31 as a whole moves downward in the first direction X. Since the first flexible plate 5222 and the second flexible plate 5322 are both flexible components, they move downward with the movement of the support plate 31 and deform. After the suction port 322 stops drawing air, the first and second flexible plates 5222 and 5322 gradually recover their deformation and drive the support plate 31 as a whole to move upward, freeing the support plate 31 from the base 10. Therefore, the provision of the first and second flexible plates 5222 and 5322 as flexible components facilitates the removal of the support plate 31, improving overall removal efficiency.

[0057] Moreover, the first hinge portion 522 and the third hinge portion 532 are both square ring structures with deformation space. The two first flexible plates 5222 and the two second flexible plates 5322 arranged at intervals are easy to deform, further improving the fixing and disassembly efficiency between the support plate 31 and the base 10.

[0058] The embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the connection between each first flexible plate 5222 and the first connecting plate 5221 and the driving connecting part 521 has a first thinning groove 5223 with an inwardly arranged concave arrangement, and the first thinning groove 5223 is used to assist the first flexible plate 5222 to deform; the connection between each second flexible plate 5322 and the second connecting plate 5321 and the fixed connecting part 531 has a second thinning groove 5323 with an inwardly arranged concave arrangement, and the second thinning groove 5323 is used to assist the second flexible plate 5322 to deform.

[0059] In specific implementation, when the support plate 31 moves downward along the first direction X, the first flexible plate 5222 can undergo a larger deformation at the first thinning groove 5223, and the second flexible plate 5322 can undergo a larger deformation at the second thinning groove 5323, thereby avoiding the situation where the stiffness of the first flexible plate 5222 and the second flexible plate 5322 is too large to undergo a larger deformation, thereby achieving the effect of assisting the first flexible plate 5222 and the second flexible plate 5322 to deform, and further improving the fixing and disassembly efficiency between the support plate 31 and the base 10.

[0060] Specifically, the first thinning groove 5223 and the second thinning groove 5323 are semicircular grooves, which can achieve a better bending effect between two adjacent plates.

[0061] like Figure 1 and Figure 6 As shown, an embodiment of the present application is a moving platform for positioning semiconductor wafers, wherein the lifting assembly 40 includes a plurality of lifting structures 41 distributed at circumferential intervals along the carrier 20, and the plurality of lifting structures 41 are all connected to the bottom of the carrier 20, and each lifting structure 41 is telescopically arranged along the first direction X.

[0062] During specific implementation, multiple lifting structures 41 distributed at circumferential intervals along the carrier 20 are used to control the lifting and lowering of various positions of the carrier 20. Under the synchronous movement of multiple lifting structures 41, the carrier 20 can always remain perpendicular to the first direction X, thereby ensuring the positioning accuracy of the chip provided on the surface of the carrier 20 and avoiding the chip from being tilted on the surface of the carrier 20.

[0063] like Figure 6 As shown, an embodiment of the present application is a moving table for positioning semiconductor wafers, wherein the lifting structure 41 includes a piezoelectric deformer 411, a guide member 412, an elastic member 413 and a lifting base 414, the lifting base 414 is installed on the fixed component 30, and the two ends of the piezoelectric deformer 411 are respectively connected to the supporting member 20 and the lifting base 414, the piezoelectric deformer 411 can be deformed after being energized to drive the supporting member 20 to move in a direction toward or away from the fixed component 30, the guide member 412 is connected to the piezoelectric deformer 411, and is used to guide the piezoelectric deformer 411 in a first direction X, and the two ends of the elastic member 413 are respectively connected to the piezoelectric deformer 411 and the lifting base 414.

[0064] During specific implementation, the two ends of the piezoelectric deformable element 411 are respectively connected to the supporting element 20 and the lifting base 414. After the piezoelectric deformable element 411 is energized, it can deform, thereby driving the supporting element 20 to move toward or away from the fixed component 30. Since the piezoelectric deformable element 411 is connected to the guide element 412, the guide element 412 can guide the piezoelectric deformable element 411 so that it can move up and down along the first direction X, so that the supporting element 20 can drive the chip to move up and down along the first direction X, thereby adjusting the height of the chip.

[0065] An elastic member 413 is connected between the piezoelectric deformable member 411 and the lifting base 414 . The elastic member 413 can enable the piezoelectric deformable member 411 to recover to its initial state under the action of elastic force at an accelerated speed after power is lost.

[0066] Optionally, the guide member 412 may be a guiding structure such as a slide rail or a hinge structure.

[0067] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0068] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A motion stage for positioning a semiconductor wafer, characterized in that: include: base (10); A carrier (20) for carrying a semiconductor wafer; A fixing assembly (30) is mounted on the base (10) and is used to mount the bearing member (20); a lifting assembly (40) telescopically mounted between the fixing assembly (30) and the bearing member (20), and configured to drive the bearing member (20) to move along a first direction (X); A rotating assembly (50), wherein the rotating assembly (50) is movably mounted on the fixed assembly (30), and the rotating assembly (50) includes a driving member (51) and at least two hinge structures connected to the fixed assembly (30) at intervals along the circumferential direction, wherein the driving member (51) is connected to one of the hinge structures, and the remaining hinge structures are fixedly connected to the base (10), and the driving member (51) is used to drive the plurality of hinge structures to deform and drive the fixed assembly (30) to rotate around a central axis extending along the first direction (X).

2. The motion stage for semiconductor wafer positioning according to claim 1, wherein: The rotating assembly (50) includes a first hinge structure (52) and a second hinge structure (53) symmetrically arranged at the center of the fixed assembly (30); the driving member (51) is fixedly mounted on the base (10); the driving member (51) is telescopically connected to the first hinge structure (52) along the circumference of the fixed assembly (30); the second hinge structure (53) is fixedly mounted on the base (10); the driving member (51) can drive the first hinge structure (52) and the second hinge structure (53) to deform along the circumference of the fixed assembly (30) so as to rotate the fixed assembly (30).

3. The motion stage for semiconductor wafer positioning according to claim 2, wherein: The first hinge structure (52) comprises a driving connection part (521), a first hinge part (522) and a second hinge part (523) connected along the extension and contraction direction of the driving member (51); the driving member (51) is connected to the driving connection part (521) and is used to drive the driving connection part (521) to move along the extension and contraction direction of the driving member (51); the second hinge part (523) is fixedly connected to the fixing assembly (30); and a first movable gap (524) and a second movable gap (525) are provided between the first hinge part (522) and the second hinge part (523). A second movable gap (525), wherein the first movable gap (524) is arranged on a side close to the center of the fixed component (30), and the second movable gap (525) is arranged on a side away from the center of the fixed component (30), and the driving connection part (521) can drive the first hinge part (522) to move along the telescopic direction of the driving member (51), so that the gap width of the first movable gap (524) is reduced, the gap width of the second movable gap (525) is increased, and the second hinge part (523) drives the fixed component (30) to rotate.

4. The motion stage for semiconductor wafer positioning according to claim 3, wherein: The second hinge structure (53) includes a fixed connection part (531), a third hinge part (532) and a fourth hinge part (533) connected along the telescopic direction of the driving member (51), the fixed connection part (531) is fixedly connected to the base (10), the fourth hinge part (533) is fixedly connected to the fixed assembly (30), and a third movable gap (534) and a fourth movable gap (535) are separated and arranged between the third hinge part (532) and the fourth hinge part (533), the third movable gap (534) is arranged on a side close to the center of the fixed assembly (30), and the fourth movable gap (535) is arranged on a side away from the center of the fixed assembly (30), and the fixed assembly (30) can drive the fourth hinge part (533) to move in a circumferential direction, so that the gap width of the third movable gap (534) is reduced and the gap width of the fourth movable gap (535) is increased.

5. The motion stage for semiconductor wafer positioning according to claim 4, wherein: The first hinge portion (522) comprises a first connecting plate (5221) and two first flexible plates (5222) spaced apart along the first direction (X), the two ends of the first flexible plates (5222) being respectively connected to the first connecting plate (5221) and the driving connecting portion (521) to form a square ring structure, and the first flexible plates (5222) are flexible parts; The third hinged portion (532) includes a second connecting plate (5321) and two second flexible plates (5322) spaced apart along the first direction (X), the two ends of the second flexible plates (5322) being respectively connected to the second connecting plate (5321) and the fixed connecting portion (531) to form a square ring structure, and the second flexible plates (5322) are flexible parts.

6. The motion stage for semiconductor wafer positioning according to claim 5, wherein: The connection between each of the first flexible plates (5222), the first connecting plate (5221) and the driving connecting portion (521) is provided with a first thinning groove (5223) which is concave inwardly, and the first thinning groove (5223) is used to assist the first flexible plate (5222) in deforming. The connection between each second flexible plate (5322), the second connecting plate (5321) and the fixed connecting portion (531) has a second thinning groove (5323) with an inwardly concave arrangement, and the second thinning groove (5323) is used to assist the second flexible plate (5322) in deforming.

7. The motion stage for semiconductor wafer positioning according to claim 3, wherein: The driving member (51) includes a driving rod (511), a driving portion (512) and a mounting portion (513), wherein the driving portion (512) is connected to the mounting portion (513), and the mounting portion (513) is fixed to the base (10). The driving rod (511) is telescopically mounted on the driving portion (512), and the driving rod (511) is sequentially passed through the second hinge portion (523) and the first hinge portion (522), and the end of the driving rod (511) is connected to the driving connection portion (521).

8. The motion stage for semiconductor wafer positioning according to claim 7, wherein: The fixing assembly (30) has two supporting protrusions (311) symmetrically arranged along its center, and the two supporting protrusions (311) are both arranged to protrude from the circumferential edge of the fixing assembly (30). The driving member (51) and the first hinge structure (52) are respectively installed on opposite sides of one of the supporting protrusions (311), and the driving rod (511) is slidably inserted into the supporting protrusion (311). The second hinge structure (53) is installed on the other supporting protrusion (311).

9. The motion stage for semiconductor wafer positioning according to claim 2, wherein: The fixing assembly (30) comprises a support plate (31) and a fixed suction cup (32); the fixed suction cup (32) has a suction cup groove (321) and an air intake (322) which are arranged in communication with each other; the air intake (322) is used to inflate and deflate the suction cup groove (321); the support plate (31) is detachably connected to the base (10) via the fixed suction cup (32).

10. The motion stage for semiconductor wafer positioning according to claim 1, wherein: The lifting assembly (40) includes a plurality of lifting structures (41) distributed at intervals along the circumference of the supporting member (20), and the plurality of lifting structures (41) are all connected to the bottom of the supporting member (20), and each of the lifting structures (41) is telescopically arranged along the first direction (X).

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