Radiator, power module, controller and household appliance

Abstract

The utility model discloses a radiator, a power module, a controller and a household electrical appliance, and relates to the technical field of semiconductors. The aluminum oxide ceramic radiator comprises an aluminum oxide ceramic radiating body, an aluminum oxide ceramic radiating portion and an aluminum oxide ceramic protrusion, the aluminum oxide ceramic radiating portion is located on the aluminum oxide ceramic radiating body, and the aluminum oxide ceramic protrusion is located on the end face, away from the aluminum oxide ceramic radiating portion, of the aluminum oxide ceramic radiating body. And the aluminum oxide ceramic heat dissipation body, the aluminum oxide ceramic heat dissipation part and the aluminum oxide ceramic bulge are connected with a copper-clad layer in the power module, and the aluminum oxide ceramic heat dissipation body, the aluminum oxide ceramic heat dissipation part and the aluminum oxide ceramic bulge are of an integrated structure. Therefore, a combined heat dissipation structure of the radiator and the copper-clad layer is used for replacing a current heat dissipation structure of a DBC structure, heat conduction silicone grease and a heat dissipation aluminum block, the heat resistance of the power module can be effectively reduced, and the heat conduction efficiency of the radiator is greatly improved while assembly is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a radiator, a power module, a controller and a household appliance. Background Art

[0002] As semiconductor packaging devices evolve toward higher power, integration, and higher frequencies, the heat dissipation requirements for packaging structures are also increasing. Currently, the majority of high-power device packages utilize a DBC (Direct Bonded Copper) package structure, which incorporates copper foil on both sides of a ceramic substrate. Due to its low thermal resistance and high thermal conductivity, the DBC structure effectively conducts heat generated by the chip away, providing an excellent heat dissipation path.

[0003] Furthermore, power modules require a heat sink during use. To prevent gaps between the heat sink and the encapsulated power device during bonding, which would affect heat dissipation, thermal grease is applied to the contact surface between the heat sink and the power module to improve the fit between the heat sink and the power device. However, the thermal conductivity of current thermal greases is generally very low, severely impacting the heat dissipation of power devices and increasing the risk of thermal failure. Utility Model Content

[0004] Aiming at the problem of low heat dissipation efficiency of power modules with direct copper cladding structure, the present invention is proposed to provide a heat sink, power module, controller and household appliance that overcome or at least partially solve the above problem.

[0005] Based on the first aspect of the present invention, a heat sink is provided, comprising an alumina ceramic heat sink body, an alumina ceramic heat sink portion and an alumina ceramic protrusion, wherein the alumina ceramic heat sink portion is located on the alumina ceramic heat sink body, and the alumina ceramic protrusion is located on the end face of the alumina ceramic heat sink body away from the alumina ceramic heat sink portion to form a connection with the copper cladding in the power module, wherein the alumina ceramic heat sink body, the alumina ceramic heat sink portion and the alumina ceramic protrusion are an integrated structure.

[0006] An optional utility model content, the cross-sectional shape of the alumina ceramic protrusion along the horizontal plane includes one of the following: rectangle, ellipse, circle and diamond.

[0007] An optional utility model content, the alumina ceramic heat dissipation portion is a rib-shaped structure extending outward from the alumina ceramic heat dissipation body.

[0008] An optional utility model content, a plurality of heat dissipation holes are opened on the end surface of the alumina ceramic heat dissipation part away from the alumina ceramic heat dissipation body.

[0009] Based on the second aspect of the present invention, a power module is further provided, wherein the power module includes the heat sink as described in any one of the above utility models.

[0010] In an optional utility model, the power module further includes:

[0011] a copper cladding layer, the copper cladding layer being disposed on the alumina ceramic protrusion;

[0012] A power chip is mounted on the end surface of the copper cladding layer away from the alumina ceramic protrusion.

[0013] An optional utility model content, the copper cladding layer is completely attached to the alumina ceramic protrusion.

[0014] An optional utility model content, the power chip and the copper cladding layer are fixed by welding.

[0015] An optional utility model content, the power module further includes a plastic package, which wraps the alumina ceramic protrusion, the copper cladding layer and the power chip.

[0016] Based on the third aspect of the present invention, a controller is further provided, which includes the power module as described in the above utility model.

[0017] According to a fourth aspect of the present invention, a household appliance is provided, which includes the controller described in the above utility model.

[0018] Compared to the prior art, the present invention includes an alumina ceramic heat sink body, an alumina ceramic heat sink portion, and an alumina ceramic protrusion. The alumina ceramic heat sink portion is located on the alumina ceramic heat sink body, and the alumina ceramic protrusion is located on the end face of the alumina ceramic heat sink body away from the alumina ceramic heat sink portion to form a connection with the copper cladding in the power module. The alumina ceramic heat sink body, the alumina ceramic heat sink portion, and the alumina ceramic protrusion form an integrated structure. Thus, the combined heat sink and copper cladding heat sink structure replaces the current heat sink structure of DBC structure, thermal grease, and aluminum heat sink block, effectively reducing the thermal resistance of the power module, facilitating assembly, and significantly improving the heat conduction efficiency of the heat sink.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be construed as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components.

[0021] In the attached figure:

[0022] Figure 1 This is a schematic structural diagram of a power module provided by an embodiment of the present utility model;

[0023] Figure 2 yes Figure 1 An enlarged schematic diagram of the structure at A in FIG;

[0024] Figure 3 This is a schematic diagram of a first cross-sectional shape of an alumina ceramic protrusion provided by an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram of a second cross-sectional shape of an alumina ceramic protrusion provided by an embodiment of the present utility model;

[0026] Figure 5 This is a schematic diagram of a third cross-sectional shape of an alumina ceramic protrusion provided by an embodiment of the present utility model;

[0027] Figure 6 This is a schematic diagram of a fourth cross-sectional shape of an alumina ceramic protrusion provided by an embodiment of the present utility model;

[0028] Figure 7 This is a bottom view structural diagram of a radiator provided by an embodiment of the utility model;

[0029] Figure 8 This is a schematic diagram of the three-dimensional structure of another radiator provided by an embodiment of the present utility model;

[0030] Figure 9 yes Figure 8 A schematic diagram of the top view of the radiator shown in FIG.

[0031] Figure 10 This is a bottom view structural diagram of another radiator provided by an embodiment of the utility model;

[0032] Figure numerals: 1. Alumina ceramic heat dissipation body; 2. Alumina ceramic heat dissipation part; 201, heat dissipation hole; 3. Alumina ceramic protrusion; 4. Copper cladding layer; 5. Power chip; 6. Plastic package; 7. Pin; 8. Solder layer. DETAILED DESCRIPTION

[0033] The following describes exemplary embodiments of the present invention in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0034] As semiconductor packaging devices evolve toward higher power, integration, and higher frequencies, the heat dissipation requirements for packaging structures are also increasing. Currently, the majority of high-power device packages utilize a DBC (Direct Bonded Copper) package structure, which incorporates copper foil on both sides of a ceramic substrate. Due to its low thermal resistance and high thermal conductivity, the DBC structure effectively conducts heat generated by the chip away, providing an excellent heat dissipation path.

[0035] Furthermore, power modules require a heat sink during use. To prevent gaps between the heat sink and the encapsulated power device during bonding, which would affect heat dissipation, thermal grease is applied to the contact surface between the heat sink and the power module to improve the fit between the heat sink and the power device. However, the thermal conductivity of current thermal greases is generally very low, severely impacting the heat dissipation of power devices and increasing the risk of thermal failure.

[0036] Based on the above technical problems, an embodiment of the present invention is proposed. The embodiment of the present invention may include an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic heat sink portion 2 is located on the alumina ceramic heat sink body 1, and the alumina ceramic protrusion 3 is located on the end face of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2 to form a connection with the copper cladding layer 4 in the power module. The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 form an integrated structure. Thus, the combined heat dissipation structure of the heat sink and the copper cladding layer 4 replaces the current heat dissipation structure of the DBC structure, thermal grease, and heat dissipation aluminum block, effectively reducing the thermal resistance of the power module, facilitating assembly, and significantly improving the thermal conductivity efficiency of the heat sink.

[0037] Reference Figure 1-10An embodiment of the utility model provides a heat sink, which includes an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2 and an alumina ceramic protrusion 3. The alumina ceramic heat sink portion 2 is located on the alumina ceramic heat sink body 1, and the alumina ceramic protrusion 3 is located on the end surface of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2 to form a connection with the copper cladding layer 4 in the power module, wherein the alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2 and the alumina ceramic protrusion 3 are an integrated structure.

[0038] In an embodiment of the present invention, the heat sink may include an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic protrusion 3, the alumina ceramic heat sink body 1, and the alumina ceramic heat sink portion 2 are stacked in sequence. One end surface of the alumina ceramic heat sink body 1 is connected to the alumina ceramic protrusion 3, and the other end surface is connected to the alumina ceramic heat sink portion 2.

[0039] The alumina ceramic heat sink body 1, alumina ceramic heat sink portion 2, and alumina ceramic protrusion 3 are each made of alumina ceramic material. Alumina ceramic material is a ceramic material primarily composed of aluminum oxide. Alumina ceramic material has the advantages of low cost, abundant sources, high chemical stability, low thermal expansion coefficient, and high corrosion resistance. The heat sink made of this alumina ceramic material is primarily used to support the power chip 5, provide a heat dissipation channel, and provide insulation protection.

[0040] The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 form an integrated structure, and the alumina ceramic protrusion 3 is located on the end surface of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2, thereby forming a connection with the copper cladding layer 4 of the power module. The copper cladding layer 4 is used to provide installation space for the power chip 5. Therefore, for the power module disclosed in the embodiment of the present utility model, its downward heat dissipation path is: the heat generated by the power chip 5 is transferred to the copper cladding layer 4, and the heat of the copper cladding layer 4 is then transferred to the heat sink.

[0041] For a power module with a DBC structure, the downward heat dissipation path is usually as follows: the heat generated by the power chip 5 is transferred to the upper copper layer, the upper copper layer then transfers the heat to the ceramic substrate, the ceramic substrate then transfers the heat to the lower copper layer, the lower copper layer then transfers the heat to the thermal grease layer, and the thermal grease layer then transfers the heat to the radiator (also known as a heat dissipation aluminum block).

[0042] Compared to existing DBC-structured power modules, the heat sink provided by this embodiment of the utility model shortens the heat transfer path and eliminates the thermally conductive silicone grease layer, a heat-conducting structure with low thermal conductivity, thereby effectively reducing the thermal resistance of the power module. Furthermore, the entire heat sink is made of alumina ceramic material, which improves the thermal conductivity of the power module, simplifies its structure, and facilitates its assembly.

[0043] In some optional embodiments of the utility model, the alumina ceramic heat dissipation body 1, the alumina ceramic heat dissipation portion 2 and the alumina ceramic protrusion 3 can be formed into an integrated structure using photocuring 3D printing technology. For example, the alumina ceramic material can be obtained by ball milling and mixing 90 parts by mass of alumina powder, 5 parts by mass of yttrium oxide powder, 3 parts by mass of lanthanum oxide powder and 2 parts by mass of niobium pentoxide powder, and then drying. Ball milling media and solvents are added during the ball milling process. The particle size of the alumina powder is between 0.1 and 0.5 microns, the particle size of the yttrium oxide powder is between 0.05 and 0.5 microns, the particle size of the lanthanum oxide powder is between 0.05 and 0.5 microns, and the particle size of the niobium pentoxide powder is between 0.05 and 0.5 microns.

[0044] During the process of light-curing 3D printing, 54 parts by mass of alumina ceramic material, 38 parts by mass of photosensitive resin, 0.4 parts by mass of photoinitiator, 5 parts by mass of dispersant, and 2.6 parts by mass of plasticizer can be added to a ball milling medium and ball milled to obtain an alumina ceramic printing slurry. The alumina ceramic printing slurry is then placed in the material tank of the light-curing 3D printer, and the radiator blank is manufactured by layered exposure and layered stacking. The radiator blank is then placed in a degreasing furnace for degreasing.

[0045] In some optional embodiments, the degreasing process is as follows: in an air atmosphere, the temperature is raised to 160 to 220 degrees Celsius at a rate of 0.5 to 1.5 degrees Celsius per minute. For example, the temperature is raised to 180 degrees Celsius, and after the temperature is raised, the temperature is kept at this temperature for 0.5 to 2 hours, for example, 1 hour, etc. Then, the temperature is raised to 320 to 380 degrees Celsius, for example, 350 degrees Celsius, etc. at a rate of 0.5 degrees Celsius per minute, and after the temperature is raised, the temperature is kept at this temperature for 0.5 to 2 hours, for example, 1 hour, etc. Finally, the temperature is raised to 550 to 600 degrees Celsius, for example, 600 degrees Celsius, etc. at a rate of degrees Celsius per minute, and after the temperature is raised, the temperature is kept at this temperature for 0.5 to 2 hours, for example, 1 hour, etc., and finally, the temperature is cooled to room temperature with the furnace.

[0046] The degreased heat sink blank is placed in a sintering furnace. The sintering process is as follows: in an air atmosphere, the temperature is raised to between 800 and 1200 degrees Celsius at a rate of 5 to 10 degrees Celsius per minute, for example, to 800 degrees Celsius. Then, the temperature is raised to 1600 to 1700 degrees Celsius at a rate of 2 to 5 degrees Celsius per minute, for example, to 1600 degrees Celsius. After the temperature is raised, the temperature is kept at this temperature for 2 to 4 hours, for example, 2 hours. Then, the temperature is lowered to between 800 and 1200 degrees Celsius at a rate of 2 to 5 degrees Celsius per minute, for example, to 800 degrees Celsius. Finally, the heat sink is cooled to room temperature in the furnace to obtain the heat sink.

[0047] In an optional embodiment of the utility model, the heat sink includes an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic heat sink portion 2 is located on the alumina ceramic heat sink body 1, and the alumina ceramic protrusion 3 is located on the end surface of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2 to form a connection with the copper cladding layer 4 in the power module. The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 are an integrated structure. The cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane includes one of the following: rectangular, elliptical, circular, and diamond.

[0048] In an embodiment of the present invention, the heat sink may include an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic protrusion 3, the alumina ceramic heat sink body 1, and the alumina ceramic heat sink portion 2 are stacked in sequence. One end surface of the alumina ceramic heat sink body 1 is connected to the alumina ceramic protrusion 3, and the other end surface is connected to the alumina ceramic heat sink portion 2.

[0049] The alumina ceramic heat sink body 1, alumina ceramic heat sink portion 2, and alumina ceramic protrusion 3 are each made of alumina ceramic material. Alumina ceramic material is a ceramic material primarily composed of aluminum oxide. Alumina ceramic material has the advantages of low cost, abundant sources, high chemical stability, low thermal expansion coefficient, and high corrosion resistance. The heat sink made of this alumina ceramic material is primarily used to support the power chip 5, provide a heat dissipation channel, and provide insulation protection.

[0050] The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 form an integrated structure, and the alumina ceramic protrusion 3 is located on the end surface of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2, thereby forming a connection with the copper cladding layer 4 of the power module. The copper cladding layer 4 is used to provide installation space for the power chip 5. Therefore, for the power module disclosed in the embodiment of the present utility model, its downward heat dissipation path is: the heat generated by the power chip 5 is transferred to the copper cladding layer 4, and the heat of the copper cladding layer 4 is then transferred to the heat sink.

[0051] For a power module with a DBC structure, the downward heat dissipation path is usually as follows: the heat generated by the power chip 5 is transferred to the upper copper layer, the upper copper layer then transfers the heat to the ceramic substrate, the ceramic substrate then transfers the heat to the lower copper layer, the lower copper layer then transfers the heat to the thermal grease layer, and the thermal grease layer then transfers the heat to the radiator (also known as a heat dissipation aluminum block).

[0052] Compared to existing DBC-structured power modules, the heat sink provided by this embodiment of the utility model shortens the heat transfer path and eliminates the thermally conductive silicone grease layer, a heat-conducting structure with low thermal conductivity, thereby effectively reducing the thermal resistance of the power module. Furthermore, the entire heat sink is made of alumina ceramic material, which improves the thermal conductivity of the power module, simplifies its structure, and facilitates its assembly.

[0053] Reference Figure 2 As shown, the cross section of the alumina ceramic protrusion 3 along the horizontal plane is the cross section obtained along the BB line. In some embodiments, referring to Figure 3 As shown, the cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane includes a rectangle, such as a square, or a rectangle. In other embodiments, referring to Figure 4 As shown, the cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane includes a rhombus. In some other embodiments, referring to Figure 5 As shown, the cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane includes a circle. In some other embodiments, referring to Figure 6 As shown, the cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane includes an elliptical shape. Thus, the cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane is regular, which facilitates the production of the alumina ceramic protrusion 3 and the installation of the copper cladding layer 4 on the alumina ceramic protrusion 3. Those skilled in the art can determine the specific cross-sectional shape of the alumina ceramic protrusion 3 along the horizontal plane based on actual design requirements, and no further limitations are imposed here.

[0054] In an optional embodiment of the utility model, referring to Figure 7 As shown, the alumina ceramic heat dissipation portion 2 is a rib-shaped structure extending outward from the alumina ceramic heat dissipation body 1.

[0055] In the embodiment of the present invention, the alumina ceramic heat sink 2 is a rib-like structure, and a plurality of ribs can be provided, which are spaced and distributed on the alumina ceramic heat sink body 1. This can increase the contact area between the alumina ceramic heat sink 2 and the air in the external environment, thereby improving the heat dissipation efficiency of the alumina ceramic heat sink 2.

[0056] In an optional embodiment of the utility model, referring to Figure 8 and Figure 9 As shown, the alumina ceramic heat dissipation portion 2 is a sheet-like structure extending outward from the alumina ceramic heat dissipation body 1 .

[0057] In this embodiment of the present invention, the alumina ceramic heat sink 2 is a sheet-like structure, and multiple sheets can be provided, spaced apart and distributed on the alumina ceramic heat sink body 1. For example, when viewed from above, the cross-sectional shape of the alumina ceramic heat sink 2 can be wavy, sawtooth, or the like. This increases the contact area between the alumina ceramic heat sink 2 and the external air, improving the heat dissipation efficiency of the alumina ceramic heat sink 2.

[0058] In an optional embodiment of the utility model, referring to Figure 1 and Figure 10 As shown, a plurality of heat dissipation holes 201 are formed on the end surface of the alumina ceramic heat dissipation portion 2 away from the alumina ceramic heat dissipation body 1 .

[0059] In the embodiment of the present invention, the alumina ceramic heat sink 2 may have a porous structure, that is, a plurality of heat dissipation holes 201 are formed on the end surface of the alumina ceramic heat sink 2 away from the alumina ceramic heat sink body 1. This can increase the contact area between the alumina ceramic heat sink 2 and the air in the external environment, thereby improving the heat dissipation efficiency of the alumina ceramic heat sink 2.

[0060] The present utility model also discloses a power module, referring to Figure 1 As shown, the power module includes the heat sink described in any one of the above-mentioned utility model embodiments.

[0061] In an embodiment of the present invention, the power module is a module formed by combining power devices according to certain functions and then encapsulating them. It can also be called an intelligent power module (IPM). The power module is integrated with the heat sink described in any of the above embodiments of the present invention.

[0062] In an optional embodiment of the utility model, the power module may further include a copper cladding layer 4 and a power chip 5, wherein the copper cladding layer 4 is arranged on the alumina ceramic protrusion 3, and the power chip 5 is installed on the end face of the copper cladding layer 4 away from the alumina ceramic protrusion 3.

[0063] In an embodiment of the present invention, the power module may further include a copper cladding layer 4 and at least one power chip 5. The copper cladding layer 4 is disposed on the end surface of the alumina ceramic protrusion 3 away from the alumina ceramic heat sink body 1. It provides a mounting area for at least one power chip 5 and can promptly transfer heat dissipated by the power chip 5 during operation to the alumina ceramic heat sink body 1. The power chip 5 may also be referred to as a power switching chip. The power chip 5 operates at an extremely high switching frequency. Therefore, in the power module, the power chip 5 is an electrical component that generates a large amount of heat and is also the key component that requires the most heat dissipation. The power chip 5 can be obtained by separating the crystals from the wafer by dicing and then bonding them. The copper cladding layer 4 can be fixed to the alumina ceramic protrusion 3 using a ceramic copper cladding process. The copper cladding layer 4 can be made of copper foil. For example, the ceramic copper cladding process can include directly sintering copper foil onto the alumina ceramic protrusion 3, thereby forming a fixed connection between the copper cladding layer 4 and the copper cladding layer 4.

[0064] After the copper clad layer 4 is fixed, the power chip 5 is mounted on the end face of the copper clad layer 4 away from the alumina ceramic protrusion 3. In some embodiments, referring to Figure 2 As shown, the power chip 5 and the copper clad layer 4 can be fixed by welding to form a welding layer 8. The welding layer 8 can be formed by welding with alloy solder. For example, the alloy solder can include but is not limited to gold-tin alloy.

[0065] For a power module with a DBC structure, the downward heat dissipation path is usually as follows: the heat generated by the power chip 5 is transferred to the upper copper layer, the upper copper layer then transfers the heat to the ceramic substrate, the ceramic substrate then transfers the heat to the lower copper layer, the lower copper layer then transfers the heat to the thermal grease layer, and the thermal grease layer then transfers the heat to the radiator (also known as a heat dissipation aluminum block).

[0066] Therefore, compared to existing DBC-structured power modules, the power module provided by the present invention shortens the heat transfer path during operation and eliminates the thermally conductive silicone grease layer, a heat-conducting structure with a low thermal conductivity coefficient, thereby effectively reducing the thermal resistance of the power module. Furthermore, the entire heat sink is made of alumina ceramic material, which improves the thermal conductivity of the power module, simplifies its structure, and facilitates its assembly.

[0067] In an optional embodiment of the utility model, the copper cladding layer 4 is completely adhered to the alumina ceramic protrusion 3.

[0068] In an embodiment of the present invention, the copper cladding layer 4 is completely adhered to the alumina ceramic protrusion 3. It can be understood that the copper cladding layer 4 is close to the end face of the alumina ceramic protrusion 3 and is completely adhered to the end face of the alumina ceramic protrusion 3, so that the copper cladding layer 4 can transfer the maximum heat to the alumina ceramic protrusion 3 and maximize the heat dissipation efficiency of the copper cladding layer 4, thereby avoiding the heat generated by the power chip 5 during operation from accumulating on the copper cladding layer 4 and causing thermal failure of the power chip 5.

[0069] In an optional embodiment of the utility model, referring to Figure 1 As shown, the power module further includes a plastic package 6 , which packages the alumina ceramic protrusion 3 , the copper cladding layer 4 and the power chip 5 .

[0070] In the embodiment of the present invention, the power module may further include a plastic package 6, which wraps the alumina ceramic protrusion 3, the copper cladding layer 4 and the power chip 5, thereby protecting the relevant electronic devices.

[0071] In some embodiments, the power module may further include pins 7, which are electrically connected to the power chip 5 and extend outside the plastic package 6 to form an electrical connection with a related electrical interface of the controller through the pins 7. For example, bonding wires may be used to electrically connect the pins 7 to the power chip 5 and the power chips 5 to each other, respectively, without further limitation herein.

[0072] In summary, the present invention discloses a power module, which may include an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic heat sink portion 2 is located on the alumina ceramic heat sink body 1, and the alumina ceramic protrusion 3 is located on the end face of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2 to form a connection with the copper cladding 4 in the power module. The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 form an integrated structure. Thus, the combined heat dissipation structure of the heat sink and the copper cladding 4 replaces the current heat dissipation structure of the DBC structure, thermal grease, and heat dissipation aluminum block, effectively reducing the thermal resistance of the power module, facilitating assembly, and significantly improving the thermal conductivity efficiency of the heat sink.

[0073] An embodiment of the present invention further provides a controller, which includes a printed circuit board and a power module as described in any one of the above embodiments of the present invention, wherein the power module is electrically connected to the printed circuit board.

[0074] In an embodiment of the utility model, an electrical interface adapted to the position of the pin 7 of the power module can be pre-set on the printed circuit board, so that the power module can be electrically connected to other packaging modules or peripheral circuits on the printed circuit board through the electrical connection between the pin 7 and the electrical interface.

[0075] In summary, the present invention discloses a controller, which may include an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic heat sink portion 2 is located on the alumina ceramic heat sink body 1, and the alumina ceramic protrusion 3 is located on the end face of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2, so as to form a connection with the copper cladding 4 in the power module. The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 form an integrated structure. Thus, the combined heat dissipation structure of the heat sink and the copper cladding 4 replaces the current heat dissipation structure of the DBC structure, thermal grease, and heat dissipation aluminum block, effectively reducing the thermal resistance of the power module, facilitating assembly, and significantly improving the thermal conductivity efficiency of the heat sink.

[0076] An embodiment of the present invention further provides a household appliance, which includes the controller as described in the above embodiment of the utility model.

[0077] In the embodiments of the present invention, the household appliances may be related household appliances that include a controller. For example, the household appliances may include, but are not limited to, air conditioners, air purifiers, washing machines, refrigerators, fans, and vacuum cleaners. The above examples of appliances do not limit the household appliances claimed in the embodiments of the present invention.

[0078] In summary, the embodiments of the present invention disclose a heat sink, a power module, a controller, and a household appliance. The present invention may include an alumina ceramic heat sink body 1, an alumina ceramic heat sink portion 2, and an alumina ceramic protrusion 3. The alumina ceramic heat sink portion 2 is located on the alumina ceramic heat sink body 1, and the alumina ceramic protrusion 3 is located on the end face of the alumina ceramic heat sink body 1 away from the alumina ceramic heat sink portion 2 to form a connection with the copper cladding 4 in the power module. The alumina ceramic heat sink body 1, the alumina ceramic heat sink portion 2, and the alumina ceramic protrusion 3 form an integrated structure. Thus, the combined heat dissipation structure of the heat sink and the copper cladding 4 replaces the current heat dissipation structure of the DBC structure, thermal grease, and heat dissipation aluminum block, effectively reducing the thermal resistance of the power module, facilitating assembly, and significantly improving the thermal conductivity efficiency of the heat sink.

[0079] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0080] It is easy for those skilled in the art to think that any combination of the above embodiments is feasible, so any combination of the above embodiments is an implementation scheme of the present utility model. However, due to space limitations, this specification will not describe them in detail here.

[0081] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0082] Similarly, it should be understood that in order to streamline the present invention and aid in understanding one or more of the various aspects of the present invention, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof.

[0083] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of the present invention and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

Claims

1. A radiator, characterized in that: The heat sink comprises an alumina ceramic heat sink body (1), an alumina ceramic heat sink portion (2) and an alumina ceramic protrusion (3); the alumina ceramic heat sink portion (2) is located on the alumina ceramic heat sink body (1); the alumina ceramic protrusion (3) is located on the end face of the alumina ceramic heat sink body (1) away from the alumina ceramic heat sink portion (2) to form a connection with the copper cladding layer (4) in the power module; wherein the alumina ceramic heat sink body (1), the alumina ceramic heat sink portion (2) and the alumina ceramic protrusion (3) are an integrated structure.

2. The radiator according to claim 1, characterized in that The cross-sectional shape of the alumina ceramic protrusion (3) along the horizontal plane includes one of the following: rectangular, elliptical, circular and diamond.

3. The radiator according to claim 1, wherein: The alumina ceramic heat dissipation portion (2) is a rib-shaped structure extending outward from the alumina ceramic heat dissipation body (1).

4. The radiator according to claim 1, wherein The alumina ceramic heat dissipation portion (2) is a sheet-like structure extending outward from the alumina ceramic heat dissipation body (1).

5. The radiator according to claim 1, wherein A plurality of heat dissipation holes (201) are provided on the end surface of the alumina ceramic heat dissipation portion (2) away from the alumina ceramic heat dissipation body (1).

6. A power module, characterized in that: The power module includes the heat sink according to any one of claims 1 to 5.

7. The power module according to claim 6, characterized in that: The power module further includes: a copper cladding layer (4), the copper cladding layer (4) being arranged on the alumina ceramic protrusion (3); A power chip (5) is mounted on the end surface of the copper cladding layer (4) away from the alumina ceramic protrusion (3).

8. The power module according to claim 7, characterized in that: The copper cladding layer (4) is completely adhered to the alumina ceramic protrusion (3).

9. The power module according to claim 7, wherein: The power chip (5) and the copper cladding layer (4) are fixed by welding.

10. The power module according to claim 7, wherein: The power module further comprises a plastic package (6), wherein the plastic package (6) packages the alumina ceramic protrusion (3), the copper cladding layer (4) and the power chip (5).

11. A controller, characterized in that: The controller includes a printed circuit board and a power module according to any one of claims 6 to 10, wherein the power module is electrically connected to the printed circuit board.

12. A household appliance, characterized in that: The household appliance includes the controller according to claim 11.

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