Electronic component

Abstract

The present application discloses an electronic component including: a substrate having an antenna pattern; the antenna signal amplifier comprises a lead frame which is provided with a connection point, and the connection point is connected with the substrate through the solder piece. The lead frame is covered with the mold sealing component, a cavity is defined by the mold sealing component and the lead frame, and the cavity corresponds to the antenna pattern. According to the technical scheme, the receiving and transmitting efficiency of the antenna can be improved at least.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductors and antennas, and more particularly, to an electronic component. Background Art

[0002] DRA (Dielectric Resonant Antenna) is a device used to receive and transmit electromagnetic waves. For example, with the diversification and characteristics of packaging structures, the Cylindrical Cup DRA structure has been developed. Its design principle is to use the characteristics of short circuit to generate electromagnetic waves and transmit or receive them. In order to make DRA work better, such as Figure 1 As shown, it's ideal to leave a hollow space 10 in the center of the DRA package. This allows electromagnetic waves to flow more freely within this hollow space 10 (also called a cavity), thereby improving the antenna's reception and transmission efficiency. If the DRA package lacks this hollow space, electromagnetic waves are blocked from flowing smoothly, affecting the antenna's reception and transmission efficiency.

[0003] like Figure 2 As shown, the conventional antenna manufacturing process is to place the element 12 (surface mounted) on the substrate 14 and then adopt a full mold method, that is, to use a mold to form a mold layer 20 to encapsulate the entire structure. The mold layer 20 covers all the elements 12 on the substrate 14. However, for the above-mentioned DRA type antenna structure, it is difficult to mold a cavity on the substrate directly using a mold chase. Figure 3A and Figure 3B As shown, an alternative prior art technique involves adding a metal cover 35 to define the cavity 30 and then forming a mold encapsulation layer 20 outside the metal cover 35. However, this approach prevents the metal cover 35 from being removed, which can affect electromagnetic wave and signal transmission and result in low material utilization. Another alternative prior art technique involves drilling holes in other directions, but this can lead to problems with dust removal during drilling and grooving. Utility Model Content

[0004] In response to the above problems, the present application proposes an electronic component to at least improve the receiving and transmitting efficiency of the antenna.

[0005] The technical solution of this application is achieved as follows:

[0006] According to one aspect of the present application, an electronic component is provided, which includes: a substrate having an antenna pattern; and an antenna signal amplifier including: a lead frame having connection points, the connection points being connected to the substrate through solder parts; and a molded component covering the lead frame and defining a cavity together with the lead frame, wherein the cavity corresponds to the antenna pattern.

[0007] In some embodiments, the connection point is in the form of a ring horizontally surrounding the cavity.

[0008] In some embodiments, the molded part exposes a lower surface of the lead frame.

[0009] In some embodiments, the lower surface of the molding member is substantially coplanar with the lower surface of the lead frame.

[0010] In some embodiments, the molding member covers the side surfaces of the lead frame.

[0011] In some embodiments, the molding member includes a side portion covering the lead frame, and an upper portion extending from the side portion, wherein the upper portion extends horizontally and vertically overlaps the antenna pattern.

[0012] In some embodiments, the thickness of the upper portion is greater than the thickness of the side portions.

[0013] In some embodiments, the height of the cavity is greater than the thickness of the upper portion.

[0014] In some embodiments, the roughness of the bottom surface of the side portion is greater than the roughness of the side surface of the side portion.

[0015] In some embodiments, the cavity exposes the antenna pattern, and the cavity exposes an inner surface of the molded part.

[0016] The above technical solution of the present application provides an antenna signal amplifier that can be formed using a mold and defines a cavity. No metal cover is required between the cavity and the molded component, so that electromagnetic waves can propagate more freely through the cavity and the antenna signal amplifier, thereby improving the receiving and transmitting efficiency of the antenna and improving material utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the cross-sectional structure of an ideal electronic component including DRA.

[0019] Figure 2 It is a schematic structural diagram of an electronic component including an antenna in the prior art.

[0020] Figure 3A and Figure 3B They are respectively a cross-sectional schematic diagram and a three-dimensional schematic diagram of an electronic component using a metal cover in the prior art.

[0021] Figure 4 is a schematic cross-sectional view of an electronic component according to an embodiment of the present application.

[0022] Figure 5 3 is a schematic cross-sectional view at an intermediate stage of forming an electronic component according to an embodiment of the present application.

[0023] Figures 6A to 6F 1 is a schematic diagram of multiple stages of forming an antenna signal amplifier in an electronic component according to an embodiment of the present application. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0025] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component may not be in direct contact. Moreover, the present invention may repeatedly refer to numbers and / or letters in various examples. This repetition is merely for simplicity and clarity and does not in itself represent a relationship between the various embodiments and / or configurations discussed.

[0026] In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] An embodiment of the present application provides an electronic component. Figure 4 1 is a schematic cross-sectional view of an electronic component 100 according to an embodiment of the present application. Figure 4As shown, the electronic component 100 includes a substrate 120 having an antenna pattern 113 thereon. The electronic component 100 may further include an antenna signal amplifier 150. The antenna signal amplifier 150 may specifically include a lead frame 152 and a molding component 154.

[0028] The lead frame 152 has a connection point connected to the substrate 120 through a solder member 162. The connection point can be at least a portion of the lower surface of the lead frame 152. In some embodiments, there are multiple solder members 162, and the multiple solder members 162 can be separated from each other. The molded part 154 covers the lead frame 152 and defines a cavity 180 together with the lead frame 152. The cavity 180 corresponds to the antenna pattern 113. In some embodiments, the cavity 180 exposes at least a portion of the corresponding antenna pattern 113. The electromagnetic waves received or transmitted by the antenna pattern 113 can propagate through the cavity 180 and the molded part 154.

[0029] The above technical solution of the present application provides an antenna signal amplifier 150 that can be formed using a mold and defines a cavity 180. Electromagnetic waves can propagate more freely through the cavity 180 and the antenna signal amplifier 150, and no metal cover is required between the cavity 180 and the molded component 154, thereby improving the receiving and transmitting efficiency of the antenna and improving material utilization.

[0030] In some embodiments, molded part 154 is made of a molding compound. Cavity 180 is filled with air. Cavity 180 exposes the inner surface of molded part 154. In other words, the inner surface of molded part 154 is in direct contact with cavity 180, and there is no component separating molded part 154 from cavity 180. Molded part 154 can completely isolate cavity 180 from the exterior of molded part 154.

[0031] Molding member 154 covers the side and top surfaces of lead frame 152. Molding member 154 may expose the bottom surface of lead frame 152. The exposed bottom surface of lead frame 152 is connected to solder member 162. In some embodiments, the bottom surface of molding member 154 is substantially coplanar with the bottom surface of lead frame 152 because the bottom surface of molding member 154 and the bottom surface of lead frame 152 are formed by grinding the same surface.

[0032] Figure 5 1 is a schematic cross-sectional view of an intermediate stage of forming the electronic component 100 according to an embodiment of the present application. Figure 5As shown, the electronic component 100 is a two-piece assembly method. First, the antenna signal amplifier 150 is made, the antenna signal amplifier 150 defines a cavity 180, and then the antenna signal amplifier 150 is bonded to the substrate 120 using solder 162. The antenna signal amplifier 150 can be formed by a mold (this will be referred to below). Figures 6A to 6F to describe).

[0033] Refer again Figure 4 As shown, molding member 154 may specifically include a side portion 154s that covers lead frame 152, and an upper portion 154u that extends laterally from side portion 154s. Upper portion 154u extends horizontally and vertically overlaps at least a portion of antenna pattern 113. In some embodiments, the bottom surface of side portion 154s has a rougher surface than the side surface of side portion 154s. This is because the bottom surface of side portion 154s is formed by grinding and, therefore, has a rougher surface.

[0034] In some embodiments, the thickness t1 of upper portion 154u can be greater than the thickness t2 of side portion 154s. Thickness refers to the dimension in the vertical direction. The height h1 of cavity 180 can be greater than the thickness t1 of upper portion 154u. The thickness of lead frame 152 can be less than the width w of side portion 154s of molding member 154. Width w of side portion 154s is the dimension between the surface of side portion 154s facing cavity 180 and the surface facing away from cavity 180.

[0035] The embodiments of the present application also provide a method for forming the antenna signal amplifier 150 . Figures 6A to 6F 1 is a schematic diagram of multiple stages of forming the antenna signal amplifier 150 in the electronic component 100 according to an embodiment of the present application. Figure 6A As shown in the top view of FIG, an initial lead frame 152' is provided. Initial lead frame 152' can be a patterned conductive material layer formed of a conductive material. Lead frame 152' can include multiple annular lead frames 612 and connectors 614 connecting adjacent lead frames 612 in the multiple lead frames 612.

[0036] refer to Figure 6B As shown in the cross-sectional view of FIG, a mold 650 is combined with the initial lead frame 152′, wherein the mold 650 may define a molding cavity 630, and a portion of the initial lead frame 152′ is placed in the molding cavity 630. In some embodiments, at least the lead frame 612 of the initial lead frame 152′ is placed in the molding cavity 630. Then, the molding cavity 630 is filled with a material suitable for forming the antenna signal booster 150, such as a molding compound 640.

[0037] Remove mold 650, reference Figure 6C The molding compound 640 is solidified to form the initial molded part 154'. According to the structure of the mold 640, the initial molded part 154' and the lead frame 612 together define a plurality of cavities 180. The initial molded part 154' is then cut to obtain Figure 6D The cross-sectional view shows a single molding member 154 and a lead frame 152 covered by the molding member 154 .

[0038] refer to Figure 6E As shown, the bottom surface of the side portion 154s of the molded part 154 is ground until the lead frame 152 is exposed. In this way, the antenna signal amplifier 150 including the lead frame 152 and the molded part 154 is formed. Because the bottom surface of the side portion 154s of the molded part 154 is ground, the bottom surface of the side portion 154s (i.e., the lower surface of the molded part 154) is substantially coplanar with the lower surface of the lead frame 152, and the roughness of the bottom surface of the side portion 154s is greater than the roughness of the side surface of the side portion 154s.

[0039] Figure 6F Shown Figure 6E Schematic diagram of the antenna signal amplifier 150 in the bottom view. Figure 6F As shown, the lower surface of the lead frame 152 is exposed by the molded part 154, and the exposed lead frame 152 is annular. At least a portion of the lower surface of the exposed lead frame 152 is used as a connection point for connection with the solder member 162. In some embodiments, the connection point is annular in the horizontal direction surrounding the cavity 180. In some embodiments, the connection point is a rectangular ring. In some embodiments, the connection point can be connected to the substrate 120 through a plurality of solder members 162 separated from each other (see Figure 4 ) to form the electronic component 100.

[0040] In summary, the technical solution of the present application provides an electronic component 100 including an antenna signal amplifier 150. The antenna signal amplifier 150 includes a lead frame 152 and a molded component 154 that jointly define a cavity 180, and the lead frame 152 and the molded component 154 can be directly formed using a mold, and no metal cover is required between the cavity 180 and the molded component 154, so that the electromagnetic waves received or emitted by the antenna pattern 113 can propagate more freely through the cavity 180 and the antenna signal amplifier 150, thereby improving the receiving and transmitting efficiency of the antenna and improving material utilization.

[0041] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An electronic component, characterized in that: include: a substrate having an antenna pattern; as well as Antenna signal amplifier, including: A lead frame having connection points, wherein the connection points are connected to the substrate through solder members; as well as The molded component covers the lead frame and defines a cavity together with the lead frame, wherein the cavity corresponds to the antenna pattern.

2. The electronic component according to claim 1, wherein The connection point is in the form of a ring surrounding the cavity in the horizontal direction.

3. The electronic component according to claim 1, wherein The molding component exposes the lower surface of the lead frame.

4. The electronic component according to claim 1, wherein The lower surface of the molding component is substantially coplanar with the lower surface of the lead frame.

5. The electronic component according to claim 1, wherein The molding component covers the side surfaces of the lead frame.

6. The electronic component according to claim 1, wherein The molding member includes a side portion covering the lead frame and an upper portion extending from the side portion, wherein the upper portion extends in a horizontal direction and vertically overlaps with the antenna pattern.

7. The electronic component according to claim 6, wherein: The thickness of the upper portion is greater than the thickness of the side portion.

8. The electronic component according to claim 6, wherein: The height of the cavity is greater than the thickness of the upper portion.

9. The electronic component according to claim 6, wherein: The roughness of the bottom surface of the side portion is greater than the roughness of the side surface of the side portion.

10. The electronic component according to claim 1, wherein The cavity exposes the antenna pattern, and the cavity exposes an inner surface of the molding part.

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