Conductive terminal and connector
By forming a receiving cavity in the precious metal coating and filling it with a rare earth metal structure to form a double-layer film layer, the problems of high cost and insufficient corrosion resistance of the conductive terminal are solved, achieving the effect of performance improvement and cost reduction.
Patent Information
- Application Number
- CN202421933672.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2022-01-07
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2032-01-07
AI Technical Summary
Existing conductive terminals use precious metal plating, which is costly and has insufficient corrosion resistance.
A receiving cavity is formed in the precious metal coating, which is filled with a rare earth metal structure to form a double-layer film to improve corrosion resistance and reduce the amount of precious metal used.
The corrosion resistance of the conductive terminal is improved, the cost is reduced, and the conductive performance is maintained or improved.
Smart Images
Figure CN223363416U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electroplating, and in particular to a conductive terminal and a connector. Background Art
[0002] Connector terminals are used to charge electronic devices or transmit data signals. In related art, the plating structure of these terminals uses precious metals such as gold, palladium nickel, and platinum. However, the high usage of precious metals leads to high costs. Furthermore, using only precious metals in the plating structure compromises the corrosion resistance of the terminals. Utility Model Content
[0003] The present application provides a conductive terminal and a connector that are intended to improve corrosion resistance and reduce costs.
[0004] The present application provides a conductive terminal, which includes a body and a plating structure, wherein the plating structure includes a first film layer arranged on the surface of the body and a second film layer arranged on the surface of the first film layer, the second film layer includes a precious metal plating layer and a rare earth metal structure, and a plurality of accommodating cavities are formed inside the precious metal plating layer, and each of the accommodating cavities is filled with the rare earth metal structure through an electroplating process.
[0005] Optionally, the rare earth metal structure is at least one of a lanthanum structure, a cerium structure, a praseodymium structure, a neodymium structure, a samarium structure, a europium structure, a gadolinium structure, a terbium structure, a dysprosium structure, a holmium structure, an erbium structure, a thulium structure, a ytterbium structure, a lutetium structure, a yttrium structure, and a scandium structure.
[0006] Optionally, the thickness of the second film layer is in the range of 0.1 μm to 5 μm.
[0007] Optionally, the precious metal coating is at least one of gold coating, gold alloy coating, palladium coating, palladium alloy coating, rhodium coating, rhodium alloy coating, platinum coating, platinum alloy coating, silver coating, silver alloy coating, ruthenium coating, and ruthenium alloy coating.
[0008] Optionally, the first film layer includes at least one of a nickel plating layer and a nickel alloy plating layer.
[0009] Optionally, the thickness of the first film layer is in the range of 1 μm to 10 μm.
[0010] Optionally, the body includes a copper body or a stainless steel body.
[0011] Optionally, the second film layer is the outermost film layer of the coating structure.
[0012] The present application also provides a connector, comprising a housing, wherein the housing comprises a cavity; and
[0013] As described above, the conductive terminal is disposed in the cavity.
[0014] The conductive terminal provided in the present application includes a body and a coating structure. The coating structure includes a first film layer and a second film layer. The second film layer includes a precious metal coating and a rare earth metal structure. A plurality of accommodating cavities are formed inside the precious metal coating, and each accommodating cavity is filled with a rare earth metal structure through an electroplating process. Compared with the technical solution in which the second film layer only includes a precious metal coating, the present application forms an accommodating cavity in the precious metal coating to fill the rare earth metal structure, thereby increasing the strength of the coating structure, thereby improving the corrosion resistance of the conductive terminal, reducing the amount of precious metal used, and effectively reducing costs.
[0015] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 The figure shows a schematic structural diagram of a connector according to an embodiment of the present application;
[0017] Figure 2 for Figure 1 A schematic diagram of a portion of the structure of the conductive terminals of the connector shown;
[0018] Figure 3 for Figure 2 Schematic diagram of the crystal structure of the second film layer shown. DETAILED DESCRIPTION
[0019] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of devices consistent with certain aspects of the present application, as detailed in the appended claims.
[0020] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. Unless otherwise defined, technical or scientific terms used in this application should have the ordinary meaning understood by a person of ordinary skill in the art to which this application belongs. The terms "first," "second," and similar words used in this specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish different components. Similarly, the terms "a" or "an" and similar words do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "plurality" or "several" mean two or more. Unless otherwise indicated, the terms "front," "rear," "lower," and / or "upper" and similar words are for convenience only and are not intended to limit to a single position or spatial orientation. The terms "include," "comprising," and similar words mean that the elements or objects preceding the term "include" or "comprising" include the elements or objects listed after the term and their equivalents, and do not exclude other elements or objects. The terms "connected," "connected," and similar words are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. As used in this specification and the appended claims, the singular forms "a," "an," "said," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0021] The conductive terminal provided in the present application includes a body and a coating structure. The coating structure includes a first film layer provided on the surface of the body and a second film layer provided on the surface of the first film layer, and the second film layer includes a precious metal coating and a rare earth metal structure. A plurality of accommodating cavities are formed inside the precious metal coating, and each accommodating cavity is filled with a rare earth metal structure through an electroplating process. With such an arrangement, compared with the technical solution in which the second film layer only includes a precious metal coating, the present application forms an accommodating cavity in the precious metal coating to fill the rare earth metal structure to increase the strength of the coating structure, thereby improving the corrosion resistance of the conductive terminal, reducing the amount of precious metal used, and effectively reducing costs.
[0022] The connector provided in this application includes a housing and conductive terminals. The housing includes a cavity. The conductive terminals are disposed in the cavity.
[0023] Figure 1 The figure shows a schematic structural diagram of a connector 1 according to an embodiment of the present application. Figure 1As shown, connector 1 includes a housing 11 and conductive terminals 12. Housing 11 includes a cavity 13. Conductive terminals 12 are disposed within cavity 13. Connector 1 is an electronic product used to connect two active devices. The conductive terminals of connector 1 can transmit current signals and / or data signals. In some embodiments, connector 1 includes but is not limited to a Type-C connector and a connector used in a smart wearable charging device.
[0024] Figure 2 for Figure 1 FIG. 1 is a partial structural diagram of the conductive terminal 12 of the connector 1. Figure 2 As shown, the conductive terminal 12 includes a body 2 and a plating structure 3. The plating structure 3 includes a first film layer 4 provided on the surface of the body 2 and a second film layer 5 provided on the surface of the first film layer 4. The second film layer 5 includes a precious metal plating layer 6 and a rare earth metal structure 7. A plurality of accommodating cavities 60 are formed inside the precious metal plating layer 6. Each accommodating cavity 60 is filled with a rare earth metal structure 7 through an electroplating process. The plating structure 3 includes a stacked first film layer 4 and a second film layer 5. Both the first film layer 4 and the second film layer 5 have good corrosion resistance. The double film layer protects the body 2 to reduce the risk of damage to the body 2, thereby extending the service life of the conductive terminal 12. Compared to the related art, the present application forms a receiving cavity in the precious metal coating 6 of the second film layer 5 to fill the rare earth metal structure 7, so that the rare earth metal structure 7 is filled in the receiving cavity 60 of the precious metal coating 6, effectively increasing the overall strength of the coating structure 3, thereby improving the corrosion resistance of the conductive terminal 12, and the rare earth metal structure 7 is cheaper than the precious metal coating 6, and the cost is effectively reduced by reducing the amount of precious metal. In some embodiments, the rare earth metal structure 7 is filled in the receiving cavity 60 of the precious metal coating 6 through an electroplating process to improve the performance of the second film layer 5. In some embodiments, the second film layer 5 is the outermost film layer of the coating structure 3. The outermost film layer is exposed to the outside air, so a receiving cavity is formed in the precious metal coating of the outermost film layer to fill the rare earth metal structure 7, so that the strength of the outermost film layer is increased, thereby better protecting the body 2 of the conductive terminal 12.
[0025] In some embodiments, the thickness of the second film layer 5 ranges from 0.1 μm to 5 μm. In this embodiment, without affecting the high corrosion resistance of the second film layer 5, the thickness of the second film layer 5 is set to be relatively thin to prevent the overall thickness of the conductive terminal 12 from being too large, thereby facilitating a thinner structure of the conductive terminal 12.
[0026] In some embodiments, the rare earth metal structure 7 is at least one of a lanthanum structure, a cerium structure, a praseodymium structure, a neodymium structure, a samarium structure, a europium structure, a gadolinium structure, a terbium structure, a dysprosium structure, a holmium structure, an erbium structure, a thulium structure, a ytterbium structure, a lutetium structure, a yttrium structure, and a scandium structure. In this embodiment, these rare earth metal structures 7 have tensile strength and corrosion resistance. Forming a cavity in the precious metal coating 6 to fill one or more of these rare earth metal structures 7 increases the strength of the second film layer 5 and significantly improves the durability of the conductive terminal 12. Furthermore, without compromising the various functionalities of the precious metal coating 6, the amount of precious metal used is effectively reduced, significantly improving the cost-effectiveness of the conductive terminal 12.
[0027] In some embodiments, the precious metal coating 6 is at least one of a gold coating, a gold alloy coating, a palladium coating, a palladium alloy coating, a rhodium coating, a rhodium alloy coating, a platinum coating, a platinum alloy coating, a silver coating, a silver alloy coating, a ruthenium coating, or a ruthenium alloy coating. In this embodiment, these precious metal coatings 6 have good chemical stability and are not easily corroded. The use of one or more of these precious metal coatings 6 in the second film layer 5 effectively improves the stability and corrosion resistance of the second film layer 5.
[0028] In some embodiments, the volume ratio of the precious metal coating 6 to the rare earth metal structure 7 is 20:1. Compared to the related art, by providing the rare earth metal structure 7 in the second film layer 5, the proportion of the precious metal coating 6 in the second film layer 5 is reduced, and the corresponding amount of precious metal used is also reduced, thereby reducing costs.
[0029] In some embodiments, the first film layer 4 includes at least one of a nickel coating and a nickel alloy coating. Nickel alloy coatings are alloy coatings composed of nickel and other elements. Nickel coatings and nickel alloy coatings have excellent corrosion resistance, thereby improving the corrosion resistance of the first film layer 4 and enhancing the protective effect of the body 2. In some embodiments, nickel alloy coatings include, but are not limited to, fill nickel coatings, phosphorus nickel coatings, and tungsten nickel coatings.
[0030] In some embodiments, the thickness of the first film layer 4 ranges from 1 μm to 10 μm. In this embodiment, the first film layer 4 is set to be relatively thin, which prevents the conductive terminal 12 from being too thick and reduces the material usage of the first film layer 4 to reduce costs.
[0031] In some embodiments, the body 2 comprises a copper body or a stainless steel body. Copper and stainless steel bodies have good electrical conductivity and corrosion resistance. Thus, using a copper or stainless steel body facilitates the electrical conduction of the conductive terminal 12 and extends the service life of the wire terminal 12.
[0032] Figure 3 for Figure 2 The crystal structure diagram of the second film layer 5 is shown in FIG. Figure 3 As shown, the precious metal coating 6 includes precious metal atoms 9, and the rare earth metal structure 7 includes rare earth metal atoms 10. The second film layer 5 includes a plurality of film layer crystals 8, and the film layer crystals 8 include a plurality of precious metal atoms 9 and a plurality of rare earth metal atoms 10 located inside the plurality of precious metal atoms. In this embodiment, the precious metal coating 6 is formed by a plurality of precious metal atoms 9. The rare earth metal structure 7 is formed by a plurality of rare earth metal atoms 10. The number of precious metal atoms 9 is greater than the number of rare earth metal atoms 10. After connecting the plurality of precious metal atoms 9 with the plurality of rare earth metal atoms 10, the plurality of rare earth metal atoms 10 are basically filled in the interior of the plurality of precious metal atoms 9. In this way, the strength of the second film layer 5 is increased, and the corrosion resistance of the connector 1 is significantly improved, so that users can experience the good stability and durability of the connector, achieve a win-win situation in quality and cost, and significantly improve economic and social benefits.
[0033] The above description is merely a preferred embodiment of the present application and does not constitute any form of limitation to the present application. Although the present application has been disclosed as a preferred embodiment as above, it is not intended to limit the present application. Any technician familiar with this profession can make some changes or modifications to the equivalent embodiment of the above-disclosed technical content without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification of the above embodiment based on the technical essence of the present application that does not depart from the content of the technical solution of the present application still falls within the scope of the technical solution of the present application.
Claims
1. A conductive terminal, characterized in that: It includes a main body and a coating structure, wherein the coating structure includes a first film layer arranged on the surface of the main body and a second film layer arranged on the surface of the first film layer, the second film layer includes a precious metal coating and a rare earth metal structure, and a plurality of accommodating cavities are formed inside the precious metal coating, and each of the accommodating cavities is filled with the rare earth metal structure through an electroplating process.
2. The conductive terminal according to claim 1, wherein: The rare earth metal structure is at least one of a lanthanum structure, a cerium structure, a praseodymium structure, a neodymium structure, a samarium structure, a europium structure, a gadolinium structure, a terbium structure, a dysprosium structure, a holmium structure, an erbium structure, a thulium structure, a ytterbium structure, a lutetium structure, a yttrium structure, and a scandium structure.
3. The conductive terminal according to claim 1, wherein: The thickness of the second film layer is in the range of 0.1 μm to 5 μm.
4. The conductive terminal according to claim 1, wherein: The precious metal coating is at least one of gold coating, gold alloy coating, palladium coating, palladium alloy coating, rhodium coating, rhodium alloy coating, platinum coating, platinum alloy coating, silver coating, silver alloy coating, ruthenium coating, and ruthenium alloy coating.
5. The conductive terminal according to claim 1, wherein: The first film layer includes at least one of a nickel plating layer and a nickel alloy plating layer.
6. The conductive terminal according to claim 1, wherein: The thickness of the first film layer is in the range of 1 μm to 10 μm.
7. The conductive terminal according to claim 1, wherein: The body includes a copper body or a stainless steel body.
8. The conductive terminal according to claim 1, wherein: The second film layer is the outermost film layer of the coating structure.
9. A connector, characterized in that: comprising a housing including a cavity; and The conductive terminal according to any one of claims 1 to 8 is disposed in the cavity.