FPC double-sided board

Abstract

The utility model relates to the technical field of flexible circuit boards, in particular to an FPC double-sided board, which comprises a covering film, a bonding pad and a copper foil, the covering film comprises a polyimide layer and a first adhesive layer, the first adhesive layer is fixed on the copper foil, the polyimide layer is fixed on the first adhesive layer, a second adhesive layer is arranged on one side, far away from the first adhesive layer, of the copper foil, and the bonding pad is arranged on the second adhesive layer. A protective layer is arranged on the second adhesive layer, a mounting groove is formed in the first adhesive layer, a placement groove is formed in the second adhesive layer, the two bonding pads are fixedly arranged on the copper foil, one bonding pad is located in the mounting groove, the other bonding pad is located in the placement groove, the thickness of the polyimide layer is 12.5 microns, and the thickness of the polyimide layer is 12.5 microns. The thickness of the first adhesive layer is 15 microns, the thickness of the copper foil is 16-20 microns, and the thickness of the copper foil is reduced, so that the effect of reducing the overall thickness is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit boards, in particular to an FPC double-sided board. Background Art

[0002] FPCs (flexible printed circuits) are widely favored for their lightweight, thin, and flexible properties, and are widely used. Circuit boards can be categorized by layer structure into single-sided, double-sided, and multi-layer boards, with single-sided and double-sided boards being the most common. Single-sided and double-sided boards are typically determined by a combination of materials: copper foil conductors, adhesives, and insulating substrates.

[0003] A traditional double-sided board product uses a cover film - double-sided copper foil - cover film. The copper foil is provided with solder pads, which are exposed to the outside. It is a combination of three materials and is relatively thick. The circuits can cross-route and the total thickness reaches more than 135μm. However, FPC products are now gradually trending towards thinner and lighter applications. The thickness of the double-sided copper foil is too thick and does not meet the assembly requirements of various manufacturers.

[0004] Based on this, the present invention designs an FPC double-sided board to solve the above problems. Utility Model Content

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an FPC double-sided board, comprising a covering film, a soldering pad, and a copper foil, the covering film comprising a polyimide layer and a first adhesive layer, the first adhesive layer being fixed on the copper foil, the polyimide layer being fixed on the first adhesive layer, a second adhesive layer being provided on the side of the copper foil away from the first adhesive layer, a protective layer being provided on the second adhesive layer, a mounting groove being provided on the first adhesive layer, a placement groove being provided on the second adhesive layer, two soldering pads being provided, both of which are fixed on the copper foil, one of which is located in the mounting groove, and the other is located in the placement groove, the thickness of the polyimide layer is 12.5um, the thickness of the first adhesive layer is 15um, and the thickness of the copper foil is 16-20um.

[0006] By adopting the above technical solution, a layer of covering film is eliminated and the thickness of the copper foil is reduced, thereby achieving the effect of reducing the overall thickness.

[0007] Preferably, the thickness of the second adhesive layer is 15 μm.

[0008] By adopting the above technical solution, the thickness of the entire double-sided board can be further reduced.

[0009] Preferably, the thickness of the protective layer is 12.5 μm.

[0010] By adopting the above technical solution, the thickness of the protective layer is reduced, further reducing the thickness of the entire double-sided board.

[0011] In summary, the present application has the following beneficial technical effects: a layer of covering film is eliminated, and the thickness of the copper foil is reduced, thereby achieving the effect of reducing the overall thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 Schematic diagram of the overall structure of the double-sided board in this embodiment.

[0014] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0015] 1. Polyimide layer; 2. First adhesive layer; 3. Copper foil; 4. Solder pad; 5. Protective layer; 6. Second adhesive layer. DETAILED DESCRIPTION

[0016] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] The following is combined with Figure 1 This application is described in further detail.

[0018] A double-sided FPC panel includes a cover film, solder pads 4, and copper foil 3. The cover film includes a polyimide layer 1 and a first adhesive layer 2. The first adhesive layer 2 is fixed to the copper foil 3. The polyimide layer 1 is fixed to the first adhesive layer 2. A second adhesive layer 6 is provided on the side of the copper foil 3 away from the first adhesive layer 2. A protective layer 5 is provided on the second adhesive layer 6. The first adhesive layer 2 is provided with a mounting groove, and the second adhesive layer 6 is provided with a placement groove. Two solder pads 4 are provided, both of which are fixed to the copper foil 3, one of which is located in the mounting groove and the other is located in the placement groove. The thickness of the polyimide layer 1 is 12.5 μm, the thickness of the first adhesive layer 2 is 15 μm, and the thickness of the copper foil 3 is 16-20 μm.

[0019] The thickness of the second adhesive layer 6 is 15 μm, and the thickness of the protective layer 5 is 12.5 μm. The protective layer 5 is also made of polyimide.

[0020] One layer of cover film is missing, and the thicknesses of the imide layer, the first adhesive layer 2, the second adhesive layer 6, the protective layer 5, and the copper foil 3 are correspondingly reduced. The total thickness is between 71-75um, achieving the effect of reducing the overall thickness.

[0021] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "two ends", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] In the present invention, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0023] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An FPC double-sided board, characterized by: The invention comprises a covering film, a soldering pad (4), and a copper foil (3), wherein the covering film comprises a polyimide layer (1) and a first adhesive layer (2), wherein the first adhesive layer (2) is fixed on the copper foil (3), and the polyimide layer (1) is fixed on the first adhesive layer (2); a second adhesive layer (6) is provided on the side of the copper foil (3) away from the first adhesive layer (2), and a protective layer (5) is provided on the second adhesive layer (6); a mounting groove is provided on the first adhesive layer (2), and a placement groove is provided on the second adhesive layer (6); two soldering pads (4) are provided, and both soldering pads (4) are fixed on the copper foil (3), wherein one soldering pad (4) is located in the mounting groove and the other soldering pad (4) is located in the placement groove; the thickness of the polyimide layer (1) is 12.5 μm, the thickness of the first adhesive layer (2) is 15 μm, and the thickness of the copper foil (3) is 16-20 μm.

2. The FPC double-sided board according to claim 1, characterized in that: The thickness of the second adhesive layer (6) is 15 μm.

3. The FPC double-sided board according to claim 2, characterized in that: The thickness of the protective layer (5) is 12.5 μm.

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