High-heat-dissipation electric appliance box
By improving the design of the electrical box using structures such as multi-strand copper wire braids and thermal pads, the problem of insufficient bonding strength between the circuit board and the heat dissipation metal plate was solved, achieving efficient heat dissipation and ensuring the stable operation of electronic components.
Patent Information
- Application Number
- CN202422792269.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-11-15
AI Technical Summary
The bonding strength between the circuit board and the heat dissipation metal plate in existing electrical boxes is insufficient, resulting in gaps, which affects the heat dissipation effect, especially when running at high heat, which can easily burn out electronic components.
A braided tape made of multiple copper wires is used as a conductor. Its deformation ability increases the fitting strength between the circuit board and the heat dissipation metal plate. A thermal pad and aluminum plate are placed between the two, combined with a plug-in bracket and foot pad structure to ensure close contact and effective heat dissipation.
The bonding strength between the circuit board and the heat dissipation metal plate is improved, gaps are avoided, and better heat dissipation effect is achieved, ensuring that the surface temperature rise of electronic components is stable at less than 50°C, thereby improving the heat dissipation performance of the electrical box.
Smart Images
Figure CN223364451U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vehicle electrical appliance boxes, in particular to a high heat dissipation electrical appliance box. Background Art
[0002] The electrical box is primarily used for power distribution, and some also centrally protect circuits from overheating, overvoltage, and overload. Typically, the electrical box is mounted directly on the vehicle body, housing a circuit board. The main lines are often connected to the circuit board using copper sheets, which are also fixed to the box. High-power startup chips, preheating MOS tubes, and MCU chips are sometimes attached to the circuit board. Excessive heat generation can cause burnout. Currently, heat dissipation from circuit boards is mostly achieved through heat-dissipating metal plates. To achieve optimal heat dissipation, the circuit board and heat-dissipating metal plate must be perfectly aligned. However, the high bending strength of the copper sheet connecting the electrical box creates deformation stress between the installed circuit board and the heat-dissipating metal plate, creating a gap between the two, which affects heat dissipation. Utility Model Content
[0003] The purpose of the utility model: In order to overcome the defects of the prior art, the utility model provides a high heat dissipation electrical box, which increases the fitting strength between the circuit board and the heat dissipation metal plate, avoids the generation of gaps, and has a good heat dissipation effect.
[0004] The technical solution of the utility model is: a high-heat dissipation electrical appliance box, including an outer box, a heat dissipation metal plate installed on the bottom of the outer box, and a circuit board arranged in the outer box. The outer box is equipped with a conductor electrically connected to the circuit board. The conductor is a braided belt woven from multiple strands of copper wire, and the two ends are directly or indirectly mounted on the outer box and the circuit board by screws. The circuit board is placed on the heat dissipation metal plate.
[0005] By adopting the above technical solution, by setting the conductor as a braided belt made of multiple copper wires, it is easy to bend and deform arbitrarily. After the conductor is deformed as needed, the circuit board and the bottom heat dissipation metal plate can be better fitted, the bonding strength between the circuit board and the heat dissipation metal plate can be increased, and the formation of gaps can be avoided, thereby achieving effective heat dissipation of the circuit board and the MOS tube on the circuit board, and making the surface temperature rise stable and controllable.
[0006] The present invention is further provided with: a heat-conducting gasket is provided between the circuit board and the heat-dissipating metal plate.
[0007] By further adopting the above configuration, a thermally conductive gasket is added. The heat dissipation structure of the thermally conductive gasket and the heat dissipation metal plate is combined to better absorb the heat generated by the MOS tube on the circuit board. The generated heat is absorbed by the thermally conductive gasket and transferred to the heat dissipation metal plate for heat dissipation, thereby effectively dissipating the heat.
[0008] The present invention is further provided with a plug-in bracket installed on the circuit board, and one end of the conductor is installed on the plug-in bracket via a screw.
[0009] By adopting the above further arrangement, the mounting bracket and the circuit board are convenient for installation and quick disassembly.
[0010] The present invention is further configured as follows: the rack has an end plate and side plates arranged on both sides of the end plate, the end plate has screw holes, the side plates on both sides have pins, and the circuit board has sockets for inserting the pins.
[0011] By further configuring the above, the side panels on both sides are connected to the circuit board, so that the installation structure is stable and the electrical connection of multiple pins is stable.
[0012] The present invention is further configured as follows: the circuit board is installed in the front of the outer box, the conductor is installed in the rear of the outer box, and the rear end of the conductor is connected to the outer box and the front end of the conductor is connected to the circuit board.
[0013] By further adopting the above arrangement, the circuit board and the conductor are reasonably distributed, and the conductor is connected to the top of the circuit board, so that the heat dissipation metal plate is attached to the bottom of the circuit board.
[0014] The present invention is further configured as follows: the heat dissipation metal plate is an aluminum plate.
[0015] By adopting the above-mentioned further configuration, the heat dissipation effect of the aluminum plate is good.
[0016] The present invention is further provided with the following configuration: the thermally conductive gasket is made of thermally conductive silicone grease.
[0017] With the above further configuration, thermal grease is commonly known as heat dissipation paste. Thermal grease uses organic silicone as the main raw material and adds heat-resistant and thermally conductive materials to make a thermally conductive organic silicone grease-like compound. It is used for heat conduction and heat dissipation of electronic components such as power amplifiers, transistors, electron tubes, CPUs, etc., thereby ensuring the stability of the electrical performance of electronic instruments and meters.
[0018] A further configuration of the present invention is that a plurality of conductors are provided.
[0019] By further adopting the above arrangement, multiple conductors are provided to facilitate multi-path power connection.
[0020] The present invention is further provided with a foot pad having a tube pin and a gasket located at the lower end of the tube pin, the tube pin is used to penetrate the through hole on the heat dissipation metal plate and the outer box, and the gasket is used to support the bottom surface of the heat dissipation metal plate.
[0021] By further adopting the above arrangement, the bottom surface of the heat dissipation metal plate is suspended in the air through the support of the foot pad, which is convenient for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a structural diagram of a specific embodiment of the utility model;
[0023] Figure 2 This is a structural diagram of the bottom surface of a specific embodiment of the utility model;
[0024] Figure 3 This is a schematic structural diagram of one side of the bottom surface of a circuit board according to a specific embodiment of the present utility model;
[0025] Figure 4 This is a schematic diagram of the structure of one side of the circuit board in a specific embodiment of the utility model;
[0026] Figure 5 This is a circuit board structure diagram of a specific embodiment of the utility model;
[0027] Figure 6 This is a structural diagram of a rack according to a specific embodiment of the present utility model;
[0028] Figure 7 This is a structural diagram of a foot pad according to a specific embodiment of the present utility model.
[0029] In the figure: outer box 1, heat dissipation metal plate 2, circuit board 3, jack 31, conductor 4, thermal pad 5, bracket 6, end plate 61, screw through hole 611, side plate 62, pin 621, foot pad 7, pin 71, gasket 72, through hole a. DETAILED DESCRIPTION
[0030] The following will clearly and completely describe the technical solutions in this embodiment with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.
[0031] like Figure 1-7As shown, the utility model discloses a high-heat dissipation electrical box, comprising an outer box 1, a heat dissipation metal plate 2 mounted on the bottom of the outer box, and a circuit board 3 disposed within the outer box. The heat dissipation metal plate and the outer box are mounted with screws. Electronic components such as a high-power startup chip, a preheating MOSFET, an MCU chip, and a boost chip are also integrated onto the circuit board 3. A conductor 4 electrically connected to the circuit board 3 is mounted on the outer box 1. The conductor 4 is a braided tape made of multiple strands of copper wire, with both ends mounted directly or indirectly to the outer box 1 and the circuit board 3 via screws. The circuit board 3 is placed on the heat dissipation metal plate 2, and a thermally conductive gasket 5 is disposed between the circuit board 3 and the heat dissipation metal plate 2. Specifically, the heat dissipation metal plate 2 is an aluminum plate, and the thermally conductive gasket 5 is made of thermally conductive silicone grease. The circuit board 3 is mounted at the front of the outer box, and the conductor 4 is mounted at the rear of the outer box. The rear end of the conductor 4 is connected to the outer box 1, and the front end of the conductor 4 is connected to the circuit board 3. The conductor 4 has screw holes at both the front and rear ends for screw insertion. The aluminum plate, the thermally conductive gasket 5 and the circuit board 3 are fastened with screws so that the circuit board 3, the thermally conductive gasket 5 and the aluminum plate are tightly fitted together.
[0032] Specifically, a mounting bracket 6 is provided for insertion and installation on the circuit board 3. One end of the conductor 4 is screwed to the mounting bracket 6. The mounting bracket 6 comprises an end plate 61 and side plates 62 disposed on either side of the end plate. The end plate 61 has screw holes 611, and the side plates 62 have pins 621. The circuit board 3 has sockets 31 for inserting the pins. The end plate 61 and the side plates 62 form an "n" shape.
[0033] Specifically, a foot pad 7 is provided, which includes a pin 71 and a gasket 72 located at the lower end of the pin. The pin 71 is used to pass through the through hole a on the heat dissipation metal plate 2 and the outer box 1, and the gasket 72 is used to support the bottom surface of the heat dissipation metal plate 2. The support of the foot pad allows the bottom surface of the heat dissipation metal plate to be suspended in the air, facilitating heat dissipation.
[0034] This utility model utilizes conductor 4 as a braided tape woven from multiple strands of copper wire, making it easy to bend and deform as desired. Furthermore, once conductor 4 is deformed as needed, the bond strength between circuit board 3, thermal pad 5, and heat sink metal plate 2 is increased, eliminating gaps. This effectively dissipates heat from the circuit board and its MOS transistors, maintaining a stable surface temperature rise below 50°C. The combined heat dissipation structure of thermal pad 5 and heat sink metal plate 2 effectively absorbs heat generated by circuit board 3 and MOS transistors. This heat is then absorbed by thermal pad 5 and transferred to heat sink metal plate 2 for dissipation.
[0035] It should be noted that in the description of the present invention, all directional indications (such as up, down, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0036] In addition, in the description of the present invention, "several" or "plurality" means at least two, such as two or three, unless otherwise specifically defined. "MOS" is the abbreviation for MOSFET, which stands for Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). "MCU" is a microcontroller unit (MCU), also known as a single-chip microcomputer (MCU). It is a CPU that reduces the frequency and specifications of the central processing unit (CPU) and integrates peripheral interfaces such as memory, timers, USB, A / D converters, UARTs, PLCs, DMA, and even LCD driver circuits on a single chip, forming a chip-level computer that provides different control combinations for different applications.
[0037] In the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," "coupled," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
Claims
1. A high heat dissipation electrical box, comprising an outer box (1), a heat dissipation metal plate (2) mounted on the bottom of the outer box, and a circuit board (3) disposed in the outer box, wherein the outer box (1) is provided with a conductor (4) electrically connected to the circuit board (3), and wherein: The conductor (4) is a braided belt formed by braiding multiple strands of copper wires, and both ends are directly or indirectly mounted on the outer box (1) and the circuit board (3) via screws, respectively. The circuit board (3) is placed on the heat dissipation metal plate (2).
2. The high heat dissipation electrical appliance box according to claim 1, characterized in that: A thermally conductive pad (5) is provided between the circuit board (3) and the heat dissipation metal plate (2).
3. A high heat dissipation electrical appliance box according to claim 1 or 2, characterized in that: A plug-in bracket (6) is also provided and is installed on the circuit board (3). One end of the conductor (4) is installed on the plug-in bracket (6) via a screw.
4. The high heat dissipation electrical appliance box according to claim 3, characterized in that: The inserting rack (6) has an end plate (61) and side plates (62) arranged on both sides of the end plate. The end plate (61) has screw holes (611), and the side plates (62) on both sides have plug pins (621). The circuit board (3) has a plug hole (31) for inserting the plug pin.
5. The high heat dissipation electrical appliance box according to claim 1 or 2, characterized in that: The circuit board (3) is installed in the front part of the outer box, and the conductor (4) is installed in the rear part of the outer box, and the rear end of the conductor (4) is connected to the outer box (1), and the front end of the conductor (4) is connected to the circuit board (3).
6. The high heat dissipation electrical appliance box according to claim 1 or 2, characterized in that: The heat dissipation metal plate (2) is an aluminum plate.
7. The high heat dissipation electrical appliance box according to claim 2, characterized in that: The thermally conductive gasket (5) is made of thermally conductive silicone grease.
8. The high heat dissipation electrical appliance box according to claim 1 or 2, characterized in that: There are a plurality of conductors (4).
9. The high heat dissipation electrical appliance box according to claim 1 or 2, characterized in that: A foot pad (7) is also provided, the foot pad (7) having a tube pin (71) and a gasket (72) located at the lower end of the tube pin, the tube pin (71) being used to penetrate the through hole (a) on the heat dissipation metal plate (2) and the outer box (1), and the gasket (72) being used to support the bottom surface of the heat dissipation metal plate (2).