Mass transfer equipment

Abstract

The utility model discloses a mass transfer device. The mass transfer apparatus comprises: a base; the straightening platform deck mechanism is used for straightening the first material and the second material; the processing platform deck mechanism is used for adjusting the levelness of the first material, so that the first material is parallel to the second material; the moving mechanism is used for moving the first material from the straightening platform deck mechanism to the machining platform deck mechanism and moving the second material from the straightening platform deck mechanism to the position above the machining platform deck mechanism; the fine positioning mechanism is used for positioning and identifying, so that the processing platform deck mechanism adjusts the first material and the second material to be aligned in the vertical direction; and a laser processing part of the laser device is used for emitting laser to the aligned second material, so that the chip on the second material is transferred to the first material. By means of the mode, according to the huge transfer equipment, two times of positioning and levelness adjustment of all the materials can be efficiently completed, the first material and the second material can be efficiently and accurately aligned, and then the transfer efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a mass transfer device. Background Art

[0002] Over the years, LED displays have entered an era of "finer pitches," such as those below 0.3mm, and "tinier LED crystals," such as 20-micron Micro LED particles. PCB substrates, with their proven technology, low cost, and abundant supply, have gradually lost their advantages. This is because Mini / Micro LED display technology demands increasingly higher precision from PCBs. Consequently, the thinner and more precise PCBs become, the more their costs rise.

[0003] Glass substrates have high thermal conductivity and heat dissipation capabilities, effectively dissipating heat. Their advantages are particularly evident in thin, lightweight, and highly integrated end products. Furthermore, glass substrates can meet the more complex wiring requirements of high-density soldering products. Their higher flatness makes them suitable not only for Mini LED backlights but also, in theory, for the mass transfer and soldering of Micro LEDs. Therefore, glass substrates are increasingly being used in the Micro LED field.

[0004] During mass transfer, the wafer and glass substrate must be aligned before the chips on the wafer are transferred to the glass substrate, completing the mass transfer process. The alignment accuracy and efficiency of the wafer and glass substrate determine the performance of the mass transfer equipment, and existing mass transfer equipment on the market still needs to be optimized in this regard. Utility Model Content

[0005] The present application mainly provides a mass transfer device to solve the problem of low transfer efficiency caused by unsatisfactory alignment accuracy and efficiency between wafers and glass substrates in existing mass transfer devices.

[0006] In order to solve the above technical problems, a technical solution adopted in this application is to provide a mass transfer device. The mass transfer equipment includes: a base, including a base and a beam fixed on the base; a straightening platform mechanism, arranged on the base, for straightening the first material and the second material respectively; a processing platform mechanism, arranged side by side with the straightening platform mechanism on the base, for carrying and adjusting the horizontality of the straightened first material, so that the first material is parallel to the second material located above it; a moving mechanism, arranged on the base, for moving the first material from the straightening platform mechanism to the processing platform mechanism, and for moving the second material from the straightening platform mechanism to above the processing platform mechanism; a fine positioning mechanism, fixed on the beam, for positioning and identifying the first material carried on the processing platform mechanism and the second material picked up by the moving mechanism, so that the processing platform mechanism adjusts the first material and the second material to be aligned in the vertical direction; a laser device, including a laser processing part fixed on the beam, the laser processing part is used to emit laser to the aligned second material, so that the chip on the second material is transferred to the first material.

[0007] In some embodiments, the mass transfer device further comprises a visual grabbing mechanism mounted on the base;

[0008] The visual grabbing mechanism is used to detect the position deviation of the first material or the second material on the straightening platform mechanism, and the straightening platform mechanism rotates and straightens the first material or the second material based on the detection result of the visual grabbing mechanism.

[0009] In some embodiments, the straightening platform mechanism includes a shock-absorbing adsorption platform, a rotary drive member, a first linear drive member, and a second linear drive member. The shock-absorbing adsorption platform is provided with a carrying position for carrying the first material or the second material, and the bottom of the carrying position has a first observation cavity passing therethrough. The shock-absorbing adsorption platform is mounted on the rotary drive member. The first linear drive member is used to drive the shock-absorbing adsorption platform to move in a first direction. The second linear drive member is used to drive the shock-absorbing adsorption platform to move in a second direction perpendicular to the first direction.

[0010] Among them, the first linear drive member and the second linear drive member cooperate to drive the shock-absorbing adsorption carrier to move above the visual grabbing mechanism, and the visual grabbing mechanism detects the first material or the second material adsorbed on the carrying position through the first observation cavity, and the rotary drive member rotates the shock-absorbing adsorption carrier based on the detection result.

[0011] In some embodiments, the mass transfer equipment also includes a laser rangefinder installed on the base and located between the straightening stage mechanism and the processing stage mechanism; the laser rangefinder is used to measure the surface shape of the second material during the process of the moving mechanism moving the second material, and the processing stage mechanism is used to adjust the levelness of the first material according to the surface shape of the second material.

[0012] In some embodiments, the processing platform mechanism includes a processing adsorption platform, a leveling module, a third linear drive component, and a fourth linear drive component. The processing adsorption platform is used to carry the first material. The processing adsorption platform is installed on the leveling module. The leveling module is used to adjust the horizontality of the first material carried on the processing adsorption platform. The third linear drive component is used to drive the processing adsorption platform to move along a first direction. The fourth linear drive component is used to drive the processing adsorption platform to move along a second direction perpendicular to the first direction.

[0013] The third linear drive member and the fourth linear drive member cooperate to adjust the position of the processing adsorption carrier so that the first material is aligned with the second material above it.

[0014] In some embodiments, the mass transfer device further comprises an optical detection component disposed on the base, wherein the optical detection component is disposed adjacent to the processing stage mechanism;

[0015] The processing adsorption carrier is provided with a penetrating second observation cavity. The processing adsorption carrier can be moved to above the optical detection component. The optical detection component detects the transferred first material through the second observation cavity.

[0016] In some embodiments, the straightening stage mechanism, the processing stage mechanism, and the crossbeam are arranged side by side on the base along a first direction;

[0017] The moving mechanism includes a fifth linear drive, a sixth linear drive, a first lifting and conveying module, and a second lifting and conveying module, the fifth linear drive is mounted on the base and is spaced apart on both sides of the straightening platform mechanism and the processing platform mechanism along the second direction, the sixth linear drive is mounted on the fifth linear drive, the first lifting and conveying module and the second lifting and conveying module are respectively arranged on both sides of the sixth linear drive along the first direction, the first lifting and conveying module is used to pick up the first material from the straightening platform mechanism and release the first material to the processing platform mechanism, and the second lifting and conveying module is used to pick up the second material from the straightening platform mechanism;

[0018] The fifth linear driving member is used to drive the first lifting and transporting module and the second lifting and transporting module to move along the first direction, and the sixth linear driving member is used to drive the second lifting and transporting module to move along the second direction.

[0019] In some embodiments, after the second lifting and handling module picks up the second material, the upper surface of the second material is kept perpendicular to the laser emission direction of the laser processing part.

[0020] In some embodiments, the mass transfer equipment also includes a first loading platform, a second loading platform, a robot and an edge-finding mechanism. The robot includes at least one material-picking arm, and the material-picking arm is used to pick up the first material from the first loading platform, or pick up the second material from the second loading platform, and place the first material or the second material on the straightening platform mechanism after the edge-finding mechanism has found the edge.

[0021] In some embodiments, the robot is further used to pick up the transferred first material or the second material and move it to the corresponding first loading platform or the second loading platform.

[0022] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a mass transfer device. By reasonably arranging the positions of the aligning stage mechanism, the processing stage mechanism, the moving mechanism, the crossbeam, the fine positioning mechanism and the laser processing part on the base, each material can efficiently complete two positioning and adjust the levelness, so that the first material and the second material can be efficiently and accurately aligned, and the coordinated movement of each component in this process can greatly reduce the pause and waiting time in the process, further improving the operating efficiency, and because the alignment accuracy of the first material and the second material is high, the efficiency and yield of the laser transfer are also effectively improved, which can greatly improve the transfer efficiency of the mass transfer device. In the present application, the same aligning stage mechanism is used to perform the initial positioning of the first material and the second material, and the same fine positioning mechanism is used to perform the fine positioning of the first material and the second material, and after the positions of the first material and the second material are aligned, they are synchronously moved to the bottom of the laser processing part to complete the laser transfer, which can make the positioning between the wafer and the glass substrate more accurate, effectively improving the transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0024] Figure 1 It is a structural diagram of an embodiment of a mass transfer device provided by the present application;

[0025] Figure 2 yes Figure 1 Schematic diagram of the assembly structure of the first loading platform, the second loading platform, the manipulator and the edge-finding mechanism in the mass transfer device shown;

[0026] Figure 3 yes Figure 1 Schematic diagram of the assembly structure of the base, the straightening stage mechanism, the processing stage mechanism, the moving mechanism and the precise positioning mechanism in the mass transfer equipment shown;

[0027] Figure 4 yes Figure 3 A schematic diagram of the structure of the alignment stage mechanism and the processing stage mechanism installed on the base;

[0028] Figure 5 yes Figure 3 A schematic diagram of the structure of the mobile mechanism installed on the base;

[0029] Figure 6 yes Figure 1 Schematic diagram of the structure of the laser device in the mass transfer equipment shown. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] The terms "first", "second" and "third" in the embodiments of the present application are only used for descriptive purposes and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second" and "third" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally also include steps or units that are not listed, or may optionally also include other steps or units inherent to these processes, methods, products or devices.

[0032] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] This application provides a mass transfer device 100, see Figure 1 , Figure 1 It is a structural diagram of an embodiment of the mass transfer equipment provided by this application.

[0034] The mass transfer device 100 includes: a base 10, including a base 12 and a beam 14 fixed to the base 12; a straightening platform mechanism 20, provided on the base 12, for straightening a first material and a second material respectively; a processing platform mechanism 30, provided side by side with the straightening platform mechanism 20 on the base 12, for carrying and adjusting the horizontality of the straightened first material so that the first material is parallel to the second material located above it; a moving mechanism 40, provided on the base 12, for moving the first material from the straightening platform mechanism 20 to the processing platform mechanism 30, And move the second material from the straightening platform mechanism 20 to above the processing platform mechanism 30; the precision positioning mechanism 50 is fixed on the beam 14, and is used to position and identify the first material carried on the processing platform mechanism 30 and the second material picked up by the moving mechanism 40, so that the processing platform mechanism 30 adjusts the first material and the second material to be aligned in the vertical direction; the laser device 60 includes a laser processing part 62 fixed on the beam 14, and the laser processing part 62 is used to emit laser to the aligned second material, so that the chip on the second material is transferred to the first material.

[0035] The first material is a glass substrate, and the second material is a wafer. A large number of chips are formed on the wafer. The large number transfer device 100 is used to transfer the large number of chips on the wafer to a preset position on the glass substrate.

[0036] The following description takes chip transfer between a glass substrate and a wafer as an example.

[0037] See also Figure 1 and Figure 2 ,in Figure 2 yes Figure 1A schematic diagram of the structure of the first loading platform, second loading platform, robot, and edge-finding mechanism in the mass transfer device is shown. In this embodiment, the mass transfer device 100 also includes a first loading platform 71, a second loading platform 72, a robot 73, and an edge-finding mechanism 74. The robot 74 includes at least one material-picking arm, which is used to pick up a first material from the first loading platform 71 or a second material from the second loading platform 72, and place the first or second material on the platform alignment mechanism 20 after the edge-finding mechanism 74 has found the first or second material.

[0038] That is, the first loading platform 71 can initially be fully loaded with glass substrates, and the second loading platform 72 can initially be fully loaded with wafers. If the robot 73 has only one retrieving arm, the robot 73 can retrieve the glass substrate from the first loading platform 71, complete edge tracing, and then place the glass substrate on the idle alignment platform mechanism 20. The robot 73 can also retrieve the glass substrate from the second loading platform 72, complete edge tracing, and then place the wafer on the idle alignment platform mechanism 20. In other words, the same alignment platform mechanism 20 can sequentially align glass substrates and wafers. While the alignment platform mechanism 20 is aligning the glass substrate or wafer, the retrieving arm of the robot 73 is performing material retrieval and edge tracing in preparation for loading the glass substrate or wafer onto the alignment platform mechanism 20.

[0039] It should be noted that the chips on a wafer can meet the needs of being transferred to multiple glass substrates. In this case, the frequency of the material picking arm of the robot 73 picking up materials from the first loading platform 71 is greater than the frequency of picking up materials from the second loading platform 72 during operation. That is, the material picking arm can pick up materials from the first loading platform 71 for multiple consecutive times, and only pick up materials from the second loading platform 72 before the chips on the wafer are consumed.

[0040] Optionally, the number of material picking arms of the manipulator 73 can be two, three or four. For example, if the number of material picking arms of the manipulator 73 is two, the actions of the two material picking arms can be coordinated to ensure that there is always a material picking arm that picks up a glass substrate or wafer in a preparatory position waiting to load the material onto the straightening stage mechanism 20 before the stage mechanism 20 is idle, so as to realize efficient loading of the material onto the straightening stage mechanism 20, thereby greatly eliminating the waiting pause time in the intermediate links and improving the operating efficiency of the mass transfer equipment 100.

[0041] For example, if one of the picking arms picks up a glass substrate or wafer and is in a preparatory position for loading the material onto the straightening stage mechanism 20, the other picking arm can pick up the glass substrate or wafer and complete the edge search based on the planning of the mass transfer device 100. After the picking arm in the preparatory position loads the material onto the straightening stage mechanism 20, the picking arm that has completed the edge search begins to fill in the position to enter the preparatory position, and the picking arm that has completed loading the material onto the straightening stage mechanism 20 cyclically picks up the material and searches for the edge.

[0042] In this embodiment, the first loading platform 71 and the second loading platform 72 are both provided with multiple layers of stacked load plates, each of which is used to carry a material. The manipulator 73 can also move up and down, so that the material picking arm can pick up the materials on each layer in sequence.

[0043] The glass substrate and wafer may be provided with positioning features such as positioning edges, positioning notches or mark points. The edge-finding mechanism 74 is used to locate the positioning edges or positioning notches on the glass substrate and wafer to ensure that the glass substrate and wafer are accurately positioned before alignment, thereby improving the subsequent alignment accuracy.

[0044] By further providing a first loading platform 71, a second loading platform 72, a manipulator 73 and an edge-finding mechanism 74 that are matched with the straightening platform mechanism 20 for loading materials, and when the straightening platform mechanism 20 straightens the material, the manipulator 73 simultaneously takes the material and finds the edge, so that the glass substrate or wafer to be loaded is in a ready position before the straightening platform mechanism 20 is idle, and the material can be loaded immediately once the straightening platform mechanism 20 is idle, thereby greatly eliminating the waiting pause time during the operation process, which is beneficial to improving the operation efficiency of the mass transfer equipment 100; and the edge-finding of the material can ensure that the glass substrate and wafer are accurately positioned before straightening, which can improve the subsequent straightening accuracy, and is beneficial to improving the positioning accuracy of the mass transfer equipment 100.

[0045] Furthermore, the robot arm 73 is also used to pick up the transferred first material or the second material and move it to the corresponding first loading platform 71 or the second loading platform 72 .

[0046] After a layer of glass substrates on the first loading platform 71 is removed, the loading platform becomes empty. After the chips are transferred from the glass substrate, the retrieving arm of the robot 73 can move the transferred glass substrate back to the loading platform. Thus, the first loading platform 71 also has the function of carrying the transferred glass substrates. Similarly, the second loading platform 72 also has the function of carrying the transferred wafers.

[0047] By using the first loading platform 71 and the second loading platform 72 to reload the transferred glass substrates and wafers, the need for an additional unloading platform is relatively eliminated, which not only saves costs but also relatively reduces the area requirements of the installation location of the mass transfer equipment 100.

[0048] See also Figure 1 、 Figure 3 and Figure 4 , Figure 3 yes Figure 1 The schematic diagram of the assembly structure of the base, the straightening stage mechanism, the processing stage mechanism, the moving mechanism and the precise positioning mechanism in the mass transfer equipment is shown. Figure 4 yes Figure 3 Schematic diagram of the structure of the alignment stage mechanism and the processing stage mechanism installed on the base.

[0049] The base 10 can be made of marble or steel, wherein the base 12 is a platform, which is used to provide a mounting surface with high precision, and the alignment platform mechanism 20, the processing platform mechanism 30 and the moving mechanism 40 are all installed on the mounting surface; the beam 14 is installed on the mounting surface of the base 12 to provide a support point above the mounting surface to support the precision positioning mechanism 50 and the laser processing part 62.

[0050] The alignment stage mechanism 20 and the processing stage mechanism 30 are arranged side by side on the mounting surface of the base 12. The moving mechanism 40 is arranged on the base 12 and its moving part is relatively located above the alignment stage mechanism 20. The precision positioning mechanism 50 and the laser processing part 62 are both fixed on the beam 14.

[0051] Furthermore, the mass transfer equipment 100 also includes a visual grabbing mechanism 81, a laser rangefinder 82 and an optical detection component 83, wherein the visual grabbing mechanism 81 is arranged on the base 12, and the straightening stage mechanism 20 can move the glass substrate or wafer to the top of the visual grabbing mechanism 81, so that the visual grabbing mechanism 81 can detect the position offset of the glass substrate or wafer located on the straightening stage mechanism 20; the laser rangefinder 82 is installed on the base 12 and is relatively arranged between the straightening stage mechanism 20 and the processing stage mechanism 30, and is used to detect the surface shape of the wafer passing above it; the optical detection component 83 is arranged near the processing stage mechanism 30 and is located on the side of the processing stage mechanism 30 away from the straightening stage mechanism 20, and the optical detection component 83 is used to detect the glass substrate that has completed the chip transfer to detect the transfer yield.

[0052] like Figure 3 and Figure 4 As shown, the visual grabbing mechanism 81 is installed on the base 12, and the visual grabbing mechanism 70 is used to detect the position offset of the glass substrate or wafer on the alignment stage mechanism 20, and the alignment stage mechanism 20 rotates and aligns the glass substrate or wafer based on the detection result of the visual grabbing mechanism 81.

[0053] Specifically, the visual grabbing mechanism 81 includes a camera, and the alignment stage mechanism 20 moves the carried glass substrate or wafer to the top of the visual grabbing mechanism 81. The camera thereon can grab and position the glass substrate or wafer, thereby guiding the alignment stage mechanism 20 to align the glass substrate or wafer.

[0054] By setting up a mark-grabbing mechanism 71, the position offset data of the glass substrate or wafer can be quickly and efficiently identified, and then the alignment stage mechanism 20 can align the glass substrate or wafer based on the position offset data to achieve their respective rough positioning. Moreover, since the same alignment stage mechanism 20 is used to align each material, the alignment deviation caused by the difference in the mechanism can be relatively eliminated, making the positioning between the glass substrate and the wafer more accurate.

[0055] Among them, mark points (position identification points) are set on the glass substrate and the wafer. The camera of the visual grabbing mechanism 71 can identify the position offset data of the material by grabbing the mark points on the corresponding material.

[0056] The glass substrate and the wafer are both aligned using the alignment stage mechanism 20 so that the postures of the glass substrate and the wafer are consistent (i.e., the relative deflection angle of the posture in the horizontal plane is 0), or the posture in the horizontal plane is deflected by a preset angle, which can be 60 degrees, 90 degrees or 120 degrees, etc. These position requirements can be pre-set as needed.

[0057] Specifically, the aligning stage mechanism 20 can respectively adsorb and fix the glass substrate and the wafer, and can adjust the postures of the glass substrate and the wafer along the XYθ axis to align the glass substrate and the wafer.

[0058] like Figure 4 As shown, the platform alignment mechanism 20 includes a shock-absorbing adsorption platform 21, a rotating drive member 22, a first linear drive member 23 and a second linear drive member 24. The shock-absorbing adsorption platform 21 is provided with a carrying position for carrying a glass substrate or a wafer, and the bottom of the carrying position has a first observation cavity (not shown) passing through. The shock-absorbing adsorption platform 21 is mounted on the rotating drive member 22. The first linear drive member 23 is used to drive the shock-absorbing adsorption platform 21 to move along a first direction A, and the second linear drive member 24 is used to drive the shock-absorbing adsorption platform 21 to move along a second direction B perpendicular to the first direction A; wherein, the first linear drive member 23 and the second linear drive member 24 cooperate to drive the shock-absorbing adsorption platform 21 to move above the visual grabbing mechanism 81, and the visual grabbing mechanism 81 detects the glass substrate or wafer adsorbed on the carrying position through the first observation cavity, and the rotating drive member 22 rotates the shock-absorbing adsorption platform 21 based on the detection result to align the glass substrate or wafer.

[0059] The first linear drive 23 is mounted on the base 12, the second linear drive 24 is mounted on the first linear drive 23, the support platform is mounted on the second linear drive 24, the rotary drive 22 is mounted on the support platform, and the shock-absorbing adsorption platform 21 is mounted on the rotary drive 22. Thus, the glass substrate or wafer placed on the shock-absorbing adsorption platform 21 can achieve XYθ-axis motion. The mounting relationship of the first linear drive 23 and the second linear drive 24 can be interchanged.

[0060] The first linear driving member 23 and the second linear driving member 24 can be a combination of a guide rail and a linear motor. The rotary driving member 22 can be a DD rotary motor. The shock-absorbing adsorption platform 21 has the functions of shock absorption and adsorption and fixing materials.

[0061] Among them, the first linear drive member 23 and the second linear drive member 24 cooperate to drive the shock-absorbing adsorption platform 21 to move above the visual grabbing mechanism 81, and the camera of the visual grabbing mechanism 81 detects the position offset of the glass substrate or wafer located at the supporting position through the first observation cavity, wherein the edge of the glass substrate or wafer is adsorbed on the supporting position, and the rest is facing the first observation cavity, that is, the mark points on the glass substrate or wafer are facing the first observation cavity, so that the camera can grab the mark points on the glass substrate or wafer through the first observation cavity to realize the position offset detection of the glass substrate or wafer, and then the rotating drive member 22 rotates and straightens the shock-absorbing adsorption platform 21 based on the visual detection results.

[0062] See also Figure 3 and Figure 4 After the glass substrate or wafer on the stage mechanism 20 is aligned, the moving mechanism 40 picks up the glass substrate and places it on the processing stage mechanism 30, or the moving mechanism 40 picks up the wafer and moves it above the processing stage mechanism 30. During the wafer movement process, when the wafer passes above the laser rangefinder 82, the laser rangefinder 82 measures the surface shape of the wafer. The processing stage mechanism 30 is used to adjust the level of the glass substrate according to the surface shape of the wafer so that the glass substrate is parallel to the lower surface of the wafer.

[0063] It can be seen that there are errors in the thickness of each chip on the wafer. By detecting the thickness of each chip through the laser rangefinder 82, the horizontality of the lower surface of the wafer, that is, the surface shape of the wafer, can be detected, thereby guiding the processing stage mechanism 30 to adjust the horizontality of the glass substrate so that the glass substrate is parallel to the lower surface of the wafer, so as to further improve the alignment accuracy between the glass substrate and the wafer.

[0064] Continue reading Figure 4In this embodiment, the processing platform mechanism 30 includes a processing adsorption platform 31, a leveling module 32, a third linear drive 33 and a fourth linear drive 34. The processing adsorption platform 31 is used to carry a glass substrate. The processing adsorption platform 31 is installed on the leveling module 32. The leveling module 32 is used to adjust the horizontality of the glass substrate carried on the processing adsorption platform 31 so that the glass substrate is parallel to the lower surface of the wafer above it; the third linear drive 33 is used to drive the processing adsorption platform 31 to move along a first direction A, and the fourth linear drive 34 is used to drive the processing adsorption platform 31 to move along a second direction B perpendicular to the first direction A; the third linear drive 33 and the fourth linear drive 34 cooperate to adjust the position of the processing adsorption platform 31 so that the glass substrate is aligned with the wafer above it.

[0065] The third linear drive 33 is mounted on the base 12, the fourth linear drive 34 is mounted on the third linear drive 33, the leveling module 32 is mounted on the fourth linear drive 34, and the processing and adsorption stage 31 is mounted on the leveling module 32. This allows the glass substrate placed on the processing and adsorption stage 31 to be adjusted along the X and Y axes and in terms of horizontality. The third and fourth linear drives 33 and 34 can be mounted interchangeably.

[0066] After obtaining the surface data of the lower surface of the wafer, the leveling module 32 can adjust the level of the glass substrate carried on the processing adsorption stage 31 so that the glass substrate is parallel to the lower surface of the wafer above it.

[0067] like Figure 3 and Figure 4 As shown, the fine positioning mechanism 50 is specifically a high-precision camera. The glass substrate located on the processing adsorption carrier 31 is driven by the third linear drive member 33 and the fourth linear drive member 34 to move to the bottom of the fine positioning mechanism 50. The fine positioning mechanism 50 obtains the position information of the mark point on the glass substrate. Then, the wafer picked up by the moving mechanism 40 moves between the glass substrate and the fine positioning mechanism 50. The fine positioning mechanism 50 obtains the position information of the mark point on the wafer, and then based on the mark point position information of the two, the third linear drive member 33 and the fourth linear drive member 34 adjust the processing adsorption carrier 31 on the X-axis. and the position in the Y-axis direction, so that the mark point on the glass substrate is aligned with the mark point on the wafer, so as to realize the secondary precision positioning between the glass substrate and the wafer, and further improve the positioning and alignment accuracy of the glass substrate and the wafer; the aligned glass substrate and wafer are then synchronously moved to the bottom of the laser processing part 62, so that under the action of the laser provided by the laser processing part 62, the chip on the wafer is transferred to the preset position of the glass substrate, so that the laser energy acting on each chip is consistent and uniform, which effectively improves the transfer yield, wherein the glass substrate is very close to the wafer but remains non-contact, so as to realize non-contact transfer.

[0068] After chips are transferred to each preset position on the glass substrate, the glass substrate located on the processing adsorption platform 31 is moved to the top of the optical detection component 83 under the drive of the third linear drive member 33 and the fourth linear drive member 34, wherein the processing adsorption platform 31 is provided with a penetrating second observation cavity (not shown in the figure). The edge of the glass substrate is adsorbed on the processing adsorption platform 31, and the remaining part is facing the second observation cavity. The optical detection component 83 can detect the transferred glass substrate through the second observation cavity to detect the chip transfer yield on the glass substrate.

[0069] After the yield rate test is completed, the glass substrate is retrieved by the robot 73 and placed on the original carrying plate of the first loading platform 71 .

[0070] See also Figures 3 to 5 ,in Figure 5 yes Figure 3 Schematic diagram of the structure of the mobile mechanism installed on the base.

[0071] In this embodiment, the straightening platform mechanism 20, the processing platform mechanism 30 and the beam 14 are arranged side by side on the base 12 along the first direction A, so that the moving mechanism 40 can move more conveniently along the first direction A between the straightening platform mechanism 20, the processing platform mechanism 30 and the beam 14, thereby improving the material movement efficiency and saving movement time.

[0072] The moving mechanism 40 includes a fifth linear drive 41, a sixth linear drive 42, a first lifting and conveying module 43 and a second lifting and conveying module 44. The fifth linear drive 41 is installed on the base 12 and is spaced apart on both sides of the straightening stage mechanism 20 and the processing stage mechanism 30 along the second direction B. The sixth linear drive 42 is installed on the fifth linear drive 41. The first lifting and conveying module 43 and the second lifting and conveying module 44 are respectively arranged on both sides of the sixth linear drive 42 along the first direction A. The first lifting and conveying module 43 is used to pick up the glass substrate from the straightening stage mechanism 20 and release the glass substrate to the processing stage mechanism 30. The second lifting and conveying module 44 is used to pick up the wafer from the straightening stage mechanism 20. Among them, the fifth linear drive 41 is used to drive the first lifting and conveying module 43 and the second lifting and conveying module 44 to move along the first direction A, and the sixth linear drive 42 is used to drive the second lifting and conveying module 44 to move along the second direction B.

[0073] Specifically, the straightening platform mechanism 20 and the processing platform mechanism 30 are respectively provided with bosses on the two sides opposite to each other along the second direction B, the fifth linear drive member 41 includes two sets of guide rails and linear motors correspondingly arranged on the two sets of bosses, and the sixth linear drive member 42 includes a load-bearing beam with two ends respectively slidably arranged on the two sets of guide rails, and the load-bearing beam spans the straightening platform mechanism 20 or the processing platform mechanism 30, the linear motor of the fifth linear drive member 41 can drive the load-bearing beam to move along the first direction A, thereby driving the first lifting and transporting module 43 and the second lifting and transporting module 44 to move along the first direction A; the sixth linear drive member 42 also includes It includes guide rails and linear motors arranged on the load-bearing beam, the first lifting and transporting module 43 and the second lifting and transporting module 44 are located on opposite sides of the load-bearing beam along the first direction A, the second lifting and transporting module 44 is slidably installed on the guide rails of the sixth linear drive member 42, and the linear motor of the sixth linear drive member 42 can drive the second lifting and transporting module 44 to move along the second direction B; the first lifting and transporting module 43 is equipped with a substrate suction cup 430, and can drive the substrate suction cup 430 to move in the vertical direction; the second lifting and transporting module 44 is equipped with a wafer suction cup 440, and can drive the wafer suction cup 440 to move in the vertical direction.

[0074] It is particularly important to note that after the second lifting and transporting module 44 picks up the wafer, it keeps the upper surface of the wafer perpendicular to the laser emission direction of the laser processing unit 62. The laser emission direction of the laser processing unit 62 can generally be set to a vertical direction, and the second lifting and transporting module 44 picks up the wafer so that the upper surface of the wafer remains horizontal.

[0075] The second lifting and transporting module 44 and the laser processing part 62 can be assembled and adjusted with the cooperation of auxiliary tools, so that the laser emission direction of the laser processing part 62 is perpendicular to the upper surface of the wafer picked up by the second lifting and transporting module 44. Once the adjustment is completed and tightened, the laser processing part 62 is fixed on the beam 14, and the positions of the second lifting and transporting module 44 and the wafer suction cup 440 thereon are also fixed, thereby ensuring that the wafer picked up by the wafer suction cup 440 maintains the same posture each time, that is, the wafer picked up each time has the same horizontality, and the upper surface of the wafer in this posture is always perpendicular to the laser emission direction of the laser processing part 62, so that the laser provided by the laser processing part 62 can act evenly and consistently on the chips of each wafer, which can effectively improve the chip transfer efficiency.

[0076] The sixth linear drive component 42 includes a guide rail and a linear motor. The second lifting and transporting module 44 is slidably mounted on the guide rail. The linear motor is used to drive the second lifting and transporting module 44 to move along the second direction B defined by the guide rail.

[0077] Since the chips on one wafer can meet the needs of being transferred to multiple glass substrates, the first lifting and transporting module 43 relatively frequently picks up the glass substrates from the aligning stage mechanism 20 .

[0078] After the moving mechanism 40 takes the material from the straightening stage mechanism 20, the straightening stage mechanism 20 starts to receive new material and straighten it, and before the glass substrate is aligned with the wafer and the chip transfer is completed, the straightening stage mechanism 20 has completed the straightening of the new material; when the transferred glass substrate is subjected to yield testing, the moving mechanism 40 can simultaneously take a new glass substrate. Once the yield test is completed and the glass substrate leaves the processing stage mechanism 30, the newly taken glass substrate by the moving mechanism 40 can be placed on the idle processing stage mechanism 30; and after all the chips on the wafer are transferred and the wafer is taken away by the robot 73, the moving mechanism 40 starts to take the newly straightened wafer from the straightening stage mechanism 20.

[0079] See also Figure 1 and Figure 6 ,in Figure 6 yes Figure 1 Schematic diagram of the structure of the laser device in the mass transfer equipment shown.

[0080] In this embodiment, the laser device 60 also includes a main optical path assembly 64, which is mounted on a bracket isolated from the base 10. Thus, the main optical path assembly 64 and the laser processing component 62 are relatively independent. The main optical path assembly 64 includes a laser for providing a laser beam to the laser processing component 62. A certain positional error between the main optical path assembly 64 and the laser processing component 62 is allowed. This positional error can be caused by vibration. Therefore, even if there is some positional error between the main optical path assembly 64 and the laser processing component 62, a high-quality laser beam can be provided to the laser processing component 62, ensuring processing quality. The laser processing component 62 is fixed to the crossbeam 14, ensuring a stable and reliable optical path during processing.

[0081] By rationally arranging and aligning the positions of the carrier mechanism 20, the processing carrier mechanism 30, the moving mechanism 40, the beam 14, the precision positioning mechanism 50 and the laser processing part 62 on the base 12, each material can efficiently complete two positioning and adjust the level, so that the glass substrate and the wafer can be efficiently and accurately aligned. In this process, the coordinated movement of each component can greatly reduce the pause and waiting time during the process, further improving the operating efficiency. Due to the high alignment accuracy of the glass substrate and the wafer, the efficiency and yield of the laser transfer are also effectively improved. In summary, the transfer efficiency of the mass transfer equipment 100 can be greatly improved.

[0082] By arranging the main optical path component 64 and the laser processing part 62 relatively independently, the vibration of the main optical path component 64 can be prevented from being transmitted to the laser processing part 62, and a certain position error is allowed between the main optical path component 64 and the laser processing part 62, and the laser processing part 62 is fixed on the beam 14, which can effectively reduce the interference of external vibration on the laser transfer accuracy.

[0083] In the present application, the glass substrate and the wafer are initially positioned in turn on the straightening stage mechanism 20, and then the wafer is measured for levelness by the laser rangefinder 82, and the glass substrate is adjusted for levelness by the processing stage mechanism 30 so that the glass substrate is parallel to the lower surface of the wafer, and then the glass substrate and the wafer are moved to the fine positioning mechanism 50 in turn for fine positioning, and the processing stage mechanism 30 adjusts the glass substrate and the wafer to position and align again according to the fine positioning result, and then the chip is transferred to the substrate under the action of the laser, so that the laser energy acting on each chip is consistent and uniform, effectively improving the transfer yield.

[0084] In addition, in this application, the same alignment stage mechanism 20 is used to perform initial positioning of the glass substrate and the wafer, and the same fine positioning mechanism 50 is used to perform fine positioning of the glass substrate and the wafer. After the positions of the glass substrate and the wafer are aligned, they are synchronously moved to the bottom of the laser processing part 62 to complete the laser transfer, which can make the positioning between the wafer and the glass substrate more accurate and effectively improve the transfer efficiency.

[0085] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A mass transfer device, characterized in that: include: A base, comprising a base and a beam fixed on the base; A platform alignment mechanism is provided on the base platform and is used to align the first material and the second material respectively; a processing platform mechanism, arranged side by side with the straightening platform mechanism on the base platform, for carrying and adjusting the horizontality of the straightened first material so that the first material is parallel to the second material located above it; a moving mechanism, disposed on the base, for moving the first material from the aligning platform mechanism to the processing platform mechanism, and for moving the second material from the aligning platform mechanism to above the processing platform mechanism; a precision positioning mechanism, fixed to the crossbeam, for positioning and identifying the first material carried on the processing stage mechanism and the second material picked up by the moving mechanism, so that the processing stage mechanism adjusts the first material and the second material to be aligned in the vertical direction; The laser device includes a laser processing part fixed on the beam, and the laser processing part is used to emit laser to the aligned second material, so that the chip on the second material is transferred to the first material.

2. The mass transfer device according to claim 1, wherein: The mass transfer device further includes a visual grabbing mechanism mounted on the base; The visual grabbing mechanism is used to detect the position deviation of the first material or the second material on the straightening platform mechanism, and the straightening platform mechanism rotates and straightens the first material or the second material based on the detection result of the visual grabbing mechanism.

3. The mass transfer device according to claim 2, wherein: The straightening platform mechanism includes a shock-absorbing adsorption platform, a rotary drive member, a first linear drive member, and a second linear drive member. The shock-absorbing adsorption platform is provided with a carrying position for carrying the first material or the second material, and the bottom of the carrying position has a first observation cavity passing therethrough. The shock-absorbing adsorption platform is mounted on the rotary drive member. The first linear drive member is used to drive the shock-absorbing adsorption platform to move in a first direction. The second linear drive member is used to drive the shock-absorbing adsorption platform to move in a second direction perpendicular to the first direction. Among them, the first linear drive member and the second linear drive member cooperate to drive the shock-absorbing adsorption carrier to move above the visual grabbing mechanism, and the visual grabbing mechanism detects the first material or the second material adsorbed on the carrying position through the first observation cavity, and the rotary drive member rotates the shock-absorbing adsorption carrier based on the detection result.

4. The mass transfer device according to claim 1, wherein: The mass transfer equipment also includes a laser rangefinder installed on the base and located between the straightening stage mechanism and the processing stage mechanism; the laser rangefinder is used to measure the surface shape of the second material during the process of the moving mechanism moving the second material, and the processing stage mechanism is used to adjust the levelness of the first material according to the surface shape of the second material.

5. The mass transfer device according to claim 1, wherein: The processing platform mechanism includes a processing adsorption platform, a leveling module, a third linear drive component and a fourth linear drive component. The processing adsorption platform is used to carry the first material. The processing adsorption platform is installed on the leveling module. The leveling module is used to adjust the level of the first material carried on the processing adsorption platform. The third linear drive component is used to drive the processing adsorption platform to move in a first direction. The fourth linear drive component is used to drive the processing adsorption platform to move in a second direction perpendicular to the first direction. The third linear drive member and the fourth linear drive member cooperate to adjust the position of the processing adsorption carrier so that the first material is aligned with the second material above it.

6. The mass transfer device according to claim 5, characterized in that The mass transfer device further comprises an optical detection component disposed on the base, wherein the optical detection component is disposed adjacent to the processing stage mechanism; The processing adsorption carrier is provided with a penetrating second observation cavity. The processing adsorption carrier can be moved to above the optical detection component. The optical detection component detects the transferred first material through the second observation cavity.

7. The mass transfer device according to claim 1, wherein: The straightening stage mechanism, the processing stage mechanism and the crossbeam are arranged side by side on the base along a first direction; The moving mechanism includes a fifth linear drive, a sixth linear drive, a first lifting and conveying module, and a second lifting and conveying module, the fifth linear drive is mounted on the base and is spaced apart on both sides of the straightening platform mechanism and the processing platform mechanism along the second direction, the sixth linear drive is mounted on the fifth linear drive, the first lifting and conveying module and the second lifting and conveying module are respectively arranged on both sides of the sixth linear drive along the first direction, the first lifting and conveying module is used to pick up the first material from the straightening platform mechanism and release the first material to the processing platform mechanism, and the second lifting and conveying module is used to pick up the second material from the straightening platform mechanism; The fifth linear driving member is used to drive the first lifting and transporting module and the second lifting and transporting module to move along the first direction, and the sixth linear driving member is used to drive the second lifting and transporting module to move along the second direction.

8. The mass transfer device according to claim 7, wherein: After the second lifting and handling module picks up the second material, the upper surface of the second material is kept perpendicular to the laser emission direction of the laser processing part.

9. The mass transfer device according to claim 1, wherein: The mass transfer equipment also includes a first loading platform, a second loading platform, a robot and an edge-finding mechanism. The robot includes at least one material-picking arm, which is used to pick up the first material from the first loading platform or pick up the second material from the second loading platform, and place the first material or the second material on the straightening platform mechanism after the edge-finding mechanism finds the edge.

10. The mass transfer device according to claim 9, wherein: The robot is further used to pick up the transferred first material or the second material and move it to the corresponding first loading platform or the second loading platform.

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