Atomizing core, atomizer and electronic atomizing device

Abstract

The utility model provides an atomizing core, an atomizer and an electronic atomizing device. The atomizing core comprises a first substrate, a semiconductor heating layer, an electrode pair and a second substrate. The first substrate comprises a first surface and a second surface which are opposite to each other, and is provided with a plurality of first flow guide through holes penetrating through the thickness direction of the first substrate; the semiconductor heating layer is arranged on the first surface of the first substrate, and the second substrate is arranged on the side, back to the semiconductor heating layer, of the first substrate; the second substrate is provided with a plurality of second diversion through holes penetrating through the thickness direction of the second substrate; the second flow guide through holes are communicated with the first flow guide through holes in a one-to-one correspondence mode, and each second flow guide through hole and the corresponding first flow guide through hole are partially arranged in a staggered mode. According to the atomizing core, smooth and stable liquid supply can be kept, and the condition of dry burning of the atomizing core is effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic atomization, and in particular to an atomization core, an atomizer and an electronic atomization device. Background Art

[0002] Atomizer cores are primarily divided into two types: cotton and ceramic. Cotton cores offer excellent flavor reproduction, while ceramic cores offer the advantages of uniform heating, consistent production, and good assembly. However, both types suffer from varying degrees of issues, including poor atomization burst, easy atomization matrix leakage, core sticking, flavor degradation, and biosafety.

[0003] To solve the above technical problems, through holes are usually opened on a ceramic substrate or a glass substrate to supply liquid for atomization to the heating layer on the substrate. However, during the atomization process, bubbles generated by the heating layer may enter the through holes of the substrate and cause the through holes to be blocked, affecting the ventilation and oil supply of the atomizer, resulting in unstable atomization or insufficient liquid supply. Utility Model Content

[0004] The main technical problem solved by this application is how to avoid the phenomenon of unstable atomization or insufficient liquid supply.

[0005] To solve the above technical problems, a technical solution adopted in this application is: to provide an atomizer core, including a first substrate, a semiconductor heating layer, an electrode pair, and a second substrate. The first substrate includes a first surface and a second surface opposite to each other, and the first substrate has a plurality of first conduction holes extending through its thickness; the semiconductor heating layer is provided on the first surface of the first substrate; the electrode pair includes two electrodes, the two electrodes are provided on the first surface of the first substrate, and are electrically connected to the two ends of the semiconductor heating layer respectively; the second substrate is provided on the side of the first substrate facing away from the semiconductor heating layer; the second substrate has a plurality of second conduction holes extending through its thickness; the plurality of second conduction holes are connected to the plurality of first conduction holes in a one-to-one correspondence, and each second conduction hole is partially staggered with the corresponding first conduction hole.

[0006] In a specific embodiment, the aperture of the first flow guide hole is larger than the aperture of the second flow guide hole; the overlapping area of ​​the orthographic projection of the second flow guide hole on the first substrate and the orthographic projection of the first flow guide hole on the first substrate is greater than or equal to half of the cross-sectional area of ​​the second flow guide hole and smaller than the cross-sectional area of ​​the second flow guide hole; or the aperture of the first flow guide hole is smaller than the aperture of the second flow guide hole; the overlapping area of ​​the orthographic projection of the first flow guide hole on the first substrate and the orthographic projection of the second flow guide hole on the first substrate is greater than or equal to half of the cross-sectional area of ​​the first flow guide hole and smaller than the cross-sectional area of ​​the first flow guide hole.

[0007] In a specific embodiment, a plurality of elongated first grooves are provided on the second surface of the first substrate and / or on the surface of the second substrate facing the first substrate; each of the first grooves is respectively connected to a plurality of the first flow-conducting holes and a plurality of the second flow-conducting holes; the atomizer core further has a ventilation channel provided on the circumferential edge, one end of the ventilation channel is connected to the end of the first groove, and the other end extends along the thickness direction of the second substrate and penetrates the second substrate.

[0008] In a specific embodiment, the ventilation channel includes a first part and a second part; wherein, the first part is connected to the end of the first groove; and the first part is formed by the second surface of the first substrate and the surface of the second substrate facing the first substrate; the second part is connected to the end of the first part away from the first groove, and penetrates the second substrate along the thickness direction of the second substrate.

[0009] In a specific embodiment, the plurality of first flow-conducting holes are arranged in an array; and at least one first groove connects a plurality of rows of the first flow-conducting holes with a corresponding plurality of rows of the second flow-conducting holes.

[0010] In a specific embodiment, the first portion of at least one ventilation channel is communicated with a plurality of adjacent first grooves.

[0011] In a specific embodiment, a second groove is provided on the second surface of the first substrate and / or on the side surface of the second substrate facing the first substrate, and at least two adjacent first grooves are connected through the second groove; and / or the atomizer core is provided with ventilation channels on both sides along the length direction of the first groove and / or on both sides along the length direction of the second groove.

[0012] In a specific embodiment, the aperture of the first flow-through hole is greater than or equal to 20 microns and less than or equal to 120 microns; the aperture of the second flow-through hole is greater than or equal to 20 microns and less than or equal to 120 microns; and / or the depth of the first groove is greater than or equal to 30 microns and less than or equal to 80 microns; the depth of the second groove is greater than or equal to 30 microns and less than or equal to 80 microns.

[0013] In a specific embodiment, the resistivity of the semiconductor heating layer is less than the resistivity of the first substrate; the semiconductor heating layer is a silicon wafer, and the silicon wafer has a plurality of third conduction holes; the third conduction holes are connected to the first conduction holes in a one-to-one correspondence; and / or, the first substrate is a silicon substrate; and / or, the second substrate is a glass substrate or a ceramic substrate.

[0014] To solve the above technical problems, another technical solution adopted in this application is: to provide an atomizer, comprising a liquid storage chamber and an atomizing core as described above; the liquid storage chamber is used to store the atomizing matrix and is connected to the atomizing core.

[0015] In order to solve the above technical problems, another technical solution adopted in this application is: to provide an electronic atomization device, including a battery assembly and the atomizer as mentioned above.

[0016] Beneficial effects of the embodiments of the present application: The present application partially staggers the first flow guide holes in the first substrate and the second flow guide holes in the second substrate so that bubbles generated when the semiconductor heating layer heats the atomized matrix can be blocked on the bonding surface of the first substrate and the second substrate, preventing bubbles from entering the second flow guide holes and causing blockage of the second flow guide holes, thereby maintaining smooth and stable liquid supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of the atomizer core provided in the first embodiment of the present application;

[0018] Figure 2A for Figure 1 A top view of the atomizer core shown;

[0019] Figure 2B for Figure 2A A partial enlarged view of point A in the middle;

[0020] Figure 2C A top view of an atomizer core provided in another embodiment;

[0021] Figure 2D for Figure 2C A partial enlarged view of point B in the middle;

[0022] Figure 3 for Figure 1 A partial cross-sectional view of the atomizer core along line AA is shown;

[0023] Figure 4 A schematic diagram of the structure of the atomizer core provided in the second embodiment of the present application;

[0024] Figure 5 for Figure 4 The cross-sectional view of the atomizer core along line BB is shown;

[0025] Figure 6 for Figure 4 A schematic structural diagram of the first substrate in the atomizer core shown;

[0026] Figure 7 for Figure 4 A schematic structural diagram of the second substrate in the atomizer core shown;

[0027] Figure 8 A schematic diagram of the structure of the atomizer core provided in the third embodiment of the present application;

[0028] Figure 9 for Figure 8 The cross-sectional view of the atomizer core along the CC line is shown;

[0029] Figure 10 for Figure 8 A schematic structural diagram of the first substrate in the atomizer core shown;

[0030] Figure 11 for Figure 8 A schematic structural diagram of the second substrate in the atomizer core shown;

[0031] Figure 12 A partially enlarged view of the first substrate in the atomizer core provided in the fourth embodiment of the present application;

[0032] Figure 13 This is a schematic structural diagram of an atomizer provided in one embodiment of the present application;

[0033] Figure 14 Schematic diagram of the structure of an electronic atomization device provided in one embodiment of the present application.

[0034] Description of Figure Numbers:

[0035] 100-atomizer; 200-battery assembly; 10-atomizer core; 20-liquid storage chamber; 1-first substrate; 2-semiconductor heating layer; 3-electrode pair; 4-second substrate; 11-first surface; 12-second surface; 13-first flow guide hole; 14-first groove; 15-second groove; 21-third flow guide hole; 41-second flow guide hole; 42-ventilation channel; 141-sub-groove; 421-first part; 422-second part. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0038] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0040] The embodiment of the present application provides an atomizer core that can be used to convert an atomized matrix into an aerosol. The atomizer core provided in the embodiment of the present application can be a heater based on a micro-electromechanical system (MEMS). MEMS is based on microelectronics, micromechanics and materials science to research, design and manufacture micro devices with specific functions, including microstructure devices, microsensors, microactuators, micromechanical optical devices and microsystems. The MEMS processing technology was developed on the basis of traditional microelectronics processing technology (also known as integrated circuit IC technology). Later, some unique technologies for making micromachines were developed. These unique technologies are combined with conventional integrated circuit technology to realize MEMS. These technologies are collectively referred to as micromachining technology. The atomizer core material based on MEMS technology is harmless to the human body, the smoke produced by the atomizer device has a delicate taste and is not dry, and the atomizer core structure is compact and the batch production consistency is good.

[0041] See also Figure 1-Figure 3 , Figure 1 A schematic diagram of the structure of the atomizer core provided in the first embodiment of the present application; Figure 2Afor Figure 1 A top view of the atomizer core shown; Figure 2B for Figure 2A A partial enlarged view of point A in the middle; Figure 2C A top view of an atomizer core provided in another embodiment; Figure 2D for Figure 2C A partial enlarged view of point B in the middle; Figure 3 for Figure 1 The atomizer core provided in the first embodiment of the present application may include a first substrate 1 , a semiconductor heating layer 2 , an electrode pair 3 and a second substrate 4 .

[0042] Among them, Figure 3 As shown, the first substrate 1 includes a first surface 11 and a second surface 12 relative to each other, and the first substrate 1 has a plurality of first flow-conducting holes 13 running through the thickness direction Z thereof, that is, the plurality of first flow-conducting holes 13 extend from the first surface 11 to the second surface 12; the first flow-conducting holes 13 are used to transfer the atomized matrix located on the second surface 12 to the first surface 11. The semiconductor heating layer 2 is provided on the first surface 11 of the first substrate 1, and is used to atomize the atomized matrix into an aerosol. The resistivity of the semiconductor heating layer 2 is less than that of the first substrate 1, so that the semiconductor heating layer 2 can conduct electricity and generate heat when powered on. Specifically, the first substrate 1 can be a silicon substrate made of single crystal silicon; the semiconductor heating layer 2 can be a conductive silicon wafer, which has good thermal conductivity.

[0043] like Figure 1 As shown, the electrode pair 3 includes two electrodes, which are provided on the first surface 11 of the first substrate 1 and are electrically connected to the two ends of the semiconductor heating layer 2, respectively, so that a voltage is applied to the semiconductor heating layer 2 through the electrode pair 3 to generate heat in the semiconductor heating layer 2. Specifically, the electrode pair 3 can cover a portion of the first surface 11 and a portion of the surface of the semiconductor heating layer 2 where the first conduction hole 13 is not provided.

[0044] like Figure 3As shown, the second substrate 4 is arranged on the side of the first substrate 1 facing away from the semiconductor heating layer 2; specifically, the second substrate 4 can be bonded to the second surface 12 of the first substrate 1. The second substrate 4 has a plurality of second guide holes 41 running through its thickness direction Z. The second guide holes 41 are used to transfer the atomized matrix located on the surface of the second substrate 4 away from the first substrate 1 to the surface of the second substrate 4 facing the first substrate 1; that is, the atomized matrix can be transferred from the surface of the second substrate 4 away from the first substrate 1 to the semiconductor heating layer 2 located on the first surface 11 of the first substrate 1 through the first guide holes 13 and the second guide holes 41 to achieve liquid supply and atomization of the atomized matrix. It can be understood that the second substrate 4 and the second guide holes 41 provided in the second substrate 4 can increase the liquid storage capacity of the atomizing core, which is beneficial to the atomization of the atomized matrix. Specifically, the second substrate 4 is a glass substrate or a ceramic substrate.

[0045] The plurality of second flow-guiding holes 41 are connected to the plurality of first flow-guiding holes 13 in a one-to-one correspondence, and each second flow-guiding hole 41 is at least partially staggered with the corresponding first flow-guiding hole 13. Specifically, the first flow-guiding holes 13 and the corresponding second flow-guiding holes 41 are not coaxially disposed, and the first flow-guiding holes 13 and the second flow-guiding holes 41 are only partially overlapped.

[0046] By partially staggering the first flow guide holes 13 in the first substrate 1 and the second flow guide holes 41 in the second substrate 4, the bubbles generated when the semiconductor heating layer 2 heats the atomized matrix can be blocked on the bonding surface of the first substrate 1 and the second substrate 4, preventing the bubbles from entering the second flow guide holes 41 and causing the second flow guide holes 41 to be blocked, thereby maintaining smooth and stable liquid supply.

[0047] Combine Figure 2A and Figure 2B In a specific embodiment, the aperture of the first flow guide hole 13 can be larger than the aperture of the second flow guide hole 41; wherein, the overlapping area of ​​the orthographic projection of the second flow guide hole 41 on the first substrate 1 and the orthographic projection of the first flow guide hole 13 on the first substrate 1 is greater than or equal to half the cross-sectional area of ​​the second flow guide hole 41 and less than the cross-sectional area of ​​the second flow guide hole 41; while preventing bubbles from entering the second flow guide hole 41, the overlapping portion of the first flow guide hole 13 and the second flow guide hole 41 can ensure that normal liquid supply requirements are met.

[0048] Of course, in some other embodiments, Figure 2C and Figure 2DThe aperture of the first flow guide hole 13 may also be smaller than the aperture of the second flow guide hole 41; wherein, the overlapping area of ​​the orthographic projection of the first flow guide hole 13 on the first substrate 1 and the orthographic projection of the second flow guide hole 41 on the first substrate 1 is greater than or equal to half the cross-sectional area of ​​the first flow guide hole 13 and less than the cross-sectional area of ​​the first flow guide hole 13; in this way, while bubbles can be prevented from entering the second flow guide hole 41, the overlapping portion of the first flow guide hole 13 and the second flow guide hole 41 can ensure that normal liquid supply requirements are met.

[0049] The first flow-through holes 13 have a diameter greater than or equal to 20 microns and less than or equal to 120 microns to ensure that the atomized substrate and bubbles can flow within the first flow-through holes 13. Specifically, the diameter of the first flow-through holes 13 can be any value among 20 microns, 50 microns, 80 microns, 100 microns, or 120 microns. The second flow-through holes 41 also have a diameter greater than or equal to 20 microns and less than or equal to 120 microns to ensure that the atomized substrate and bubbles can flow within the second flow-through holes 41. Specifically, the diameter of the second flow-through holes 41 can be any value among 20 microns, 50 microns, 80 microns, 100 microns, or 120 microns.

[0050] See Figure 4-Figure 7 , Figure 4 A schematic diagram of the structure of the atomizer core provided in the second embodiment of the present application; Figure 5 for Figure 4 The cross-sectional view of the atomizer core along line BB is shown; Figure 6 for Figure 4 A schematic structural diagram of the first substrate in the atomizer core shown; Figure 7 for Figure 4 Schematic diagram of the structure of the second substrate in the atomizer core shown. The atomizer core provided in the second embodiment of the present application has a substantially identical structure to the atomizer core provided in the first embodiment of the present application, with the difference being that, in the second embodiment, a plurality of elongated first grooves 14 are provided on the second surface 12 of the first substrate 1 and / or on the side surface of the second substrate 4 facing the first substrate 1, and the atomizer core further has a ventilation channel 42 provided on the circumferential edge.

[0051] Combine Figure 4 and Figure 5Each first groove 14 connects the plurality of first flow-guiding holes 13 with the corresponding plurality of second flow-guiding holes 41. A ventilation channel 42 is provided at the circumferential edge of the plurality of second flow-guiding holes 41. One end of the ventilation channel 42 connects to the end of the first groove 14, while the other end extends along the thickness direction of the second substrate 4 and penetrates the second substrate 4. The ventilation channel 42 connects to the first flow-guiding holes 13 through the first groove 14, allowing bubbles to be guided through the first groove 14 to the ventilation channel 42 and then discharged from the atomizer core. This prevents bubbles from accumulating at the bonding surface between the first substrate 1 and the second substrate 4 and clogging the liquid supply channel, further ensuring a stable and unobstructed liquid supply.

[0052] Specifically, such as Figure 6 As shown, the first groove 14 can be provided on the second surface 12 of the first substrate 1 and extend along the length direction X perpendicular to the thickness direction Z of the atomizer core; the extension direction of the first groove 14 can be the arrangement direction of the two electrodes or perpendicular to the arrangement direction of the electrodes.

[0053] Combine Figure 5-Figure 7 The ventilation channel 42 is provided on at least one side of the plurality of second flow-guiding holes 41 and is connected to the first groove 14; the ventilation channel 42 may specifically include a first portion 421 and a second portion 422. The first portion 421 is connected to the end of the first groove 14, and the first portion 421 may be formed by the second surface 12 of the first substrate 1 and the surface of the second substrate 4 facing the first substrate 1; the second portion 422 is connected to the end of the first portion 421 away from the first groove 14, and penetrates the second substrate 4 along the thickness direction Z of the second substrate 4, so as to discharge the bubbles in the first groove 14 to the outside of the atomizer core through the ventilation channel 44. The aperture of the ventilation channel 42 is greater than or equal to three times the aperture of the second flow-guiding holes 41, so as to facilitate the transfer of bubbles from the first groove 14 to the ventilation channel 42.

[0054] Among them, the second part 422 of the ventilation hole 44 can be a groove opened on the side wall of the second substrate 4, or it can be a through hole close to the side wall; the following embodiments of this application are all explained by taking the second part 422 as a groove opened on the side wall of the second substrate 4 as an example.

[0055] like Figure 5 As shown, the depth h of the first groove 14 can be greater than or equal to 30 microns and less than or equal to 80 microns, so as to ensure the structural strength of the first substrate 1 while allowing bubbles to move within the first groove 14. Specifically, the depth h of the first groove 14 can be any value among 30 microns, 40 microns, 50 microns, 60 microns, or 80 microns.

[0056] In a specific embodiment, a plurality of first flow guide holes 13 may be arranged in an array on the first substrate 1, and a plurality of second flow guide holes 41 may also be arranged in an array on the second substrate 4. The second surface 12 of the first substrate 1 has a plurality of first grooves 14 spaced apart from each other. The plurality of first grooves 14 are spaced apart along a first direction Y perpendicular to the length direction X. At least one first groove 14 connects adjacent rows of first flow guide holes 13 with corresponding rows of second flow guide holes 41, allowing bubbles within the rows of first flow guide holes 13 to be transferred to the corresponding first groove 14.

[0057] In some embodiments, one first groove 14 may connect multiple rows of first flow guide holes 13 and corresponding multiple rows of second flow guide holes 41; or some of the multiple first grooves 14 may connect multiple rows of first flow guide holes 13 and corresponding multiple rows of second flow guide holes 41; or each first groove 14 may connect multiple rows of first flow guide holes 13 and corresponding multiple rows of second flow guide holes 41.

[0058] The atomizer core is provided with ventilation channels 42 on both sides along the length direction X of the first groove 14. Specifically, along the row direction, multiple ventilation channels 42 are provided on opposite sides of the multiple second guide holes 41 of the second substrate 4 at intervals. Both ends of each first groove 14 are connected to the corresponding ventilation channel 42, so that bubbles in the adjacent multiple rows of first guide holes 13 can be guided to the ventilation channels 42 at both ends through the corresponding first groove 14 and then discharged from the atomizer core, thereby preventing bubbles from accumulating at the bonding surface of the first substrate 1 and the second substrate 4 and clogging the liquid supply channel, further ensuring stable and unobstructed liquid supply.

[0059] like Figure 4 As shown, the semiconductor heating layer 2 also has a plurality of third flow holes 21. The third flow holes 21 are connected to the first flow holes 13 in a one-to-one correspondence, so that the atomized substrate can enter the third flow holes 21 through the first flow holes 13, thereby increasing the contact area between the atomized substrate and the semiconductor heating layer 2 and improving the atomization efficiency. Specifically, the plurality of third flow holes 21 can also be arranged in a two-dimensional array on the semiconductor heating layer 2; preferably, each third flow hole 21 can be coaxially arranged with the corresponding first flow hole 13; and the aperture of the third flow hole 21 can be equal to the aperture of the first flow hole 13 to ensure liquid supply and improve atomization efficiency.

[0060] In a specific embodiment, conductive ions can be directly doped onto the first surface 11 of the first substrate 1 to form a semiconductor heating layer 2 on the portion of the first substrate 1 close to the first surface 11, thereby thinning the semiconductor heating layer 2 to a thickness of less than or equal to 10 microns.

[0061] See Figures 8-11 ; Figure 8A schematic diagram of the structure of the atomizer core provided in the third embodiment of the present application; Figure 9 for Figure 8 The cross-sectional view of the atomizer core along the CC line is shown; Figure 10 for Figure 8 A schematic structural diagram of the first substrate in the atomizer core shown; Figure 11 for Figure 8 Schematic diagram of the structure of the second substrate in the atomizer core shown. The atomizer core provided in the third embodiment of the present application has a substantially identical structure to the atomizer core provided in the second embodiment of the present application, with the difference that, in the third embodiment, along the row direction, the second substrate 4 has a plurality of spaced-apart ventilation channels 42 on opposite sides of the plurality of second flow-guiding holes 41; the ventilation channels 42 located on one side of the plurality of second flow-guiding holes 41 are connected only to one end of the first grooves 14 in the odd-numbered rows, and the ventilation channels 42 located on the other side of the plurality of second flow-guiding holes 41 are connected only to one end of the first grooves 14 in the even-numbered rows.

[0062] In this way, bubbles in the multiple rows of first guide holes 13 corresponding to the odd-numbered rows of first grooves 14 can be guided to the ventilation channel 42 located on one side of the multiple second guide holes 41 through the odd-numbered rows of first grooves 14, and then discharged from the atomizer core; and bubbles in the multiple rows of first guide holes 13 corresponding to the even-numbered rows of first grooves 14 can be guided to the ventilation channel 42 located on the other side of the multiple second guide holes 41 through the even-numbered rows of first grooves 14, and then discharged from the atomizer core; thereby preventing bubbles from gathering on the bonding surface of the first substrate 1 and the second substrate 4 and clogging the liquid supply channel, further ensuring stable and unobstructed liquid supply.

[0063] Specifically, a plurality of first flow-guiding holes 13 are arranged in an array on the first substrate 1, and a plurality of second flow-guiding holes 41 are arranged in an array on the second substrate 4; the second surface 12 of the first substrate 1 has a plurality of first grooves 14 arranged at intervals, and each first groove 14 connects to a plurality of rows of first flow-guiding holes 13. The plurality of first grooves 14 are arranged at intervals along the first direction Y. The two opposite sides of the atomizer core along the longitudinal direction X of the first groove are defined as the first side and the second side, respectively. The plurality of first grooves 14 in odd-numbered rows are connected to the corresponding ventilation channel 42 only through one end close to the first side; the plurality of first grooves 14 in even-numbered rows are connected to the corresponding ventilation channel only through one end close to the second side.

[0064] At the same time, the multiple ventilation channels 42 located on one side of the second substrate 4 and the multiple ventilation channels 42 located on the other side of the second substrate 4 are also staggered so that the ventilation channels 42 on one side are connected to the first grooves 14 of the odd rows, and the ventilation channels 42 on the other side are connected to the first grooves 14 of the even rows.

[0065] Furthermore, in a specific embodiment, the second surface 12 of the first substrate 1 may be provided with a second groove 15, through which at least two adjacent first grooves 14 are connected; preferably, multiple first grooves 14 may all be connected through the second groove 15. Furthermore, ventilation channels 42 are provided on both sides of the atomizer core along the length direction (first direction Y) of the second groove; specifically, along the column direction, ventilation channels 42 are provided on opposite sides of the multiple second guide holes 41 of the second substrate 4.

[0066] The second grooves 15 are connected to the multiple rows of first guide holes 13 and are connected to the ventilation channel 42, so that bubbles in the adjacent rows of first guide holes 13 can be guided to the ventilation channels 42 at both ends through the second grooves 15 and then discharged from the atomizer core, thereby preventing bubbles from gathering on the bonding surface between the first substrate 1 and the second substrate 4 and clogging the liquid supply channel, thereby further ensuring stable and unobstructed liquid supply.

[0067] Specifically, the second groove 15 extends from one side of the first substrate 1 to the other side along the first direction Y, and the second groove 15 is connected to multiple first grooves 14, so that bubbles can be transferred between the multiple first grooves 14 through the second groove 15, further avoiding the situation where bubbles gather and block the liquid supply channel.

[0068] Of course, in other embodiments, the second groove 15 may also be provided on a surface of the second substrate 4 facing the first substrate 1 .

[0069] See Figure 12 , Figure 12 This is a partial enlarged view of the first substrate in the atomizer core provided in the fourth embodiment of the present application; the structure of the atomizer core provided in the fourth embodiment of the present application is basically the same as that of the atomizer core provided in the second embodiment of the present application, except that, in the fourth embodiment, the corresponding first flow-conducting holes 13 and the second flow-conducting holes 41 are completely staggered; the side wall of the first groove 14 has a sub-groove 141 connected to the second flow-conducting holes 41, and the width of the sub-groove 141 is smaller than the width of the first groove 14; so that the atomized matrix can enter the first flow-conducting holes 13 from the second flow-conducting holes 41 through the sub-groove 141 and the first groove 14 in sequence, while preventing bubbles from entering the first flow-conducting holes 13 through the sub-groove 141, thereby blocking the bubbles in the groove 14.

[0070] Specifically, the plurality of first flow-guiding holes 13 can be arranged in an array on the first substrate 1, and the plurality of second flow-guiding holes 41 can also be arranged in an array on the second substrate 4. The second surface 12 of the first substrate 1 has a plurality of first grooves 14 spaced apart, each first groove 14 connecting to a row of first flow-guiding holes 13. Bubbles within each row of first flow-guiding holes 13 can be transferred to the corresponding first groove 14. Along the row direction, a plurality of ventilation channels 42 spaced apart are formed on one side of the plurality of second flow-guiding holes 41 of the second substrate 4. At least one end of each first groove 14 connects to a corresponding ventilation channel 42, allowing bubbles within the first groove 14 to be discharged out of the atomizer core through the corresponding ventilation channel 42.

[0071] It should be noted that the corresponding first flow-conducting holes 13 and the second flow-conducting holes 41 are completely misaligned, which means that the projection of the first flow-conducting holes 13 along the thickness direction Z on the first substrate 1 does not overlap with the projection of the corresponding connected second flow-conducting holes 41 along the thickness direction Z on the first substrate 1 at all, and can only be connected through the sub-groove 141.

[0072] Furthermore, the first portion of at least one ventilation channel 42 is connected to the adjacent first grooves 14 , so that the aperture of the ventilation channel 42 is larger than the aperture of the second guide hole 41 , so as to facilitate the transfer of bubbles from the first grooves 14 to the ventilation channel 42 .

[0073] The present application provides an atomizer core, which includes a first substrate 1, a semiconductor heating layer 2, an electrode pair 3, and a second substrate 4. The atomizer core is configured by partially staggering the first guide holes 13 in the first substrate 1 and the second guide holes 41 in the second substrate 4, so that bubbles generated when the semiconductor heating layer 2 heats the atomizing matrix can be blocked on the bonding surface between the first substrate 1 and the second substrate 4, preventing bubbles from entering the second guide holes 41 and causing blockage of the second guide holes 41, thereby maintaining smooth and stable liquid supply.

[0074] See also Figure 13 , Figure 13 1 is a schematic diagram of the structure of an atomizer provided in one embodiment of the present application. The present application provides an atomizer 100. The atomizer 100 includes a liquid storage chamber 20 and the atomizer core 10 described above.

[0075] The liquid storage chamber 20 is used to store the atomized matrix and is in communication with the atomizer core 10. The liquid storage chamber 20 is in communication with the first guide hole 13 of the first substrate 1.

[0076] In this embodiment, the atomizer core 10 is disposed below the liquid storage chamber 20 and is horizontally placed.

[0077] The atomizer core 10 may also be placed vertically or tilted. For example, the atomizer core 10 may be placed at a certain angle to the horizontal plane, or at a certain angle to the circumference of the atomizer 100. That is, the present application does not limit the placement angle of the atomizer core 10.

[0078] In other embodiments, the atomizer core 10 may be disposed on the side of the liquid storage chamber 20, or may be partially embedded in the liquid storage chamber 20. That is, the atomizer core 10 and the liquid storage chamber 20 may also be disposed in other ways, which are not limited here and may be selected according to actual assembly requirements.

[0079] See also Figure 14 , Figure 14 Schematic diagram of the structure of an electronic atomization device provided in one embodiment of the present application. The present application provides an electronic atomization device. The electronic atomization device includes a battery assembly 200 and the aforementioned atomizer 100. The battery assembly 200 is used to power the atomizer 100 to operate the atomizer 100. The battery assembly 200 is electrically connected to the electrode so that a path is formed between the electrode and the semiconductor heating layer, allowing the semiconductor heating layer to act as a resistor to generate Joule heat.

[0080] The electronic atomization device may also include a housing, a nozzle, a microphone and other structures, which will not be described in detail here. The detailed structural features of the electronic atomization device are within the scope of understanding of those skilled in the art and will not be repeated here. The structure of the electronic atomization device can be of various structures and forms. As long as it utilizes the atomization core structure in the embodiment of the present application, it should be included in the scope of protection of this application.

[0081] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An atomizer core, characterized in that: include: A first substrate includes a first surface and a second surface opposite to each other, wherein the first substrate has a plurality of first guide holes extending through the thickness direction thereof; a semiconductor heating layer, disposed on the first surface of the first substrate; an electrode pair, comprising two electrodes, the two electrodes being disposed on the first surface of the first substrate and electrically connected to two ends of the semiconductor heating layer, respectively; A second substrate is provided on a side of the first substrate facing away from the semiconductor heating layer; the second substrate has a plurality of second conduction holes extending through the thickness thereof; The plurality of second flow-conducting holes are respectively connected to the plurality of first flow-conducting holes in a one-to-one correspondence, and each of the second flow-conducting holes is partially staggered with the corresponding first flow-conducting hole.

2. The atomizer core according to claim 1, characterized in that The aperture of the first flow-conducting hole is larger than the aperture of the second flow-conducting hole; An overlapping area of ​​an orthographic projection of the second flow guide hole on the first substrate and an orthographic projection of the first flow guide hole on the first substrate is greater than or equal to half of a cross-sectional area of ​​the second flow guide hole and smaller than a cross-sectional area of ​​the second flow guide hole; or The aperture of the first flow-conducting hole is smaller than the aperture of the second flow-conducting hole; An overlapping area of ​​an orthographic projection of the first flow guide hole on the first substrate and an orthographic projection of the second flow guide hole on the first substrate is greater than or equal to half of a cross-sectional area of ​​the first flow guide hole and smaller than the cross-sectional area of ​​the first flow guide hole.

3. The atomizer core according to claim 1, characterized in that A plurality of elongated first grooves are provided on the second surface of the first substrate and / or on a side of the second substrate facing the first substrate; each of the first grooves is connected to a plurality of the first guide holes and a plurality of the second guide holes; The atomizer core further has a ventilation channel arranged at the circumferential edge, one end of the ventilation channel is connected to the end of the first groove, and the other end extends along the thickness direction of the second substrate and penetrates the second substrate.

4. The atomizer core according to claim 3, characterized in that The ventilation channel comprises: a first portion communicating with an end portion of the first groove; and the first portion is formed by the second surface of the first substrate and the surface of the second substrate facing the first substrate; The second portion is communicated with an end of the first portion away from the first groove and penetrates the second substrate along a thickness direction of the second substrate.

5. The atomizer core according to claim 3, characterized in that The plurality of first flow-conducting holes are arranged in an array; and at least one first groove connects a plurality of rows of the first flow-conducting holes with a corresponding plurality of rows of the second flow-conducting holes.

6. The atomizer core according to claim 4, characterized in that The first portion of at least one of the ventilation channels is in communication with a plurality of adjacent first grooves.

7. The atomizer core according to claim 3, characterized in that A second groove is provided on the second surface of the first substrate and / or on a side surface of the second substrate facing the first substrate, and at least two adjacent first grooves are connected through the second groove; and / or, The atomizing core is provided with ventilation channels on both sides along the length direction of the first groove and / or on both sides along the length direction of the second groove.

8. The atomizer core according to any one of claims 3 to 7, characterized in that: The aperture of the first flow-conducting hole is greater than or equal to 20 micrometers and less than or equal to 120 micrometers; the aperture of the second flow-conducting hole is greater than or equal to 20 micrometers and less than or equal to 120 micrometers; and / or, The depth of the first groove is greater than or equal to 30 microns and less than or equal to 80 microns; the depth of the second groove on the second surface of the first substrate and / or the surface of the second substrate facing the first substrate is greater than or equal to 30 microns and less than or equal to 80 microns.

9. The atomizer core according to any one of claims 1 to 7, characterized in that: The resistivity of the semiconductor heating layer is lower than the resistivity of the first substrate; The semiconductor heating layer is a silicon wafer, and the silicon wafer has a plurality of third conduction holes; the third conduction holes are connected to the first conduction holes in a one-to-one correspondence; and / or, The first substrate is a silicon substrate; and / or, The second substrate is a glass substrate or a ceramic substrate.

10. An atomizer, characterized in that: comprising a liquid storage chamber and an atomizing core according to any one of claims 1 to 9; The liquid storage chamber is used to store the atomization matrix and is communicated with the atomization core.

11. An electronic atomization device, characterized in that: Comprising the atomizer as claimed in claim 10.

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