Novel freezing fat dissolving control system

Abstract

The utility model relates to the technical field of medical instruments, in particular to a novel freezing fat dissolving control system which comprises a handle temperature detection element, an air pressure detection element, a turbidity detection element, a water tank temperature detection element and a refrigeration sheet temperature detection element. A turbidity detection element and a water tank temperature detection element are arranged in the water tank, and a refrigeration sheet temperature detection element is installed on the hot end face of the semiconductor refrigeration sheet B. According to the novel freezing fat dissolving control system, by integrating various detection elements and intelligent control strategies, comprehensive monitoring and accurate control over the treatment process are achieved, the safety and the effect of treatment are improved, resources are saved, and the maintenance process is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of medical devices, in particular to a novel cryolipolysis control system. Background Art

[0002] With the development of modern medical technology, non-invasive fat reduction methods are gradually gaining popularity among consumers. Among them, cryolipolysis, as an emerging and relatively safe fat reduction method, relies on the fact that fat cells are more sensitive to low temperatures. By precisely controlling the freezing temperature, fat cells are induced to apoptosis, which is then excreted from the body through natural metabolic processes, achieving a fat reduction effect. However, despite the huge potential of cryolipolysis in the field of fat reduction, the safety and efficiency of its control system remain key factors restricting its widespread application.

[0003] The control systems of the current cryolipolysis equipment on the market generally have many deficiencies, which are mainly manifested in the following aspects:

[0004] Frequent malfunctions in the water circulation system: The water pump design failed to effectively prevent air inhalation, resulting in an inability to effectively circulate water within the cryolipolysis handle. This in turn caused the semiconductor cooling chip to dry out and become damaged. This not only increased the maintenance cost of the equipment but also seriously threatened the safety of the treatment process.

[0005] Insufficient negative pressure control accuracy: The negative pressure pump lacks precise air pressure value limits during the suction process, which can easily cause excessive negative pressure on the treatment area, forming blood blisters, causing unnecessary pain to the patient and potential health risks;

[0006] Unstable temperature control: The temperature control mechanism of the semiconductor refrigeration chip is not precise enough. Limited by the performance of the temperature sensor and the response speed of the feedback system, the treatment area may be over-cold or the temperature may be insufficient, affecting the fat reduction effect, seriously affecting the safety and effectiveness of the treatment.

[0007] Energy consumption and water waste: Traditional designs require frequent replacement of fresh water in the water tank, which not only increases the complexity of the operation but also results in a large amount of water waste. Furthermore, excessively high water temperature in the water tank reduces the cooling efficiency of the cryolipolysis handle, further affecting the treatment effect.

[0008] Lack of monitoring of the auxiliary refrigeration system: There is a lack of effective monitoring means for the working status of the semiconductor refrigeration plate and its cooling fan used to cool the water in the water tank. When the fan fails, it cannot be discovered in time, which often leads to overheating and damage of the semiconductor refrigeration plate, affecting the stability and service life of the entire system.

[0009] In view of the above problems, there is an urgent need for a more advanced, safe and efficient cryolipolysis control system to address the shortcomings of existing technologies, improve the comfort, safety and treatment effects of the treatment process, and at the same time achieve effective resource utilization and environmental protection. Utility Model Content

[0010] In order to solve the above problems, the utility model provides a new type of cryolipolysis control system. The new cryolipolysis control system realizes comprehensive monitoring and precise control of the treatment process by integrating multiple detection elements and intelligent control strategies, which not only improves the safety and effectiveness of the treatment, but also saves resources and simplifies the maintenance process.

[0011] The technical solution of the utility model is as follows:

[0012] A new type of cryolipolysis control system is used to control a cryolipolysis instrument. The cryolipolysis instrument consists of a controller, a cryolipolysis handle, a negative pressure pump, a water pump, a water tank, a fan, a semiconductor refrigeration plate A and a semiconductor refrigeration plate B. The cryolipolysis handle is connected to the negative pressure pump. A semiconductor refrigeration plate A is arranged in the cryolipolysis handle. The semiconductor refrigeration plate A draws water from the water tank for cooling through the water pump. A semiconductor refrigeration plate B is arranged in the water tank. A fan is arranged next to the semiconductor refrigeration plate B. The controller is communicatively connected with the negative pressure pump, the water pump, the semiconductor refrigeration plate A, the semiconductor refrigeration plate B and the fan. The controller includes a handle temperature detection element, an air pressure detection element, a turbidity detection element, a water tank temperature detection element and a refrigeration plate temperature detection element. A handle temperature detection element and an air pressure detection element are arranged in the cryolipolysis handle. A turbidity detection element and a water tank temperature detection element are arranged in the water tank. A refrigeration plate temperature detection element is installed on the hot end surface of the semiconductor refrigeration plate B.

[0013] The novel cryolipolysis control system further includes a screen, which is communicatively connected with the controller.

[0014] The handle temperature detection element is temperature sensor A.

[0015] The air pressure detection element is an air pressure sensor.

[0016] The turbidity detection element is a turbidity sensor.

[0017] The water tank temperature detection element is temperature sensor B.

[0018] The temperature sensor C is the temperature detection element of the refrigeration plate.

[0019] The beneficial effects of the present invention are:

[0020] 1. The utility model discloses a novel cryolipolysis control system, which is simple to control, highly safe and reliable, monitors important data, and facilitates subsequent fault repair.

[0021] 2. The utility model discloses a new type of cryolipolysis control system. The air pressure value, turbidity value, and temperature data of the new cryolipolysis control system will be displayed on the screen for safety monitoring. When any value is abnormal, the entire machine will be powered off and stop working, avoiding damage to the instrument, waste of water resources, and the risk of harm to human skin.

[0022] 3. This utility model discloses a novel cryolipolysis control system. By incorporating multiple sensing elements (such as handle temperature, air pressure, turbidity, water tank temperature, and cooling plate temperature), the system can monitor key parameters during the cryolipolysis process in real time, including handle temperature, air pressure in the treatment area, water tank water quality and temperature, and semiconductor cooling plate temperature. These monitoring measures effectively prevent equipment damage and patient injury risks caused by parameter anomalies (such as air pump aspiration, excessive negative pressure, and cooling plate overheating), significantly improving the safety of the treatment process.

[0023] 4. This utility model discloses a novel cryolipolysis control system. Through precise temperature control (e.g., temperature control of semiconductor cooling plate A), this system ensures that the treatment area achieves the desired cooling effect, preventing either overcooling that could cause frostbite or insufficient temperature that could affect fat reduction. This precise control enhances the predictability and stability of treatment results.

[0024] 5. This utility model discloses a novel cryolipolysis control system. This system uses a turbidity sensor to monitor and assess the water quality within the water tank, thereby avoiding unnecessary and frequent water changes and significantly conserving water resources. This not only reduces operating costs for medical institutions but also complies with environmental protection principles.

[0025] 6. This utility model discloses a novel cryolipolysis control system. All key parameters of this system are displayed in real time on a screen, enabling operators to intuitively understand the operating status of the equipment and facilitate timely identification and resolution of problems. Furthermore, this centralized monitoring method simplifies daily maintenance and management of the equipment, improving work efficiency.

[0026] 7. The utility model discloses a novel cryolipolysis control system. By providing real-time feedback and safety assurance, the novel cryolipolysis control system can enhance the patient's trust and satisfaction with the treatment process, thereby improving the overall user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] By reading the detailed description of the preferred embodiment below, the solutions and advantages of the present application will become clear to those skilled in the art. The accompanying drawings are only used to illustrate the preferred embodiment and are not to be considered as limiting the present invention.

[0028] In the attached figure:

[0029] Figure 1 This is a schematic diagram of the composition of a novel cryolipolysis control system according to an embodiment of the present utility model;

[0030] Figure 2 This is a working logic diagram of a negative pressure pump control system of a novel cryolipolysis control system according to an embodiment of the present utility model;

[0031] Figure 3 This is a working logic diagram of a semiconductor refrigeration chip A of a novel cryolipolysis control system according to an embodiment of the present utility model;

[0032] Figure 4 This is a working logic diagram of the semiconductor refrigeration plate B of a new type of cryolipolysis control system according to an embodiment of the present utility model;

[0033] The components represented by the reference numerals in the figure are:

[0034] The utility model includes: 1. screen, 2. controller, 3. cryolipolysis handle, 4. negative pressure pump, 5. water pump, 6. water tank, 7. fan, 8. semiconductor cooling sheet A, 9. semiconductor cooling sheet B, 10. temperature sensor A, 11. temperature sensor B, 12. temperature sensor C, 13. air pressure sensor, 14. turbidity sensor. DETAILED DESCRIPTION

[0035] Example

[0036] like Figure 1 As shown, the novel cryolipolysis control system includes a controller 2, a cryolipolysis handle 3, a negative pressure pump 4, a water pump 5, a water tank 6, a fan 7, a semiconductor cooling plate A8, a semiconductor cooling plate B9, a screen 1, a temperature sensor A10 (handle temperature detection element), an air pressure sensor 13 (air pressure detection element), a turbidity sensor 14 (turbidity detection element), a temperature sensor B11 (water tank temperature detection element) and a temperature sensor C12 (cooling plate temperature detection element).

[0037] In the prior art, the cryolipolysis device is composed of a controller 2, a cryolipolysis handle 3, a negative pressure pump 4, a water pump 5, a water tank 6, a fan 7, a semiconductor refrigeration sheet A8 and a semiconductor refrigeration sheet B9. The cryolipolysis handle 3 is connected to the negative pressure pump 4, and a semiconductor refrigeration sheet A8 is arranged in the cryolipolysis handle 3. The semiconductor refrigeration sheet A8 draws water from the water tank 6 for cooling through the water pump 5. A semiconductor refrigeration sheet B9 is arranged in the water tank 6, and a fan 7 is arranged next to the semiconductor refrigeration sheet B9. The controller 2 and the negative pressure pump 4, the water pump 5, the semiconductor refrigeration sheet A8, the semiconductor refrigeration sheet B9 and the fan 7 are connected through cable communication; the cryolipolysis handle 3 is connected to the negative pressure pump 4 through a pipeline, and is used to suck up skin and fat during the treatment process; the semiconductor refrigeration sheet A8 is installed inside the cryolipolysis handle 3, and the cooling water in the water tank 6 is drawn by the water pump 5 for cooling; a semiconductor refrigeration sheet B9 is arranged in the water tank 6 for lowering the water temperature in the water tank, and a fan 7 is installed next to it to assist in heat dissipation.

[0038] The controller 2 is communicatively connected with the negative pressure pump 4, water pump 5, semiconductor refrigeration chip A8, semiconductor refrigeration chip B9, fan 7, temperature sensor A10, air pressure sensor 13, turbidity sensor 14, temperature sensor B11 and temperature sensor C12, and is responsible for receiving sensor data and controlling the operation of each component.

[0039] The screen 1 is in communication with the controller 2 and is used to display the data, working status and alarm information of each sensor.

[0040] During use, the operator starts the system, and the screen 1 displays the initial data of each sensor. Preferably, the screen 1 is a PLC touch screen.

[0041] The negative pressure pump 4 is started and the air pressure in the cryolipolysis handle 3 is monitored in real time through the air pressure sensor 13. When the air pressure reaches the set value, it automatically stops working to avoid skin damage caused by excessive negative pressure.

[0042] The water pump 5 starts working, extracting cooling water from the water tank 6 and cooling it through the semiconductor refrigeration chip A8. The temperature sensor A10 monitors the temperature of the handle in real time to ensure that the temperature of the treatment area is within a safe range.

[0043] The semiconductor refrigeration plate B9 works, and the fan 7 assists in heat dissipation. The temperature sensor B11 monitors the water tank temperature to ensure that the cooling water temperature is appropriate.

[0044] The turbidity sensor 14 regularly detects the water quality in the water tank to prevent impurities from affecting the cooling effect.

[0045] The temperature sensor C12 monitors the temperature of the hot end of the semiconductor refrigeration chip B9 to ensure the normal operation of the heat dissipation system and prevent overheating damage.

[0046] During the treatment process, all sensor data are displayed in real time on screen 1. If there is any abnormality (such as high temperature, high air pressure, turbid water, etc.), controller 2 will automatically cut off the power supply of related components to prevent accidents.

[0047] Example

[0048] like Figure 1 As shown, the new control system includes a screen, temperature sensor, water pressure sensor, air pressure sensor, water pump, semiconductor cooling plate, negative pressure pump, water tank, turbidity sensor, and fan. The cryolipolysis handle is equipped with a temperature sensor, air pressure sensor, semiconductor cooling plate, and negative pressure pump. The entire cryolipolysis operation can be divided into two stages. The first stage is the negative pressure adsorption stage. The machine is running, the screen button is pressed, and the negative pressure pump is started. At this time, the skin and fat to be treated on the human body are adsorbed into the inner shell of the cryolipolysis handle. The air pressure sensor monitors the air pressure inside the cryolipolysis handle. The specific operation logic program of the negative pressure pump is as follows: Figure 2 As shown, when the air pressure in the inner shell of the handle reaches the set value, the air pressure pump stops working. The second stage is the cryotherapy stage, the semiconductor refrigeration piece A starts working, the temperature sensor A monitors the temperature inside the cryolipolysis handle, and the working logic program of the semiconductor refrigeration piece A is as follows: Figure 3 As shown, when the temperature inside the handle reaches the set point, the rated current of semiconductor cooler A is reduced to the limited current, the temperature difference between the hot and cold ends of semiconductor cooler A is fixed, and the temperature inside the handle does not change until the treatment time ends and the machine shuts down. If the monitored temperature inside the handle drops by more than 1 degree below the set point, the machine shuts down directly and semiconductor cooler A stops working.

[0049] On the other side of the control system, temperature sensor B, turbidity sensor, semiconductor refrigeration plate B, and fan are installed on the water tank. One side of the water tank is connected to the water pump through a conduit. Semiconductor refrigeration plate B cools the water tank and the water inside. The fan cools semiconductor refrigeration plate B with air cooling. The water pump draws the clean water in the water tank into the cryolipolysis handle to cool semiconductor refrigeration plate A with water. The water then flows back to the water tank through the conduit. Temperature sensor B monitors the temperature of the water tank. Once the temperature exceeds the value set by the controller, the screen alarms and stops running. Turbidity sensor monitors the turbidity of the water in the water tank. If the turbidity of the water exceeds the value set by the controller, the screen alarm stops running and reminds the staff to change the water. Temperature sensor C is installed on the hot end face of semiconductor refrigeration plate B. The working logic program of semiconductor refrigeration plate B is as follows Figure 4 As shown, the semiconductor refrigeration piece B is working, and the temperature sensor C monitors the temperature of the hot end surface of the semiconductor refrigeration piece B. When the monitored temperature is higher than the temperature set by the controller, the screen alarm will stop the machine.

Claims

1. A novel cryolipolysis control system for controlling a cryolipolysis instrument, wherein the cryolipolysis instrument comprises a controller (2), a cryolipolysis handle (3), a negative pressure pump (4), a water pump (5), a water tank (6), a fan (7), a semiconductor cooling plate A (8) and a semiconductor cooling plate B (9), wherein the cryolipolysis handle (3) is connected to the negative pressure pump (4), a semiconductor cooling plate A (8) is provided in the cryolipolysis handle (3), the semiconductor cooling plate A (8) is cooled by water drawn from the water tank (6) by the water pump (5), a semiconductor cooling plate B (9) is provided in the water tank (6), a fan (7) is provided next to the semiconductor cooling plate B (9), the controller (2) is connected to the negative pressure pump (4), the water pump (5), the semiconductor cooling plate A (8), the semiconductor cooling plate B (9) and the fan (7), and ... The invention comprises a handle temperature detection element, an air pressure detection element, a turbidity detection element, a water tank temperature detection element and a refrigeration plate temperature detection element. The handle temperature detection element and the air pressure detection element are arranged in the cryolipolysis handle (3), the turbidity detection element and the water tank temperature detection element are arranged in the water tank (6), and the refrigeration plate temperature detection element is installed on the hot end surface of the semiconductor refrigeration plate B (9).

2. A novel cryolipolysis control system according to claim 1, characterized in that: It also includes a screen (1), which is communicatively connected with the controller (2).

3. A novel cryolipolysis control system according to claim 2, characterized in that: The handle temperature detection element is a temperature sensor A (10).

4. A novel cryolipolysis control system according to claim 2, characterized in that: The air pressure detection element is an air pressure sensor (13).

5. A novel cryolipolysis control system according to claim 2, characterized in that: The turbidity detection element is a turbidity sensor (14).

6. A novel cryolipolysis control system according to claim 2, characterized in that: The water tank temperature detection element is a temperature sensor B (11).

7. A novel cryolipolysis control system according to claim 2, characterized in that: The refrigeration plate temperature detection element is a temperature sensor C (12).

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