Laser cutting machine convenient to dissipate heat

Abstract

The utility model discloses a convenient heat dissipation laser cutting machine relates to laser cutting machine technical field, including cutting machine body, moving frame and cutting head, cutting machine body outer side and moving frame inner side bottom are movably installed, cutting head is installed on the surface of cutting machine body, cutting machine body outer side and moving frame inner side bottom are movably installed, cutting machine body outer side and moving frame inner side bottom are fixed, cutting machine body outer side and moving frame inner side bottom are fixed, cutting machine body outer side and moving frame inner side bottom are fixed. A heat absorption cooling assembly is fixedly connected to the surface of the cutting head, and a flowing heat dissipation assembly is arranged on the left side of the cutting machine body. According to the laser cutting machine, the heat absorption cooling assembly is arranged to be matched with the flowing heat dissipation assembly to stably cool and dissipate heat of the surface of the cutting head, so that the problem that the cutting head is overheated and cannot be continuously used after being used for a certain time due to the fact that an existing laser cutting machine cannot stably and effectively dissipate heat of the cutting head in use is solved; the problems that the use efficiency of the laser cutting machine is affected, inconvenience in use is caused, and the use effect of the laser cutting machine is reduced are solved, and the effect of stable heat dissipation is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser cutting machines, in particular to a laser cutting machine that is convenient for heat dissipation. Background Art

[0002] The laser cutting machine focuses the laser emitted from the laser into a high-power density laser beam through the optical path system. The laser beam irradiates the surface of the workpiece, causing the workpiece to reach the melting point or boiling point. At the same time, high-pressure gas coaxial with the beam blows away the molten or vaporized metal. As the relative position of the beam and the workpiece moves, a slit is eventually formed in the material, thereby achieving the purpose of cutting.

[0003] For example, the laser cutting machine with publication number CN204430576U mainly connects the collection basket by sliding under the workbench. After the laser component cuts the sheet metal placed on the support plate, the waste falls from the gap between the support plates and falls into the collection basket under the workbench. By setting up the collection basket, the waste can be collected. When the waste in the collection basket is full, the collection basket can be slid out through the discharge port, and the waste in the collection basket can be cleaned.

[0004] Based on the search of patent numbers and combined with the findings of deficiencies in the prior art;

[0005] Existing laser cutting machines are unable to stably and effectively dissipate heat from the cutting head during use, which causes the cutting head to overheat and become inoperable after a certain period of use, affecting the efficiency of the laser cutting machine, causing inconvenience in use, and reducing the effectiveness of the laser cutting machine. Utility Model Content

[0006] In order to solve the problems raised in the above-mentioned background technology, the purpose of the present invention is to provide a laser cutting machine that is easy to dissipate heat, which has the advantage of stable heat dissipation and solves the problem that the existing laser cutting machine cannot stably and effectively dissipate heat from the cutting head during use, which causes the cutting head to overheat and become unable to continue to be used after a certain period of use, affecting the efficiency of the laser cutting machine, causing inconvenience in use, and reducing the use effect of the laser cutting machine.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a laser cutting machine that is convenient for heat dissipation, comprising a cutting machine body, a movable frame and a cutting head, wherein the outer side of the cutting machine body and the bottom of the inner side of the movable frame are movably installed, the cutting head is installed on the surface of the cutting machine body, the surface of the cutting head is fixedly connected with a heat absorption and cooling component, and a flow heat dissipation component is provided on the left side of the cutting machine body.

[0008] As a preferred embodiment of the present invention, the heat absorption and cooling component includes a copper ring, the outer side of the copper ring is fixedly connected to a copper sheet, the outer side of the copper ring is wrapped with a heat absorption tube, the surface of the heat absorption tube is interactively connected to the surface of the copper sheet, one end of the heat absorption tube is connected to a hose, and the other end of the hose is connected to a water pump.

[0009] As a preferred embodiment of the present invention, the flow heat dissipation component includes a central box, the right side of the central box is connected to a connecting pipe, the other end of the connecting pipe is connected to the suction end of the water pump, the other end of the heat absorption pipe is connected to a telescopic pipe, the other end of the telescopic pipe is connected to a fixed box, the left side of the fixed box is connected to a heat dissipation pipe, the surface of the heat dissipation pipe is fixedly connected to a heat sink, a number of heat sinks are provided, and the heat sinks are arranged in a ring shape at equal distances.

[0010] As a preferred embodiment of the present invention, the other end of the heat dissipation pipe is connected to a cooling box, and the back side of the cooling box is connected to the top of the central box through a pipeline.

[0011] As a preferred embodiment of the present invention, a fixing groove is provided on the top of the right side of the cooling box, a heat conducting plate is fixedly connected to the inside of the fixing groove, and a semiconductor refrigeration plate is fixedly connected to the right side of the heat conducting plate.

[0012] As a preferred embodiment of the present invention, a protective box is fixedly connected to the right side of the cooling box, the right side of the protective box is fixedly connected to the left side of the fixed box, and a blower is fixedly connected to the right side of the top of the protective box.

[0013] As a preferred embodiment of the present invention, the left side of the top of the protection box is connected to a centralizing bucket, and the other end of the centralizing bucket is connected to a ventilation pipe.

[0014] As a preferred embodiment of the present invention, a temperature sensor is fixedly connected to the top of the inner wall of the cooling box, a temperature controller is fixedly connected to the top of the cooling box, the temperature controller is electrically connected to the semiconductor refrigeration plate through a wire, and the temperature sensor is electrically connected to the temperature controller through a wire.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] 1. The utility model solves the problem that the existing laser cutting machine cannot stably and effectively dissipate heat from the cutting head during use by arranging a heat-absorbing cooling component in conjunction with a fluid heat dissipation component to stably cool and dissipate heat from the surface of the cutting head. This causes the cutting head to overheat and become inoperable after a certain period of use, affecting the efficiency of the laser cutting machine, causing inconvenience in use, and reducing the use effect of the laser cutting machine, thereby achieving the effect of stable heat dissipation.

[0017] 2. The utility model is provided with a heat absorption and cooling component. During use, the copper ring can absorb the heat emitted from the surface of the cutting head and transfer it to the copper sheet. The copper sheet effectively transfers the heat to the inside of the heat absorption tube. Then, by starting the water pump, the output end of the water pump delivers the coolant to the inside of the hose. The coolant can enter the heat absorption tube through the hose and flow to absorb the heat, thereby stably dissipating heat and cooling the surface of the cutting head.

[0018] 3. The utility model is provided with a flow heat dissipation component. During use, the coolant passing through the heat absorption tube can enter the interior of the telescopic tube, and the coolant can enter the interior of the fixed box through the telescopic tube, and then enter the interior of the heat dissipation tube through the fixed box to quickly dissipate heat. At the same time, the heat sink can increase the contact area between the heat dissipation tube and the air, thereby enhancing the heat dissipation effect of the heat dissipation tube during use, so that the heat dissipation tube can absorb the coolant stably and quickly dissipate heat, so that the coolant temperature can be stably reduced and flowed. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the three-dimensional split structure of the utility model;

[0021] Figure 3 For this utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0022] In the figure: 1. Cutting machine body; 2. Mobile frame; 3. Cutting head; 4. Heat absorption and cooling component; 41. Copper ring; 42. Copper sheet; 43. Heat absorption tube; 44. Hose; 45. Water pump; 46. Water pump; 5. Flow heat dissipation component; 51. Centralizing box; 52. Connecting pipe; 53. Fixed box; 54. Heat dissipation pipe; 55. Heat sink; 56. Telescopic tube; 6. Cooling box; 7. Fixed slot; 8. Heat conduction plate; 9. Semiconductor refrigeration plate; 10. Protective box; 11. Blower; 12. Centralizing bucket; 13. Ventilation pipe; 14. Temperature sensor; 15. Temperature controller. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] like Figures 1 to 3As shown, the utility model provides a laser cutting machine that is easy to dissipate heat, including a cutting machine body 1, a movable frame 2 and a cutting head 3. The outer side of the cutting machine body 1 and the bottom of the inner side of the movable frame 2 are movably installed, and the cutting head 3 is installed on the surface of the cutting machine body 1. The surface of the cutting head 3 is fixedly connected with a heat absorption and cooling component 4, and a flow heat dissipation component 5 is provided on the left side of the cutting machine body 1.

[0025] refer to Figure 3 The heat absorption and cooling component 4 includes a copper ring 41, a copper sheet 42 is fixedly connected to the outside of the copper ring 41, a heat absorption tube 43 is wrapped around the outside of the copper ring 41, and the surface of the heat absorption tube 43 is interactively connected to the surface of the copper sheet 42. One end of the heat absorption tube 43 is connected to a hose 44, and the other end of the hose 44 is connected to a water pump 45.

[0026] As a technical optimization solution of the present invention, by setting up a heat absorption and cooling component 4, the copper ring 41 can absorb the heat emitted from the surface of the cutting head 3 during use, and transfer it to the copper sheet 42, and cooperate with the copper sheet 42 to effectively transfer the heat to the inside of the heat absorption tube 43. Then, by starting the water pump 45, the output end of the water pump 45 transports the coolant to the inside of the hose 44. The coolant can enter the heat absorption tube 43 through the hose 44 and flow to absorb the heat, thereby stably dissipating heat and cooling the surface of the cutting head 3.

[0027] refer to Figure 2 The flow heat dissipation component 5 includes a central box 51. The right side of the central box 51 is connected to a connecting pipe 52. The other end of the connecting pipe 52 is connected to the suction end of the water pump 45. The other end of the heat absorption pipe 43 is connected to a telescopic pipe 56. The other end of the telescopic pipe 56 is connected to a fixed box 53. The left side of the fixed box 53 is connected to a heat dissipation pipe 54. The surface of the heat dissipation pipe 54 is fixedly connected to a heat sink 55. A plurality of heat sinks 55 are provided, and the plurality of heat sinks 55 are arranged in a ring shape with equal distances.

[0028] As a technical optimization solution of the present invention, by providing a flow heat dissipation component 5, during use, the coolant passing through the heat absorption tube 43 can enter the interior of the telescopic tube 56, and the coolant can enter the interior of the fixed box 53 through the telescopic tube 56, and then enter the interior of the heat dissipation tube 54 through the fixed box 53 to quickly dissipate heat. At the same time, the heat sink 55 can increase the contact area between the heat dissipation tube 54 and the air, thereby enhancing the heat dissipation effect of the heat dissipation tube 54 during use, so that the heat dissipation tube 54 can absorb the stable and rapid heat dissipation in the coolant, so that the coolant temperature can be stably reduced and flowed.

[0029] refer to Figure 1 The other end of the heat dissipation pipe 54 is connected to the cooling box 6, and the back of the cooling box 6 is connected to the top of the central box 51 through a pipeline.

[0030] As a technical optimization solution of the present invention, by setting up a cooling box 6, the coolant can enter the interior of the cooling box 6 after passing through the heat dissipation pipe 54. After collecting the coolant, the cooling box 6 can transport the coolant to the interior of the central box 51, which is convenient for the water pump 45 to absorb heat from the coolant in the central box 51 through the connecting pipe 52 and transport it to the internal flow of the hose 44 and the heat absorption pipe 43 for heat dissipation.

[0031] refer to Figure 2 A fixing groove 7 is provided on the top of the right side of the cooling box 6, a heat conducting plate 8 is fixedly connected to the inside of the fixing groove 7, and a semiconductor refrigeration sheet 9 is fixedly connected to the right side of the heat conducting plate 8.

[0032] As a technical optimization solution of the present invention, by setting a fixing groove 7, a heat conducting plate 8 and a semiconductor refrigeration plate 9, the fixing groove 7 can facilitate the installation and fixation of the heat conducting plate 8, and the heat conducting plate 8 can facilitate the transfer of heat during use. The semiconductor refrigeration plate 9 can be started during use, so that the cooling surface of the semiconductor refrigeration plate 9 cools the heat conducting plate 8, so that the temperature on the heat conducting plate 8 drops rapidly. The temperature reduction on the heat conducting plate 8 can cool the coolant in the cooling box 6, so that the temperature of the coolant can drop steadily and rapidly, thereby improving the heat dissipation effect of the cutting head 3 during use.

[0033] refer to Figure 2 The right side of the cooling box 6 is fixedly connected to a protective box 10 , the right side of the protective box 10 is fixedly connected to the left side of the fixed box 53 , and the right side of the top of the protective box 10 is fixedly connected to a blower 11 .

[0034] As a technical optimization solution of the present invention, by setting up a protective box 10 and a blower 11, the protective box 10 can protect the outer side of the heat pipe 54 during use. At the same time, the blower 11 can be started during use, so that the blower 11 outputs wind force into the interior of the protective box 10, quickly blowing the heat around the heat pipe 54 in the protective box 10, thereby reducing the temperature around the heat pipe 54 and enhancing the heat dissipation effect of the heat pipe 54 during use.

[0035] refer to Figure 2 The left side of the top of the protection box 10 is connected to a central bucket 12, and the other end of the central bucket 12 is connected to a ventilation pipe 13.

[0036] As a technical optimization solution of the present invention, by setting a concentration bucket 12 and a ventilation pipe 13, the concentration bucket 12 can concentrate the wind flowing in the protective box 10 into the interior of the ventilation pipe 13 during use, making it convenient for the ventilation pipe 13 to quickly discharge the hot air for heat dissipation, thereby enhancing the heat dissipation effect during use.

[0037] refer to Figure 2A temperature sensor 14 is fixedly connected to the top of the inner wall of the cooling box 6, and a temperature controller 15 is fixedly connected to the top of the cooling box 6. The temperature controller 15 is electrically connected to the semiconductor refrigeration sheet 9 through a wire, and the temperature sensor 14 is electrically connected to the temperature controller 15 through a wire.

[0038] As a technical optimization solution of the present invention, by setting a temperature sensor 14 and a temperature controller 15, the temperature sensor 14 can detect the temperature inside the cooling box 6 during use and send the detection data to the temperature controller 15. The temperature controller 15 can control the cooling temperature of the semiconductor refrigeration plate 9 during use, thereby enhancing the heat dissipation and cooling effect during use.

[0039] The working principle and use process of the present invention are as follows: when in use, the copper ring 41 can absorb the heat emitted from the surface of the cutting head 3 and transfer it to the copper sheet 42, which cooperates with the copper sheet 42 to effectively transfer the heat to the inside of the heat absorption tube 43, and then by starting the water pump 45, the output end of the water pump 45 transports the coolant to the inside of the hose 44. The coolant can enter the heat absorption tube 43 through the hose 44 and flow to absorb the heat, thereby stably dissipating heat and cooling the surface of the cutting head 3. At the same time, the coolant through the heat absorption tube 43 can enter the inside of the telescopic tube 56, and the coolant can enter the inside of the fixed box 53 through the telescopic tube 56, and then enter the inside of the heat dissipation tube 54 through the fixed box 53 to quickly dissipate heat. At the same time, the heat sink 55 can increase the contact area between the heat dissipation tube 54 and the air, thereby enhancing the heat dissipation effect of the heat dissipation tube 54 during use, so that the heat dissipation tube 54 can absorb the stable and rapid heat dissipation in the coolant, so that the coolant temperature can be stably reduced and flowed. After passing through the heat dissipation tube 54, the coolant can enter the inside of the cooling box 6. The cooling box 6 After the coolant is collected, the coolant can be transported to the interior of the centralized box 51, which makes it convenient for the water pump 45 to absorb heat from the coolant in the centralized box 51 and transport it to the internal flow of the hose 44 and the heat absorption pipe 43 through the connecting pipe 52 during use to dissipate heat. At the same time, the fixing groove 7 can facilitate the installation and fixation of the heat conducting plate 8, and the heat conducting plate 8 can facilitate the transfer of heat during use. During use, the semiconductor refrigeration plate 9 can be started to cool the heat conducting plate 8 on the cooling surface of the semiconductor refrigeration plate 9, so that the temperature on the heat conducting plate 8 drops rapidly. The temperature reduction on the heat conducting plate 8 can cool the coolant in the cooling box 6, so that the temperature of the coolant can drop steadily and quickly, thereby improving the heat dissipation effect of the cutting head 3 during use. Then, by starting the blower 11, the blower 11 outputs wind power into the interior of the protective box 10, and quickly blows the heat around the heat dissipation pipe 54 in the protective box 10, so that the temperature around the heat dissipation pipe 54 is reduced, thereby enhancing the heat dissipation effect of the heat dissipation pipe 54 during use, achieving a stable heat dissipation effect on the cutting head 3, and enhancing the use effect of the laser cutting machine.

[0040] To sum up: this laser cutting machine that is easy to dissipate heat, by setting a heat absorption and cooling component 4 and a fluid heat dissipation component 5 to stably cool and dissipate the surface of the cutting head 3, solves the problem that the existing laser cutting machine cannot stably and effectively dissipate heat from the cutting head during use, which causes the cutting head to overheat and become unable to continue to be used after a certain period of use, affecting the efficiency of the laser cutting machine, causing inconvenience in use, and reducing the use effect of the laser cutting machine.

[0041] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser cutting machine that is convenient for heat dissipation, comprising a cutting machine body (1), a movable frame (2) and a cutting head (3), characterized in that: The outer side of the cutting machine body (1) is movably mounted on the bottom of the inner side of the movable frame (2); the cutting head (3) is mounted on the surface of the cutting machine body (1); a heat absorbing and cooling component (4) is fixedly connected to the surface of the cutting head (3); and a fluid heat dissipation component (5) is provided on the left side of the cutting machine body (1).

2. The laser cutting machine for facilitating heat dissipation according to claim 1, characterized in that: The heat absorption and cooling component (4) comprises a copper ring (41), the outer side of the copper ring (41) is fixedly connected to a copper sheet (42), the outer side of the copper ring (41) is wound and connected to a heat absorption tube (43), the surface of the heat absorption tube (43) and the surface of the copper sheet (42) are interactively connected, one end of the heat absorption tube (43) is connected to a hose (44), and the other end of the hose (44) is connected to a water pump (45).

3. The laser cutting machine for facilitating heat dissipation according to claim 2, characterized in that: The fluid heat dissipation assembly (5) comprises a central box (51), the right side of the central box (51) is connected to a connecting pipe (52), the other end of the connecting pipe (52) is connected to the suction end of the water pump (45), the other end of the heat absorption pipe (43) is connected to a telescopic pipe (56), the other end of the telescopic pipe (56) is connected to a fixed box (53), the left side of the fixed box (53) is connected to a heat dissipation pipe (54), the surface of the heat dissipation pipe (54) is fixedly connected to a heat dissipation fin (55), and a plurality of heat dissipation fins (55) are provided, and the plurality of heat dissipation fins (55) are arranged in a ring shape with equal distances.

4. The laser cutting machine for facilitating heat dissipation according to claim 3, characterized in that: The other end of the heat dissipation pipe (54) is connected to a cooling box (6), and the back of the cooling box (6) is connected to the top of the central box (51) through a pipeline.

5. The laser cutting machine for facilitating heat dissipation according to claim 4, characterized in that: A fixing groove (7) is provided on the top of the right side of the cooling box (6), a heat conducting plate (8) is fixedly connected inside the fixing groove (7), and a semiconductor refrigeration plate (9) is fixedly connected to the right side of the heat conducting plate (8).

6. The laser cutting machine for facilitating heat dissipation according to claim 4, characterized in that: The right side of the cooling box (6) is fixedly connected to a protection box (10), the right side of the protection box (10) is fixedly connected to the left side of the fixed box (53), and the right side of the top of the protection box (10) is fixedly connected to a blower (11).

7. The laser cutting machine for facilitating heat dissipation according to claim 6, characterized in that: The left side of the top of the protection box (10) is connected to a concentration bucket (12), and the other end of the concentration bucket (12) is connected to a ventilation pipe (13).

8. The laser cutting machine for facilitating heat dissipation according to claim 5, characterized in that: A temperature sensor (14) is fixedly connected to the top of the inner wall of the cooling box (6), and a temperature controller (15) is fixedly connected to the top of the cooling box (6). The temperature controller (15) is electrically connected to the semiconductor refrigeration plate (9) through a wire, and the temperature sensor (14) is electrically connected to the temperature controller (15) through a wire.

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