Silicon wafer grinding device

Abstract

The utility model provides a silicon wafer grinding device, which comprises a support plate, a grinding component, a grinding component and a grinding component, the limiting and fixing assembly is arranged below the supporting plate and comprises hanging plates annularly arranged on the bottom face of the supporting plate. The threaded rods are rotationally connected to the lifting plates, the bevel gears are installed at the ends, close to each other, of the threaded rods, the limiting and fixing structures are arranged outside the threaded rods, and the driving structures are installed below the supporting plates and used for driving the limiting and fixing structures. And a dust suction assembly. Through cooperation of a motor, a driving gear, bevel gears, threaded rods, a threaded cylinder, a push plate, a frame rod and a fan-shaped plate, the motor works, the driving gear can drive the two sets of bevel gears and the two sets of threaded rods to synchronously rotate in the same direction, the threaded cylinder can drive the push plate to synchronously approach a silicon wafer, and the fan-shaped plate can rapidly limit and fix the silicon wafer. And therefore, the grinding efficiency of workers is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer grinding device. Background Art

[0002] During the processing of polycrystalline silicon wafers, grinding is a very important step. The purpose of grinding is to remove scratches and bumps generated during the cutting process and make the surface of the silicon wafer smooth.

[0003] Optical glass, like silicon wafers, needs to be ground during the processing. Application No. 202220312496.6 discloses an adjustable optical glass grinding and polishing device, which relates to the field of optical glass technology, and includes a workbench, a grinding disc for grinding and polishing optical glass is provided on the top of the workbench, a motor is provided inside the workbench, and the transmission shaft of the motor is connected to the grinding disc, and a switch for controlling the start and stop of the motor is provided on the workbench, and a plurality of fixed cylinders are fixed on the outside of the grinding disc at the top of the workbench, and a connecting tube is slidably connected to the inside of the fixed cylinder, and one end of the connecting tube extends to the outside of the fixed cylinder. By controlling the rotation direction and number of turns of the first adjusting rod, the distance between the connecting tube and the center of the grinding disc can be changed. By using the cooperation of several groups of first adjusting rods, fixed cylinders, and connecting tubes, optical glasses of different shapes and sizes can be limited on the top of the grinding disc, which greatly improves the convenience of polishing optical glass.

[0004] The above solution has shortcomings when used. It is necessary to rotate multiple first adjustment rods to achieve the limit fixation of the optical glass. Fixing the optical glass will take a long time, thereby affecting the grinding efficiency of the optical glass. Similarly, these shortcomings also exist when grinding silicon wafers. For this reason, we provide a silicon wafer grinding device. Utility Model Content

[0005] The utility model provides a silicon wafer grinding device, which solves the technical problem that fixing the silicon wafer consumes a long time and affects the grinding efficiency of the silicon wafer.

[0006] The purpose and effect of the silicon wafer grinding device of the utility model are achieved by the following specific technical means: A silicon wafer grinding device includes a support plate:

[0007] A grinding assembly is arranged above the support plate;

[0008] The position-limiting and fixing assembly is arranged below the support plate and includes hanging plates arranged in a ring on the bottom surface of the support plate, threaded rods rotatably connected to each hanging plate, bevel gears installed on the ends of each set of threaded rods close to each other, a position-limiting and fixing structure provided on the outside of each threaded rod, and a driving structure installed below the support plate for driving the position-limiting and fixing structure;

[0009] The dust suction component is arranged above the support plate and located behind the grinding component, and is used to suck the debris generated by grinding the silicon wafer.

[0010] Preferably, the grinding assembly includes a motor mounted on the upper surface of the support plate, and the output end of the motor is fixedly connected to the grinding disc.

[0011] Preferably, the limiting and fixing structure of the limiting and fixing assembly includes a threaded barrel threadedly connected to each threaded rod, each group of threaded barrels has a push plate fixedly connected to one end away from each other, each group of push plates has a rack rod fixedly connected to one side close to each other, and each group of rack rods has a fan-shaped plate fixedly connected to one end close to each other.

[0012] Preferably, the driving structure of the position limiting and fixing assembly includes a motor installed on the bottom surface of the support plate, and the output end of the motor is fixedly connected to a driving gear, and the driving gear is meshed with two sets of bevel gears.

[0013] Preferably, each side of the push plates that are close to each other is fixedly connected to a guide rod, the outer surface of each guide rod is slidably connected to a guide plate, the top of each guide plate is connected to the bottom surface of the support plate, and the end of each group of guide rods that are close to each other is fixedly connected to a baffle.

[0014] Preferably, the dust suction assembly includes a dust collecting pipe arranged above the support plate, an exhaust fan is installed inside the dust collecting pipe, and a group of suction pipes are fixedly connected to the outer surface of the dust collecting pipe.

[0015] Preferably, a group of equally spaced pillars are fixedly connected to the outer surface of the dust collecting pipe, and the bottom end of each pillar is connected to the upper surface of the support plate.

[0016] Preferably, the bottom surface of the support plate is fixedly connected with annularly arranged support legs.

[0017] Beneficial effects:

[0018] 1. The limit fixing component can quickly and conveniently complete the limit fixing of the silicon wafer, which can ensure the grinding efficiency of the silicon wafer. The dust suction component can be used to suck the dust generated by grinding the silicon wafer, which is convenient for the staff to collect dust and prevent dust from floating and polluting the environment.

[0019] 2. Through the coordination of the motor, driving gear, bevel gear, threaded rod, threaded barrel, push plate, rack rod and sector plate, the motor works, and the driving gear can drive the two sets of bevel gears and two sets of threaded rods to rotate synchronously in one direction. The threaded barrel will drive the push plate to approach the silicon wafer synchronously. The sector plate can quickly form a limit fixation for the silicon wafer, thereby ensuring the grinding efficiency of the staff. The hanging plate can stably hold the threaded rod, and can ensure stable engagement between the bevel gear and the driving gear. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model.

[0021] Figure 2 It is a schematic diagram of the three-dimensional structure of the bottom view of the support plate of the present invention.

[0022] Figure 3 It is a three-dimensional structural diagram of a top view of the limiting and fixing component of the utility model.

[0023] Figure 4 This is a schematic diagram of the three-dimensional structure of a rear cross-sectional view of the dust suction component of the present invention.

[0024] Figure 1-4 , the corresponding relationship between component names and figure numbers is as follows:

[0025] 1. Support plate; 2. Grinding assembly; 201. Motor; 202. Grinding disc; 3. Position limiting and fixing assembly; 301. Hanging plate; 302. Threaded rod; 303. Bevel gear; 304. Threaded barrel; 305. Push plate; 306. Rack; 307. Fan plate; 308. Motor; 309. Driving gear; 310. Guide rod; 311. Guide plate; 312. Baffle; 4. Dust suction assembly; 401. Dust collecting pipe; 402. Exhaust fan; 403. Suction pipe; 404. Pillar; 5. Support leg. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] First embodiment

[0028] As attached Figure 1 To the attached Figure 4As shown: A silicon wafer grinding device includes a support plate 1: a grinding assembly 2, which is arranged above the support plate 1. The grinding assembly 2 includes a motor 201 installed on the upper surface of the support plate 1. The output end of the motor 201 is fixedly connected to a grinding disc 202. The operation of the motor 201 can drive the grinding disc 202 to rotate, thereby realizing the grinding of the silicon wafer.

[0029] Second embodiment

[0030] As attached Figure 1 To the attached Figure 3 As shown: the limiting and fixing component 3 is arranged below the support plate 1, including hanging plates 301 arranged in a ring on the bottom surface of the support plate 1, threaded rods 302 rotatably connected to each hanging plate 301, bevel gears 303 installed on one end of each group of threaded rods 302 close to each other, and a limiting and fixing structure arranged on the outside of each threaded rod 302. The thread directions of each group of oppositely arranged threaded rods 302 are opposite.

[0031] The limiting and fixing structure of the limiting and fixing assembly 3 includes a threaded barrel 304 threadedly connected to each threaded rod 302, and each group of threaded barrels 304 are fixedly connected to a push plate 305 at the end away from each other, and each group of push plates 305 are fixedly connected to a rack rod 306 at the side close to each other, and each group of rack rods 306 are fixedly connected to a fan-shaped plate 307 at the end close to each other. When the bevel gear 303 drives the threaded rod 302 to rotate in the same direction, the threaded barrels 304 will approach each other, and the push plate 305 will push the fan-shaped plate 307. The fan-shaped plate 307 can quickly form a stable clamping of the silicon wafer, which can improve the efficiency of its grinding.

[0032] The driving structure for driving the position-limiting and fixing structure is installed under the support plate 1. The driving structure of the position-limiting and fixing assembly 3 includes a motor 308 installed on the bottom surface of the support plate 1. The output end of the motor 308 is fixedly connected to a driving gear 309. The driving gear 309 is engaged with the two sets of bevel gears 303. By utilizing the operation of the motor 308, the driving gear 309 can drive the two sets of bevel gears 303 to rotate in the same direction, thereby realizing the same-direction rotation of the two sets of threaded rods 302.

[0033] The side of each push plate 305 that is close to each other is fixedly connected to a guide rod 310, and the outer surface of each guide rod 310 is slidably connected to a guide plate 311, and the top of each guide plate 311 is connected to the bottom surface of the support plate 1, and the end of each group of guide rods 310 that is close to each other is fixedly connected to a baffle 312. The cooperation between the guide rod 310 and the guide plate 311 can stabilize the push plate 305 and prevent the threaded cylinder 304 from driving the push plate 305 to rotate. At the same time, the baffle 312 can limit the guide rod 310 to prevent the guide rod 310 from separating from the guide plate 311.

[0034] Third embodiment

[0035] As attached Figure 1 and attached Figure 4 As shown: the dust suction component 4 is arranged above the support plate 1 and behind the grinding component 2, and is used to suck the debris generated by grinding the silicon wafer. The dust suction component 4 includes a dust collecting pipe 401 arranged above the support plate 1, and an exhaust fan 402 is installed inside the dust collecting pipe 401. The outer surface of the dust collecting pipe 401 is fixedly connected to a group of suction pipes 403. With the operation of the exhaust fan 402, the suction pipe 403 will suck the dust near one end of the silicon wafer, and can suck the dust into the dust collecting pipe 401. The dust can be discharged from the side of the exhaust fan 402, which is convenient for the staff to collect the dust.

[0036] The outer surface of the dust collecting tube 401 is fixedly connected to a group of equally spaced pillars 404, and the bottom end of each pillar 404 is connected to the upper surface of the support plate 1. The provided pillars 404 can support the dust collecting tube 401, allowing the suction tube 403 to be closer to the grinding area, thereby facilitating the collection of dust.

[0037] Fourth embodiment

[0038] The bottom surface of the support plate 1 is fixedly connected with support legs 5 arranged in a ring. The support legs 5 can be used to lift the support plate 1 to a certain height from the ground, so that the threaded cylinder 304 can move normally.

[0039] Working principle: When in use, the silicon wafer can be placed on the grinding disc 202, and then the motor 308 is started. The motor 308 will drive the driving gear 309 to rotate. At the same time, the driving gear 309 will drive the two sets of bevel gears 303 to rotate in one direction, and will drive the threaded rod 302 to rotate inside the threaded barrel 304. The oppositely arranged threaded barrels 304 will approach each other, and the push plate 305 will push the fan-shaped plate 307 to move toward the silicon wafer. The two sets of fan-shaped plates 307 will gradually form a clamp for the silicon wafer, which can quickly and conveniently complete the limit fixation of the silicon wafer, ensuring the grinding efficiency.

Claims

1. A silicon wafer polishing device, characterized in that: Includes support plate (1): A grinding assembly (2) is arranged above the support plate (1); A position-limiting and fixing assembly (3) is arranged below the support plate (1), comprising hanging plates (301) arranged in an annular arrangement on the bottom surface of the support plate (1), threaded rods (302) rotatably connected to each hanging plate (301), bevel gears (303) installed on one end of each group of threaded rods (302) close to each other, a position-limiting and fixing structure arranged outside each threaded rod (302), and a driving structure installed below the support plate (1) for driving the position-limiting and fixing structure; The dust suction component (4) is arranged above the support plate (1) and located behind the grinding component (2), and is used to suck debris generated by grinding silicon wafers.

2. A silicon wafer polishing device according to claim 1, characterized in that: The grinding assembly (2) comprises a motor (201) mounted on the upper surface of the support plate (1), and the output end of the motor (201) is fixedly connected to a grinding disc (202).

3. The silicon wafer polishing device according to claim 1, wherein: The position-limiting and fixing structure of the position-limiting and fixing assembly (3) comprises a threaded barrel (304) threadedly connected to each threaded rod (302), a push plate (305) fixedly connected to one end of each group of threaded barrels (304) away from each other, a rack rod (306) fixedly connected to one side of each group of push plates (305) close to each other, and a fan-shaped plate (307) fixedly connected to one end of each group of rack rods (306) close to each other.

4. The silicon wafer polishing device according to claim 1, wherein: The driving structure of the position-limiting fixing assembly (3) comprises a motor (308) mounted on the bottom surface of the support plate (1); the output end of the motor (308) is fixedly connected to a driving gear (309); and the driving gear (309) is meshed with two sets of bevel gears (303).

5. The silicon wafer polishing device according to claim 3, wherein: The side of each push plate (305) close to each other is fixedly connected to a guide rod (310), the outer surface of each guide rod (310) is slidably connected to a guide plate (311), the top of each guide plate (311) is connected to the bottom surface of the support plate (1), and the end of each group of guide rods (310) close to each other is fixedly connected to a baffle (312).

6. The silicon wafer polishing device according to claim 1, wherein: The dust suction assembly (4) comprises a dust collecting pipe (401) arranged above the support plate (1), an exhaust fan (402) is installed inside the dust collecting pipe (401), and a group of suction pipes (403) are fixedly connected to the outer surface of the dust collecting pipe (401).

7. The silicon wafer polishing device according to claim 6, characterized in that: A group of equally spaced pillars (404) are fixedly connected to the outer surface of the dust collecting pipe (401), and the bottom end of each pillar (404) is connected to the upper surface of the support plate (1).

8. The silicon wafer polishing device according to claim 1, wherein: The bottom surface of the support plate (1) is fixedly connected with support legs (5) arranged in a ring shape.

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