BGA (Ball Grid Array) pseudo soldering detection equipment

Abstract

The utility model relates to the technical field of BGA (Ball Grid Array) pseudo soldering detection, and discloses BGA pseudo soldering detection equipment, which comprises a casing and a marking mechanism arranged in the casing, a thermal imaging device is arranged on the upper end face of the casing, and the working end of the thermal imaging device faces a circuit board to be detected; the marking mechanism comprises a first motor, the output end of the first motor is fixedly connected with a first lead screw, the first lead screw is in threaded connection with a driving plate and two bearing seats, the opposite sides of the two bearing seats are rotationally connected with a second lead screw, the second lead screw is fixedly connected with an output shaft of a second motor, and the second lead screw is in threaded connection with a connecting plate. The connecting plate is connected with an electric push rod. The telescopic end of the electric push rod is provided with a marking pen. After the circuit board is powered on, the thermal imaging device is used for scanning and monitoring the circuit board in real time, the temperature abnormity of the pseudo soldering point can be effectively recognized, under the telescopic action of the electric push rod, the detected position of the pseudo soldering point is accurately marked, and the problem that pseudo soldering detection is inaccurate is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA cold solder joint detection, in particular to a BGA cold solder joint detection device. Background Art

[0002] BGA (Ball Grid Array) is a type of packaging, also known as a solder ball array package, that uses spherical solder joints to attach chips to circuit boards. Due to its high density and high performance, BGA is widely used in modern electronic devices. However, BGA soldering can cause cold solder joints, which are poor connections where the solder joint appears normal but is actually incomplete. This can lead to signal instability or current interruption, impacting device performance and reliability. However, because BGA solder joints are typically located on the bottom of the component, they are difficult to visually observe.

[0003] Existing cold solder joint detection devices usually use an air pump to inject high-pressure gas, which is ejected from a nozzle through a diverter pipe to flush the surface of the circuit board with high-pressure airflow, blowing off the parts with empty solder joints and cold solder joints, and then finding the locations of the empty solder joints and cold solder joints. However, some cold solder joints are not completely connected to the circuit board and are therefore difficult to be blown off by the airflow during detection. Therefore, it is easy to make mistakes when detecting cold solder joints, and the detection is inaccurate.

[0004] Therefore, it is necessary to provide a BGA cold solder joint detection device to solve the problem of inaccurate detection of the cold solder joint detection device. Utility Model Content

[0005] The purpose of the utility model is to provide a BGA cold solder joint detection device to solve the technical problems mentioned in the background technology.

[0006] The utility model adopts the following technical solutions:

[0007] A BGA cold solder joint detection device comprises a housing and a marking mechanism disposed in the housing, wherein a thermal imaging device is disposed on the upper end surface of the housing, and a working end of the thermal imaging device faces a circuit board to be tested;

[0008] The marking mechanism includes a first motor, the output end of the first motor is fixedly connected to a first screw rod, the first screw rod is threadedly connected to a drive plate, the upper end surface of the drive plate is provided with two bearing seats, the two opposite sides of the bearing seats are rotatably connected to a second screw rod, the second screw rod is fixedly connected to the output shaft of the second motor, the second screw rod is threadedly connected to a connecting plate, the connecting plate is connected to an electric push rod, and a marking pen is provided at the telescopic end of the electric push rod.

[0009] Furthermore, one end of the driving plate away from the first screw rod is slidably connected to a guide rod, and both ends of the guide rod are fixedly connected to the inner wall of the housing.

[0010] Furthermore, the bottom end of the connecting plate is fixedly connected to a carrier plate, the electric push rod is passed through the carrier plate, the telescopic end of the electric push rod is fixedly connected to a concave disk, and the marking pen is threadedly connected to the concave disk.

[0011] Furthermore, both ends of the first screw rod are fixedly connected to limit rings, and the two limit rings are respectively located on both sides of the driving plate.

[0012] Furthermore, a detection base and two limit bars are provided on the inner bottom wall of the housing, and the side surfaces of the two limit bars close to each other respectively abut against the front surface and the back surface of the detection base.

[0013] Furthermore, a control panel is fixedly connected to the upper end surface of the casing, and a glass plate is inlaid on the top wall of the casing, and the glass plate is arranged on one side of the thermal imaging device.

[0014] Furthermore, a sealing door is hinged on the front of the casing via two pins, and a draw groove is provided on the front of the sealing door.

[0015] Furthermore, a plurality of rubber pads are provided below the housing, and the upper end surface of each of the rubber pads is fixedly connected to the bottom surface of the housing.

[0016] Furthermore, the driving plate is provided with a sliding hole for the connecting plate to slide, the front of the connecting plate is provided with a guide hole, the inner wall of the guide hole is slidably connected to a sliding rod, and both ends of the sliding rod are fixedly connected to the inner wall of the driving plate.

[0017] Furthermore, two through slots are provided on the upper surface of the detection base.

[0018] Beneficial effects:

[0019] The utility model provides a BGA cold solder joint detection device. After the circuit board is powered on, the thermal imaging device is used to scan and monitor the circuit board in real time, which can effectively identify the temperature anomaly of the cold solder joint. The position of the marking pen is moved by the cooperation of the first motor, the second motor, the first screw rod and the second screw rod in the marking mechanism. Under the telescopic action of the electric push rod, the position of the cold solder joint detected with the temperature anomaly is accurately marked, thereby facilitating the staff to repair the position of the cold solder joint, effectively solving the problem of inaccurate cold solder joint detection by traditional air flow scouring, reducing the possibility of missed detection and false detection, and greatly improving the accuracy and efficiency of detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is a schematic diagram of the overall structure of a BGA cold solder joint detection device of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of a BGA cold solder joint detection device of the present invention;

[0022] Figure 3 This is a schematic structural diagram of the marking mechanism of the present utility model;

[0023] Figure 4 It is a cross-sectional schematic diagram of the marking mechanism of the present utility model;

[0024] Among them: 1. Casing; 101. Groove; 102. Sealing door; 103. Rubber foot pad; 2. Glass plate; 3. Thermal imaging device; 4. Control panel; 5. Marking mechanism; 501. First motor; 502. First screw rod; 503. Connecting plate; 504. Drive plate; 505. Second screw rod; 506. Second motor; 507. Electric push rod; 508. Bearing seat; 509. Carrier plate; 510. Marking pen; 511. Guide rod; 512. Limiting ring; 513. Guide hole; 514. Sliding rod; 515. Concave disk; 6. Detection base; 601. Through groove; 602. Limiting strip.

[0025] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "several" means two or more, unless otherwise clearly and specifically defined.

[0028] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections, direct connections, or indirect connections through an intermediate medium; they may refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0029] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0030] Reference Figures 1 to 4 The utility model proposes a BGA cold solder joint detection device, comprising: a housing and a marking mechanism arranged in the housing, wherein the upper end surface of the housing is provided with a thermal imaging device, and the working end of the thermal imaging device faces the circuit board to be tested;

[0031] The marking mechanism includes a first motor, the output end of the first motor is fixedly connected to a first screw rod, the first screw rod is threadedly connected to a drive plate, the upper end surface of the drive plate is provided with two bearing seats, the two opposite sides of the bearing seats are rotatably connected to a second screw rod, the second screw rod is fixedly connected to the output shaft of the second motor, the second screw rod is threadedly connected to a connecting plate, the connecting plate is connected to an electric push rod, and a marking pen is provided at the telescopic end of the electric push rod.

[0032] One end of the driving plate 504 away from the first screw rod 502 is slidably connected to a guide rod 511 , and both ends of the guide rod 511 are fixedly connected to the inner wall of the housing 1 .

[0033] The bottom end of the connecting plate 503 is fixedly connected to a carrier plate 509 , the electric push rod 507 is passed through the carrier plate 509 , the telescopic end of the electric push rod 507 is fixedly connected to a recessed disk 515 , and the marking pen 510 is threadedly connected to the recessed disk 515 .

[0034] In the above embodiment, a thermal imaging device 3 is fixedly mounted on the upper surface of the casing 1, a detection base 6 is fixedly connected to the inner bottom wall of the casing 1, and the marking mechanism 5 includes a first motor 501, an output end of the first motor 501 is fixedly connected to a first screw rod 502, an outer surface of the first screw rod 502 is threadedly connected to a driving plate 504, an inner wall of the driving plate 504 is slidably connected to a guide rod 511, and the left and right ends of the guide rod 511 are fixedly connected to the inner side wall of the casing 1, and the upper surface of the driving plate 504 is fixedly connected to two bearing seats 508, two bearings The inner wall of the seat 508 is connected to the second screw rod 505 in a common rotation, and the front side of one of the bearing seats 508 is fixedly connected to the second motor 506, and the front end of the second screw rod 505 is fixedly connected to the output end of the second motor 506. The outer surface of the second screw rod 505 is threadedly connected to the connecting plate 503, and the bottom surface of the connecting plate 503 is fixedly connected to the carrier plate 509. The upper surface of the carrier plate 509 is fixedly inlaid with an electric push rod 507, and the telescopic end of the electric push rod 507 is fixedly connected to a concave disk 515, and the inner wall of the concave disk 515 is threadedly connected to a marking pen 510.

[0035] After the circuit board is powered on, the thermal imaging device 3 is used to perform real-time scanning and monitoring of the circuit board, which can effectively identify temperature anomalies of the cold solder joints. The position movement of the marking pen 510 is achieved through the cooperation of the first motor 501, the second motor 506, the first screw rod 502 and the second screw rod 505 in the marking mechanism 5. Under the telescopic action of the electric push rod 507, the position of the detected cold solder joint is accurately marked, which makes it convenient for the staff to repair the position of the cold solder joint, effectively solves the problem of inaccurate detection of traditional air flow scouring, reduces the possibility of missed detection and false detection, and greatly improves the accuracy and efficiency of detection.

[0036] In one embodiment, the outer surface of the first screw rod 502 is fixedly connected to a limit ring 512, and the two limit rings 512 are respectively located on the left and right sides of the driving plate 504. By setting the limit rings 512, the driving plate 504 can be limited to prevent the driving plate 504 from colliding with the housing 1.

[0037] In one embodiment, the inner bottom wall of the casing 1 is provided with a detection base 6 and two limit bars 602, and the side surfaces of the two limit bars 602 that are close to each other respectively abut the front side of the detection base 6 and the back side of the detection base 6, and the side surfaces of the limit bars 602 that are close to each other are fixedly connected to the front side of the detection base 6 and the back side of the detection base 6, respectively. The detection base 6 can be limited by the limit bars 602 to prevent the detection base 6 from loosening.

[0038] In one embodiment, a control panel 4 is fixedly connected to the upper end surface of the housing 1 , and a glass plate 2 is inlaid on the top wall of the housing 1 . The glass plate 2 is disposed on one side of the thermal imaging device 3 .

[0039] A glass plate 2 is fixedly embedded on the upper surface of the casing 1 , and the glass plate 2 is located in front of the thermal imaging device 3 . The glass plate 2 allows the staff to easily observe the position of the marking pen 510 , so as to facilitate the control of the marking pen 510 .

[0040] In one embodiment, a sealing door 102 is hinged on the front of the housing 1 through two pins, and a groove 101 is provided on the front of the sealing door 102. The sealing door 102 and the groove 101 can prevent foreign matter from entering during detection, ensuring that there will be no interference during detection.

[0041] In one embodiment, a plurality of rubber pads 103 are provided below the housing 1 , and the upper end surface of each rubber pad 103 is fixedly connected to the bottom surface of the housing 1 .

[0042] Two groups of four rubber pads 103 are provided under the casing 1. The upper surface of each rubber pad 103 is fixedly connected to the bottom surface of the casing 1. The rubber pads 103 can support the device and increase the friction of the bottom surface of the device to prevent the device from sliding.

[0043] In one embodiment, the driving plate 504 is provided with a sliding hole for the connecting plate 503 to slide, and a guide hole 513 is provided on the front of the connecting plate 503. The inner wall of the guide hole 513 is slidably connected to a sliding rod 514, and both ends of the sliding rod 514 are fixedly connected to the inner wall of the driving plate 504.

[0044] A guide hole 513 is provided on the front of the connecting plate 503, and a slide rod 514 is slidably connected to the inner wall of the guide hole 513. Both ends of the slide rod 514 are fixedly connected to the inner wall of the driving plate 504. By providing the slide rod 514, the connecting plate 503 can be guided, making the connecting plate 503 more stable during movement.

[0045] In one embodiment, two through slots 601 are provided on the upper surface of the detection base 6 , and the circuit board can be easily taken out by providing the through slots 601 .

[0046] In actual application, when inspecting the solder joints of the circuit board, the sealed door 102 is opened, and then the circuit board is placed inside the inspection base 6, the circuit board is connected to the power supply, the circuit board is energized, and the temperature of the circuit board below is sensed by the thermal imaging device 3. When there is a cold solder joint on the circuit board component, the temperature of the electronic component rises, and the staff uses the thermal imaging device 3 to detect the abnormal temperature position of the circuit board, control the first motor 501 and the second motor 506, the first motor 501 drives the first screw rod 502 to rotate, the first screw rod 502 drives the driving plate 504 to move, and the driving plate 504 drives the carrier plate 509 to adjust the left and right position, the second motor 506 drives the second screw rod 505 to rotate, and the second screw rod 505 moves with the connecting plate 503 to adjust the front and rear direction position of the carrier plate 509, and then start the electric push rod 507, so that the electric push rod 507 pushes the marking pen 510 to move downward, so that the marking pen 510 marks the electronic component with abnormal temperature, thereby facilitating the staff to repair the position of the cold solder joint.

[0047] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A BGA cold solder joint detection device, characterized in that: It comprises a housing (1) and a marking mechanism (5) arranged in the housing (1); a thermal imaging device (3) is provided on the upper end surface of the housing (1); a working end of the thermal imaging device (3) faces the circuit board to be tested; The marking mechanism (5) comprises a first motor (501), an output end of the first motor (501) is fixedly connected to a first screw rod (502), the first screw rod (502) is threadedly connected to a driving plate (504), an upper end surface of the driving plate (504) is provided with two bearing seats (508), opposite sides of the two bearing seats (508) are rotatably connected to a second screw rod (505), the second screw rod (505) is fixedly connected to an output shaft of a second motor (506), the second screw rod (505) is threadedly connected to a connecting plate (503), the connecting plate (503) is connected to an electric push rod (507), and a marking pen (510) is provided at the telescopic end of the electric push rod (507).

2. A BGA cold solder joint detection device according to claim 1, characterized in that: One end of the driving plate (504) away from the first screw rod (502) is slidably connected to a guide rod (511), and both ends of the guide rod (511) are fixedly connected to the inner wall of the housing (1).

3. A BGA cold solder joint detection device according to claim 1, characterized in that: The bottom end of the connecting plate (503) is fixedly connected to a carrier plate (509), the electric push rod (507) is passed through the carrier plate (509), the telescopic end of the electric push rod (507) is fixedly connected to a concave disc (515), and the marking pen (510) is threadedly connected to the concave disc (515).

4. A BGA cold solder joint detection device according to claim 1, characterized in that: Both ends of the first screw rod (502) are fixedly connected to limit rings (512), and the two limit rings (512) are respectively located on both sides of the driving plate (504).

5. A BGA cold solder joint detection device according to claim 1, characterized in that: The inner bottom wall of the housing (1) is provided with a detection base (6) and two limit bars (602), and the side surfaces of the two limit bars (602) that are close to each other respectively abut against the front side of the detection base (6) and the back side of the detection base (6).

6. The BGA cold solder joint detection device according to claim 1, characterized in that: A control panel (4) is fixedly connected to the upper end surface of the housing (1), and a glass plate (2) is inlaid on the top wall of the housing (1), wherein the glass plate (2) is arranged on one side of the thermal imaging device (3).

7. The BGA cold solder joint detection device according to claim 1, characterized in that: A sealing door (102) is hinged on the front of the housing (1) via two pins, and a groove (101) is provided on the front of the sealing door (102).

8. The BGA cold solder joint detection device according to claim 1, characterized in that: A plurality of rubber pads (103) are provided below the housing (1), and the upper end surface of each rubber pad (103) is fixedly connected to the bottom surface of the housing (1).

9. The BGA cold solder joint detection device according to claim 1, characterized in that: The driving plate (504) is provided with a sliding hole for the connecting plate (503) to slide, and a guide hole (513) is provided on the front surface of the connecting plate (503). The inner wall of the guide hole (513) is slidably connected to a sliding rod (514), and both ends of the sliding rod (514) are fixedly connected to the inner wall of the driving plate (504).

10. The BGA cold solder joint detection device according to claim 5, characterized in that: Two through slots (601) are provided on the upper surface of the detection base (6).

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