Carrying disc device

By providing grooves and relative fixing components on the carrier device, the problem of difficulty in vertically fixing the sample is solved, the stable vertical placement and convenience of the semiconductor sample are achieved, and the risk of sample breakage is reduced.

CN223377234UActive Publication Date: 2025-09-23GTA SEMICON CO LTD
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Patent Information

Application Number
CN202422595759.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-25
Publication Date
2025-09-23
Estimated Expiration
2034-10-25

AI Technical Summary

Technical Problem

The existing technology makes it difficult to effectively fix semiconductor samples to facilitate the detection of the PN junction position and shape of the underlying layer. In particular, it is difficult to fix thin samples vertically, resulting in detection difficulties and sample fragmentation.

Method used

A carrier device is designed, including a groove extending along the diameter direction on the carrier for placing the sample, and a first and second opposite fixing components are arranged on the upper side of the carrier, respectively located on both sides of the groove, for clamping and fixing the sample to ensure that it is placed vertically and not tilted.

Benefits of technology

It achieves stable vertical fixation of the sample, reduces the sample height, facilitates detection, reduces the risk of sample breakage, and ensures the stability of detection.

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Abstract

The utility model relates to a tray device and relates to semiconductor manufacturing technical field, the tray device comprises a tray, the tray is provided with a groove extending along the diameter direction of the tray, the groove is used for placing a sample, the upper side of the tray is also provided with a fixing device, the fixing device comprises a first fixing assembly and a second fixing assembly which are oppositely arranged, and the first fixing assembly and the second fixing assembly are arranged on the tray. The first fixing assembly and the second fixing assembly are located on the two sides of the groove respectively and matched with each other to clamp and fix the sample. The sample is placed in the groove, so that not only can the vertical sample be preliminarily fixed, but also the height of the sample can be reduced, and the sample can be placed in a detection instrument. In addition, the first fixing assembly and the second fixing assembly which are oppositely arranged are arranged, the sample in the groove can be clamped from the two sides, and it is guaranteed that the vertically-arranged sample is stably fixed and does not incline.
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Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a disk loading device. Background Art

[0002] The performance of semiconductors is closely related to the quality of subsequent products. Therefore, electrical testing of prepared semiconductor samples is crucial.

[0003] In existing tests, if you want to visually see the position and shape of the PN junction in the lower layer of the sample, you need to stand the sample upright for testing. However, it is difficult to ensure that the sample is fixed without tilting by relying solely on conductive glue. Moreover, for thinner samples, vertical fixation is even more difficult.

[0004] Based on this, how to better place the sample vertically for easy detection has become a technical problem that technical personnel in this field urgently need to solve. Utility Model Content

[0005] Based on this, it is necessary to provide a tray device for better placing the sample vertically.

[0006] In order to achieve the above-mentioned object, the present invention provides a disk loading device, comprising:

[0007] A carrier plate, the carrier plate comprising a groove, the groove extending along a diameter direction of the carrier plate, the groove being used for placing a sample;

[0008] A fixing device is located on the upper side of the carrier, and the fixing device includes a first fixing component and a second fixing component that are arranged opposite to each other. The first fixing component and the second fixing component are respectively located on both sides of the groove, and the first fixing component and the second fixing component are used to cooperate with each other to clamp and fix the sample.

[0009] In one embodiment, the groove includes a first sub-groove and a second sub-groove which are arranged in sequence and connected to each other along a direction perpendicular to the plane where the carrier is located; in the first direction, the width of the first sub-groove is smaller than the width of the second sub-groove, and the first direction is parallel to the carrier and perpendicular to the extension direction of the groove.

[0010] In one embodiment, the first fixing assembly includes a first retractable assembly and a first fixing clamp, the first fixing clamp is used to clamp the sample, and the first retractable assembly is used to adjust the distance between the first fixing clamp and the sample.

[0011] In one embodiment, the first fixing assembly further includes a first gasket located on a side of the first fixing plate facing the second fixing assembly.

[0012] In one embodiment, the first telescopic component includes a first crossbar and a first spring, the first spring is sleeved on the outside of the first crossbar, and the first crossbar is connected to the first fixing clamp.

[0013] In one embodiment, the first fixing assembly further includes a first fixing platform, the first fixing platform includes a first through hole, the first cross bar passes through the first through hole, and the first spring is located on a side of the first fixing platform close to the second fixing assembly, and the first fixing platform is used to fix the first fixing assembly on the carrier.

[0014] In one embodiment, the second fixing assembly includes a second retractable assembly and a second fixing plate, the second fixing plate is used to clamp the sample, and the second retractable assembly is used to adjust the distance between the second fixing plate and the sample.

[0015] In one embodiment, the second fixing assembly further includes a second gasket located on a side of the second fixing plate facing the first fixing assembly.

[0016] In one embodiment, the second telescopic component includes a second crossbar and a second spring, the second spring is sleeved on the outside of the second crossbar, and the second crossbar is connected to the second fixing clamp.

[0017] In one embodiment, the second fixing assembly further includes a second fixing platform, the second fixing platform includes a second through hole, the second cross bar passes through the second through hole, and the second spring is located on a side of the second fixing platform close to the first fixing assembly, and the second fixing platform is used to fix the second fixing assembly on the carrier.

[0018] Compared with the existing technology, the above technical solution has the following advantages:

[0019] The carrier device provided in the present application includes a carrier, and a groove extending in the diameter direction of the carrier is provided on the carrier, and the groove is used to place the sample. A fixing device is also provided on the upper side of the carrier, and the fixing device includes a first fixing component and a second fixing component that are relatively arranged. The first fixing component and the second fixing component are respectively located on both sides of the groove, and cooperate with each other to clamp and fix the sample. Placing the sample in the groove can not only allow the vertical sample to be initially fixed, but also reduce the height of the sample so that the sample can be placed in the detection instrument. In addition, the first fixing component and the second fixing component that are relatively arranged can clamp the sample in the groove from both sides to ensure that the vertically arranged sample is fixed stably and does not tilt. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic structural diagram of a disk loading device is provided for an embodiment of the present application;

[0022] Figure 2 A schematic structural diagram of another disk loading device provided in an embodiment of the present application;

[0023] Figure 3 A schematic diagram of a partial cross-sectional structure of a disk loading device provided in an embodiment of the present application;

[0024] Figure 4 A schematic diagram of the three-dimensional structure of a disk loading device provided in an embodiment of the present application;

[0025] Figure 5 A schematic diagram of the three-dimensional structure of a fixing device provided in an embodiment of the present application.

[0026] Explanation of the reference numerals: 01-carrying plate; 02-groove; 02a-first sub-groove; 02b-second sub-groove; 03-sample; 04-fixing device; 04a-first fixing component; 04b-second fixing component; 05-first telescopic component; 05a-first cross bar; 05b-first spring; 06-first fixing clamp; 07-first fixing table; 08-second telescopic component; 08a-second cross bar; 08b-second spring; 09-second fixing clamp; 10-second fixing table. DETAILED DESCRIPTION

[0027] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0029] It will be understood that when a layer is referred to as being "on," "adjacent," or "connected to" another layer, it can be directly on, adjacent, or connected to the other layer, or intervening layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent," or "directly connected to" another layer, there are no intervening layers present.

[0030] When used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0031] As discussed in the background technology, nanoprobe electrical measurement (Nano-probing) is an electrical testing tool that integrates a nanoprobe system with a scanning electron microscope (SEM). The SEM's nanometer-scale high resolution, combined with the extremely small nanoprobes, can precisely locate nanometer-scale transistors for electrical testing and pinpointing nanometer-scale anomalies. Using eight nanoprobes, it can perform tests such as IV curve measurement, SRAM bit cell measurement, BEOL metal / poly resistance measurement, EBAC / EBIRCH (chip circuit open / short location), EBIC (transistor pn junction imaging / leakage location), and high / low temp (high and low temperature environmental testing).

[0032] Most of the above tests are used for testing planar samples. There is no problem in fixing the sample with a flat stage. However, if you want to visually see the position and shape of the underlying PN junction, you need to stand the sample upright and examine it under the SEM. However, IC samples with common Si substrates cannot directly characterize the clear PN junction boundary under the SEM like SiC samples. This is where EBIC (Electron Beam Induced Current) is needed. When the electron beam of the electron microscope irradiates the PN junction interface, a needle is inserted into the P-end and N-end respectively. The current induced by the built-in electric field is output through the nanoprobe to the amplifier to form a current image, which characterizes the PN junction interface.

[0033] However, it is difficult to ensure that the sample is fixed upright without tilting by relying solely on conductive glue. Moreover, because the distance between the nanoprobe and the sample is about 4 mm, the height of the upright sample cannot exceed 2 mm. However, it is difficult for us to judge the height of the sample with the naked eye. It is even more difficult to fix relatively thin and small samples vertically. During operation, the problem of sample breakage is often encountered.

[0034] Based on this, the present application provides a fixation, the carrier device includes a carrier, a groove extending in the diameter direction of the carrier is provided on the carrier, the groove is used to place the sample, and a fixing device is also provided on the upper side of the carrier, the fixing device includes a first fixing component and a second fixing component that are relatively arranged, the first fixing component and the second fixing component are respectively located on both sides of the groove, and cooperate with each other to clamp and fix the sample. Placing the sample in the groove can not only allow the vertical sample to be initially fixed first, but also reduce the height of the sample so that the sample can be placed in the detection instrument. In addition, the first fixing component and the second fixing component that are relatively arranged can clamp the sample in the groove from both sides to ensure that the vertically arranged sample is fixed stably and does not tilt.

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0036] refer to Figure 1 , Figure 1 A schematic structural diagram of a disk loading device is provided for an embodiment of the present application; the device includes:

[0037] The carrier plate 01 includes a groove 02 , which extends along the diameter direction of the carrier plate 01 and is used to place the sample 03 .

[0038] The fixing device 04 is located on the upper side of the carrier plate 01, and the fixing device 04 includes a first fixing component 04a and a second fixing component 04b arranged opposite to each other. The first fixing component 04a and the second fixing component 04b are respectively located on both sides of the groove 02, and the first fixing component 04a and the second fixing component 04b are used to cooperate with each other to clamp and fix the sample 03.

[0039] Specifically, carrier plate 01 is used to hold sample 03. Because sample 03 must be placed vertically during testing, a groove 02 is provided on carrier plate 01. This groove 02 provides initial support for sample 03 during vertical placement and prevents it from being too high to fit into the testing device. To facilitate testing, sample 03 is placed in the center of carrier plate 01 as much as possible. Therefore, groove 02 extends along the diameter of carrier plate 01.

[0040] A fixture 04 is also located on the upper side of carrier plate 01. This fixture 04 comprises a first fixture assembly and a second fixture assembly 04b. The first fixture assembly 04a and the second fixture assembly 04b are symmetrically arranged to facilitate preparation. The first fixture assembly 04a and the second fixture assembly 04b are positioned on either side of groove 02. When sample 03 is placed in groove 02, the first fixture assembly 04a and the second fixture assembly 04b cooperate to clamp and secure sample 03, preventing it from tilting.

[0041] It should be noted that in the present application, in the direction perpendicular to the plane where the carrier 01 is located, the height range of the fixing device 04 can be 0.5mm-2.5mm, including the endpoint values. For example, the height range of the fixing device 04 can be 0.5mm or 1.6mm or 2.1mm, etc., and there is no specific limitation.

[0042] The carrier device provided in the embodiment of the present application can fix the sample 03 more firmly in the vertical direction, further reducing the breakage of the sample 03.

[0043] Optionally, in another embodiment of the present application, refer to Figure 2 , Figure 2 A structural diagram of another disk loading device provided in an embodiment of the present application; Figure 3 , Figure 3 Schematic diagram of a partial cross-sectional structure of a disk carrier device provided in an embodiment of the present application; the groove 02 includes a first sub-groove 02a and a second sub-groove 02b arranged in sequence and interconnected along a direction perpendicular to the plane of the carrier 01; in a first direction M, the width h of the first sub-groove 02a is smaller than the width H of the second sub-groove 02b, and the first direction M is parallel to the carrier 01 and perpendicular to the extension direction of the groove 02.

[0044] Specifically, in an embodiment of the present application, groove 02 may include a first sub-groove 02a and a second sub-groove 02b, arranged in sequence and interconnected along a direction perpendicular to the plane of carrier plate 01. The first sub-groove 02a has a height y in the direction perpendicular to the plane of carrier plate 01, and the second sub-groove 02b has a height Y in the direction perpendicular to the plane of carrier plate 01. In other words, the first sub-groove 02a is deeper than the second sub-groove 02b. When sample 03 is too high, sample 03 can be placed in first sub-groove 02a to lower the height of sample 03, making it easier to place in the detection device. For example, when sample 03 is over 2 mm tall, inserting it into groove 02 can effectively lower the height of sample 03, increase the distance between sample 03 and the probe, and reduce the size requirements of sample 03. In addition, due to the deeper depth of first sub-groove 02a, the stability of sample 03 placed therein is also better.

[0045] The width h of the first sub-groove 02a in the first direction M is smaller than the width H of the second sub-groove 02b in the first direction M. It should be noted that providing two grooves 02 of different widths allows for a wider range of thicknesses of samples 03 to be clamped, effectively preventing not only thicker but also thinner samples 03 from being clamped. In this embodiment, the width h of the first sub-groove 02a can be 300±μm, and the height y can be 1.5±mm; the width H of the second sub-groove 02b can be 750±μm, and the height Y can be 1±mm, etc. These are not specifically limited and can be adjusted based on specific needs.

[0046] Optionally, in another embodiment of the present application, refer to Figure 4 , Figure 4 A schematic diagram of the three-dimensional structure of a disk loading device provided in an embodiment of the present application; Figure 5 , Figure 5 A schematic diagram of the three-dimensional structure of a fixing device provided in an embodiment of the present application; the first fixing component 04a includes a first telescopic component 05 and a first fixing clamp 06, the first fixing clamp 06 is used to clamp the sample, and the first telescopic component 05 is used to adjust the distance between the first fixing clamp 06 and the sample 03.

[0047] Specifically, the first retractable component 05 and the first fixed plate 06 are integrally formed, with the first fixed plate 06 positioned adjacent to the second fixed component 04b. It should be noted that the area of ​​the first fixed plate 06 can be larger than that of the first retractable component 05. This larger area allows for easier gripping of the sample 03 and more evenly distributes pressure across the sample 03, preventing it from breaking. The first retractable component 05 can pull the first fixed plate 06 apart, allowing the sample 03 to be placed into the groove 02, providing flexibility for samples 03 of varying thicknesses.

[0048] Optionally, in another embodiment of the present application, the first fixing assembly 04a further includes a first gasket located on a side of the first fixing clamp 06 facing the second fixing assembly 04b.

[0049] Specifically, the first gasket is made of a soft non-colloidal conductive material and can be bonded to the first fixing plate using a high and low temperature resistant conductive adhesive. Since the first gasket is made of a soft material, it will not damage the sample.

[0050] Optionally, in another embodiment of the present application, as Figure 4 As shown, the first telescopic component 05 includes a first crossbar 05a and a first spring 05b. The first spring 05b is sleeved on the outside of the first crossbar 05a. The first crossbar 05a is connected to the first fixed clamping plate 06.

[0051] Specifically, the first crossbar 05a acts as a tensioning device, while the first spring 05b provides pressure to the first fixed clamp 06, thereby allowing the first fixed clamp 06 to clamp the sample 03. The first spring 05b is sleeved on the outside of the first crossbar 05a, and the first crossbar 05a also serves to fix the first spring 05b, ensuring the stability of the spring during tension.

[0052] Optionally, in another embodiment of the present application, as Figure 4 As shown, Figure 5 As shown, the first fixing component 04a also includes a first fixing platform 07, the first fixing platform 07 includes a first through hole, the first cross bar 05a passes through the first through hole, and the first spring 05b is located on the side of the first fixing platform 07 close to the second fixing component 04b. The first fixing platform 07 is used to fix the first fixing component 04a on the carrier 01.

[0053] Specifically, the first fixing assembly 04a is further provided with a first fixing platform 07, which is primarily used to secure the first fixing assembly 04a to the carrier 01. The first fixing platform 07 can be welded to the carrier 01. A first through-hole is also provided on the first fixing platform 07, through which the first crossbar 05a passes. The first spring 05b is positioned between the first fixing platform 07 and the first fixing clamp 06. Since the position of the first fixing platform 07 is fixed, stretching the first crossbar 05a passing through the first through-hole can open the first fixing clamp 06, thus increasing the stability of the first retractable assembly 05.

[0054] Optionally, in another embodiment of the present application, the second fixing component 04b includes a second telescopic component 08 and a second fixing clamp 09, the second fixing clamp 09 is used to clamp the sample, and the second telescopic component 08 is used to adjust the distance between the second fixing clamp 09 and the sample 03.

[0055] Specifically, the second retractable assembly 08 and the second fixed clamp 09 are integrally formed, with the second fixed clamp 09 located adjacent to the first fixed assembly 04a. It should be noted that the area of ​​the second fixed clamp 09 can be larger than that of the second retractable assembly 08. This larger area allows for easier gripping of the sample 03 and more evenly distributes pressure across the sample 03, preventing it from breaking. The second retractable assembly 08 can pull the second fixed clamp 09 apart, allowing the sample 03 to be placed into the groove 02, providing flexibility for samples 03 of varying thicknesses.

[0056] It should be noted that the first fixed clamping plate 06 and the second fixed clamping plate 09 can be arranged in parallel to better clamp the sample.

[0057] Optionally, in another embodiment of the present application, the second fixing assembly 04b further includes a second gasket located on the side of the second fixing clamping plate 09 facing the first fixing assembly 04a.

[0058] Specifically, the second gasket is made of a soft non-colloidal conductive material and can be bonded to the second fixing splint 09 using a high and low temperature resistant conductive adhesive. Since the second gasket is made of a soft material, it will not damage the sample 03.

[0059] Optionally, in another embodiment of the present application, as Figure 4 As shown, the second telescopic assembly 08 includes a second crossbar 08a and a second spring 08b. The second spring 08b is sleeved on the outside of the second crossbar 08a. The second crossbar 08a is connected to the second fixed clamping plate 09.

[0060] Specifically, second crossbar 08a acts as a tensioning device, while second spring 08b applies pressure to second fixing plate 09, thereby allowing second fixing plate 09 to clamp sample 03. Second spring 08b is sheathed around the outside of second crossbar 08a, and second crossbar 08a also serves to secure second spring 08b, ensuring its stability during tension.

[0061] Optionally, in another embodiment of the present application, as Figure 4 As shown, the second fixing component 04b also includes a second fixing platform 10, the second fixing platform 10 includes a second through hole, the second cross bar 08a passes through the second through hole, and the second spring 08b is located on the side of the second fixing platform 10 close to the first fixing component 04a. The second fixing platform 10 is used to fix the second fixing component 04b on the carrier 01.

[0062] Specifically, the second fixing assembly 04b is further provided with a second fixing platform 10, which is primarily used to secure the second fixing assembly 04b to the carrier plate 01. The second fixing platform 10 can be welded to the carrier plate 01. A second through-hole is also provided on the second fixing platform 10, through which the second crossbar 08a passes. The second spring 08b is positioned between the second fixing platform 10 and the second fixing plate 09. Since the position of the second fixing platform 10 remains fixed, stretching the second crossbar 08a passing through the second through-hole can open the second fixing plate 09, thus increasing the stability of the second retractable assembly 08.

[0063] In the description of this specification, reference to the terms "some embodiments" or "another embodiment" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0064] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A disc loading device, characterized in that: include: A carrier plate, the carrier plate comprising a groove, the groove extending along a diameter direction of the carrier plate, the groove being used for placing a sample; A fixing device is located on the upper side of the carrier, and the fixing device includes a first fixing component and a second fixing component that are arranged opposite to each other. The first fixing component and the second fixing component are respectively located on both sides of the groove, and the first fixing component and the second fixing component are used to cooperate with each other to clamp and fix the sample.

2. The disk loading device according to claim 1, wherein: The groove includes a first sub-groove and a second sub-groove which are arranged in sequence and connected to each other in a direction perpendicular to the plane where the carrier is located; in the first direction, the width of the first sub-groove is smaller than the width of the second sub-groove, and the first direction is parallel to the carrier and perpendicular to the extension direction of the groove.

3. The disk loading device according to claim 1, wherein: The first fixing assembly includes a first retractable assembly and a first fixing clamping plate, the first fixing clamping plate is used to clamp the sample, and the first retractable assembly is used to adjust the distance between the first fixing clamping plate and the sample.

4. The disk loading device according to claim 3, wherein: The first fixing assembly further includes a first gasket located on a side of the first fixing clamp facing the second fixing assembly.

5. The disk loading device according to claim 3, wherein: The first telescopic component includes a first crossbar and a first spring. The first spring is sleeved on the outside of the first crossbar, and the first crossbar is connected to the first fixing clamp.

6. The disk loading device according to claim 5, wherein: The first fixing assembly further includes a first fixing platform, the first fixing platform includes a first through hole, the first cross bar passes through the first through hole, and the first spring is located on a side of the first fixing platform close to the second fixing assembly, and the first fixing platform is used to fix the first fixing assembly on the carrier.

7. The disk loading device according to claim 1, wherein: The second fixing assembly includes a second retractable assembly and a second fixing clamping plate, the second fixing clamping plate is used to clamp the sample, and the second retractable assembly is used to adjust the distance between the second fixing clamping plate and the sample.

8. The disk loading device according to claim 7, wherein: The second fixing assembly further includes a second gasket located on a side of the second fixing clamp facing the first fixing assembly.

9. The disk loading device according to claim 7, wherein: The second telescopic component includes a second cross bar and a second spring. The second spring is sleeved on the outside of the second cross bar. The second cross bar is connected to the second fixing clamp.

10. The disk loading device according to claim 9, wherein: The second fixing assembly also includes a second fixing platform, the second fixing platform includes a second through hole, the second cross bar passes through the second through hole, and the second spring is located on a side of the second fixing platform close to the first fixing assembly, and the second fixing platform is used to fix the second fixing assembly on the carrier.