Positioning device for oversized packaging chip detection

Abstract

The utility model relates to the technical field of packaged chip detection, and discloses a positioning device for detecting an oversized packaged chip, which comprises a packaged chip, one side of the packaged chip is provided with a clamping component capable of positioning and clamping the packaged chip, and the other side of the packaged chip is provided with a positioning component. The two sides of the clamping assembly are respectively provided with a control assembly which can freely control the clamping force of the clamping assembly on the packaged chip. By arranging the clamping assembly and the control assembly, the specially-made clamping assembly can be directly placed in electron microscope detection equipment, so that the clamping assembly is used for clamping a packaged chip, then the control assembly is used for controlling the clamping force of the clamping assembly to the packaged chip, and the situation that the packaged chip is damaged due to the fact that clamping is not tight or the clamping force is too large is avoided; through the arrangement, electron microscope detection can be carried out without splitting a large-size packaged chip into a small-size packaged chip.

Description

Technical Field

[0001] The utility model relates to the technical field of encapsulated chip detection, in particular to a positioning device for detecting ultra-large encapsulated chips. Background Art

[0002] At present, when performing electron microscope detection on current encapsulated chip samples, large-sized encapsulated chips need to be split into small-sized encapsulated chips, fixed to the standard sample stage of the electron microscope instrument with conductive tape, and then detected by the electron microscope equipment.

[0003] Currently, splitting large-sized encapsulated chips into small-sized samples has a cumbersome sample preparation process. It requires skilled sample preparation personnel and multiple preparations to obtain the required samples, resulting in a large waste of materials. Fixing the sample with conductive tape, the conductivity of the encapsulated chip sometimes fails to meet the requirements of electron microscope detection, and further carbon plating, gold plating or other metal layers need to be used to process the sample, which affects the detection speed of the entire large-sized encapsulated chip. Therefore, it is necessary to design a positioning device for detection that can directly clamp and position large-sized encapsulated chips. Summary of the Utility Model

[0004] To solve the technical problem that current large-sized encapsulated chips need to be split into small-sized encapsulated chips for detection, the utility model provides a positioning device for detecting ultra-large encapsulated chips.

[0005] The utility model is realized by the following technical solutions: A positioning device for detecting ultra-large encapsulated chips includes an encapsulated chip. On one side of the encapsulated chip, there is a clamping component capable of positioning and clamping the encapsulated chip. On both sides of the clamping component, there are control components capable of freely controlling the clamping force of the clamping component on the encapsulated chip. The clamping component includes a special bottom plate arranged in a "C" shape on one side of the encapsulated chip, two support plates fixedly installed inside the special bottom plate, and two clamping plates arranged on both sides of the special bottom plate. The encapsulated chip is located between the special bottom plate and one of the clamping plates.

[0006] Through the above technical solutions, the special clamping component can be directly placed into the electron microscope detection equipment. Then, use the clamping component to clamp the encapsulated chip, and then use the control component to control the clamping force of the clamping component on the encapsulated chip, avoiding damage to the encapsulated chip caused by insufficient clamping or excessive clamping force. This setting can avoid the need to split large-sized encapsulated chips into small-sized encapsulated chips for electron microscope detection.

[0007] As a further improvement of the above solution, threaded columns are arranged on both sides of each clamping plate, and one end of each threaded column penetrates through the adjacent clamping plate and the special bottom plate.

[0008] Through the above technical solutions, the threaded columns play a supporting role for the clamping plates.

[0009] As a further improvement of the above solution, each of the threaded columns is provided with a threaded sleeve which is fixedly mounted on a special base plate.

[0010] Through the above technical solution, the threaded sleeve allows the threaded column to be tightened on the special base plate, so that the clamping plate is tightened to clamp the packaged chip.

[0011] As a further improvement of the above solution, each of the threaded columns is sleeved with a bearing mounted on an adjacent clamping plate.

[0012] Through the above technical solution, the bearing allows the threaded column to rotate on the clamping plate, thereby preventing the connection between the threaded column and the clamping plate from loosening.

[0013] As a further improvement of the above solution, the control assembly includes a driving gear fixedly mounted on one end of each threaded column and a synchronous belt mounted on every two driving gears on the same side.

[0014] Through the above technical solution, the rotation of one driving gear will cause the synchronous belt to drive the other driving gear to rotate together, thereby causing the two threaded columns to rotate synchronously.

[0015] As a further improvement of the above solution, a limit plate for limiting the deviation of adjacent synchronous belts is fixedly installed on one side of each driving gear, and each synchronous belt is located between an adjacent limit plate and an adjacent bearing.

[0016] Through the above technical solution, the limit plate can prevent the synchronous belt from deviating from the driving gear during the movement.

[0017] As a further improvement of the above solution, a protective cover is fixedly installed on one side of each clamping plate, and each of the threaded column, bearing, drive gear, synchronous belt and limit plate is located inside an adjacent protective cover.

[0018] Through the above technical solution, the protective cover can protect the internal parts and prevent the parts from loosening due to external forces.

[0019] As a further improvement of the above solution, a rotating column is fixedly installed on one side of each of the limit plates, one end of each of the rotating columns passes through the adjacent protective cover and extends to its outside, and a plurality of convex strips are fixedly installed on the end of each of the rotating columns located outside the protective cover.

[0020] Through the above technical solution, the rotation of the rotating column will cause the two threaded columns on the same side to rotate, so that the clamping plate can complete the clamping of the packaged chip.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] The utility model is provided with a clamping component and a control component. The specially designed clamping component can be directly placed into an electron microscope detection device. In this way, the clamping component is used to clamp the packaged chip, and then the control component is used to control the clamping force of the clamping component on the packaged chip, avoiding damage to the packaged chip caused by insufficient clamping or excessive clamping force. Such a setting can avoid the need to split large-sized packaged chips into small-sized packaged chips for electron microscope detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a three-dimensional structural schematic diagram of the utility model;

[0024] Figure 2 is a structural schematic diagram of the utility model with a control component;

[0025] Figure 3 is a structural schematic diagram of the interior of the protective cover of the utility model;

[0026] Figure 4 [[ID=1's]]is a structural schematic diagram of the utility model with a threaded column.

[0027] MAIN SYMBOL DESCRIPTION:

[0028] 1. Packaged chip; 201. Special bottom plate; 202. Support plate; 203. Clamping plate;

[0028] 301. Driving gear; 302. Synchronous belt; 4. Threaded column; 5. Threaded sleeve; 6. Bearing; 7. Limiting plate; 8. Protective cover; 9. Rotating column; 10. Rib. SPECIFIC EMBODIMENTS

[0029] Next, in combination with the drawings and specific embodiments, the utility model will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined to form new embodiments.

[0030] Please refer to Figure 1-Figure 4 , a positioning device for detecting an ultra-large packaged chip in this embodiment includes a packaged chip 1. A clamping component capable of positioning and clamping the packaged chip 1 is provided on one side of the packaged chip 1. Control components capable of freely controlling the clamping force of the clamping component on the packaged chip 1 are provided on both sides of the clamping component. The clamping component includes a special bottom plate 201 arranged in a "C" shape on one side of the packaged chip 1, two support plates 202 fixedly installed inside the special bottom plate 201, and two clamping plates 203 arranged on both sides of the special bottom plate 201. The packaged chip 1 is located between the special bottom plate 201 and one of the clamping plates 203. The specially designed clamping component can be directly placed into an electron microscope detection device. In this way, the clamping component is used to clamp the packaged chip 1, and then the control component is used to control the clamping force of the clamping component on the packaged chip 1, avoiding damage to the packaged chip caused by insufficient clamping or excessive clamping force;

[0031] Combine Figure 2-Figure 4 , each clamping plate 203 is provided with a threaded column 4 on both sides, one end of each threaded column 4 passes through the adjacent clamping plate 203 and the special base plate 201, each threaded column 4 is threadedly sleeved with a threaded sleeve 5 fixedly mounted on the special base plate 201, and each threaded column 4 is sleeved with a bearing 6 mounted on the adjacent clamping plate 203. The threaded sleeve 5 allows the threaded column 4 to be tightened on the special base plate 201, so that the clamping plate 203 is tightened to clamp the packaged chip 1;

[0032] Combine Figure 1-Figure 4 The control assembly includes a driving gear 301 fixedly mounted on one end of each threaded column 4 and a synchronous belt 302 mounted on each of the two driving gears 301 on the same side. A limit plate 7 is fixedly installed on one side of each driving gear 301 to limit the deviation of the adjacent synchronous belts 302. Each synchronous belt 302 is located between the adjacent limit plate 7 and the adjacent bearing 6. When one driving gear 301 rotates, the synchronous belt 302 drives the other driving gear 301 to rotate together, thereby allowing the two threaded columns 4 to rotate synchronously. The limit plate 7 prevents the synchronous belt 302 from deviating from the driving gear 301 during movement.

[0033] Combine Figure 1 and Figure 3 A protective cover 8 is fixedly installed on one side of each clamping plate 203. Each threaded column 4, bearing 6, drive gear 301, synchronous belt 302 and limit plate 7 are located inside the adjacent protective cover 8. The protective cover 8 protects the internal parts and prevents the parts from loosening due to external forces.

[0034] Combined with the diagram, Figure 2 and Figure 4 A rotating column 9 is fixedly installed on one side of each limiting plate 7, and one end of each rotating column 9 passes through the adjacent protective cover 8 and extends to its outside. A plurality of convex strips 10 are fixedly installed on one end of each rotating column 9 located on the outside of the protective cover 8. When the rotating column 9 rotates, the two threaded columns 4 on the same side will rotate, so that the clamping plate 203 completes the clamping of the packaged chip 1.

[0035] The implementation principle of a positioning device for testing an ultra-large packaged chip in the embodiment of the present application is as follows: the specially made base plate 201 is made according to the electron microscope testing equipment used, and can be directly placed in the electron microscope instrument for testing, without the need for multiple chip cracking. Personnel without chip cracking experience can also directly prepare samples, thereby reducing the waste of packaged chips 1 and saving costs.

[0036] The large-sized packaged chip 1 is placed between the clamping plate 203 and the special bottom plate 201. The staff manually twists the rotating column 9, which will cause the limit plate 7 to drive the driving gear 301 to rotate. The rotation of one driving gear 301 will cause the synchronous belt 302 to start moving, and the other driving gear 301 will also rotate.

[0037] When both driving gears 301 rotate, they will drive the threaded posts 4 connected to them to rotate together. When both threaded posts 4 rotate, the threaded sleeves 5 will move. The movement of the threaded posts 4 will move the clamping plate 203, so that the large-sized packaged chip 1 can be clamped. Moreover, since the tightening is done manually by the staff, the force control can be much more precise than using tools, so that the large-sized packaged chip 1 is not easily worn or scratched by the clamping.

[0038] This arrangement can avoid the need to split the large-sized packaged chip 1 into small-sized packaged chips 1 for electron microscope inspection.

[0039] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A positioning device for detecting an ultra-large packaged chip, comprising a packaged chip (1), characterized in that: On one side of the encapsulated chip (1), there is a clamping component capable of positioning and clamping the encapsulated chip (1). On both sides of the clamping component, there are control components capable of freely controlling the clamping force of the clamping component on the encapsulated chip (1). The clamping component includes a special bottom plate (201) arranged in a "C" shape on one side of the encapsulated chip (1), two support plates (202) fixedly installed inside the special bottom plate (201), and two clamping plates (203) arranged on both sides of the special bottom plate (201). The encapsulated chip (1) is located between the special bottom plate (201) and one of the clamping plates (203).

2. The positioning device for detecting an ultra-large packaged chip according to claim 1, wherein: On both sides of each clamping plate (203), there are threaded columns (4), and one end of each threaded column (4) penetrates through the adjacent clamping plate (203) and the special bottom plate (201).

3. The positioning device for detecting an ultra-large packaged chip according to claim 2, wherein: On each threaded column (4), there is a threaded sleeve (5) fixedly installed with the special bottom plate (201) threadedly sleeved thereon.

4. The positioning device for detecting an ultra-large packaged chip according to claim 2, wherein: On each threaded column (4), there is a bearing (6) sleeved thereon and installed with the adjacent clamping plate (203).

5. The positioning device for detecting an ultra-large packaged chip according to claim 2, wherein: The control component includes a driving gear (301) fixedly sleeved on one end of each threaded column (4) and a synchronous belt (302) sleeved on every two same-side driving gears (301).

6. The positioning device for detecting an ultra-large packaged chip according to claim 5, characterized in that: On one side of each driving gear (301), there is a limiting plate (7) fixedly installed to limit the deviation of the adjacent synchronous belt (302). Each synchronous belt (302) is located between the adjacent limiting plate (7) and the adjacent bearing (6).

7. The positioning device for detecting an ultra-large packaged chip according to claim 6, wherein: On one side of each clamping plate (203), there is a protective cover (8) fixedly installed. Each threaded column (4), bearing (6), driving gear (301), synchronous belt (302), and limiting plate (7) are all located inside the adjacent protective cover (8).

8. The positioning device for detecting an ultra-large packaged chip according to claim 7, wherein: On one side of each limiting plate (7), there is a rotating column (9) fixedly installed. One end of each rotating column (9) penetrates through the adjacent protective cover (8) and extends to its outside. On the end of each rotating column (9) located outside the protective cover (8), there are a plurality of convex strips (10) fixedly installed.

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