Thermal resistance testing system

Abstract

The utility model provides a thermal resistance test system, which comprises a test chamber, a voltage acquisition module, a control unit and a radiator, and is characterized in that the test chamber comprises an accommodating cavity and a first test port, the accommodating cavity is used for accommodating a to-be-tested device, and the first test port is electrically connected with the to-be-tested device; the voltage acquisition module is electrically connected with a to-be-tested device through a first test port, and outputs m different digital voltage signals according to different voltage intervals where the to-be-tested device is located; the control unit is electrically connected with the voltage acquisition module and outputs a corresponding control signal according to each digital voltage signal; the radiator is electrically connected with the control unit, and the radiator can be switched to a corresponding radiating power output gear under the control of each control signal; m > = 3. The thermal resistance test system can adaptively adjust the heat dissipation power of the radiator according to different voltage intervals where the to-be-tested device is located, so as to improve the accuracy of test data and avoid the waste of the heat dissipation power.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a thermal resistance testing system. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. Due to its advantages such as low energy consumption, small size, long life, good stability, fast response, and stable emission wavelength, it has been widely used in lighting, display, medical treatment, optical communication and other fields.

[0003] However, during normal operation of an LED, more than 50% of the electrical energy is converted into heat energy, causing the junction temperature of the LED chip to rise significantly. The junction temperature is an important parameter that directly affects the operating characteristics of the LED. Generally, as the input current increases, the luminous flux of the LED will increase, but it will also increase the heat generation and the junction temperature. The higher the junction temperature, the lower the luminous efficiency. As a result, a vicious cycle will occur in which the temperature of the light-emitting layer increases, the luminous efficiency decreases, the power consumption increases, and the junction temperature further increases. The applicant found in internal research and testing that the differential curve corresponding to the thermal resistance test results of an LED that has undergone heat dissipation treatment is more reasonable than the differential curve corresponding to the thermal resistance test results of an LED that has not undergone heat dissipation treatment. There is no excessive heat redundancy, which can improve the accuracy and stability of the thermal resistance test. However, the current thermal resistance test system uses natural heat dissipation, or uses thermal grease or fixed-power heat dissipation devices to enhance heat dissipation.

[0004] However, whether it is natural heat dissipation, the use of thermal grease, or a fixed-power heat sink, the heat dissipation efficiency is relatively fixed and cannot be dynamically adjusted. This can easily lead to problems such as premature LED light attenuation and inaccurate test data caused by insufficient heat dissipation, as well as radiator power waste caused by excessive heat dissipation power of the heat sink. The above technical problems need to be solved urgently. Summary of the Invention

[0005] The present application provides a thermal resistance testing system that can effectively solve the problems of inaccurate test data and power waste of the radiator caused by the relatively fixed heat dissipation efficiency and the inability to dynamically adjust the heat dissipation efficiency in the thermal resistance testing system in the related art.

[0006] The present application provides a thermal resistance testing system, which includes: a test chamber, wherein the test chamber includes a receiving cavity and a first test port, the receiving cavity is used to receive a device under test, and the first test port is electrically connected to the device under test; a voltage acquisition module, which is electrically connected to the device under test through the first test port and can output m different digital voltage signals according to the voltage range of the device under test; a control unit, which is electrically connected to the voltage acquisition module and can output a corresponding control signal according to each digital voltage signal; a radiator, which is electrically connected to the control unit and has m different heat dissipation power output gears, and the radiator can switch to a corresponding heat dissipation power output gear under the control of each control signal; wherein m≥3.

[0007] Optionally, the test chamber further includes a second test port, the thermal resistance test system further includes a driving module, the driving module is electrically connected to the device under test through the second test port, and the control unit is electrically connected to the driving module.

[0008] Optionally, the test chamber includes a first test chamber, the first test chamber includes a plurality of support rods arranged on a side wall of the first test chamber, and the device under test can be suspended in the first test chamber under the support of the support rods.

[0009] Optionally, the test chamber includes a second test chamber, the second test chamber includes a temperature control platform, the temperature control platform is used to carry the device under test, and the control unit is electrically connected to the temperature control platform to control the temperature control platform to control the temperature of the device under test to a given temperature value.

[0010] Optionally, the thermal resistance testing system also includes an optical parameter measurement module, which includes an integrating sphere and a spectrometer. The integrating sphere is provided with a lighting window and a detection window. The device to be tested is arranged opposite to the lighting window, and the spectrometer is arranged opposite to the detection window.

[0011] Optionally, the voltage range in which the device under test is located includes a first voltage range, a second voltage range and a third voltage range that do not overlap with each other, and the maximum value of the first voltage range, the maximum value of the second voltage range and the maximum value of the third voltage range increase successively; the heat dissipation power output gear of the radiator includes a first heat dissipation power output gear, a second heat dissipation power output gear and a third heat dissipation power output gear, and the heat dissipation power corresponding to the first heat dissipation power output gear, the heat dissipation power corresponding to the second heat dissipation power output gear and the heat dissipation power corresponding to the third heat dissipation power output gear increase successively; wherein, the first voltage range corresponds to the first heat dissipation power output gear, the second voltage range corresponds to the second heat dissipation power output gear, and the third voltage range corresponds to the third heat dissipation power output gear.

[0012] Optionally, the voltage acquisition module includes a resistor divider and an analog-to-digital converter, wherein the resistor divider is electrically connected to the device under test, and the analog-to-digital converter is electrically connected to the resistor divider to convert the analog-to-digital voltage signal read from the resistor divider into a digital voltage signal.

[0013] Optionally, the control unit is an STM32 chip.

[0014] Optionally, the radiator includes a PWM speed-regulating fan and a power supply end, a ground end and two PWM signal input ends electrically connected to the PWM speed-regulating fan, the power supply end is electrically connected to the driving module, the two PWM signal input ends are electrically connected to the control unit, the PWM speed-regulating fan has m different speed output gears, and the PWM speed-regulating fan can switch to a corresponding speed output gear under the control of each control signal.

[0015] Optionally, the thermal resistance testing system further includes a testing substrate and a metal bracket arranged on the testing substrate, and the heat sink is fixedly arranged on a side of the device under test away from the testing substrate via the metal bracket.

[0016] The present application provides a thermal resistance testing system, comprising a test chamber, a voltage acquisition module, a control unit, and a heat sink. The test chamber includes a receiving cavity and a first test port, the receiving cavity being used to receive a device under test (DUT), the first test port being electrically connected to the DUT; the voltage acquisition module being electrically connected to the DUT via the first test port and capable of outputting m different digital voltage signals depending on the voltage range of the DUT; the control unit being electrically connected to the voltage acquisition module and capable of outputting a corresponding control signal based on each digital voltage signal; and the heat sink being electrically connected to the control unit and having m different heat dissipation power output gears, the heat sink being capable of switching to a corresponding heat dissipation power output gear under the control of each control signal; wherein m ≥ 3. The thermal resistance testing system provided herein can adaptively switch to a corresponding heat dissipation power output gear depending on the voltage range of the DUT, thereby dynamically adjusting the heat dissipation power of the heat sink, improving the accuracy of test data, and avoiding waste of heat dissipation power. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0018] Figure 1 A schematic diagram of the modular structure of a thermal resistance testing system provided in some embodiments of the present application.

[0019] Figure 2 A schematic diagram of the modular structure of another thermal resistance testing system provided in some embodiments of the present application.

[0020] Figure 3 An equivalent circuit diagram of a heat sink provided for some embodiments of the present application.

[0021] Description of reference numerals:

[0022] Test chamber 11; first test chamber 11A; second test chamber 11B; accommodating chamber 110; first test port 111; second test port 112; support rod 113; temperature control platform 114; device under test 12; voltage acquisition module 13; resistor divider 131; analog-to-digital converter 132; control unit 14; heat sink 15; PWM speed-regulating fan 151; power supply terminal VCC; ground terminal GND; PWM signal input terminal PWM-in; driver module 16; test substrate 17; metal bracket 18. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0024] The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature specified as "first," "second," or "third" may explicitly or implicitly include one or more of the specified features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically specified.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0026] The disclosure below provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0027] Figure 1 A schematic diagram of a modular structure of a thermal resistance testing system provided in some embodiments of the present application; Figure 2 A schematic diagram of a modular structure of another thermal resistance test system provided in some embodiments of the present application. Figure 1 and Figure 2As shown, an embodiment of the present application provides a thermal resistance testing system, which includes a test chamber 11, a voltage acquisition module 13, a control unit 14 and a radiator 15, wherein the test chamber 11 includes a receiving chamber 110 and a first test port 111, the receiving chamber 110 is used to receive a device under test 12, and the first test port 111 is electrically connected to the device under test 12; the voltage acquisition module 13 is electrically connected to the device under test 12 through the first test port 111, and can output m different digital voltage signals according to the voltage range of the device under test 12; the control unit 14 is electrically connected to the voltage acquisition module 13, and can output a corresponding control signal according to each digital voltage signal; the radiator 15 is electrically connected to the control unit 14, and has m different heat dissipation power output gears, and the radiator 15 can switch to a corresponding heat dissipation power output gear under the control of each control signal; wherein m≥3.

[0028] In the thermal resistance testing system provided in the embodiment of the present application, the voltage acquisition module 13 in the thermal resistance testing system can output three or more digital voltage signals according to the voltage range of the device under test 12, and transmit the digital voltage signals to the control unit 14. The control unit 14 can generate corresponding control signals based on the different digital voltage signals to control the heat sink 15 to switch to the corresponding heat dissipation power output gear. That is, the thermal resistance testing system can monitor the dynamic changes in the voltage of the device under test 12, determine the voltage range of the voltage across the device under test 12 in real time, and adaptively switch the heat sink 15 to the corresponding heat dissipation power output gear based on the voltage range of the device under test 12. Moreover, because the heat sink 15 has three or more heat dissipation power output gears, the device under test 12 in the thermal resistance testing system can have three or more heat dissipation efficiencies, realizing dynamic multi-mode adjustment of the heat dissipation power of the heat sink 15, avoiding the problems of insufficient heat dissipation or excessive heat dissipation power, effectively improving the accuracy of test data, and avoiding waste of heat dissipation power.

[0029] In some embodiments of the present application, the device under test 12 is an LED light-emitting device.

[0030] In some embodiments of the present application, the test chamber 11 further includes a second test port 112 , the thermal resistance testing system further includes a driving module 16 , the driving module 16 is electrically connected to the device under test 12 through the second test port 112 , and the control unit 14 is electrically connected to the driving module 16 .

[0031] In the thermal resistance testing system provided in the embodiment of the present application, since the driving module 16 is electrically connected to the device under test 12 through the second test port 112, and the driving module 16 is also electrically connected to the control unit 14, the driving module 16 can output a test current and a heating current to the device under test 12 through the second test port 112 under the control of the control unit 14. The test current can be the current that has the least effect on the self-heating of the device under test 12, that is, the current used for K-factor measurement. Then, according to the voltage corresponding to the test current, the voltage range can be selected, and the appropriate bias voltage can be set to perform volt-ampere characteristic and constant current tests to complete the electrical parameter test of the device under test 12.

[0032] In some embodiments of the present application, the thermal resistance testing system further includes a display, and the control unit 14 is electrically connected to the display. After the control unit 14 completes the analysis of various test results, it can transmit the analysis results to the display in the form of electrical signals.

[0033] In some embodiments of the present application, the test chamber 11 includes a first test chamber 11A, which includes a plurality of support rods 113 arranged on the side walls of the first test chamber 11A. The device under test 12 can be suspended in the first test chamber 11A under the support of the support rods 113.

[0034] In the thermal resistance testing system provided in the embodiment of the present application, the first test chamber 11A can provide a closed and relatively static testing space for the device under test 12. The device under test 12 can be suspended in the first test chamber 11A under the support of the support rod 113, thereby reducing the interference of other heat dissipation effects and improving the test accuracy.

[0035] In some embodiments of the present application, the first test chamber 11A further includes a temperature sensor, which is capable of detecting the temperatures of different reference points to establish a spatial temperature field based on the device under test 12, thereby obtaining the temperature difference between the PN junction of the device under test 12 and the environment at different reference points during the heat dissipation process, and using the control unit 14 to perform thermal resistance structure analysis.

[0036] In some embodiments of the present application, the test chamber 11 includes a second test chamber 11B, the second test chamber 11B includes a temperature control platform 114, the temperature control platform 114 is used to support the device under test 12, and the control unit 14 is electrically connected to the temperature control platform 114 to control the temperature control platform 114 to control the temperature of the device under test 12 to a given temperature value.

[0037] In the thermal resistance test system provided in the embodiment of the present application, the temperature control platform 114 can control the temperature of the device under test 12 to a given temperature value under the control of the control unit 14 to perform a K coefficient test. It should be noted that the given temperature value can be variable.

[0038] Continue to refer to Figure 2 In some embodiments of the present application, the thermal resistance testing system also includes an optical parameter measurement module, which includes an integrating sphere and a spectrometer. The integrating sphere is provided with a lighting window and a detection window. The device under test 12 is arranged opposite to the lighting window, and the spectrometer is arranged opposite to the detection window.

[0039] In the thermal resistance testing system provided in the embodiments of the present application, the optical parameter testing module comprises an integrating sphere and a spectrometer. The device under test 12 is located at a light-collecting window, and the spectrometer is located at a detection window and is electrically connected to the control unit 14. The light-collecting window is capable of collecting optical signals from the device under test 12. The spectrometer measures the collected optical signals and feeds the results back to the control unit 14. After completing data analysis and processing, the control unit 14 outputs the results to a display, which then displays the test results.

[0040] In some embodiments of the present application, the voltage interval in which the device under test 12 is located includes a first voltage interval, a second voltage interval, and a third voltage interval that do not overlap with each other, and the maximum value of the first voltage interval, the maximum value of the second voltage interval, and the maximum value of the third voltage interval increase in sequence; the heat dissipation power output gear of the radiator 15 includes a first heat dissipation power output gear, a second heat dissipation power output gear, and a third heat dissipation power output gear, and the heat dissipation power corresponding to the first heat dissipation power output gear, the heat dissipation power corresponding to the second heat dissipation power output gear, and the heat dissipation power corresponding to the third heat dissipation power output gear increase in sequence; wherein, the first voltage interval corresponds to the first heat dissipation power output gear, the second voltage interval corresponds to the second heat dissipation power output gear, and the third voltage interval corresponds to the third heat dissipation power output gear.

[0041] In the thermal resistance test system provided in the embodiment of the present application, the applicant found that when the voltage value at both ends of the device under test 12 is higher, the heat dissipation effect required by the device under test 12 is stronger, and the heat dissipation output power requirement of the heat sink 15 is higher. Therefore, the present application divides the device under test 12 into a first voltage interval, a second voltage interval, and a third voltage interval with successively increasing maximum voltage values, so that when the voltage value at both ends of the device under test 12 continuously increases during the test and falls into the first voltage interval, the second voltage interval, and the third voltage interval at different times, the first heat dissipation power output gear, the second heat dissipation power output gear, and the third heat dissipation power output gear are sequentially used to dissipate heat for the device under test 12, thereby improving the heat dissipation test conditions, optimizing the junction temperature of the device under test 12, and improving the problems of premature light attenuation of LED light-emitting devices and inaccurate test data caused by insufficient heat dissipation.

[0042] In some embodiments of the present application, the first voltage interval, the second voltage interval, and the third voltage interval have the same range. For example, the first voltage interval is [a, b], and the corresponding voltage value is in volts; the second voltage interval is (b, c], and the corresponding voltage value is in volts; the first voltage interval is (c, d], and the corresponding voltage value is in volts; and the absolute value of the difference between a and b, the absolute value of the difference between b and c, and the absolute value of the difference between c and d are all equal, where a ≥ 0, and a, b, c, and d increase in order.

[0043] In some embodiments of the present application, the first voltage interval, the second voltage interval, and the third voltage interval have different ranges, and the range of the first voltage interval is greater than the range of the second voltage interval, and the range of the second voltage interval is greater than the range of the third voltage interval. For example, the first voltage interval is [a, b], and the corresponding voltage value is in volts; the second voltage interval is (b, c], and the corresponding voltage value is in volts; the first voltage interval is (c, d], and the corresponding voltage value is in volts; and the absolute value of the difference between a and b is greater than the absolute value of the difference between b and c, and the difference between b and c is greater than the absolute value of the difference between c and d, where a ≥ 0, and a, b, c, and d increase in sequence.

[0044] In some embodiments of the present application, the power values ​​corresponding to the first heat dissipation power output gear, the second heat dissipation power output gear, and the third heat dissipation power output gear may all be multiples of 100W.

[0045] In some embodiments of the present application, the difference between the power values ​​corresponding to the first heat dissipation power output gear and the second heat dissipation power output gear is equal to the difference between the power values ​​corresponding to the second heat dissipation power output gear and the third heat dissipation power output gear.

[0046] In some embodiments of the present application, the voltage acquisition module 13 includes a resistor divider 131 and an analog-to-digital converter 132, wherein the resistor divider 131 is electrically connected to the device under test 12, and the analog-to-digital converter 132 is electrically connected to the resistor divider 131 to convert the analog-to-digital voltage signal read from the resistor divider 131 into a digital voltage signal.

[0047] In the thermal resistance testing system provided by the embodiment of the present application, the resistor divider 131 and the analog-to-digital converter 132 can improve test safety while accurately monitoring the voltage state of the device under test 12 .

[0048] In some embodiments of the present application, the control unit 14 is an STM32 chip.

[0049] In the thermal resistance test system provided in the embodiment of the present application, the STM32 chip can be used as a voltage processor for testing the device under test 12 based on the voltage method, and can also be used as a controller for controlling the change in the heat dissipation power of the radiator 15, which effectively simplifies the structure of the thermal resistance test system and reduces production costs.

[0050] Figure 3 The equivalent circuit diagram of the heat sink provided in some embodiments of the present application. Figure 1 、 Figure 2 and Figure 3 As shown, in some embodiments of the present application, the radiator 15 includes a PWM speed-regulating fan 151 and a power supply terminal VCC, a ground terminal GND and two PWM signal input terminals PWM-in electrically connected to the PWM speed-regulating fan 151, the power supply terminal VCC is electrically connected to the driving module 16, and the two PWM signal input terminals PWM-in are electrically connected to the control unit 14, and the PWM speed-regulating fan 151 has m different speed output gears, and the PWM speed-regulating fan 151 can switch to a corresponding speed output gear under the control of each control signal.

[0051] In the thermal resistance testing system provided in the embodiment of the present application, the PWM speed-regulating fan 151 can receive various PWM signals output by the STM32 chip and change its speed output gear by adjusting its duty cycle, thereby achieving the purpose of adjusting the heat dissipation power of the radiator 15.

[0052] In some embodiments of the present application, the heat sink 15 further includes a plurality of resistors and a plurality of transistors. For example, the heat sink 15 includes four resistors and six transistors, wherein the resistance values ​​of the plurality of resistors may be fixed, that is, the resistance values ​​of the plurality of resistors are the same.

[0053] In some embodiments of the present application, the thermal resistance testing system further includes a testing substrate 17 and a metal bracket 18 disposed on the testing substrate 17 , and the heat sink 15 is fixedly disposed on a side of the device under test 12 away from the testing substrate 17 via the metal bracket 18 .

[0054] In the thermal resistance testing system provided in an embodiment of the present application, the first test port 111 and the second test port 112 together constitute a four-wire test port including two positive electrode interfaces and two negative electrode interfaces. The present application can lead out the two positive electrodes and two negative electrodes of the device under test 12 by setting the test substrate 17. Furthermore, the heat sink 15 can be well fixed to one side of the device under test 12 by setting a metal bracket 18 on the test substrate 17, so that the heat sink 15 can more fully dissipate heat for the device under test 12, reduce the use of thermal grease, save material costs, and improve test efficiency.

[0055] In summary, the present application provides a thermal resistance testing system, comprising a test chamber, a voltage acquisition module, a control unit, and a heat sink. The test chamber comprises a receiving cavity and a first test port, the receiving cavity being used to receive a device under test, the first test port being electrically connected to the device under test; the voltage acquisition module being electrically connected to the device under test via the first test port and capable of outputting m different digital voltage signals depending on the voltage range of the device under test; the control unit being electrically connected to the voltage acquisition module and capable of outputting a corresponding control signal based on each digital voltage signal; and the heat sink being electrically connected to the control unit and having m different heat dissipation power output gears, the heat sink being capable of switching to a corresponding heat dissipation power output gear under the control of each control signal; wherein m ≥ 3. The thermal resistance testing system provided in the present application can adaptively switch to a corresponding heat dissipation power output gear depending on the voltage range of the device under test, thereby dynamically adjusting the heat dissipation power of the heat sink, improving the accuracy of test data, and avoiding waste of heat dissipation power.

[0056] The above is a detailed introduction to a thermal resistance testing system provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, based on the idea of ​​the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A thermal resistance testing system, characterized in that: The thermal resistance testing system comprises: a test chamber, comprising a receiving cavity and a first test port, wherein the receiving cavity is used to receive the device under test, and the first test port is electrically connected to the device under test; a voltage acquisition module, electrically connected to the device under test through the first test port, and capable of outputting m different digital voltage signals according to different voltage intervals of the device under test; A control unit is electrically connected to the voltage acquisition module and is capable of outputting a corresponding control signal according to each digital voltage signal; a radiator electrically connected to the control unit and having m different heat dissipation power output gears, wherein the radiator can be switched to a corresponding heat dissipation power output gear under the control of each control signal; Among them, m≥3.

2. The thermal resistance testing system according to claim 1, characterized in that: The test chamber further includes a second test port, and the thermal resistance test system further includes a driving module. The driving module is electrically connected to the device under test through the second test port, and the control unit is electrically connected to the driving module.

3. The thermal resistance testing system according to claim 2, characterized in that: The test chamber includes a first test chamber, which includes a plurality of support rods arranged on a side wall of the first test chamber. The device under test can be suspended in the first test chamber under the support of the support rods.

4. The thermal resistance testing system according to claim 3, characterized in that: The test chamber includes a second test chamber, the second test chamber includes a temperature control platform, the temperature control platform is used to carry the device under test, and the control unit is electrically connected to the temperature control platform to control the temperature control platform to control the temperature of the device under test to a given temperature value.

5. The thermal resistance testing system according to claim 4, characterized in that: The thermal resistance testing system also includes an optical parameter measurement module, which includes an integrating sphere and a spectrometer. The integrating sphere is provided with a lighting window and a detection window. The device under test is arranged opposite to the lighting window, and the spectrometer is arranged opposite to the detection window.

6. The thermal resistance testing system according to claim 1, characterized in that: The voltage interval of the device under test includes a first voltage interval, a second voltage interval, and a third voltage interval that do not overlap with each other, and the maximum value of the first voltage interval, the maximum value of the second voltage interval, and the maximum value of the third voltage interval increase in sequence; The heat dissipation power output gear of the radiator includes a first heat dissipation power output gear, a second heat dissipation power output gear and a third heat dissipation power output gear, and the heat dissipation power corresponding to the first heat dissipation power output gear, the heat dissipation power corresponding to the second heat dissipation power output gear and the heat dissipation power corresponding to the third heat dissipation power output gear increase in sequence; The first voltage interval corresponds to the first heat dissipation power output gear, the second voltage interval corresponds to the second heat dissipation power output gear, and the third voltage interval corresponds to the third heat dissipation power output gear.

7. The thermal resistance testing system according to claim 2, characterized in that: The voltage acquisition module includes a resistor divider and an analog-to-digital converter, wherein: The resistor voltage divider is electrically connected to the device under test, and the analog-to-digital converter is electrically connected to the resistor voltage divider to convert the analog-to-digital voltage signal read from the resistor voltage divider into a digital voltage signal.

8. The thermal resistance testing system according to claim 7, characterized in that: The control unit is an STM32 chip.

9. The thermal resistance testing system according to claim 8, characterized in that: The radiator includes a PWM speed-regulating fan and a power supply end, a ground end, and two PWM signal input ends electrically connected to the PWM speed-regulating fan. The power supply end is electrically connected to the driving module, and the two PWM signal input ends are electrically connected to the control unit. The PWM speed-regulating fan has m different speed output gears, and the PWM speed-regulating fan can switch to a corresponding speed output gear under the control of each control signal.

10. The thermal resistance testing system according to claim 1, characterized in that: The thermal resistance testing system further includes a testing substrate and a metal bracket arranged on the testing substrate. The heat sink is fixedly arranged on a side of the device under test away from the testing substrate via the metal bracket.

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