Test socket for enhancing integrated circuit wafer testing

Abstract

The utility model discloses a test socket used for enhancing integrated circuit wafer test. The test socket comprises an insulation support structure with a plurality of through holes and a plurality of elastic conductive columns. The resilient conductive posts are partially embedded in the support structure and pass through the vias to accommodate variations due to IC package warpage and BGA solder ball dimensional tolerances. The insulation supporting structure further comprises a groove located near the through hole, and the elastic conductive column can be safely fixed. The elastic conductive column has an elastic structure, and the surface of the elastic conductive column is at least partially covered by an insulating material layer to prevent short circuit. The test socket is also provided with a hard support frame which can be made of polyimide, PCB (printed circuit board) materials or ceramics, and a soft support frame made of silica gel, so that the test socket is durable and flexible.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, and more particularly to a test socket for performing electrical testing on integrated circuit chips. Background Art

[0002] In electronics manufacturing, testing integrated circuit (IC) chips is a critical step in ensuring component functionality and reliability before they are deployed in consumer products. Test sockets play a key role in this process by providing a temporary connection between the IC die and the test equipment, enabling evaluation of the IC's performance without the need for permanent soldering.

[0003] A major challenge in test socket design lies in balancing secure electrical contact with accommodating a wide range of IC die sizes and configurations. Traditional test sockets often rely on rigid conductive components that may not adapt to variations in IC die package size or warpage. Furthermore, maintaining electrical contact integrity while preventing shorts between closely spaced conductive components remains a persistent challenge.

[0004] Another key concern is the durability and reliability of the test socket itself. Frequent insertion and removal of IC chips can wear out the socket's components, leading to inaccurate test results or requiring frequent replacement. The materials used to manufacture the test socket, including the supporting structure and conductive elements, play a crucial role in its overall performance and lifespan.

[0005] In view of these challenges, those skilled in the art need to continuously innovate the design of test sockets to provide improved flexibility, reliability, and ease of use. Utility Model Content

[0006] In order to solve the above problems, the present invention aims to provide a test socket for enhancing integrated circuit chip testing and a manufacturing method thereof.

[0007] The utility model relates to a test socket designed specifically for testing integrated circuit (IC) chips. The test socket combines an advanced structural configuration with a specific manufacturing method. The utility model aims to significantly improve the reliability and efficiency of IC chip testing through its unique features.

[0008] The test socket comprises an insulating support structure containing multiple through-holes. Embedded within this structure are several elastic conductive posts, each extending through a through-hole and having a first portion positioned below the insulating support structure and a second portion positioned above it. A unique feature of these posts is a layer of insulating material covering at least a portion of their surrounding surface, designed to prevent electrical shorts and ensure stable and reliable electrical contact during testing.

[0009] A key innovation of this test socket lies in the specific materials and structural components it employs. The insulating support structure comprises a rigid support frame and a flexible support frame. The rigid support frame, made of materials such as polyimide, PCB material, or ceramic, provides the necessary structural rigidity and durability for the test socket. In contrast, the flexible support frame, made of silicone, offers flexibility to accommodate IC package warpage and BGA solder ball size tolerances.

[0010] In addition, the insulating support structure is designed with multiple grooves located near the through-holes. These grooves help to strengthen the secure fixation of the elastic conductive pillar within the structure, thereby improving the durability of the conductive socket.

[0011] The beneficial effect of the present invention is that it solves and overcomes the short circuit or leakage phenomenon that may occur between the conductive posts of the test socket when the IC chip is pressed down and deformed by providing a more reliable, flexible and durable IC chip testing solution, thereby significantly improving the reliability of test data.

[0012] To make the above-mentioned objects, features and advantages of the present invention more clearly understood, the following embodiments are described in detail with reference to the accompanying drawings. It should be noted that the components in the accompanying drawings are merely schematic and are not drawn to scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Illustrated is a partial cross-sectional view of a test socket according to one embodiment of the present invention;

[0014] Figure 2 Shown is Figure 1 One of the variations of the embodiment shown;

[0015] Figure 3 Shown is Figure 1 Another variation of the illustrated embodiment;

[0016] Figure 4 Illustrated is a partial cross-sectional view of a test socket according to another embodiment of the present invention;

[0017] Figure 5 Shown is Figure 4 One of the variations of the embodiment shown;

[0018] Figure 6 Shown is Figure 4 Another variation of the embodiment shown;

[0019] Figure 7 Shown is Figure 4 Another variation of the embodiment shown;

[0020] Figure 8 Illustrated is a flow chart of one embodiment of a method for manufacturing a test socket;

[0021] Figure 9 Shown is Figure 8 The schematic diagram of the manufacturing method step S110 is shown;

[0022] Figure 10 Shown is Figure 8 A schematic diagram of the manufacturing method step S120 is shown;

[0023] Figure 11 Shown is Figure 8 The schematic diagram of the manufacturing method step S130 is shown;

[0024] Figure 12 Shown is Figure 8 A schematic diagram of a stage of step S140 of the manufacturing method is shown;

[0025] Figure 13 Shown is Figure 8 A schematic diagram of a stage of step S150 of the manufacturing method is shown;

[0026] Figure 14 Shown is Figure 8 The schematic diagram of the manufacturing method step S160 is shown;

[0027] Figure 15 A flow chart of another embodiment of a method for manufacturing a test socket is shown;

[0028] Figure 16 Shown is Figure 15 A schematic diagram of step 240 of the test socket manufacturing method is shown;

[0029] Figure 17 Shown is Figure 15 FIG. 1 is a schematic diagram of step S250 of the method for manufacturing a test socket. DETAILED DESCRIPTION

[0030] The utility model relates to a test socket specifically designed for integrated circuit (IC) chip testing. In the field of electronics, test sockets play a vital role by establishing reliable electrical contact between the IC chip and the test equipment during the evaluation phase. This temporary connection must be accurate and stable to ensure accurate results during IC chip testing without the need for permanent soldering, which is crucial for the efficiency and cost-effectiveness of IC chip testing.

[0031] Please refer to Figure 1 , Figure 1A partial cross-sectional view of a test socket according to one embodiment of the present invention is shown. One of the main features of the test socket 100 disclosed in this embodiment is that it includes an insulating support structure 110 having a plurality of through-holes 112. An elastic conductive post 120 is embedded within the insulating support structure 110 and extends through the through-holes 112. The elastic conductive post 120 has a portion located below the insulating support structure 110 (hereinafter referred to as the first portion 122), another portion located above the insulating support structure 110 (hereinafter referred to as the second portion 124), and a third portion 126 located within the insulating support structure. The upper and lower endpoints of the third portion 126 are connected to corresponding endpoints of the second portion 124 and the first portion 122, respectively.

[0032] In addition, the insulating support structure 110 is further characterized by grooves 114 adjacent to the through-holes 112. These grooves 114 accommodate a portion of the elastic conductive posts 120, thereby ensuring a stable attachment between the elastic conductive posts 120 and the insulating support structure 110. This ensures that the elastic conductive posts 120 do not fall off during the entire testing process, thereby enhancing the durability of the test socket 100.

[0033] In this embodiment, the elastic conductive pillar 120 is composed of conductive particles 121 and an elastic material 123. The elastic material 123 is, for example, a silicone-based material, while the conductive particles 121 can be selected from a group consisting of metal powder, metal alloy powder, graphite powder, conductive compounds, and conductive plastics. The conductive particles 121 ensure the electrical conductivity of the elastic conductive pillar 120, while the elastic material 123 not only provides the necessary elasticity but also contributes to the stability of the overall connection by adhering to the groove 114 adjacent to 112.

[0034] Furthermore, the circumferential surfaces of the elastic conductive pillars 120 are at least partially covered by an insulating material layer 130, significantly reducing the risk of short circuits during testing. In this embodiment, the thickness of the insulating material layer 130 can be between 10 and 300 microns. The insulating material layer 130 has multiple functions. It acts as a barrier to prevent electrical short circuits between adjacent elastic conductive pillars 120, particularly when the elastic conductive pillars 120 are deformed by pressure during testing.

[0035] In addition, the position of the insulating material layer 130 on the elastic conductive pillar 120 may vary depending on different designs. Figure 2 As shown, the insulating material layer 130 may be located at the first portion 122 and the third portion 126 of the elastic conductive column 120 located below the insulating support structure 110. Alternatively, as shown in FIG. Figure 3As shown, the insulating material layer 130 may also be located on the second portion 124 and the third portion 126 above the insulating support structure 110. Furthermore, in this embodiment, the insulating material layer 130 is made of silicone, which has excellent thermal stability and electrical insulation properties.

[0036] Please refer to Figure 4 , Figure 4 A partial cross-sectional view of another embodiment of a test socket according to the present invention is shown. In this embodiment, the insulating support structure 210 of the test socket 200 includes a rigid support frame 212 and a flexible support frame 214. The rigid support frame 212 provides rigidity and durability to the insulating support structure 210, while the flexible support frame 214 provides the necessary flexibility to adapt to environmental changes, such as those caused by IC package warpage or variations in BGA solder ball dimensional tolerances.

[0037] In this embodiment, the rigid support frame 212 of the insulating support structure 210 is constructed from highly rigid and durable materials, including polyimide, PCB material, and / or ceramic material. Polyimide exhibits excellent thermal stability, electrical insulation, and mechanical strength, while PCB and ceramic materials offer robustness and durability, thereby extending the life of the test socket 200.

[0038] In this embodiment, the soft support frame 214 is disposed above the rigid support frame 212 and is typically made of a relatively soft material (e.g., silicone). Since the elastic conductive posts 120 may move and deform during testing of the test socket 200, the soft support frame 214 provides a flexible support for the elastic conductive posts 120.

[0039] In addition, in this embodiment, the insulating material layer 230 can be selectively applied to various parts of the elastic conductive column 120. For example, Figure 5 As shown, the insulating material layer 230 is not completely covered around the top of the elastic conductive column 120. Alternatively, as shown in FIG. Figure 6 As shown, the soft support frame 214 is disposed below the rigid support frame 212. The insulating material layer 230 is not only disposed beside the elastic conductive pillar 120 above the soft support frame 214, but also surrounds the elastic conductive pillar 120 in the rigid support frame 212, leaving only the bottom periphery of the elastic conductive pillar 120 exposed. Alternatively, as Figure 7 As shown, the soft support frame 214 can be set below the hard support frame 212, and the insulating material layer 230 is only set beside the elastic conductive column 120 in the lower part of the soft support frame 214, and does not completely cover the top and bottom peripheries of the elastic conductive column 120.

[0040] Next, please refer to Figure 8, and please refer to Figures 9 to 14 . Figure 8 A flow chart of one embodiment of a method for manufacturing a test socket is provided. Figures 9 to 14 The schematic diagram of the test socket at various stages of the manufacturing method, each schematic diagram is Figure 8 First, refer to steps S110 and Figure 9 , forming a layered structure. The manufacturing method of this embodiment begins with forming a layered structure 200', which serves as the molding basis of the test socket 200. The layered structure 200' of this embodiment includes an insulating support layer 210' and at least one sacrificial layer 240 ( Figure 9 The figure shows two sacrificial layers 240, wherein the insulating support layer 210′ ​​provides the physical and electrical insulation required for testing, while the sacrificial layer 240 will be removed in a later step. In this embodiment, the insulating support layer 210′ ​​includes a hard support layer 212′ and a soft support layer 214′. The material of the sacrificial layer 240 is selected based on its ability to be easily removed without damaging the insulating support layer 210′ ​​or the elastic conductive pillars 120, regardless of whether the removal method is mechanical or chemical.

[0041] Next, please refer to steps S120 and Figure 10 , forming first through-holes. Once the layered structure 200' is in place, a plurality of first through-holes 201 are formed therein. The positions of these first through-holes 201 are determined based on the final position of the elastic conductive pillars 120. These first through-holes 201 are formed using precision machining tools to ensure they are positioned correctly. Such machining tools may include, for example, a laser cutter, a micro drill, an etching machine, or a CNC machine.

[0042] Then, please refer to steps S130 and Figure 11 , inject the insulating material. Fill the first through hole 201 with the insulating material 230'. In this embodiment, the insulating material 230' is silicone. Of course, those skilled in the art can also choose other types of insulating materials. Afterwards, refer to step S140 and Figure 12 After the insulating material 230' is filled, a plurality of second through holes 202 are formed in the insulating material 230'. These second through holes 202 are located inside the insulating material 230' and are where the conductive gel 120' is filled to form the elastic conductive pillars 120.

[0043] Then, refer to steps S150 and Figure 13, filling with conductive gel. The conductive gel 120' is injected into the second through hole 202. The conductive gel 120' is a mixture of conductive particles 121 and an adhesive 123'. The adhesive 123' is, for example, a material based on silicone. Once cured, the adhesive 123' forms a Figure 4 The elastic material 123 is shown, thereby forming an elastic conductive column 120. In this step, it is preferred to inject the conductive gel 120' into each second through hole 202 under a vacuum environment to avoid bubbles and ensure that each elastic conductive column 120 has consistent performance.

[0044] Afterwards, please refer to steps S160 and Figure 14 , removing the sacrificial layer. The sacrificial layer 240 can be removed by various methods, such as stripping or chemical dissolution, depending on the material made of the sacrificial layer 240. Removing the sacrificial layer 240 will expose a portion of the elastic conductive pillars 120, which are now firmly embedded in the insulating support structure 230.

[0045] It should be noted that Figure 8 The manufacturing method shown is used to manufacture Figure 4 The test socket 200 of the embodiment shown is a test socket 200. However, those skilled in the art should understand that by adjusting the steps of the manufacturing method, other test sockets can be formed. Figure 9 If the insulating support layer 210' is provided with only the hard support layer 212' but not the soft support layer 214', the following can be formed: Figure 1 The test socket 100 of the embodiment shown.

[0046] Alternatively, please refer to Figure 15 and Figure 16 and Figure 17 , Figure 15 A flow chart of another embodiment of a method for manufacturing a test socket is provided. Figure 16 and Figure 17 yes Figure 15 The schematic diagrams of each stage of the manufacturing method of the test socket shown in FIG. Figure 15 Corresponds to the new steps in . Figure 15 In the process, steps S210 to S230 are the same as steps S110 to S130, so they are not described here. Figure 16 After the insulating material 230' is filled, a covering sacrificial layer 250 is formed to cover the insulating material 230'. In this embodiment, the covering sacrificial layer 250 and the sacrificial layer 240 are made of the same material. Figure 17, forming a second through hole 202', the second through hole 202' not only penetrates the insulating material 230', but also penetrates the covering sacrificial layer 250. Then, the following steps S260 and S270 are the same as Figure 8 The steps S150 and S160 are the same, so they are not described in detail. After the manufacturing process shown in steps S210 to S270, a similar Figures 5 to 7 Test socket, that is, Figure 5 The top of the elastic conductive pillar 120 is not covered by the insulating material layer 230 in the test socket shown.

[0047] In addition, through the manufacturing process similar to step S210 to step S270, a Figures 6 to 7 For example (the following is just text description, no illustration), if you want to form a test socket like Figure 7 The test socket is first layered to form a soft support layer 214 on a first sacrificial layer, then to form a first through hole, inject an insulating material into the first through hole, then form a hard support layer 212 and a second sacrificial layer on the hard support layer 212, and then cover the first sacrificial layer with a third sacrificial layer, then form a second through hole in the first through hole, fill and cure the conductive gel 120, and then remove all the sacrificial layers to form a test socket. Figure 7 Test socket.

[0048] The above embodiments are merely examples for the convenience of explanation. Although any modifications may be made by those skilled in the art, they will not deviate from the scope of protection as set forth in the claims.

Claims

1. A test socket for enhancing integrated circuit chip testing, characterized in that: include: an insulating support structure comprising a plurality of through holes; as well as a plurality of elastic conductive pillars, embedded in the insulating support structure and passing through the through holes; Each of the elastic conductive pillars includes a first portion located below the insulating support structure and a second portion located above the insulating support structure; and Wherein, at least a portion of the circumferential surface of the elastic conductive column is covered by an insulating material layer.

2. The test socket according to claim 1, wherein: The thickness of the insulating material layer is between 10 and 300 microns.

3. The test socket according to claim 1, wherein: The insulating material layer is located on the first portion of the elastic conductive column.

4. The test socket according to claim 1, wherein: The insulating material layer is located on the second portion of the elastic conductive column.

5. The test socket according to claim 1, wherein: The insulating material layer is located on the first portion and the second portion of the elastic conductive column.

6. The test socket according to claim 1, wherein: The insulating support structure includes a rigid support frame and a soft support frame.

7. The test socket according to claim 1, wherein: The insulating support structure further includes a plurality of grooves located adjacent to the through holes, wherein a portion of the elastic conductive pillar is received by the grooves.

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