Thick-film power resistor

Abstract

The utility model discloses a thick-film power resistor, particularly relates to the technical field of resistors, and is technically characterized in that the resistor comprises an insulating substrate, a first electrode module, a second electrode module, a resistance plate and a grounding module, and the first electrode module, the second electrode module and the resistance plate are all arranged at the top of the insulating substrate; the grounding module is arranged on one side of the insulating substrate, and one side of the second electrode module is connected with the grounding module; the cross section of the second electrode module is of a U-shaped structure, and the resistance plate is arranged on the inner side of the second electrode module and connected with the inner side wall, close to the grounding module, of the second electrode module. The first electrode module is connected with one side of the resistance plate away from the grounding module. The resistance plate is arranged in the second electrode module of the U-shaped structure, and the U-shaped structure of the second electrode module forms the isolation area to isolate the resistance plate, so that noise interference of other structures on the resistance plate is reduced, signal transmission is stable, and the resistance plate has higher frequency response.

Description

Technical Field

[0001] The utility model relates to the technical field of resistors, in particular to a thick film power resistor. Background Art

[0002] A power resistor is a resistive element that can withstand high power. It has the following characteristics: Large power capacity: It can handle and consume high electrical power; Good heat dissipation performance: In order to withstand the heat generated by high power, it usually has an effective heat dissipation structure, such as a large surface area, heat sink or special packaging materials; High resistance value stability: Under high-power operating conditions, it can maintain a relatively stable resistance value, reducing resistance value changes caused by heat.

[0003] Resistors in the prior art often generate noise interference on the internal resistor plates due to their structural layout, resulting in problems such as insufficient resistor power and low frequency. Therefore, the present invention aims to provide a thick-film power resistor to solve the above technical problems. Utility Model Content

[0004] The technical problem to be solved by the present invention is that resistors in the prior art often generate noise interference on the internal resistor plate due to the structural layout, resulting in problems such as insufficient resistor power and low frequency. The purpose of the present invention is to provide a thick-film power resistor. By arranging the resistor plate inside the second electrode module of the U-shaped structure, the U-shaped structure of the second electrode module is utilized to isolate the resistor plate, thereby reducing noise interference from other structures on the resistor plate, making signal transmission smoother and having a higher frequency response.

[0005] The utility model is achieved through the following technical solutions:

[0006] A thick film power resistor includes an insulating substrate, a first electrode module, a second electrode module, a resistor plate, and a grounding module. The first electrode module, the second electrode module, and the resistor plate are all arranged on top of the insulating substrate. The grounding module is arranged on one side of the insulating substrate. One side of the second electrode module is connected to the grounding module.

[0007] The cross section of the second electrode module adopts a U-shaped structure. The resistor plate is arranged on the inner side of the second electrode module and connected to the inner side wall of the second electrode module close to the grounding module. The first electrode module is connected to the side of the resistor plate away from the grounding module.

[0008] Furthermore, the first electrode module includes a first electrode plate, a second electrode plate and a third electrode plate, one side of the third electrode plate is connected to the resistor plate, the side of the third electrode plate away from the resistor plate is connected to the second electrode plate, and the side of the second electrode plate away from the third electrode plate is connected to the first electrode plate.

[0009] Furthermore, the length of the third electrode plate is consistent with the length of the resistance plate.

[0010] Furthermore, the second electrode module includes a fourth electrode plate and two fifth electrode plates. The two fifth electrode plates are vertically spaced apart and arranged on one side of the fourth electrode plate. The resistor plate is arranged between the two fifth electrode plates.

[0011] Furthermore, the distances between the fifth electrode plates and the resistor plates on both sides are kept consistent.

[0012] Furthermore, the size of the resistance board is 1.9 cm×1.9 cm.

[0013] Furthermore, the length of the inner side wall of the second electrode module close to the grounding module is greater than the length of the resistor plate.

[0014] Furthermore, the grounding module includes a first grounding plate and a second grounding plate. The first grounding plate is arranged on one side of the insulating substrate, and the edge of the first grounding plate near the top of the insulating substrate is connected to the fourth electrode plate. The second grounding plate is arranged at the bottom of the insulating substrate, and one side of the second grounding plate is connected to the first grounding plate.

[0015] Furthermore, surfaces of the first ground plate and the second ground plate are both plated with silver.

[0016] Furthermore, the insulating substrate adopts an aluminum nitride ceramic substrate.

[0017] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0018] In the present invention, the resistor plate is arranged inside the second electrode module of the U-shaped structure, and the U-shaped structure of the second electrode module is used to form an isolation area to isolate the resistor plate, thereby reducing the noise interference of other structures on the resistor plate, making the signal transmission smooth and having a higher frequency response. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the following briefly introduces the drawings required for use in the examples. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be considered as limiting the scope. A person of ordinary skill in the art can also derive other relevant drawings based on these drawings without inventive effort. In the drawings:

[0020] Figure 1 Schematic diagram of the structure of a thick film power resistor in this embodiment;

[0021] Figure 2 Schematic diagram of the bottom view of the thick film power resistor in this embodiment;

[0022] Figure 3 FIG. 4 is a top view of a thick film power resistor in this embodiment.

[0023] Markings and corresponding parts names in the accompanying drawings:

[0024] 1. Insulating substrate; 2. First electrode module; 201. First electrode plate; 202. Second electrode plate; 203. Third electrode plate; 3. Second electrode module; 301. Fourth electrode plate; 302. Fifth electrode plate; 4. Resistor plate; 5. Grounding module; 501. First grounding plate; 502. Second grounding plate. DETAILED DESCRIPTION

[0025] The following description of exemplary embodiments of the present disclosure is made in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be appreciated by those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0026] In this disclosure, unless otherwise specified, the use of terms such as "first" and "second" to describe various elements is not intended to limit the positional relationship, temporal relationship, or importance relationship of these elements. Such terms are only used to distinguish one element from another. In some examples, the first element and the second element may refer to the same instance of the element, while in some cases, based on the context of the description, they may also refer to different instances.

[0027] The terms used in the descriptions of various examples in this disclosure are for the purpose of describing specific examples only and are not intended to be limiting. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the element may be one or more. In addition, the term "and / or" used in this disclosure encompasses any one and all possible combinations of the listed items.

[0028] It should be noted that, in the description of the following embodiments, Figure 3 As shown, the x direction is the length direction of the thick film power resistor, and the y direction is the width direction of the thick film power resistor.

[0029] Example

[0030] See also Figure 1-3As shown, a thick film power resistor includes an insulating substrate 1, a first electrode module 2, a second electrode module 3, a resistor plate 4, and a grounding module 5. The insulating substrate 1 is an aluminum nitride ceramic substrate, and the length and width of the insulating substrate 1 are 4 cm. The length and width of the resistor plate 4 are 1.9 cm. The first electrode module 2, the second electrode module 3, and the resistor plate 4 are all fixedly mounted on the top of the insulating substrate 1. The grounding module 5 is fixedly mounted on one side of the insulating substrate 1, and one side of the second electrode module 3 is connected to the grounding module 5.

[0031] The cross-section of the second electrode module 3 adopts a U-shaped structure. The resistor plate 4 is placed on the inner side of the second electrode module 3 and is connected to the inner wall of the second electrode module 3 close to the grounding module 5. The length of the inner wall of the second electrode module 3 close to the grounding module 5 is greater than the length of the resistor plate 4; the first electrode module 2 is connected to the side of the resistor plate 4 away from the grounding module 5.

[0032] Specifically, in this embodiment, by arranging the resistor plate 4 inside the second electrode module 3 of the U-shaped structure, the U-shaped structure of the second electrode module 3 is used to form an isolation area for the resistor plate 4, thereby reducing the noise interference of other structures on the resistor plate 4, making the signal transmission smooth and having a higher frequency response; at the same time, the resistor plate 4 facilitates the storage of external input power.

[0033] Furthermore, the first electrode module 2 includes a first electrode plate 201, a second electrode plate 202 and a third electrode plate 203, the length of the first electrode plate 201 is 1.2 cm, the width of the first electrode plate 201 is 0.9 cm, the length of the second electrode plate 202 is 0.6 cm, the width of the second electrode plate 202 is 0.3 cm, the length of the third electrode plate 203 is 1.9 cm, and the width of the third electrode plate 203 is 0.5 cm; one side of the third electrode plate 203 is connected to the resistor plate 4, the side of the third electrode plate 203 away from the resistor plate 4 is connected to the second electrode plate 202, the side of the second electrode plate 202 away from the third electrode plate 203 is connected to the first electrode plate 201, and the length of the third electrode plate 203 is consistent with the length of the resistor plate 4.

[0034] Specifically, in this embodiment, the first electrode plate 201 facilitates connection with an external circuit; the third electrode plate 203 facilitates connection with the resistor plate 4; and the second electrode plate 202 facilitates connection between the first electrode plate 201 and the third electrode plate 203.

[0035] Furthermore, the second electrode module 3 includes a fourth electrode plate 301 and two fifth electrode plates 302, the length of the fourth electrode plate 301 is 4 cm, the width of the fourth electrode plate 301 is 0.4 cm, the length of the fifth electrode plate 302 is 0.6 cm, and the width of the fifth electrode plate 302 is 2.4 cm; the two fifth electrode plates 302 are vertically spaced apart on one side of the fourth electrode plate 301, and the resistor plate 4 is arranged between the two fifth electrode plates 302, and the spacing between the fifth electrode plates 302 and the resistor plate 4 on both sides is consistent, and the spacing distance is 0.4 cm.

[0036] Specifically, in this embodiment, the fourth electrode plate 301 is used to facilitate the connection between the resistor plate 4 and the grounding module 5; the two fifth electrode plates 302 are used to facilitate the isolation of the resistor plate 4, thereby reducing the noise interference of other structures on the resistor plate 4, making the signal transmission smooth and having a higher frequency response.

[0037] Furthermore, the grounding module 5 includes a first grounding plate 501 and a second grounding plate 502, the surfaces of the first grounding plate 501 and the second grounding plate 502 are both silver-plated, the first grounding plate 501 is fixedly installed on one side of the insulating substrate 1, and the edge of the first grounding plate 501 near the top of the insulating substrate 1 is connected to the fourth electrode plate 301, and the second grounding plate 502 is fixedly installed on the bottom of the insulating substrate 1, and one side of the second grounding plate 502 is connected to the first grounding plate 501.

[0038] Working principle: The external circuit is connected to the power resistor through the first electrode module 2, and the external circuit is input into the resistor board 4 through the first electrode module 2 for power storage.

[0039] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only a specific implementation method of the utility model and is not intended to limit the scope of protection of the utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

Claims

1. A thick film power resistor, characterized in that: The resistor comprises an insulating substrate (1), a first electrode module (2), a second electrode module (3), a resistor plate (4) and a grounding module (5); the first electrode module (2), the second electrode module (3) and the resistor plate (4) are all arranged on the top of the insulating substrate (1); the grounding module (5) is arranged on one side of the insulating substrate (1); and one side of the second electrode module (3) is connected to the grounding module (5); The cross section of the second electrode module (3) adopts a U-shaped structure; the resistor plate (4) is arranged on the inner side of the second electrode module (3) and connected to the inner side wall of the second electrode module (3) close to the grounding module (5); and the first electrode module (2) is connected to the side of the resistor plate (4) away from the grounding module (5).

2. A thick film power resistor according to claim 1, characterized in that: The first electrode module (2) comprises a first electrode plate (201), a second electrode plate (202) and a third electrode plate (203); one side of the third electrode plate (203) is connected to the resistor plate (4); the side of the third electrode plate (203) away from the resistor plate (4) is connected to the second electrode plate (202); and the side of the second electrode plate (202) away from the third electrode plate (203) is connected to the first electrode plate (201).

3. A thick film power resistor according to claim 2, characterized in that: The length of the third electrode plate (203) is consistent with the length of the resistance plate (4).

4. The thick film power resistor according to claim 1, characterized in that: The second electrode module (3) comprises a fourth electrode plate (301) and two fifth electrode plates (302), the two fifth electrode plates (302) being vertically spaced apart and arranged on one side of the fourth electrode plate (301), and the resistor plate (4) being arranged between the two fifth electrode plates (302).

5. The thick film power resistor according to claim 4, characterized in that: The distances between the fifth electrode plates (302) and the resistor plates (4) on both sides are kept consistent.

6. The thick film power resistor according to claim 1, characterized in that: The size of the resistor plate (4) is 1.9 cm x 1.9 cm.

7. The thick film power resistor according to claim 6, characterized in that: The length of the inner side wall of the second electrode module (3) close to the grounding module (5) is greater than the length of the resistance plate (4).

8. The thick film power resistor according to claim 4, characterized in that: The grounding module (5) comprises a first grounding plate (501) and a second grounding plate (502), wherein the first grounding plate (501) is arranged on one side of the insulating substrate (1), and the edge of the first grounding plate (501) close to the top of the insulating substrate (1) is connected to the fourth electrode plate (301), and the second grounding plate (502) is arranged on the bottom of the insulating substrate (1), and one side of the second grounding plate (502) is connected to the first grounding plate (501).

9. The thick film power resistor according to claim 8, characterized in that: The surfaces of the first grounding plate (501) and the second grounding plate (502) are both silver-plated.

10. The thick film power resistor according to claim 1, characterized in that: The insulating substrate (1) adopts an aluminum nitride ceramic substrate.

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