Diode processing die bonding device capable of eliminating transmission offset

Abstract

The utility model relates to the technical field of diode processing, in particular to a die bonding device for diode processing capable of eliminating transmission deviation, which comprises a main machine body, a first transfer assembly, a second transfer assembly and a positioning assembly, a transmission assembly is arranged on one side of the main machine body and is used for transmitting a substrate of a to-be-mounted die bonding diode, and the positioning assembly is arranged on the other side of the main machine body. The positioning assembly is arranged at the tail of the conveying assembly, a first transferring assembly is arranged on one side of the conveying assembly and one side of the positioning assembly, the first transferring assembly transfers a base plate on the conveying assembly to the positioning assembly, and the positioning assembly is positioned to eliminate deviation of the base plate in the conveying process. The positioning assembly is adopted, the movable positioning block is arranged on the positioning assembly, after the base plate is transferred to the supporting table, the positioning block moves to gradually rectify the deviation of the base plate, the base plate is restrained to the center of the supporting table, and therefore conveying deviation is eliminated.

Description

Technical Field

[0001] The utility model relates to the technical field of diode processing, in particular to a diode processing crystal bonding device capable of eliminating transmission deviation. Background Art

[0002] A diode is a common electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). It has unidirectional conductivity, meaning that if a forward voltage is applied to the diode anode, the diode conducts, and if a reverse voltage is applied to the anode and cathode, the diode blocks. The conduction and blocking of the diode are equivalent to the on and off of a switch. Diode die bonding is a key step in semiconductor manufacturing, mainly involving the process of fixing the diode chip to the substrate. A high-precision die bonding machine is used to accurately place the diode chip in a preset position.

[0003] Chinese patent CN219040443U discloses a solid crystal anti-displacement device, including a base, an equipment box fixedly mounted on the base, a mounting member fixedly mounted on the equipment box, a stepper motor mounted on the base, an output end of the stepper motor transmission connected to a threaded rod, a moving block threadedly connected to the threaded rod, the moving block slidably connected to a slide rod, and the slide rod fixedly mounted on the base.

[0004] The positioning component in the above structure uses a camera for positioning, but the camera can only be used to detect the position of the substrate and does not have a positioning function. If there is a certain angle deviation when the substrate is transferred, this positioning component cannot adjust the position of the substrate, resulting in the substrate still having too large a deviation during the subsequent transfer process, thereby affecting the subsequent diode bonding. Utility Model Content

[0005] The purpose of the present utility model is to provide a diode processing die-bonding device that eliminates transmission deviation. The device adopts a positioning component with a movable positioning block. When the substrate is transferred to the support table, the movement of the positioning block will gradually correct the substrate and constrain the substrate to the center of the support table, thereby eliminating the transmission deviation.

[0006] In order to solve the problems of the prior art, the utility model provides a diode processing solid crystal device that eliminates transmission offset, including a main body, a first transfer component, a second transfer component and a positioning component. A transmission component is provided on one side of the main body, and the transmission component is used to transmit the substrate on which the solid crystal diode is to be installed. The positioning component is provided at the tail of the transmission component. A first transfer component is provided on one side of the transmission component and the positioning component. The first transfer component transfers the substrate on the transmission component to the positioning component, and positions the positioning component to eliminate the offset of the substrate during transmission.

[0007] Preferably, the positioning assembly includes a support platform, and four slide grooves are provided on the support platform, and the slide grooves are distributed at the four corners of the support platform.

[0008] Preferably, a positioning block is slidingly provided in the slide groove, and a telescopic driving member for driving the positioning block to reciprocate is also provided inside the support table. When the substrate is transferred to the support table, the positioning block constrains the substrate to the center of the support table under the action of the telescopic driving member.

[0009] Preferably, an adjusting component is provided in front of the positioning component, and a second transfer component is provided on one side of the main body close to the positioning component and the adjusting component, and the second transfer component transfers the substrate on the positioning component to the adjusting component.

[0010] Preferably, a chip receiving platform for receiving the chip is installed on the main body near the adjustment component. The chip receiving platform can rotate around its own axis to convert chips in different positions. A crystal bonding component is installed on the main body above the chip receiving platform. The crystal bonding component is used to adsorb and transfer the chip on the chip receiving platform to the substrate on the adjustment component for crystal bonding to form a diode.

[0011] Preferably, the first transfer component includes a first moving mechanism and a first lifting mechanism. The first moving mechanism is used to drive the first lifting mechanism to reciprocate along the length direction of the first moving mechanism. The first lifting mechanism is also provided with a first pickup component. The first lifting mechanism is used to drive the first pickup component to move up and down so that the first pickup component adsorbs the substrate. The first pickup component is a vacuum suction cup.

[0012] Preferably, the second transfer component includes a second moving component and a second lifting component arranged on the second moving component, the second moving component is used to drive the second lifting component to move along the length direction of the second moving component, and the second lifting component is also provided with a second picking component, the second lifting component drives the second picking component to adsorb the substrate on the positioning component and transfer the substrate to the adjustment component.

[0013] Preferably, the adjustment component includes a third moving mechanism that moves forward and backward and a fourth moving mechanism that is arranged on the third moving mechanism and moves left and right. A movable workbench is provided on the fourth moving mechanism. A plurality of air holes for ventilation are provided on the movable workbench. A pipe interface is connected to one side of the movable workbench. When the substrate is placed on the movable workbench, the substrate is fixed by vacuum adsorption.

[0014] Preferably, the die-bonding assembly includes a fifth moving mechanism and a third lifting mechanism disposed on the fifth moving mechanism, the fifth moving mechanism is used to drive the third lifting mechanism to move back and forth, and a suction head for adsorbing the chip is further disposed at the bottom of the third lifting mechanism.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the diode processing die bonding device that eliminates transmission offset has a reasonable structure and has the following advantages:

[0016] (1) By adopting a positioning assembly, the positioning assembly includes a slide groove and a positioning block sliding in the slide groove. When the substrate is placed on the support table, the positioning block can constrain the substrate to the center of the support table under the action of the telescopic drive member. Even if the substrate is offset, the positioning block will gradually move the substrate until the substrate is corrected to the center of the support table, thereby eliminating the transfer offset of the substrate and improving the accuracy of subsequent crystal bonding.

[0017] (2) This application uses a movable workbench, air holes and pipe interfaces to fix the substrate to avoid displacement of the substrate during crystal solidification. By opening a number of air holes in the movable workbench, when the substrate is placed on the movable workbench, the movable workbench uses vacuum adsorption to fix the substrate to avoid displacement of the substrate during crystal solidification. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The present invention is a first three-dimensional structural schematic diagram of a diode processing die-bonding device capable of eliminating transfer offset.

[0019] Figure 2 The present invention is a second three-dimensional structural schematic diagram of a diode processing die-bonding device capable of eliminating transfer offset.

[0020] Figure 3 The present invention is a schematic diagram of a top view of a die-bonding device for diode processing that eliminates transfer offset.

[0021] Figure 4 The present invention is a schematic diagram of the three-dimensional structure of an adjustment component of a die-bonding device for diode processing that eliminates transfer offset.

[0022] Figure 5 The present invention is a first three-dimensional structural schematic diagram of a positioning component of a die-bonding device for diode processing that eliminates transfer offset.

[0023] Figure 6 The present invention is a second three-dimensional structural schematic diagram of a positioning component of a die-bonding device for diode processing that eliminates transfer offset.

[0024] The numbers in the figure are: 1. main body; 11. first transfer component; 111. first moving mechanism; 112. first lifting mechanism; 113. first picking component; 12. conveying component; 13. second transfer component; 131. second moving component; 132. second lifting component; 133. second picking component; 14. positioning component; 141. support table; 1411. slide; 142. positioning block; 143. telescopic drive member; 15. adjustment component; 151. third moving mechanism; 152. fourth moving mechanism; 153. mobile workbench; 154. air hole; 155. pipeline interface; 16. solid crystal component; 161. fifth moving mechanism; 162. third lifting mechanism; 163. suction head; 17. chip receiving platform. DETAILED DESCRIPTION

[0025] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, the present invention is described in further detail below in conjunction with the accompanying drawings and specific implementation methods.

[0026] Reference Figures 1-6As shown, the utility model provides: a diode processing solid crystal device that eliminates transmission offset, including a main body 1, a first transfer component 11, a second transfer component 13 and a positioning component 14. A transmission component 12 is provided on one side of the main body 1. The main body 1 serves as the basic support structure of the entire solid crystal device. The main body 1 carries various functional components to ensure that they can work stably and coordinated. The transmission component 12 is used to transmit the substrate on which the solid crystal diode is to be installed. The transmission component 12 usually adopts a conveyor belt to transmit the substrate, and realizes continuous transmission of the substrate through motor drive. During the transmission process, it is ensured that the substrate can maintain a stable and uniform movement. The positioning component 14 is provided at the tail of the transmission component 12. The first transfer component 11 is provided on one side of the transmission component 12 and the positioning component 14. The first transfer component 11 transfers the substrate on the transmission component 12 to the positioning component 14, and positions the positioning component 14 to eliminate the offset of the substrate during transmission. The main body 1 is provided on one side close to the positioning component 14. The second transfer assembly 13 is equipped with a positioning assembly 14, which includes a support platform 141. The support platform 141 is provided with four slide grooves 1411, which are distributed at the four corners of the support platform 141. A positioning block 142 is slidably arranged in the slide groove 1411. The support platform 141 is also provided with a telescopic drive member 143 for driving the positioning block 142 to reciprocate. When the substrate is transferred to the support platform 141, the positioning block 142 is constrained to the center of the support platform 141 under the action of the telescopic drive member 143. The core components of the positioning assembly 14 are the support platform 141 and the positioning block 142. The support platform 141 provides a stable support surface, while the positioning block 142 reciprocates in the slide groove 1411 through the action of the telescopic drive member 143, which is a double-headed cylinder or hydraulic cylinder, or other components, as long as it can make the positioning block 142 move synchronously to the center position of the support platform 141. When the substrate is transferred to the support platform 141 , the positioning blocks 142 constrain the substrate from four directions and firmly fix it at the center of the support platform 141 .

[0027] By adopting the positioning component 14, the positioning component 14 includes a slide groove 1411 and a positioning block 142 sliding in the slide groove 1411. When the substrate is placed on the support table 141, the positioning block 142 can constrain the substrate to the center of the support table 141 under the action of the telescopic drive member 143. Even if the substrate is offset, the positioning block 142 will gradually move the substrate until the substrate is corrected to the center of the support table 141, thereby eliminating the transfer offset of the substrate and improving the accuracy of subsequent crystal bonding.

[0028] An adjustment component 15 is provided directly in front of the positioning component 14, and a second transfer component 13 is provided on one side of the main body 1 close to the positioning component 14 and the adjustment component 15. The second transfer component 13 fixes the substrate on the adjustment component 15 when transferring the substrate on the positioning component 14. When the second transfer component 13 transfers the substrate from the positioning component 14 to the adjustment component 15, the adjustment component 15 can make slight position adjustments as needed to facilitate the subsequent fixing of the chip at the corresponding position of the substrate. A chip receiving platform 17 for receiving the chip is installed on the main body 1 near the adjustment component 15. The chip receiving platform 17 can rotate around its own axis to convert chips in different positions. A crystal bonding component 16 is installed above the chip receiving platform 17 on the main body 1. The crystal bonding component 16 is used to adsorb and transfer the chip on the chip receiving platform 17 to the substrate on the adjustment component 15 for crystal bonding to form a diode. The chip receiving platform 17 is usually designed as a disc-shaped structure that can rotate around its own axis. A plurality of chip placement positions are provided on the chip receiving platform 17, each of which can hold a chip to be bonded. When a chip at a certain position needs to be picked up, the chip receiving platform 17 rotates to a corresponding angle to facilitate the bonding assembly 16 to pick up the chip.

[0029] The first transfer assembly 11 includes a first moving mechanism 111 and a first lifting mechanism 112. The first moving mechanism 111 is used to drive the first lifting mechanism 112 to reciprocate along the length of the first moving mechanism 111. The first moving mechanism 111 generally includes components such as a motor, a lead screw, a guide rail, and a slider to drive the first lifting mechanism 112 to reciprocate along its length. The first lifting mechanism 112 is also provided with a first pickup assembly 113. The first lifting mechanism 112 is used to drive the first pickup assembly 113 to move up and down so that the first pickup assembly 113 can absorb the substrate. The first pickup assembly 113 is a vacuum suction cup. The first lifting mechanism 112 generally includes components such as a motor, a lead screw, a guide rail, and a slider to drive the first pickup assembly 113 to move up and down. The second transfer component 13 includes a second moving component 131 and a second lifting component 132 arranged on the second moving component 131. The second moving component 131 is used to drive the second lifting component 132 to move along the length direction of the second moving component 131. The second lifting component 132 is also provided with a second picking component 133. The second lifting component 132 drives the second picking component 133 to adsorb the substrate on the positioning component 14 and transfer the substrate to the adjustment component 15.

[0030] When the transport assembly 12 delivers the substrate to the designated position, the first moving mechanism 111 drives the first lifting mechanism 112 to that position. The first lifting mechanism 112 then descends, allowing the first pickup assembly 113 to contact and attract the substrate. The first lifting mechanism 112 then ascends, lifting the substrate. Finally, the first moving mechanism 111 drives the first lifting mechanism 112 along the guide rails to above the positioning assembly 14. The first lifting mechanism 112 descends again, placing the substrate on the support platform 141 of the positioning assembly 14. Once the positioning assembly 14 has precisely positioned the substrate, the second moving assembly 131 drives the second lifting assembly 132 to above the positioning assembly 14. The second lifting assembly 132 then descends, allowing the second pickup assembly 133 to contact and attract the substrate. The second lifting assembly 132 then ascends, lifting the substrate. Finally, the second moving assembly 131 drives the second lifting assembly 132 along the guide rails to above the adjustment assembly 15. The second lifting assembly 132 descends again, placing the substrate at the designated position on the adjustment assembly 15.

[0031] The adjustment component 15 includes a third moving mechanism 151 that moves forward and backward and a fourth moving mechanism 152 that is arranged on the third moving mechanism 151 and moves left and right. A moving workbench 153 is provided on the fourth moving mechanism 152. A plurality of air holes 154 for ventilation are provided on the moving workbench 153. A pipe interface 155 is connected to one side of the moving workbench 153. The pipe interface 155 is connected to the air holes 154 on the moving workbench 153 and the vacuum pump through a pipe for transmitting the air required for vacuum adsorption. When the vacuum pump is started, the air holes 154 will inhale air, thereby forming a negative pressure between the moving workbench 153 and the substrate, firmly adsorbing the substrate on the moving workbench 153. When the substrate is placed on the moving workbench 153, the substrate is fixed by the action of vacuum adsorption.

[0032] As the second transfer assembly 13 transfers the substrate to the movable worktable 153, a vacuum pump applies negative pressure to the air holes 154 through the pipes, firmly adsorbing the substrate onto the movable worktable 153. The third and fourth moving mechanisms 151 and 152 can then be fine-tuned forward, backward, and left, right, as needed to ensure precise alignment for subsequent die-bonding operations. This fine-tuning capability significantly enhances the flexibility and accuracy of die-bonding operations.

[0033] The die bonding assembly 16 includes a fifth moving mechanism 161 and a third lifting mechanism 162 disposed on the fifth moving mechanism 161 . The fifth moving mechanism 161 is used to drive the third lifting mechanism 162 to move back and forth. A suction head 163 for adsorbing chips is further disposed at the bottom of the third lifting mechanism 162 .

[0034] Working principle: When in use, the substrate is transported to the conveying assembly 12 through other conveying devices, and then the first lifting mechanism 112 causes the first picking assembly 113 to move down and adsorb the substrate. Then the first picking assembly 113 rises and is transferred to the support table 141 through the first moving mechanism 111. The substrate may deviate on the support table 141. At this time, the telescopic driving member 143 causes the positioning block 142 to move in the slide groove 1411, so that the positioning block 142 gradually moves toward the center of the support table 141, so that the substrate is slowly corrected until the substrate is in the center of the support table 141, thereby eliminating the conveying deviation of the substrate, and then the second picking assembly 113 is lifted up and transferred to the support table 141 through the first moving mechanism 111. The taking component 133 adsorbs the substrate on the support table 141, and the substrate is transferred to the movable workbench 153 through the action of the second lifting component 132 and the second moving component 131. The pipe interface 155 is connected to the vacuum pump through a pipe, and the substrate is fixed on the movable workbench 153 through the principle of vacuum adsorption. Subsequently, the chip on the chip receiving table 17 is adsorbed by the suction head 163, and the chip is transferred to the corresponding position of the substrate through the action of the fifth moving mechanism 161 and the third lifting mechanism 162. The position of the substrate is fine-tuned by the third moving mechanism 151 and the fourth moving mechanism 152 so that the chip can be placed at the corresponding position of the chip.

[0035] The above embodiments merely represent one or several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A diode die bonding device for eliminating transfer offset, characterized by: The invention comprises a main body (1), a first transfer component (11), a second transfer component (13) and a positioning component (14); a conveying component (12) is provided on one side of the main body (1); the conveying component (12) is used to convey a substrate on which a solid-crystal diode is to be mounted; the positioning component (14) is provided at the tail of the conveying component (12); a first transfer component (11) is provided on one side of the conveying component (12) and the positioning component (14); the first transfer component (11) transfers the substrate on the conveying component (12) to the positioning component (14); and the positioning component (14) is positioned to eliminate the offset of the substrate during conveyance.

2. The diode die bonding device for eliminating transfer offset according to claim 1, characterized in that: The positioning assembly (14) includes a support platform (141). Four slide grooves (1411) are provided on the support platform (141). The slide grooves (1411) are distributed at the four corners of the support platform (141).

3. The diode die bonding device for eliminating transfer offset according to claim 2, characterized in that: A positioning block (142) is slidably provided in the slide groove (1411), and a telescopic driving member (143) for driving the positioning block (142) to reciprocate is further provided inside the support platform (141). When the substrate is transferred to the support platform (141), the positioning block (142) constrains the substrate to the center of the support platform (141) under the action of the telescopic driving member (143).

4. The diode die bonding device for eliminating transfer offset according to claim 1, characterized in that: An adjusting component (15) is provided directly in front of the positioning component (14), and a second transfer component (13) is provided on one side of the main body (1) close to the positioning component (14) and the adjusting component (15). The second transfer component (13) transfers the substrate on the positioning component (14) to the adjusting component (15).

5. The diode die bonding device for eliminating transfer offset according to claim 4, characterized in that: A chip receiving platform (17) for receiving a chip is installed on the main body (1) at a position close to the adjustment component (15). The chip receiving platform (17) can rotate around its own axis to switch chips at different positions. A crystal bonding component (16) is installed on the main body (1) above the chip receiving platform (17). The crystal bonding component (16) is used to absorb and transfer the chip on the chip receiving platform (17) to a substrate on the adjustment component (15) for crystal bonding to form a diode.

6. The diode die bonding device for eliminating transfer offset according to claim 1, characterized in that: The first transfer component (11) comprises a first moving mechanism (111) and a first lifting mechanism (112). The first moving mechanism (111) is used to drive the first lifting mechanism (112) to reciprocate along the length direction of the first moving mechanism (111). The first lifting mechanism (112) is also provided with a first pickup component (113). The first lifting mechanism (112) is used to drive the first pickup component (113) to move up and down so that the first pickup component (113) adsorbs the substrate. The first pickup component (113) is a vacuum suction cup.

7. The diode die bonding device for eliminating transfer offset according to claim 1, characterized in that: The second transfer component (13) includes a second moving component (131) and a second lifting component (132) arranged on the second moving component (131). The second moving component (131) is used to drive the second lifting component (132) to move along the length direction of the second moving component (131). The second lifting component (132) is also provided with a second picking component (133). The second lifting component (132) drives the second picking component (133) to adsorb the substrate on the positioning component (14) and transfer the substrate to the adjustment component (15).

8. The diode die bonding device for eliminating transfer offset according to claim 5, characterized in that: The adjustment assembly (15) comprises a third moving mechanism (151) that moves forward and backward and a fourth moving mechanism (152) that is arranged on the third moving mechanism (151) and moves left and right. A movable workbench (153) is arranged on the fourth moving mechanism (152). The movable workbench (153) is provided with a plurality of air holes (154) for ventilation. A pipe interface (155) is connected to one side of the movable workbench (153). When a substrate is placed on the movable workbench (153), the substrate is fixed by vacuum adsorption.

9. The diode die bonding device for eliminating transfer offset according to claim 5, characterized in that: The crystal fixing assembly (16) includes a fifth moving mechanism (161) and a third lifting mechanism (162) arranged on the fifth moving mechanism (161). The fifth moving mechanism (161) is used to drive the third lifting mechanism (162) to move back and forth. The bottom of the third lifting mechanism (162) is also provided with a suction head (163) for adsorbing the chip.

Images