SMT solder paste printing machine

Abstract

The utility model provides an SMT solder paste printing machine, and belongs to the technical field of SMT. The device comprises a frame, a support is installed at the top of the frame, driving mechanisms are arranged on the two sides of the support, solder paste scraping mechanisms are installed at the telescopic ends of the two driving mechanisms, cleaning mechanisms are arranged on the sides, close to each other, of the two solder paste scraping mechanisms, and a machine body is installed on the bottom side of the interior of the frame. The fixing rod, the first bent plate, the second bent plate, the first cleaning part and the second cleaning part are arranged at the bottom of the support, when the first air cylinder is in an ascending state, the first scraper is cleaned through the first cleaning part under the guidance of the first inclined block, and when the second air cylinder is in a descending state, the second scraper is cleaned through the second cleaning part. And the solder paste on the scraper I and the scraper II is scraped in time, and the scraped solder paste falls back to the surface of the steel mesh, so that the solder paste adhered to the scraper I and the scraper II is prevented from being hardened, and the waste of the solder paste is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patches, in particular to an SMT solder paste printer. Background Art

[0002] An SMT solder paste printer is a device used in surface mount technology. It is mainly used to accurately print solder paste onto circuit boards. Solder paste is a paste containing solder powder and flux, and is mainly used to connect surface mount components and circuit boards electrically. When printing solder paste on a circuit board, the solder paste is first poured onto a steel mesh, and then the circuit board is placed at the bottom of the steel mesh. Two lifting cylinders then alternately drive two scrapers up and down, and the sliding cylinder then drives the lowered scraper to move along the surface of the steel mesh to print the solder paste on the circuit board.

[0003] When the existing SMT solder paste printer is in use, due to the strong adhesion of the solder paste, when the scraper descends to push the solder paste on the surface of the steel mesh, the scraper contacts the solder paste. When the scraper rises, there is no mechanism to clean the solder paste stuck on the scraper surface, which causes the surface of the scraper to stick to the solder paste on the surface of the steel mesh. When the scraper works back and forth for a long time, the solder paste initially stuck on the scraper surface becomes harder and difficult to continue using, resulting in waste of solder paste. Therefore, the present application provides an SMT solder paste printer to meet the needs. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an SMT solder paste printer to solve the problem of solder paste waste.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] An SMT solder paste printer comprises a frame, a bracket is installed on the top of the frame, a driving mechanism is provided on both sides of the bracket, a solder paste scraping mechanism is installed on the telescopic end of the two sets of driving mechanisms, a cleaning mechanism is provided on the side where the two sets of solder paste scraping mechanisms are close to each other, an organic body is installed on the inner bottom side of the frame, a steel mesh is installed on the top of the body, the top of the steel mesh conflicts with the bottom of the solder paste scraping mechanism, solder paste is placed on the top of the steel mesh, when the driving mechanism drives any solder paste scraping mechanism to descend and scrape the solder paste on the surface of the steel mesh, the other solder paste scraping mechanism rises and is cleaned by the cleaning mechanism.

[0007] As a preferred technical solution of the present invention: the driving mechanism includes a cylinder 1 and a cylinder 2 fixedly connected to both sides of the bracket.

[0008] As an optimal technical solution of the present invention: the solder paste scraping mechanism includes a mounting base 1 fixedly connected to the telescopic end of cylinder 1 and a mounting base 2 fixedly connected to the telescopic end of cylinder 2, the bottom of the mounting base 1 is fixedly connected to scraper 1, the bottom of the mounting base 2 is fixedly connected to scraper 2, and the scraper 1 and scraper 2 alternately conflict with the top of the steel mesh.

[0009] The cam is secured to the bottom of the support frame, and the cam has two retaining members, one of which is secured on both sides with a retaining member, and the other is secured on the bottom of the support frame with a retaining member.

[0010] As an optimal technical solution of the present invention: the bottoms of the cleaning part 1 and the cleaning part 2 are both fixedly connected with blocking bars.

[0011] As a preferred technical solution of the present invention: the bottoms of the cleaning part 1 and the cleaning part 2 are provided with inclined surfaces, and the angles between the facing surfaces of the two baffles and the corresponding inclined surfaces are acute angles.

[0012] As a preferred technical solution of the present invention: the bottoms of the two baffles are V-shaped.

[0013] As a preferred technical solution of the present invention: the first raised portion and the second raised portion are arc-shaped.

[0014] Compared with the prior art, the present invention has at least the following beneficial effects:

[0015] In the above scheme, a fixing rod, a bending plate 1, a bending plate 2, a cleaning part 1 and a cleaning part 2 are arranged at the bottom of the bracket. When the cylinder 1 is in an ascending state, the cleaning part 1 is used to clean the scraper 1 by guiding the inclined block 1. When the cylinder 2 is in a descending state, the cleaning part 2 is used to clean the scraper 2. The solder paste on the scraper 1 and the scraper 2 is scraped off in time, and the scraped solder paste falls back to the surface of the steel mesh to prevent the solder paste adhering to the scraper 1 and the scraper 2 from hardening, thereby effectively reducing the waste of solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable one skilled in the relevant art to make and use the present disclosure.

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the SMT solder paste printer;

[0018] Figure 2 This is a structural diagram of the SMT solder paste printer after removing the frame;

[0019] Figure 3 for Figure 2 A in the middle is an enlarged structural diagram;

[0020] Figure 4 for Figure 2 Schematic diagram of the structure at B in the middle;

[0021] Figure 5 Schematic diagram of the connection structure between the bending plate 1 and the rotating shaft 1;

[0022] Figure 6 It is a schematic diagram of the cross-sectional structure of the solder paste scraping mechanism, driving mechanism, and cleaning mechanism;

[0023] [Reference Signs]

[0024] 1. Frame; 2. Bracket; 3. Solder paste scraping mechanism; 31. Mounting seat 1; 32. Mounting seat 2; 33. Scraper 1; 34. Scraper 2; 4. Cleaning mechanism; 41. Fixing rod; 42. Rotating shaft 1; 43. Rotating shaft 2; 44. Bending plate 1; 441. Protrusion 1; 442. Cleaning section 1; 45. Bending plate 2; 451. Protrusion 2; 452. Cleaning section 2; 46. Magnetic block 1; 47. Magnetic block 2; 48. Bevel block 1; 49. Bevel block 2; 5. Machine body; 6. Driving mechanism; 61. Cylinder 1; 62. Cylinder 2; 7. Steel mesh; 8. Baffle bar.

[0025] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments, and the adjustments or modifications made are still included in the scope of the appended claims. DETAILED DESCRIPTION

[0026] The following describes in detail an SMT solder paste printer provided by the present invention, with reference to the accompanying drawings and specific embodiments. It is also noted that, to provide a more detailed description, the following embodiments are best and preferred embodiments, and those skilled in the art may employ alternative implementations for certain known technologies. Furthermore, the accompanying drawings are intended only to provide a more detailed description of the embodiments and are not intended to limit the present invention.

[0027] It should be noted that references in the specification to "one embodiment," "an embodiment," "exemplary embodiments," "some embodiments," etc. indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment will include such specific features, structures, or characteristics. Furthermore, when specific features, structures, or characteristics are described in conjunction with an embodiment, it is within the knowledge of persons skilled in the relevant art to implement such features, structures, or characteristics in conjunction with other embodiments (whether or not explicitly described).

[0028] In general, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0029] like Figure 1 As shown, an embodiment of the present invention provides an SMT solder paste printer, including a frame 1, a bracket 2 is installed on the top of the frame 1, and driving mechanisms 6 are provided on both sides of the bracket 2. The telescopic ends of the two sets of driving mechanisms 6 are installed with solder paste scraping mechanisms 3, and the driving mechanism 6 includes a cylinder 1 61 and a cylinder 2 62 fixedly connected to both sides of the bracket 2. Through the alternating lifting and lowering of the cylinder 1 61 and the cylinder 2 62, the two sets of driving mechanisms 6 can be better alternately lifted and lowered to the surface of the steel mesh 7.

[0030] like Figure 2As shown, the solder paste scraping mechanism 3 includes a mounting base 31 fixedly connected to the telescopic end of the cylinder 1 61 and a mounting base 2 32 fixedly connected to the telescopic end of the cylinder 2 62. The bottom of the mounting base 1 31 is fixedly connected with a scraper 1 33, and the bottom of the mounting base 2 32 is fixedly connected with a scraper 2 34. The scraper 1 33 and the scraper 2 34 alternately contact the top of the steel mesh 7; the reciprocating lifting of the cylinder 1 61 and the cylinder 2 62 drives the mounting base 1 31 and the mounting base 2 32 to be lifted and lowered reciprocally, thereby driving the scraper 1 33 and the scraper 2 34 installed at the bottom of the mounting base 1 31 and the mounting base 2 32 to be lifted and lowered alternately, which can better move the scraper 1 33 and the scraper 2 34 to the surface of the steel mesh 7, and can better make the scraper 1 33 and the scraper 2 34 contact the solder paste on the surface of the steel mesh 7 respectively.

[0031] like Figure 2As shown, a cleaning mechanism 4 is provided on the side where the two groups of solder paste scraping mechanisms 3 are close to each other, an organic body 5 is installed on the inner bottom side of the frame 1, a steel mesh 7 is installed on the top of the organic body 5, the top of the steel mesh 7 conflicts with the bottom of the solder paste scraping mechanism 3, solder paste is placed on the top of the steel mesh 7, and when the driving mechanism 6 drives any solder paste scraping mechanism 3 to descend and scrapes the solder paste on the surface of the steel mesh 7, the other solder paste scraping mechanism 3 rises and is cleaned by the cleaning mechanism 4, and the cleaning mechanism 4 includes two fixed rods 41 fixedly connected to both sides of the bottom of the bracket 2, and a rotating shaft 1 42 and a rotating shaft 2 43 are rotatably connected between the two fixed rods 41, a bending plate 1 44 is fixedly connected to the rotating shaft 1 42, and the bending plate 1 44 is provided on one side close to the mounting seat 1 31. There is a raised portion 441, and a cleaning portion 442 is provided on the side of the bending plate 44 close to the mounting seat 31. The cleaning portion 442 conflicts with the side of the scraper 33 near the top position. A bending plate 2 45 is fixedly connected to the rotating shaft 43. A raised portion 2 451 is provided on the side of the bending plate 2 45 close to the mounting seat 2 32. A cleaning portion 2 452 is provided on the side of the bending plate 2 45 close to the mounting seat 2 32. The cleaning portion 2 452 conflicts with the side of the scraper 34 near the bottom position. The opposite surfaces of the mounting seat 1 31 and the mounting seat 2 32 are respectively inlaid with a magnetic block 1 46 and a magnetic block 2 47. The side of the raised portion 441 fits with the side of the magnetic block 1 46, and the opposite surfaces of the mounting seat 1 31 and the mounting seat 2 32 are fixed. The inclined block 1 48 and the inclined block 2 49 are connected, and the inclined surface of the inclined block 2 49 conflicts with the side surface of the raised portion 2 451; when the cylinder 1 61 is raised, it drives the mounting seat 1 31 and the scraper 1 33 at the bottom to rise, and in the process of rising, the raised portion 1 441 is separated from the magnetic block 1 46, and then the mounting seat 1 31 drives the inclined block 1 48 to rise. When the inclined block 1 48 contacts the inclined surface of the raised portion 1 441 during the rising process, the raised portion 1 441 drives the bending plate 1 44 and the rotating shaft 1 42 to rotate along the inclined surface inside the two fixed rods 41, so that the cleaning portion 1 442 at the bottom of the bending plate 1 44 is always in contact with the surface of the scraper 1 33, which can better scrape off the solder paste adhering to the surface of the scraper 1 33. The scraped solder paste falls to the surface of the steel mesh 7, preventing the solder paste adhering to the scraper 33 from hardening, which is beneficial to reducing the waste of solder paste. When the cylinder 1 61 rises, the cylinder 2 62 descends. During the descent of the cylinder 2 62, the magnetic block 2 47 is driven to descend, and the mounting seat 2 32 contacts the bending plate 2 45. The bending plate 2 45 drives the rotating shaft 2 43 and the protrusion 2 451 to rotate along the inclined surface of the inclined block 2 49. When the magnetic block 2 47 descends to fit with the protrusion 2 451, the magnetic block 2 47 absorbs the protrusion 2 451, thereby better fixing the bending plate 2 45 and preventing the bending plate 2 45 from swinging during operation and colliding with the mounting seat 2 32 and the scraper 2 34, thereby causing damage.

[0032] like Figure 3As shown, the bottom of the cleaning part 1 442 and the cleaning part 2 452 are fixedly connected with a blocking bar 8; when the cleaning part 1 442 and the cleaning part 2 452 are cleaning the solder paste adhered to the surface of the scraper 1 33 and the scraper 2 34, by fixing the blocking bar 8 at the bottom of the cleaning part 1 442 and the cleaning part 2 452, the solder paste scraped off from the surface of the scraper 1 33 and the scraper 2 34 can be better blocked, reducing the area of ​​the solder paste adhered to the surface of the cleaning part 1 442 and the cleaning part 2 452 during scraping, which is beneficial to prevent the waste of solder paste.

[0033] like Figure 3 As shown, the bottom of the cleaning part 1 442 and the cleaning part 2 452 is provided with an inclined surface, and the angle between the facing surfaces of the two baffles 8 and the corresponding inclined surfaces is an acute angle; by making the angle between the facing surfaces of the two baffles 8 and the corresponding inclined surfaces an acute angle, the area of ​​solder paste adhering to the surface of the cleaning part 1 442 and the cleaning part 2 452 during scraping can be better reduced, which is beneficial to prevent the waste of solder paste.

[0034] like Figure 3 As shown, the bottoms of the two baffles 8 are V-shaped; through the V-shaped bottoms of the two baffles 8, the solder paste scraped off by the cleaning part 1 442 and the cleaning part 2 452 can be better dripped along the sides of the baffles 8, avoiding waste of solder paste.

[0035] like Figure 2 As shown, the facing away surfaces of the protrusion 1 441 and the protrusion 2 451 are arc-shaped; by setting an arc on the facing away surfaces of the protrusion 1 441 and the protrusion 2 451, it is possible to better prevent the protrusion 1 441 and the protrusion 2 451 from colliding with the edges of the inclined block 1 48 and the inclined block 2 49 when they move on the inclined surfaces of the inclined block 1 48 and the inclined block 2 49.

[0036] Working principle:

[0037] When solder paste printing is required on the circuit board, the circuit board is placed on the body 5 at the bottom of the steel mesh 7, and the cylinder 61 drives the mounting seat 31 and the scraper 33 at the bottom to rise. During the rising process, the protrusion 441 is separated from the magnetic block 46, and the mounting seat 31 drives the inclined block 48 to rise. When the inclined block 48 contacts the inclined surface of the protrusion 441 during the rising process, the protrusion 441 drives the bending plate 44 and the rotating shaft 42 to rotate along the inclined surface inside the two fixed rods 41, so that the cleaning part 442 at the bottom of the bending plate 44 is always in contact with the surface of the scraper 33, so as to clean the solder paste adhered to the surface of the scraper 33. The scraping is performed so that the scraped solder paste falls to the surface of the steel mesh 7 through the guidance of the baffle 8 and the cleaning part 1 442. While the cylinder 1 61 descends, the cylinder 2 62 rises, driving the magnetic block 2 47 to descend, and the mounting seat 2 32 contacts the bending plate 2 45. The bending plate 2 45 drives the rotating shaft 2 43 and the protrusion 2 451 to rotate along the inclined surface of the inclined block 2 49. When the magnetic block 2 47 descends to fit with the protrusion 2 451, the magnetic block 2 47 absorbs the protrusion 2 451, thereby better fixing the bending plate 2 45 and preventing the bending plate 2 45 from swinging and colliding with the mounting seat 2 32 and the scraper 2 34 during operation, thereby causing damage.

[0038] The present invention encompasses any substitutions, modifications, equivalent methods, and solutions that are not within the spirit and scope of the present invention. To provide a thorough understanding of the present invention, specific details are described in detail in the preferred embodiments of the present invention above, but those skilled in the art can fully understand the present invention without these detailed descriptions.

[0039] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An SMT solder paste printer, characterized in that: include: A frame (1) is provided, wherein a bracket (2) is installed on the top of the frame (1), a driving mechanism (6) is provided on both sides of the bracket (2), a solder paste scraping mechanism (3) is installed on the telescopic end of the two sets of the driving mechanisms (6), a cleaning mechanism (4) is provided on the side close to the two sets of the solder paste scraping mechanisms (3), an organic body (5) is installed on the bottom side of the interior of the frame (1), a steel mesh (7) is installed on the top of the organic body (5), solder paste is placed on the top of the steel mesh (7), and when the driving mechanism (6) drives any one of the solder paste scraping mechanisms (3) to descend and scrape the solder paste on the surface of the steel mesh (7), the other solder paste scraping mechanism (3) rises and is cleaned by the cleaning mechanism (4).

2. The SMT solder paste printer according to claim 1, characterized in that: The driving mechanism (6) comprises a cylinder 1 (61) and a cylinder 2 (62) fixedly connected to both sides of the bracket (2).

3. The SMT solder paste printer according to claim 2, characterized in that: The solder paste scraping mechanism (3) includes a mounting base 1 (31) fixedly connected to the telescopic end of the cylinder 1 (61) and a mounting base 2 (32) fixedly connected to the telescopic end of the cylinder 2 (62), wherein the bottom of the mounting base 1 (31) is fixedly connected to a scraper 1 (33), and the bottom of the mounting base 2 (32) is fixedly connected to a scraper 2 (34), and the scraper 1 (33) and the scraper 2 (34) alternately contact the top of the steel mesh (7).

4. The SMT solder paste printer according to claim 3, characterized in that: The cleaning mechanism (4) includes two fixed rods (41) fixedly connected to both sides of the bottom of the bracket (2), a rotating shaft (42) and a rotating shaft (43) are rotatably connected between the two fixed rods (41), a bending plate (44) is fixedly connected to the rotating shaft (42), a protrusion (441) is provided on the side of the bending plate (44) close to the mounting seat (31), a cleaning portion (442) is provided on the side of the bending plate (44) close to the mounting seat (31), the cleaning portion (442) is in conflict with the side of the scraper (33) near the top position, a bending plate (45) is fixedly connected to the rotating shaft (43), and the bending plate (45) is close to the mounting seat. A second protrusion (451) is provided on one side of the second mounting seat (32), and a second cleaning portion (452) is provided on the side of the second bending plate (45) close to the second mounting seat (32). The second cleaning portion (452) contacts the side of the second scraper (34) near the bottom. The opposing surfaces of the first mounting seat (31) and the second mounting seat (32) are respectively inlaid with a first magnetic block (46) and a second magnetic block (47). The side of the first protrusion (441) is fitted with the side of the first magnetic block (46). The opposing surfaces of the first mounting seat (31) and the second mounting seat (32) are fixedly connected with an inclined block (48) and an inclined block (49). The inclined surface of the inclined block (49) contacts the side of the second protrusion (451).

5. The SMT solder paste printer according to claim 4, characterized in that: The bottoms of the cleaning part 1 (442) and the cleaning part 2 (452) are both fixedly connected with a blocking bar (8).

6. The SMT solder paste printer according to claim 5, characterized in that: The bottoms of the cleaning portion 1 (442) and the cleaning portion 2 (452) are provided with inclined surfaces, and the angles between the facing surfaces of the two blocking bars (8) and the corresponding inclined surfaces are acute angles.

7. The SMT solder paste printer according to claim 5, characterized in that: The bottoms of the two baffles (8) are V-shaped.

8. The SMT solder paste printer according to claim 4, characterized in that: The facing surfaces of the protrusion part 1 (441) and the protrusion part 2 (451) are arc-shaped.

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