Semiconductor manufacturing equipment frame
Through the design of the support adjustment and adjustment stabilization mechanism, the problem of insufficient adaptability of the semiconductor manufacturing equipment frame under the fixed support cross bar is solved, and flexible adjustment and positioning stability of the support height and width are achieved, thereby improving the convenience and stability of use.
Patent Information
- Application Number
- CN202422695089.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-06
AI Technical Summary
The existing semiconductor manufacturing equipment frame is difficult to adapt to different support requirements due to the fixed installation method of the support cross bar, which affects the stability, flexibility and adaptability of the support.
A semiconductor manufacturing equipment frame including a support adjustment mechanism and an adjustment stabilization mechanism is designed. Through the movably connected support frame, adjustment rod and stabilization rod, combined with springs and positioning structures, flexible adjustment of support height and width and stable positioning are achieved.
The support stability, flexibility and adaptability of the frame are improved, ensuring convenient adjustment and positioning stability of the support height and width, and enhancing the convenience and stability of use.
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Figure CN223379451U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing equipment frames, in particular to a semiconductor manufacturing equipment frame. Background Art
[0002] The semiconductor manufacturing equipment frame is a structure specially designed to support and protect semiconductor manufacturing equipment. This frame is usually made of high-strength, corrosion-resistant materials such as steel or alloy to ensure its stability and durability during use. Since different semiconductor manufacturing equipment requires different support heights, it is necessary to adjust the support height.
[0003] In the related art, during the use of the semiconductor manufacturing equipment frame, a fixed cross bar is generally installed inside the support frame to provide a supporting and stable medium for the semiconductor manufacturing equipment, thereby supporting and stabilizing the semiconductor manufacturing equipment and allowing it to be used.
[0004] However, during the current use of semiconductor manufacturing equipment frames, since the support cross bars are installed in a fixed manner, it is difficult for the support cross bars to stably support semiconductor manufacturing equipment with different support requirements, affecting the support stability flexibility and adaptability of the frame. Utility Model Content
[0005] In order to make up for the above deficiencies, the present invention provides a semiconductor manufacturing equipment frame that overcomes the above technical problems or at least partially solves the above problems.
[0006] The utility model is achieved in this way:
[0007] The utility model provides a semiconductor manufacturing equipment frame, comprising a frame body, protective doors being installed on both sides of the front side of the frame body, and openings being provided on both sides of the frame body;
[0008] Support adjustment mechanism; the support adjustment mechanism includes:
[0009] Support frame; the support frame is movably connected to the interior of the frame body, and the interior of the support frame is movably connected to a support plate;
[0010] Adjustment port; the adjustment port is opened at the four corners of the support frame, the adjustment port is movably connected to the interior of the adjustment rod, and the outer side of the adjustment rod is fixedly connected to the inner wall of the frame body;
[0011] Adjusting and stabilizing mechanism; the adjusting and stabilizing mechanism is arranged on both sides of the bottom of the supporting frame.
[0012] In a preferred embodiment, the adjustment and stabilization mechanism includes a stabilization cavity, a stabilization rod and a stabilization groove. The stabilization cavity is opened on both sides of the bottom of the support frame, the stabilization rod is movably connected to both sides of the inside of the stabilization cavity, the stabilization groove is opened on the inner side of the adjustment rod, and the outer side of the stabilization rod is located inside the stabilization groove.
[0013] In a preferred solution, the inner side of the stabilizing rod is fixedly connected to the moving rod, and a spring is provided inside the stabilizing cavity, with the outer side of the spring connected to the inner side of the moving rod.
[0014] In a preferred solution, both sides of the top of the support frame are provided with bayonet holes located on the outside of the support plate, and the bottom of the inner wall of the bayonet hole is provided with a positioning hole.
[0015] In a preferred solution, positioning holes are provided on both sides of the top of the support plate, positioning posts are movably connected inside the positioning holes, and the bottoms of the positioning posts pass through the support frame through positioning openings.
[0016] In a preferred solution, both sides of the support plate and the support frame are movably connected with a limit plate, and the inner side of the limit plate is fixedly connected to the outer side of the positioning column.
[0017] In a preferred solution, the front side and the rear side of both sides of the frame body are movably connected to a closing plate located outside the opening, and the outer side of the closing plate is fixedly connected to a moving handle.
[0018] In a preferred solution, a connecting groove is provided on the outer side of the inner side of the closing plate, a connecting seat is movably connected to the outer side of the connecting groove, and the surface of the inner frame body of the connecting seat is fixedly connected.
[0019] The utility model provides a semiconductor manufacturing equipment frame, the beneficial effects of which include:
[0020] 1. By setting up a support adjustment mechanism, a medium can be provided for the user to adjust the internal support height position of the frame body, so that the staff can adjust the internal support stability height of the frame body according to the actual support stability height requirements of the external semiconductor manufacturing equipment, avoiding the situation where the internal support height of the frame body is difficult to adjust when the frame body is in use, thereby improving the support stability flexibility and adaptability of the frame body.
[0021] 2. By setting up an adjustment and stabilization mechanism, the support frame and the adjustment rod can be raised and lowered to adjust the positioning and stabilization work, ensuring the support and stability effect of the support frame after adjustment, and avoiding the situation where it is difficult to position and stabilize after the height of the support frame is adjusted, thereby improving the adjustment, positioning and stability convenience of the support frame.
[0022] 3. By setting up the moving rod and the spring, the user can be provided with a medium for synchronously moving the stabilizing rods on both sides of the support frame, and exert an outward thrust when the stabilizing rod is working, and support and reinforce the bottom of the support plate, thereby improving the convenience and stability of the use of the stabilizing rod. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 It is an overall stereogram provided by the embodiment of the present utility model;
[0025] Figure 2 A schematic diagram of a three-dimensional cross-sectional structure of a support frame provided in an embodiment of the present utility model;
[0026] Figure 3 A schematic diagram of a three-dimensional cross-sectional structure of a support plate provided in an embodiment of the present utility model;
[0027] Figure 4 A schematic diagram of the right-side stereoscopic structure of a closing plate provided in an embodiment of the present utility model;
[0028] In the figure: 1. Frame body; 2. Protective door; 3. Opening; 4. Support frame; 5. Support plate; 6. Adjustment opening; 7. Adjustment rod; 8. Stabilizing cavity; 9. Stabilizing rod; 10. Stabilizing slot; 11. Moving rod; 12. Spring; 13. Bayonet; 14. Positioning opening; 15. Positioning hole; 16. Positioning column; 17. Limiting plate; 18. Closing plate; 19. Moving handle; 20. Connecting slot; 21. Connecting seat. DETAILED DESCRIPTION
[0029] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0030] Reference Figures 1-4The utility model provides a technical solution: a semiconductor manufacturing equipment frame, including a frame body 1 and a support adjustment mechanism, protective doors 2 are installed on both sides of the front side of the frame body 1, and openings 3 are provided on both sides of the frame body 1, which can provide users with a medium for adjusting the internal support height position of the frame body 1, so that the staff can adjust the internal support stability height of the frame body 1 according to the actual support stability height requirements of the external semiconductor manufacturing equipment, avoid the situation where the internal support height of the frame body 1 is difficult to adjust when the frame body 1 is in use, thereby improving the support stability flexibility and adaptability of the frame body 1.
[0031] Reference Figures 1-4 In a preferred embodiment, the support adjustment mechanism includes a support frame 4, the support frame 4 is movably connected to the inside of the frame body 1, the support frame 4 is movably connected to the support plate 5, the adjustment port 6 is opened at the four corners of the support frame 4, the adjustment port 6 is movably connected to the adjustment rod 7, the outer side of the adjustment rod 7 is fixedly connected to the inner wall of the frame body 1, and the adjustment stabilization mechanism is arranged on both sides of the bottom of the support frame 4. According to the actual support and stability height requirements of the external semiconductor manufacturing equipment, the support frame 4 is lifted and lowered by the handheld device to adjust the support and stability height of the support frame 4. At this time, the adjustment rod 7 moves inside the adjustment port 6 to perform a sliding connection between the support frame 4 and the frame body 1 to prevent deviation and tilting. Then, according to the support width requirements of the external semiconductor manufacturing equipment, the handheld device is lifted and lowered to adjust the support and stability height of the support frame 4. The support plate 5 is placed inside the support frame 4, and the support stability width at the top of the support frame 4 is adjusted, so that the support frame 4 can cooperate with the support plate 5 to support and stabilize the external semiconductor manufacturing equipment. The adjustment and stabilization mechanism includes a stabilization cavity 8, a stabilization rod 9 and a stabilization groove 10. The stabilization cavity 8 is opened on both sides of the bottom of the support frame 4, and the stabilization rod 9 is movably connected on both sides of the inside of the stabilization cavity 8. The stabilization groove 10 is opened on the inner side of the adjustment rod 7, and the outer side of the stabilization rod 9 is located inside the stabilization groove 10. The support frame 4 and the adjustment rod 7 can be raised and lowered to adjust the positioning and stabilization of the support frame 4, thereby ensuring the support and stabilization effect of the support frame 4 after adjustment, and avoiding the situation where it is difficult to position and stabilize the support frame 4 after the height is adjusted, thereby improving the convenience of adjusting the positioning and stabilization of the support frame 4.
[0032] Reference Figure 2In a preferred embodiment, a moving rod 11 is fixedly connected to the inner side of the stabilizing rod 9, a spring 12 is provided inside the stabilizing cavity 8, and the outer side of the spring 12 is connected to the inner side of the moving rod 11, which can provide the user with a medium for synchronously moving the stabilizing rods 9 on both sides of the support frame 4, and apply an outward thrust when the stabilizing rod 9 is working, and support and reinforce the bottom of the support plate 5, thereby improving the convenience and stability of the use of the stabilizing rod 9. Both sides of the top of the support frame 4 are provided with a bayonet 13 located on the outer side of the support plate 5, and a positioning hole 14 is provided at the bottom of the inner wall of the bayonet 13, which can perform preliminary installation and stabilization work between the support plate 5 and the support frame 4 to ensure the stability of the support plate 5 when in use.
[0033] Reference Figure 2-Figure 3 In a preferred embodiment, positioning holes 15 are opened on both sides of the top of the support plate 5, and the positioning holes 15 are movably connected with positioning columns 16 inside. The bottom of the positioning columns 16 passes through the support frame 4 through the positioning opening 14. The positioning opening 14 can be used to cooperate with the bayonet 13 to perform rigid positioning and stabilization of the support plate 5 and the support frame 4 to ensure the connection stability of the support plate 5 and the support frame 4. Both sides of the support plate 5 and the support frame 4 are movably connected with limiting plates 17, and the inner side of the limiting plate 17 is fixedly connected to the outer side of the positioning column 16, which can limit the misalignment between the positioning column 16 and the positioning hole 15 and the positioning opening 14 to ensure the positioning effect of the positioning column 16.
[0034] Reference Figure 4 In a preferred embodiment, a closing plate 18 located on the outside of the opening 3 is movably connected to the front and rear sides of both sides of the frame body 1, and a movable handle 19 is fixedly connected to the outside of the closing plate 18, which can provide the user with a medium for closing the opening 3, ensuring the convenience and flexibility of closing the opening 3. A connecting groove 20 is provided on the outside of the inner side of the closing plate 18, and a connecting seat 21 is movably connected to the outside of the connecting groove 20. The surface of the inner side of the connecting seat 21 is fixedly connected to the surface of the frame body 1, and the closing plate 18 can be slidably connected to the frame body 1 to ensure the stability of the closing plate 18.
[0035] Specifically, the working process or working principle of the semiconductor manufacturing equipment frame is as follows: when in use, first, according to the actual support and stability height requirements of the external semiconductor manufacturing equipment, the handheld moving rod 11 drives the stabilizing rod 9 to move inward and out of the stabilizing groove 10. At this time, the spring 12 is affected by the thrust of the moving rod 11 moving inward to shrink, preparing for the subsequent thrust applied to the moving rod 11, and lifting and moving the support frame 4 to adjust the support and stability height of the support frame 4. At this time, the adjustment rod 7 moves inside the adjustment port 6 to perform a sliding connection between the support frame 4 and the frame body 1 to prevent deviation and tilt. At the same time, a corresponding number of support frames 4 can be installed according to the support quantity requirements of the external semiconductor manufacturing equipment, so that the support frame 4 can support and stabilize multiple semiconductor manufacturing equipment. After the height adjustment of the support frame 4 is completed, the handheld moving rod 11 drives the stabilizing rod 9 to move outward into the stabilizing groove 10, and performs plug-in positioning between the support frame 4 and the adjustment rod 7. At this time, the contracted spring 12 applies an outward thrust to the moving rod 11 and the stabilizing rod 9 to ensure the stability of the stabilizing rod 9 when positioning, and then according to the external semiconductor manufacturing The support width requirement of the equipment is to first hold the limit plate 17 to drive the positioning column 16 to rotate parallel to the positioning port 14, then hold the support plate 5 and place it inside the bayonet 13 to adjust the support stable width of the top of the support frame 4. At this time, the limit plate 17 follows the support plate 5 to move through the positioning column 16, and passes through the support frame 4 through the positioning port 14 to perform the plug-in positioning work between the support plate 5 and the support frame 4, and then hold the limit plate 17 to rotate and stagger with the positioning port 14, so that the limit plate 17 performs the staggered limiting work between the positioning column 16 and the positioning port 14, so that the support frame 4 cooperates with the support plate 5 to support and stabilize the external semiconductor manufacturing equipment. Subsequently, according to the actual height of the support frame 4 and the support plate 5 supporting and stabilizing the semiconductor manufacturing equipment and the subsequent material loading and unloading requirements, the corresponding closing plate 18 is moved to both sides by hand to open the corresponding position of the opening 3, so that the semiconductor manufacturing equipment supported and stabilized by the support frame 4 and the support plate 5 can be loaded and unloaded later. At this time, the connecting seat 21 moves inside the connecting groove 20 to perform a sliding connection between the closing plate 18 and the frame body 1 to ensure the opening and closing effect of the closing plate 18 on the opening 3.
Claims
1. A semiconductor manufacturing equipment frame, comprising a frame body (1), protective doors (2) installed on both sides of the front side of the frame body (1), openings (3) provided on both sides of the frame body (1), characterized in that ; Support adjustment mechanism; The support adjustment mechanism includes: A support frame (4); the support frame (4) is movably connected to the interior of the frame body (1), and a support plate (5) is movably connected to the interior of the support frame (4); Adjustment opening (6); the adjustment opening (6) is opened at the four corners of the support frame (4); the adjustment opening (6) is internally movably connected to an adjustment rod (7); the outer side of the adjustment rod (7) is fixedly connected to the inner wall of the frame body (1); Adjusting and stabilizing mechanism; the adjusting and stabilizing mechanism is arranged on both sides of the bottom of the supporting frame (4).
2. A semiconductor manufacturing equipment frame according to claim 1, characterized in that: The adjustment and stabilization mechanism comprises a stabilization cavity (8), a stabilization rod (9) and a stabilization groove (10); the stabilization cavity (8) is provided on both sides of the bottom of the support frame (4); the stabilization rod (9) is movably connected to both sides of the interior of the stabilization cavity (8); the stabilization groove (10) is provided on the inner side of the adjustment rod (7); and the outer side of the stabilization rod (9) is located inside the stabilization groove (10).
3. A semiconductor manufacturing equipment frame according to claim 2, characterized in that: The inner side of the stabilizing rod (9) is fixedly connected to a moving rod (11), and a spring (12) is provided inside the stabilizing cavity (8), and the outer side of the spring (12) is connected to the inner side of the moving rod (11).
4. A semiconductor manufacturing equipment frame according to claim 1, characterized in that: Both sides of the top of the support frame (4) are provided with bayonet holes (13) located outside the support plate (5), and the bottom of the inner wall of the bayonet hole (13) is provided with a positioning hole (14).
5. A semiconductor manufacturing equipment frame according to claim 4, characterized in that: Positioning holes (15) are provided on both sides of the top of the support plate (5), and a positioning column (16) is movably connected inside the positioning hole (15), and the bottom of the positioning column (16) passes through the support frame (4) through the positioning opening (14).
6. A semiconductor manufacturing equipment frame according to claim 5, characterized in that: Both sides of the support plate (5) and the support frame (4) are movably connected to a limit plate (17), and the inner side of the limit plate (17) is fixedly connected to the outer side of the positioning column (16).
7. The semiconductor manufacturing equipment frame according to claim 1, characterized in that: The front and rear sides of both sides of the frame body (1) are movably connected to a closing plate (18) located outside the opening (3), and the outer side of the closing plate (18) is fixedly connected to a moving handle (19).
8. A semiconductor manufacturing equipment frame according to claim 7, characterized in that: A connecting groove (20) is provided on the outer side of the inner side of the closing plate (18), and a connecting seat (21) is movably connected to the outer side of the inner side of the connecting groove (20), and the surface of the inner side frame body (1) of the connecting seat (21) is fixedly connected.