Laser doping system

Abstract

The utility model discloses a laser doping system, which comprises a printing assembly, a laser splitting and doping assembly and a plurality of supports, the printing assembly and the laser splitting and doping assembly are connected through a first transmission unit, and a silicon substrate printed by the printing assembly is transmitted into the laser splitting and doping assembly through the first transmission unit for twice laser processing; according to the method, a laser is adopted for light splitting treatment to obtain at least two beams of light with different wavelengths, the light is guided to a first working position and a second working position through two laser emitting devices, the working positions of a silicon substrate on a transfer unit are changed, and laser treatment is sequentially carried out twice. According to the laser doping system provided by the embodiment of the invention, high-efficiency and high-quality semiconductor production can be realized through accurate positioning, a flexible light splitting doping device, an efficient transmission mechanism and accurate light splitting control, and meanwhile, the laser doping system has good expansibility and practicability.

Description

Technical Field

[0001] The utility model relates to the technical field of laser doping, in particular to a laser doping system. Background Art

[0002] Currently, the impurity atoms doped in solar cells are mostly boron and phosphorus, which form a pn junction through the doping of boron and phosphorus atoms. At the same time, due to the inherent characteristics of boron and phosphorus atoms, the required temperature during the diffusion process varies, so different process temperatures need to be adjusted during the diffusion process.

[0003] However, most current laser doping systems process the doping source by combining a single or multiple lasers to form a separate beam. During the doping process, a layer of doping slurry is printed or coated before a laser treatment. When two or more doping elements need to be doped, multiple printing processes and multiple laser treatments are required, which increases the process steps and reduces production capacity.

[0004] Therefore, it is necessary to provide a system that can simultaneously perform laser doping on two elements. Utility Model Content

[0005] The purpose of the utility model is to provide a laser doping system to solve the problem of using one laser to perform doping treatment on two doping elements.

[0006] In order to solve the above technical problems, the utility model provides a laser doping system, comprising: a printing component and a laser splitting doping component connected by a first transmission unit and a plurality of brackets;

[0007] The printing assembly is used to print on a silicon substrate;

[0008] The bracket is mounted on the laser splitting and doping component;

[0009] The laser splitting doping assembly includes a transfer unit and a laser splitting unit provided on the bracket, wherein the transfer unit is connected to the first transmission unit and is located below the laser splitting unit;

[0010] The laser spectrometer unit includes a laser, a spectrometer having at least two output ends, and a laser emitting device corresponding one-to-one to the output ends of the spectrometer. The light beams emitted by the laser pass through the output ends of the spectrometer and reach the laser emitting devices respectively. The laser emitting devices include a first laser emitting device and a second laser emitting device perpendicular to the transfer unit.

[0011] Optionally, the light splitting device includes a total reflection mirror and a light splitting prism;

[0012] The beam splitter prism includes two output ends. The light beam emitted by the laser reaches the beam splitter prism through the total reflection mirror. The light beams output from the two output ends of the beam splitter prism reach the first laser emitting device and the second laser emitting device respectively.

[0013] Optionally, the laser emitting device includes a light spot shaping device and a galvanometer device, and the light beam output by the beam splitter prism passes through the light spot shaping device and reaches the galvanometer device.

[0014] Optionally, the first laser emitting device points to a first working position, the second laser emitting device points to a second working position, and the first working position is located between the first conveying unit and the second working position.

[0015] Optionally, the transfer unit includes a rotating table and a rotating robotic arm, and the rotating robotic arm is arranged on the side of the rotating table away from the first conveying unit; the rotating table includes a rotating table surface, and the rotating table surface is connected to the first conveying unit or is located at the first working position; the rotating robotic arm is used to transfer the silicon substrate on the first working position to the second working position.

[0016] Optionally, it also includes a metal chain conveyor and an annealing heating device, wherein the metal chain conveyor is arranged between the laser spectrometer doping component and the annealing heating device, and the transfer unit is used to transfer the silicon substrate passing through the laser spectrometer doping component to the metal chain conveyor, and the other end of the metal chain conveyor is connected to the annealing heating device.

[0017] Optionally, it further includes a loading port and a loading port, wherein the loading port is arranged on a side of the printing component away from the laser spectrometry doping component, and the loading port is arranged on a side of the annealing and heating device away from the metal chain conveyor belt.

[0018] Optionally, the printing assembly includes at least two printing units, and the two printing units are connected via a second transmission unit;

[0019] The printing unit includes a printing press, a drying machine, and a third transmission unit connecting the printing press and the drying machine.

[0020] Optionally, the two printing units include a first printing unit and a second printing unit, and the dryer of the first printing unit and the printing press of the second printing unit are connected via the second conveying unit.

[0021] Compared with the existing technology, the laser doping system provided by the present invention includes a printing component and a laser spectrometer doping component and multiple brackets connected by a first transmission unit. The silicon substrate printed by the printing component is transmitted to the laser spectrometer doping component through the first transmission unit and undergoes two laser treatments. The present invention uses a laser and performs spectrometer treatment to obtain at least two beams of light with different wavelengths. The silicon substrate changes its working position on the transfer unit and is laser treated in turn by two laser emitting devices, which reduces the process flow, shortens the process time, and thus increases production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the structure of the laser doping system in an embodiment of the present utility model;

[0023] Figure 2 This is a schematic diagram of the structure of the printing assembly in the embodiment of the utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the laser splitting and doping component in the embodiment of the utility model;

[0025] Figure 4 It is a structural schematic diagram of an annealing furnace in an embodiment of the present utility model.

[0026] In the figure: 1. Printing component; 11. Printing machine; 12. Dryer; 121. Heating plate; 13. Printing table; 21. First conveying unit; 22. Second conveying unit; 23. Third conveying unit; 3. Laser spectrometer doping component; 301. Silicon substrate; 30. Rotating table; 31. Laser; 32. Total reflection mirror; 33. Beam splitter prism; 34. Spot shaping device; 35. Galvanometer device; 36. Rotating robotic arm; 37. Docking position; 38. First working position; 39. Second working position; 41. First positioning camera; 42. Second positioning camera; 5. Metal chain conveyor; 6. Annealing heating device; 7. Bracket. DETAILED DESCRIPTION

[0027] The present invention will be described below with reference to schematic diagrams, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art may modify the present invention as described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as a general guide for those skilled in the art and not as a limitation of the present invention.

[0028] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present utility model, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0029] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0030] The following paragraphs describe the present invention in more detail by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are greatly simplified and not to exact scale, and are intended solely to facilitate and clearly illustrate the embodiments of the present invention.

[0031] The present invention provides a laser doping system. Figure 1 , comprising: a printing component 1 and a laser spectrometer-doping component 3 and a plurality of brackets 7 connected by a first conveying unit 21; the printing component 1 is used to print on a silicon substrate 301; the bracket 7 is mounted on the laser spectrometer-doping component 3; the laser spectrometer-doping component 3 comprises a transfer unit and a laser spectrometer unit arranged on the bracket 7, the transfer unit is connected to the first conveying unit 21 and is located below the laser spectrometer unit; the laser spectrometer unit comprises a laser 31, a spectrometer having at least two output ends and a laser emitting device corresponding to the output ends of the spectrometer device, the light beam emitted by the laser 31 passes through the output ends of the spectrometer device and reaches the laser emitting device respectively; the laser emitting device comprises a first laser emitting device and a second laser emitting device perpendicular to the transfer unit.

[0032] In this embodiment, the silicon substrate 301 is first transferred to the printing assembly 1 for printing. The printed silicon substrate 301 is then transferred to the laser spectrometer doping assembly 3 via the first conveying unit 21. The transfer unit receives the silicon substrate 301, and the first positioning camera 41 accurately positions the silicon substrate 301. The transfer unit then transfers the silicon substrate 301 to the bottom of the laser spectrometer unit. The laser light generated by the laser 31 is split into at least two beams of light with different wavelengths by a spectrometer. The split laser beams are then vertically directed to the silicon substrate 301 by the first laser emitting device and the second laser emitting device, respectively. The silicon substrate 301 passes under the first laser emitting device and the second laser emitting device on the transfer unit in sequence for laser doping. In this embodiment, the transmission and positioning of the laser beam can be precisely controlled to achieve an efficient laser doping process.

[0033] Furthermore, a first positioning camera 41 is provided on the support 7. When the transfer unit receives the silicon substrate 301, the first positioning camera 41 captures an image of the silicon substrate 301 to ensure accurate alignment of the printed silicon slurry during subsequent laser processing. In this embodiment, the first positioning camera 41 is equipped with a high-resolution camera capable of capturing an image of the silicon substrate 301. It should be noted that the second positioning camera 42 can be a conventional product.

[0034] Furthermore, the spectroscopic device includes a total reflection mirror 32 and a spectroscopic prism 33; the light beam emitted by the laser 31 passes through the total reflection mirror 32 to reach the spectroscopic prism 33, and the light beams output from the two output ends of the spectroscopic prism 33 respectively reach the first laser emitting device and the second laser emitting device.

[0035] The beam splitter prism 33 receives the laser beam from the total reflection mirror 32 and splits it into at least two beams of light with different wavelengths. Specifically, the total reflection mirror 32 guides the laser beam through total internal reflection, achieving precise optical path control and lossless reflection of the light. The beam splitter prism 33 separates the laser beam into at least two different wavelengths for different doping depths or types.

[0036] Furthermore, the laser emitting device includes a spot shaping device 34 and a galvanometer device 35. The light beam output by the beam splitter prism 33 passes through the spot shaping device 34 and reaches the galvanometer device 35. In this embodiment, the beam splitter prism 33 receives the laser beam from the total reflection mirror 32 and splits it into at least two beams of light with different wavelengths. The at least two beams of light with different wavelengths are respectively directed to the spot shaping device 34. Specifically, the spot shaping device 34 receives the laser beam from the beam splitter prism 33, shapes the spot through components such as lenses and apertures, and shapes the circular laser spot into a square or other shape. The shaped laser beam is then transmitted to the galvanometer device 35, which outputs the laser beam and scans the surface of the silicon substrate 301. Specifically, the galvanometer device 35 controls the scanning path of the laser beam on the surface of the silicon substrate 301 to achieve fine processing. The doping process requires the formation of a precise doping pattern on the silicon wafer. The galvanometer device 35 moves on these predetermined patterns by scanning the laser beam, thereby achieving precise doping.

[0037] In a specific example, the galvanometer device 35 includes a high-speed galvanometer and a control circuit to accurately adjust the position of the laser beam, allowing the laser beam to cover a large area or a specific pattern in a controllable manner.

[0038] Furthermore, the first laser emitting device points to a first working position 38 , and the second laser emitting device points to a second working position 39 . The first working position 38 is located between the first conveying unit 21 and the second working position 39 .

[0039] During the operation of the laser doping system, the conveying direction of the silicon substrate 301 is first to be printed by the printing component 1, and then to be laser processed by the laser spectrometer doping component 3; it can be understood that in the conveying direction of the silicon substrate 301, the first working position 38 is located between the first conveying unit 21 and the second working position 39.

[0040] Furthermore, the transfer unit includes a rotating platform 30 and a rotating mechanical arm 36, and the rotating mechanical arm 36 is arranged on a side of the rotating platform 30 away from the first conveying unit 21. The rotating platform 30 includes a rotating table, which is connected to the first conveying unit 21. The first positioning camera 41 is arranged on the bracket 7 and is horizontally located between the first laser emitting device and the interface between the rotating table and the first conveying unit 21. The first laser emitting device points to the first working position 38, and the rotating table is connected to the first conveying unit 21 or rotated to the first working position 38.

[0041] In this embodiment, after the first positioning camera 41 positions the silicon substrate 301 of the rotating table 30, the rotating table 30 can rotate from the docking position 37 to the first working position 38, and the first laser emitting device performs laser processing on the silicon substrate 301 at the first working position 38.

[0042] It should be noted that the rotating table 30 can be a product of existing technology. For example, in a specific example, the rotating table 30 includes a base, a rotating shaft, a rotating table and a driving member; the base is arranged on one side of the first transmission unit 21, and the driving member is installed on the base. The rotating shaft is arranged vertically, one end of the rotating shaft is connected to the driving member, and the other end is fixed to the rotating table by bolts, welding or other mechanical connection methods.

[0043] Furthermore, the rotating robotic arm 36 is used to transfer the silicon substrate 301 on the first working position 38 to the second working position 39 , and the second laser emitting device performs laser processing on the silicon substrate 301 on the second working position 39 .

[0044] Specifically, the rotating table 30 is connected to the first conveying unit 21. The rotating table carries the silicon substrate 301 and rotates to change the position of the silicon substrate 301 on the rotating table. When the rotating table is at the docking position 37, after the rotating table carries the silicon substrate 301, the first positioning camera 41 positions the silicon substrate 301. When the rotating table rotates to the first working position 38 with the silicon substrate 301, the light beam output by the first laser emitting device performs a first doping treatment on the silicon substrate 301 at the first working position 38. The rotating robotic arm 36 is disposed on the side of the rotating table 30 away from the first conveying unit 21. The rotating robotic arm 36 transfers the silicon substrate 301 at the first working position 38 to the second working position 39. The light beam output by the second laser emitting device performs a second doping treatment on the silicon substrate 301 at the second working position 39.

[0045] In this embodiment, the rotating table changes position, thereby changing the position of the silicon substrate 301 it carries, allowing the silicon substrate 301 to be precisely positioned below the first positioning camera 41, ensuring that the silicon substrate 301 is accurately identified and positioned before the doping process. Furthermore, the silicon substrate 301 can be quickly transported from the first conveyor unit 21 to the first working position 38, achieving efficient movement and improving the efficiency of the entire production line. The automated operation of the rotating table 30 reduces the need for manual operation, reduces the possibility of human error, and improves the stability of the production process. The rotating table 30 allows the silicon substrate 301 to be quickly repositioned to adapt to different process requirements, thereby improving the versatility of the equipment.

[0046] The rotating robotic arm 36 can precisely transfer the silicon substrate 301, which has undergone the first doping treatment, from the first working position 38 to the second working position 39, ensuring the accurate positioning of the silicon substrate 301 during the second doping treatment. The rotating robotic arm 36 allows for a continuous production process, meaning that after the first doping treatment is completed, the silicon substrate 301 can be immediately transferred and subjected to the second doping treatment, thereby improving production efficiency. This reduces manual intervention and operational difficulty, making the entire production process simpler and more efficient. Furthermore, the rotating robotic arm 36 can be adjusted according to the shape and size of the silicon substrate 301 to accommodate silicon substrates 301 of varying specifications, thus enhancing the adaptability and flexibility of the equipment.

[0047] It should be noted that the rotating robotic arm 36 can be a product of existing technology. For example, in a specific example, the rotating robotic arm 36 includes a base and a robotic arm body connected to the base; the robotic arm body includes at least one rotating joint and an end effector, and the rotating joint is fixed on the robotic arm body, allowing the rotating robotic arm 36 to move in multiple directions; the end effector is arranged at one end of the robotic arm body away from the base.

[0048] The base is connected to the workbench or the ground by bolts, welding or other fixing methods. The main body of the robotic arm is made of high-strength metal (such as aluminum alloy or stainless steel), and the rotary joint is fixed to the main body of the robotic arm by bearings or bolts. The end effector includes: a clamp or a vacuum suction cup, and the end effector is connected to the end of the robotic arm body to ensure that the silicon substrate 301 sample can be fixed and moved during the movement. Through the rotary joint and movement path of the robotic arm body, the end effector can drive the silicon substrate 301 sample to the desired working position.

[0049] Furthermore, it also includes a metal chain conveyor 5 and an annealing heating device 6, the metal chain conveyor 5 is arranged between the laser spectrometer doping component 3 and the annealing heating device 6, the transfer unit is used to transfer the silicon substrate 301 processed by the laser spectrometer doping component 3 to the metal chain conveyor 5, and the other end of the metal chain conveyor 5 is connected to the annealing heating device 6.

[0050] Specifically, in this embodiment, the rotating robotic arm 36 is used to transfer the silicon substrate 301 on the second working position 39 to the metal chain conveyor 5 .

[0051] It should be noted that the term "docking" in this embodiment refers to the positional alignment of two units or components to facilitate material transfer. Beyond this positional alignment, in this embodiment, "docking" also refers to the functional ability of two units or components to transfer materials. For example, the transfer unit and first conveyor unit 21 physically correspond and function in conjunction, allowing for a smooth transition of the silicon substrate 301 between them. Functionally, the transfer unit can receive the silicon substrate 301 from the first conveyor unit 21, enabling a continuous production process.

[0052] In this embodiment, after the two doping treatments are completed, the cell needs to be subjected to a short heat treatment to further repair the laser damage, and then the cell is subjected to subsequent passivation and metallization after repair. The annealing heating device 6 performs annealing treatment on the silicon substrate 301 to help optimize the doping effect and improve the electrical and mechanical properties of the silicon substrate 301. Through the metal chain conveyor 5 and the annealing heating device 6, the doping treatment process of the silicon substrate 301 is achieved in a more continuous, stable and efficient manner, thereby improving the automation level of the production line and ensuring the effect and safety of the doping treatment. In addition, the rotating robotic arm 36 can accurately control the position of the silicon substrate 301 to ensure that it will not be offset or damaged during the transfer process. Through the operation of the robotic arm, the operator can be prevented from direct contact with high temperature, thereby improving the safety of the production process.

[0053] Furthermore, in this embodiment, it also includes a loading port and a unloading port. The loading port is arranged on the side of the printing component 1 away from the laser spectrometry doping component 3, and the unloading port is arranged on the side of the annealing heating device 6 away from the metal chain conveyor belt 5.

[0054] Furthermore, the printing assembly 1 includes at least two printing units, and the two printing units are connected via a second transmission unit 22 .

[0055] The printing unit includes a printing machine 11 , a drying machine 12 , and a third conveying unit 23 connecting the printing machine 11 and the drying machine 12 .

[0056] In this embodiment, the connection of the second conveyor unit 22 enables a continuous production process between the two printing units, thereby improving production efficiency. The printer 11 prints the silicon substrate 301 on the printing table 13. The printed silicon substrate 301 is then transported to the dryer 12 for drying. Specifically, the dryer 12 includes a heating plate 121 arranged along a metal conveyor belt.

[0057] In this embodiment, the printing assembly 1 further includes a second positioning camera 42. A bracket 7 for securing the second positioning camera 42 is mounted on the printing unit. The second positioning camera 42 is located above the printing press 11 and is capable of accurately positioning the silicon substrate 301. Positioning by the second positioning camera 42 ensures consistent slurry printing positions for all samples during subsequent printing. It should be noted that the second positioning camera 42 can be a conventional product.

[0058] Furthermore, the two printing units include a first printing unit and a second printing unit, and the dryer 12 of the first printing unit is connected to the printer 11 of the second printing unit via the second conveying unit 22. After being dried in the dryer 12 of the first printing unit, the silicon substrate 301 is transported to the second printing unit via the second conveying unit 22.

[0059] It should be noted that the drying machine, the printing machine and the heating plate can all be products of the existing technology.

[0060] In this embodiment, the doping elements may include boron, phosphorus, arsenic, germanium, carbon, sulfur, aluminum, gallium or indium.

[0061] In this embodiment, the first conveying unit 21, the second conveying unit 22 and the third conveying unit 23 include belt conveyors or metal conveyor belts. It should be noted that the first conveying unit 21, the second conveying unit 22 and the third conveying unit 23 can be selected from existing products.

[0062] In this embodiment, based on the above-mentioned laser doping system, an exemplary process of laser doping the silicon substrate 301 with two elements, B and P, is provided:

[0063] 1. Printing:

[0064] The obtained silicon substrate 301 is subjected to the polishing and texturing treatment required before doping.

[0065] The loading port is connected to the belt conveyor, and the polished and velvet-treated silicon substrate 301 enters the first printing unit through the belt conveyor. The silicon substrate 301 sample is first conveyed to the bottom of the positioning camera in the first printing unit. The positioning of the positioning camera ensures that the slurry printing position of all samples is consistent in the subsequent printing process.

[0066] First, silicon slurry containing B or P doping elements is printed. After printing, it is transferred to a metal conveyor belt via a belt conveyor and dried in a dryer 12 .

[0067] The dried silicon substrate 301 is transported to the second printing unit via a belt conveyor. The silicon substrate 301 sample is first transported to the bottom of the positioning camera of the second printing unit. The positioning of the positioning camera ensures that the slurry printing position of all samples is consistent during the subsequent printing process.

[0068] The silicon paste containing P or B doping elements is printed, and after printing is completed, it is transferred to the metal conveyor belt via the belt conveyor and dried again in the dryer 12.

[0069] 2. Laser processing

[0070] The dried silicon substrate 301 sample enters the laser spectrometry doping assembly 3 via a belt conveyor.

[0071] The rotating stage 30 is connected to the belt conveyor, receives the silicon substrate 301 sample, and is positioned by the first positioning camera 41 to ensure that the printed silicon paste can be accurately aligned during subsequent laser processing.

[0072] After positioning, the rotating stage 30 rotates the silicon substrate 301 sample to the first working position 38 for the first laser treatment.

[0073] After the first laser treatment, the silicon substrate 301 sample at the first working position 38 is transferred to the second working position 39 by the rotating robot arm 36 for a second laser treatment.

[0074] 3. Annealing

[0075] The silicon substrate 301 sample after the second laser treatment is transferred to the metal chain conveyor 5 by the rotating robot arm 36 and enters the annealing furnace.

[0076] After being repaired, the silicon substrate 301 sample in the annealing furnace leaves the laser doping system through the discharge port, completing the entire process.

[0077] In this embodiment, the laser doping system includes a laser and at least two laser emitting devices, which output light beams of different wavelengths through the laser emitting devices to perform doping treatment on different doping elements, and complete the treatment of at least two doping elements in sequence in a laser spectrometry doping component; a positioning camera is used to realize the positioning of the doping position, ensuring the precise alignment of the silicon substrate during the laser spectrometry doping process, reducing the processing error caused by inaccurate positioning, and improving the accuracy and consistency of doping; in addition, the printing component can print silicon slurry containing at least two different doping elements on the silicon substrate to adapt to different doping requirements and optimize the printing process; using this system for doping treatment, there is no need to print one doping element and then perform laser doping once, and then print and laser dope another doping element, which further optimizes the entire doping process and improves the processing efficiency; in addition, the rotating table rotates the silicon substrate from the docking position to the first working position, which improves the flexibility and processing capability of the system, and has good scalability and practicality; the rotating robotic arm provides the possibility of continuous production. The laser doping system provided in this embodiment can achieve high-efficiency, high-quality semiconductor production through precise positioning, flexible spectroscopic doping devices, efficient transmission mechanisms, and precise spectroscopic control. It also has good scalability and practicality, reduces the process flow, shortens the process time, and can further increase production capacity.

[0078] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A laser doping system, characterized in that: include: A printing component, a laser splitting and doping component, and a plurality of supports connected via a first conveying unit; The printing assembly is used to print on a silicon substrate; The bracket is mounted on the laser splitting and doping component; The laser splitting doping assembly includes a transfer unit and a laser splitting unit provided on the bracket, wherein the transfer unit is connected to the first transmission unit and is located below the laser splitting unit; The laser spectrometer unit includes a laser, a spectrometer having at least two output ends, and a laser emitting device corresponding one-to-one to the output ends of the spectrometer. The light beams emitted by the laser pass through the output ends of the spectrometer and reach the laser emitting devices respectively. The laser emitting devices include a first laser emitting device and a second laser emitting device perpendicular to the transfer unit.

2. The laser doping system according to claim 1, wherein: The light splitting device includes a total reflection mirror and a light splitting prism; The beam splitter prism includes two output ends. The light beam emitted by the laser reaches the beam splitter prism through the total reflection mirror. The light beams output from the two output ends of the beam splitter prism reach the first laser emitting device and the second laser emitting device respectively.

3. The laser doping system according to claim 2, wherein: The laser emitting device includes a light spot shaping device and a galvanometer device. The light beam output by the beam splitter prism passes through the light spot shaping device and reaches the galvanometer device.

4. The laser doping system according to claim 1, wherein: The first laser emitting device points to a first working position, and the second laser emitting device points to a second working position. The first working position is located between the first conveying unit and the second working position.

5. The laser doping system according to claim 4, wherein: The transfer unit includes a rotating table and a rotating robotic arm, wherein the rotating robotic arm is arranged on the side of the rotating table away from the first conveying unit; the rotating table includes a rotating table surface, which is connected to the first conveying unit or is located at the first working position; the rotating robotic arm is used to transfer the silicon substrate on the first working position to the second working position.

6. The laser doping system according to claim 1, wherein: It also includes a metal chain conveyor and an annealing heating device. The metal chain conveyor is arranged between the laser spectrometer doping component and the annealing heating device. The transfer unit is used to transfer the silicon substrate passing through the laser spectrometer doping component to the metal chain conveyor. The other end of the metal chain conveyor is connected to the annealing heating device.

7. The laser doping system according to claim 6, wherein: It also includes a loading port and a loading port. The loading port is arranged on a side of the printing component away from the laser spectrometer doping component, and the loading port is arranged on a side of the annealing and heating device away from the metal chain conveyor belt.

8. The laser doping system according to claim 1, wherein: The printing assembly includes at least two printing units, and the two printing units are connected via a second transmission unit; The printing unit includes a printing press, a drying machine, and a third transmission unit connecting the printing press and the drying machine.

9. The laser doping system according to claim 8, wherein: The two printing units include a first printing unit and a second printing unit, and the drying machine of the first printing unit and the printing machine of the second printing unit are connected via the second conveying unit.

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